SW Test Expo

The SW Test EXPO is the Who’s Who of industry leaders in the semiconductor wafer test industry.

The top probe card, probe equipment and related service suppliers will showcase the latest products and services at SW Test 2018.

You’ll never have a better opportunity to meet face-to-face with the leading suppliers in one place, at one time in a relaxed atmosphere, enhanced by great food, open bars, and all your industry friends and colleagues.

Check out the list of industry leading exhibitors and corporate sponsors below.

2018 Exhibitors

Our 2018 exhibitors are looking forward to seeing old friends and meeting new ones.  Please be sure to stop by their booths for the latest and greatest in products and services.

Booth Number: Bernardo – #106
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Description:
TBD

Contact:
Masatomo Takahashi | takahashimt@accretech.jp
2968-2, Ishikawa-machi, Hachioji-shi 1920032 Japan
Tel: +1-214-459-1688 | Fax: +1-214-459-1696

Booth Number: Tent – #7
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Description:
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems with an installed base of more than 2,500 systems worldwide for both burn-in / test of integrated circuits and optoelectronics devices such as: VCSELs, Laser Diodes, LEDs, Gesture Recognition, Proximity Sensors and Contact Image Sensors (CIS).

Contact:
www.aehr.com
Carl Kasinski | ckasinski@aehr.com
400 Kato Terrace, Fremont, CA 94539, USA
Tel: +358-2-274-6040

Booth Number: Bernardo – #204
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Description:
Afore provides unique probe stations with real physical stimulus. Chamber type prober AIOLOS for vacuum and environmental sensor testing and rotating prober KRONOS for motions sensor testing in wafer level.

Contact:
Ari Kuukkala | ari.kuukkala@afore.fi
Vakiotie 5 Lieto 21420 Finland
Tel: +1-510-623-9400 | Fax: +1-510-623-9450

Booth Number: Tent – #36
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Description:
Celadon produces high performance probe cards for production parametric, multi-probe, modeling & characterization, burn-in and wafer level reliability. Celadon probe cards thrive in extreme test environments, deliver accurate measurements and precise data and with a very low cost of ownership.

Contact:
Garrett Tranquillo | garrett.tranquillo@celadonsystems.com
13795 Frontier Court, Burnsville, MN 55337, USA
Tel: +1-952-232-1700

Booth Number: Tent – #3
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Description:
Chunghwa Precision Test Tech. Co., Ltd. (CHPT) was founded on Aug. 26, 2005. It was located in Pingzhen Industrial Park, Taoyuan City. CHPT was the high-speed PCB team in the Chunghwa Telecom Laboratories. We have been focusing on the interface board services required for testing in the semiconductor industry since 2001. Our primary products are Load Board for IC test, probe PCB for wafer test, substrate for vertical probe card and DUT board for memory test.

Contact:
Hsueh-Fen Hsieh | annabellehsieh@cht-pt.com.tw
3120 de la Cruz Blvd, Suite 110, Santa Clara, CA 95054 USA
Tel: +886-9-394-1633-1

Booth Number: Tent – #22
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Description:
We are a leader in the computer-aided engineering, design, manufacturing and
assembly of complex printed circuit boards. Working in partnership with you, we develop next level, simple solutions for the sophisticated ate world. We deliver in the shortest time to market, in order to help you sustain your competitive advantage.

Contact:
Tom Mordue | tmordue@cmrsummit.com
473 Sapena Ct., Suite 11, Santa Clara, CA 95054, USA
Tel: +1-408-844-9550 | Fax: +1-408-844-9550

Booth Number: Tent – #30
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Description:
Complete Probe Solutions Inc. is the premier licensed manufacturer of Electroglas brand wafer probers. CPS provides unparalleled support through distributors and representatives around the globe. Complete Probe Solutions also represents manufacturers of innovative products designed for the semiconductor industry.

