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Products and Services
EXPO SW Test 2008

(updated 5/5/2008)

Important Information for 2008 Exhibitors

BOOTH ASSIGNMENTS
(as of 5/5/2008)

EXHIBITOR

PRODUCTS AND SERVICES

BOOTH
SUPPORTER
Accuprobe, Inc. Probes, probe cards and probe card assembly services.
9
Air Products & Chemicals, Inc. Back End Packaging
20
AMST CO., LTD Probe Cards
1
Apex America, Inc. Probe Cards
51
Beijert Engineering Probe Card Analyzer
27

BucklingBeam Solutions, LLC

Vertical Probe Cards
6

Camtek USA

Semiconductor Wafer Inspection
36

Cascade Microtech

Pyramid Probe Cards & Gryphics
Test Sockets
12

Cognex Corporation

Wafer Prober Upgrade Kit
42

Dynamic Test Solutions - DTS

PBCs, Complete Turn-key
Test Hardware
31

Electroglas, Inc.

Wafer probers, prober-based test handlers test automation solutions
10

Electronic Apparatus NV

Design & Production of Printed Circuit Boards, Testboards for Wafer Testing
11

ERS America

Thermal Wafer Chucks
5

Everett Charles Technologies
(ECT)

Probe Cards-Design: FAB, VLCSP Contractors, Turnkey and Simulation Services
46

Feinmetall GmbH

Vertical Wafer Probe Cards
23

Fima SRL

High Quality PCBs for Testing
48
FormFactor Advanced Wafer Probe Cards
33
Hyphenated-Systems 3Dimensional Volume Inspection and Metrology
3
ICOS Vision Systems, Inc. 2D Surface Defect and 3D Bumped Wafer Inspection Systems 
45
Instec Inc Hot and Cold Chucks and Precision Temperature Controllers
52
Integrated Technology Corporation Probe Card Metrology and Repair Tools
22
Integrated Test Corporation Test boards and electro-mechanical
test hardware
32

International Contact Technologies, Inc.

Vertical Probe Card Technology
49

International Test Solutions

Non-destructive probe card cleaning materials, Probe tip shaping materials; on-site process evaluation
and laboratory testing services
7
inTest Silicon Valley Corp Semiconductor devices
25
JEM America, Inc. Probe Cards
34
Left Coast Instruments Probe card cleaners, probe and wafer inspection microscopes, probe card design, repair and manufacturing, chemical probe card cleaning solution, DeOx and ChemStrip chemical test socket cleaning solution.
8

Micronics Japan Co., Ltd.

Cantilever, Advanced Vertical, Advanced MEMS Technology
Probe Cards, Final Test Contractors
19

Microprobe, Inc.

Probe Cards
13
NHK Spring Co., Ltd Wafer Level Test Probe Cards for Logic, Memory, ASICS Applications,
Featuring FWLT, WLBI
24

OptimalTest Ltd.

Probe Card Management System
28
Oxford Lasers High Precision Laser Drilling for Vertical Probe Card Technology
15

Probe Logic

Cantilever and Vertical Probe Cards
26

Qualitau, Inc.

Test Equipment
47

R&D Circuits

Probe Cards, DUT Boards,
Contactors, Sockets
30
Rudolph Technologies Probe Card Analysis Systems, Probe Mark Inspection System, Wafer Probing Process Analysis System
43

Salland Engineering B.V.

Products & Tools for Testing
4

Scanimetrics

Non-contact Wafer Test Solutions
37

SUSS MicroTec Inc.

Probe Systems
39
SV Probe, Inc. Vertical, Cantilever & Blade Probe Cards
14

Synergetix

Test Sockets
35
TACONIC HRF Laminates and Advanced Materials for High Speed Digital and Chip Testing/Packaging Applications
53
Technoprobe, S.p.A. Probe Cards
2

T.I.P.S. Messtechnik GmbH

Probe Card Reshaping/Cleaning Tool, Probe Cards
44
Tokyo Electron Limited (TEL) Fully Automatic Wafer Probers
17

Topcon

Chip Defect Inspection
40
ToTo U.S.A., Inc. Ceramic Materials and Micro-hole drilling for Wafer Probe Cards
41
TSE Co., Ltd. 300mm 1T/D Probe Card
16
Wentworth Laboratories, Inc. Advanced Vertical Probe Card Products
21
Xena Technologies Cantilever and Vertical probe card needle assemblies
38
Xpress Test Solutions Semi Conductor Test
 
50
 

BOOTH CANCELLATION POLICY
A $250 non-refundable deposit must accompany completed application with the remaining balance due May 2, 2008. If assigned space is cancelled or reduced by exhibitor before the close of business Friday, May 2, 2008, a fee of 25% of total booth cost will be assessed. Cancellations received after May 2, 2008 will result in a full forfeiture.  If assigned space is cancelled or reduced by exhibitor after May 2, 2008 all fees paid will be retained. Any exhibitor who contracts and pays for exhibition space after May 2, 2008 will receive no refund for the cancellation or reduction of space, and/or full payment will still be due.
 

 

SUBLETTING OR SHARING SPACE POLICY
Exhibitor may not assign, sublet, or apportion to others, the whole or any part of the space allotted, and may not advertise or display goods or services other than those produced or sold by exhibitor in the regular course of its business. However, exhibitor may use equipment or products of another exhibitor or vendor in its booth(s) for the purpose of better presentation of exhibitor’s own products.

 
 
 

For further information on the SWTW-2008 and the Technical Program, please contact the appropriate SWTW Committee Chair ...
 

Jerry Broz, Ph.D.
General Chair
IEEE SW Test Workshop

(303) 885-1744
jerry.broz@swtest.org

Brett Crump
Technical Program Chair
IEEE SW Test Workshop

(208) 363-3745
bcrump@micron.com

William R. Mann
Chair Emeritus
IEEE SW Test Workshop

(949) 645-3294
william.mann@ieee.org

Maddie Harwood
Finance Chair
CEM, Inc.

(540) 937- 8280
maddie@cemamerica.com

Meredith M. Griffith
Registration / EXPO Coordinator
CEM, Inc.

(540) 827-4779
meredith@cemamerica.com
 


 


 

   
 

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Last updated: May 05, 2008