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Products and Services
EXPO SW Test 2008
(updated
5/5/2008)
Important Information for 2008 Exhibitors
BOOTH ASSIGNMENTS
(as of 5/5/2008)
|
EXHIBITOR |
PRODUCTS AND
SERVICES |
BOOTH |
SUPPORTER |
| Accuprobe, Inc.
|
Probes, probe
cards and probe card assembly services. |
9 |
|
| Air
Products & Chemicals, Inc. |
Back End
Packaging |
20 |
|
| AMST CO., LTD
|
Probe Cards
|
1 |
|
| Apex
America, Inc. |
Probe
Cards |
51 |
|
| Beijert Engineering |
Probe
Card Analyzer |
27 |
|
|
BucklingBeam Solutions, LLC |
Vertical Probe
Cards |
6 |
|
|
Camtek USA |
Semiconductor
Wafer Inspection |
36 |
|
|
Cascade Microtech |
Pyramid Probe
Cards & Gryphics Test Sockets |
12 |
|
|
Cognex Corporation |
Wafer Prober
Upgrade Kit |
42 |
|
|
Dynamic Test Solutions - DTS |
PBCs, Complete
Turn-key Test Hardware |
31 |
|
|
Electroglas, Inc. |
Wafer probers,
prober-based test handlers test automation solutions |
10 |
|
|
Electronic Apparatus NV |
Design &
Production of Printed Circuit Boards, Testboards for Wafer
Testing |
11 |
|
|
ERS America |
Thermal Wafer
Chucks |
5 |
|
|
Everett Charles Technologies (ECT) |
Probe
Cards-Design: FAB, VLCSP Contractors, Turnkey and Simulation
Services |
46 |
|
|
Feinmetall GmbH |
Vertical Wafer
Probe Cards |
23 |
|
|
Fima SRL
|
High Quality
PCBs for Testing |
48 |
|
| FormFactor |
Advanced Wafer
Probe Cards |
33 |
|
| Hyphenated-Systems |
3Dimensional
Volume Inspection and Metrology |
3 |
|
| ICOS Vision Systems,
Inc. |
2D Surface
Defect and 3D Bumped Wafer Inspection Systems |
45 |
|
| Instec Inc
|
Hot and Cold
Chucks and Precision Temperature Controllers |
52 |
|
| Integrated Technology
Corporation |
Probe Card
Metrology and Repair Tools |
22 |
|
| Integrated
Test Corporation |
Test boards and
electro-mechanical test hardware |
32 |
|
|
International Contact
Technologies, Inc. |
Vertical Probe
Card Technology |
49 |
|
|
International Test Solutions |
Non-destructive
probe card cleaning materials, Probe tip shaping materials;
on-site process evaluation and laboratory testing
services |
7 |
|
| inTest Silicon
Valley Corp |
Semiconductor
devices |
25 |
|
| JEM America,
Inc. |
Probe
Cards |
34 |
|
| Left
Coast Instruments |
Probe card
cleaners, probe and wafer inspection microscopes, probe card
design, repair and manufacturing, chemical probe card cleaning
solution, DeOx and ChemStrip chemical test socket cleaning
solution. |
8 |
|
|
Micronics Japan Co., Ltd. |
Cantilever,
Advanced Vertical, Advanced MEMS Technology Probe Cards,
Final Test Contractors |
19 |
|
|
Microprobe,
Inc. |
Probe Cards
|
13 |
|
| NHK Spring Co.,
Ltd |
Wafer Level Test Probe
Cards for Logic, Memory, ASICS Applications, Featuring
FWLT, WLBI |
24 |
|
|
OptimalTest Ltd. |
Probe Card
Management System |
28 |
|
| Oxford
Lasers |
High Precision
Laser Drilling for Vertical Probe Card Technology |
15 |
|
|
Probe
Logic |
Cantilever and
Vertical Probe Cards |
26 |
|
|
Qualitau, Inc. |
Test Equipment
|
47 |
|
|
R&D Circuits |
Probe Cards,
DUT Boards, Contactors, Sockets |
30 |
|
| Rudolph
Technologies |
Probe Card
Analysis Systems, Probe Mark Inspection System, Wafer Probing
Process Analysis System |
43 |
|
|
Salland Engineering B.V. |
Products &
Tools for Testing |
4 |
|
|
Scanimetrics |
Non-contact
Wafer Test Solutions |
37 |
|
|
SUSS MicroTec Inc. |
Probe Systems
|
39 |
|
| SV Probe, Inc. |
Vertical,
Cantilever & Blade Probe Cards |
14 |
|
|
Synergetix |
Test Sockets
|
35 |
|
| TACONIC |
HRF Laminates
and Advanced Materials for High Speed Digital and Chip
Testing/Packaging Applications |
53 |
|
| Technoprobe,
S.p.A. |
Probe
Cards |
2 |
|
|
T.I.P.S. Messtechnik GmbH |
Probe Card
Reshaping/Cleaning Tool, Probe Cards |
44 |
|
| Tokyo
Electron Limited (TEL) |
Fully Automatic
Wafer Probers |
17 |
|
Topcon |
Chip Defect
Inspection |
40 |
|
| ToTo U.S.A., Inc. |
Ceramic Materials and Micro-hole drilling for Wafer Probe Cards |
41 |
|
| TSE
Co., Ltd. |
300mm 1T/D
Probe Card |
16 |
|
| Wentworth
Laboratories, Inc. |
Advanced
Vertical Probe Card Products |
21 |
|
| Xena
Technologies |
Cantilever and
Vertical probe card needle assemblies |
38 |
|
| Xpress Test
Solutions |
Semi Conductor
Test |
50 |
|
|
|
|
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BOOTH CANCELLATION POLICY
A $250 non-refundable deposit must accompany completed application with the
remaining balance due May 2, 2008. If assigned space is cancelled or reduced
by exhibitor before the close of business Friday, May 2, 2008, a fee of 25%
of total booth cost will be assessed. Cancellations received after May 2,
2008 will result in a full forfeiture. If assigned space is cancelled
or reduced by exhibitor after May 2, 2008 all fees paid will be retained.
Any exhibitor who contracts and pays for exhibition space after May 2, 2008
will receive no refund for the cancellation or reduction of space, and/or
full payment will still be due.
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SUBLETTING OR SHARING SPACE POLICY
Exhibitor may not assign, sublet, or apportion to others, the whole or any
part of the space allotted, and may not advertise or display goods or
services other than those produced or sold by exhibitor in the regular
course of its business. However, exhibitor may use equipment or products of
another exhibitor or vendor in its booth(s) for the purpose of better
presentation of exhibitor’s own products. |
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For further information on the SWTW-2008 and the Technical Program,
please contact the appropriate SWTW Committee Chair ...
|
|
Jerry Broz, Ph.D.
General Chair
IEEE SW Test Workshop
(303) 885-1744
jerry.broz@swtest.org |
Brett Crump
Technical Program Chair
IEEE SW Test Workshop
(208) 363-3745
bcrump@micron.com
|
William R. Mann
Chair Emeritus
IEEE SW Test Workshop
(949) 645-3294
william.mann@ieee.org |
Maddie Harwood
Finance Chair
CEM, Inc.
(540) 937- 8280
maddie@cemamerica.com |
Meredith M. Griffith
Registration / EXPO Coordinator
CEM, Inc.
(540) 827-4779
meredith@cemamerica.com |
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