Contact:
Sancho Adam
sadam@completeprobesolutions.com
393- E Tomkins Court, Gilroy, CA 95020, USA
Tel: +1-408-755-5567

Booth Number: Tent – #17
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Description:
Wafer Level Burn-in Provider.

Contact:
Glenn Prince | glenn@delta-v.com
1870 Firman, Richardson, TX, 75081, USA
Tel: +1-972-644-6501

Booth Number: Bernardo – #206
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Description:
Deringer-Ney Inc. specializes in the manufacture of platinum group metal alloys. In addition to custom alloy development, the company’s fabrication capabilities include precision machining, stamping, insert molding and micro-molding, miniature wire forming, MICROmfg cold heading, dissimilar metals joining, and clean room contract assembly services. Our manufacturing facilities create custom solutions for customers that range from prototype to full volume production quantities.

Contact:
Bruce Quimby | dmaynard@deringerney.com
353 Woodland Avenue, Bloomfield, CT 06002 USA
Tel: +1-860-286-6101

Booth Number: Tent – #26
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Description:
ERS has been supplying innovative thermal test solutions to the semiconductor industry since 1970 and is famous for fast-ramping and precise low-noise thermal systems (-65°C to +300°C) for analytical, parametric and wafer sort probing up to 300mm.

Contact:
Harald Ibele | ibele@ers-gmbh.de
Stettiner Strasse 3, Germering, 82110, Germany
Tel: +49 (0)89 894132-0 | Fax: +49 (0)89 8418766

Feinmetall GmbH logo 2018Booth Number: Tent – #23
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Description:
Feinmetall has a long-term experience in design and fabrication of probe cards for wafer test.

Contact:
Sascha Bernhardt | sascha.bernhardt@feinmetall.de
Zeppelinstr. 8, Herenberg 71083, Germany
Tel: +49-171-5372072

Booth Number: Bernardo – #109
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Description:
Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market.

Contact:
info@ferrotec.com | 3945 Freedom Circle #450,
Santa Clara, CA 95054, USA
Tel: +1-408-964-7700

Booth Number: Tent – #4
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Description:
FormFactor, Inc. is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America. For more information, visit the Company’s website at www.formfactor.com.

Contact:
info_usa@formfactor.com
7005 Southfront Road, Livermore, CA 94551, USA
Tel: +1-925-290-4000

Booth Number: Tent – #13
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Description:
Headquartered in Santa Clara, California, Harbor Electronics is one of the world’s preeminent providers of advanced PCBs for the semiconductor test market. Founded in 1995 to support ATE applications, Harbor joined forces with Shenzhen Fastprint Circuit Technology in 2015 to become the largest ATE PCB supplier in the world. We are proud to be a part of the mission critical supply chain for the top semiconductor companies of the world.

Contact:
Chris Cuda | chris.cuda@harbor-electronics.com
3021 Kenneth Street, Santa Clara, CA 95054
Tel: +1-408-988-6544

Booth Number: #B1
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Description:
For wafer test industry, e. g. probe card or needle manufacturer, Heraeus is offering precious metal based materials for the use at the heart of probe cards: The interface between wafer and the tester’s periphery. A variety of alloys is available for customers in order to produce cantilever needles, elements for vertical probing and other interfaces for carrying high currents, offering good signal-to-noise ratio and / or withstand corrosion effects strongly.

Contact:
Marc Raettig | marc.raettig@heraeus.com
Heraeusstrasse 12-14, Hanau 63450, Germany
Tel: +49-171-5372072

Booth Number: Tent – #37
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Description:
We are a chemical manufacturing company that started from the research and development of ‘insulating varnish’ in Japan in 1912. Since then, we have developed a ‘technology platform’ consisting of ‘material technologies’, ‘process technologies’, and ‘evaluation technologies’. And with these technologies, We contribute to society by delivering ‘wonders’ that exceed the expectations of our customers. At SWTest, we introduce and exhibit unique PWBs.

Contact:
Eijiro Ikegami | ikegami@hitachi-chemical.com
2150 N First St. Suite 350, San Jose, CA 95131, USA

Booth Number: #B4
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Description:
INNO Global Inc. will provide PiS® Technology for interposer.
PiS® (Pin in Silicone) makes tension with silicone. Pin embedded in Silicone body.
Simple structure, just pin in silicone, can make fine pitch solution and reduce test cost.
0.2mm pitch or over 20GHz for high frequency test. Less Noise & Crosstalk with PiS design.

Contact:
Alex Lee | alex@inno50.com
123 Cheomdan Gwagiro, Gwagnju 61005, South Korea
Tel: +82-2-572-1525

Booth Number: Bernardo – #104
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Description:
TBD

Contact:
Zak Williamson | purchasing@instec.com
5589 Arapahoe Ave, Suite 208, Boulder, CO 80303, USA
Tel: +1-303-444-4608

Booth Number: Bernardo – #110
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Description:
Integrated Technology Corporation has been serving the needs of our customers for more than 35 years. We provide solutions for metrology and testing equipment in many areas:
– Test, analysis, and repair of IC probe cards
– Innovative metrology and inspection solutions
– Solutions for dynamic testing of power semiconductors

Contact:
Mark McLaren | markm@inttechcorp.com
1228 N Stadem Drive, Tempe, AZ 85281, USA
Tel: +1-480-612-2182

Booth Number: Tent – #2
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Description:
Design, manufacture and assemble printed circuits boards and hardware interface solutions for the ATE Industry.

Contact:
Tim Barr | tbarr@integratedtest.com
10365 Sanden Dr, Dallas, TX 75238, USA

Booth Number: Tent – #5
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Description:
Since 1999, International Test Solutions has been the leading global supplier of highly engineered cleaning materials supporting the semiconductor industry. ITS products are used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW). International Test Solutions provides critical materials and turnkey products that enable device manufactures and foundries to maximize uptime and throughput for substantial cost of test savings.

Contact:
Cooper Smith | coopers@inttest.net
1595 Meadow Wood Lane, Reno, NV 89502, USA
Tel: +1-775-284-9220 | Fax: +1-775-284-9227

Booth Number: Tent – #27
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Description:
inTEST Corporation designs and manufactures engineered solutions for ATE and other electronic test, as well as industrial process applications. Our products are used by semiconductor manufacturers to perform development, qualifying and final testing of integrated circuits (ICs) and wafers, and for other electronic test across a range of industries including the automotive, defense/aerospace, energy, industrial and telecommunications markets.

Contact:
Dan Adney | d.adney@intest.com
47777 Warm Springs Blvd, Freemont, CA 94539, USA
Tel: +1-408-678-9123

Booth Number: Bernardo – #101
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Description:
IWIN develops test parts and produces test equipment for the post processes of semiconductors. We offer products of the best correspondence and the top quality for customer needs.

Contact:
AJ Park | aj@iwinsn.com
201 CBTP Yangcheongri, Ochang, Cheongju Chungbuk, 28115, Korea
Tel: +82-43-212-7580 | Fax: +82-43-211-1231

Booth Number: Tent – #6
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Description:
JEM is a leading manufacturer of advanced probe cards and card-to-tester interfaces for semiconductor manufacturers worldwide. Products include MEMS, vertical, cantilever and parametric probe cards and custom PCB design services.

Contact:
Karen Wong | sales@jemam.com
3000 Laurelview Court, Fremont, CA 94538, USA
Tel: +1-510-683-9234 | Fax: +1-510-683-9790

Booth Number: Tent – #31
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Description:
Johnstech designs and manufactures test contactors (sockets) with the industry’s highest electrical and mechanical performance. Our products are the most stable and accurate tests, delivering reliable results for a wide range of applications. A total solution company, Johnstech also provides services to support your product from idea to market. ISO 9001: 2015 Certified.

Contact:
info@johnstech.com
1210 New Brighton Blvd., Minneapolis, MN 55413, USA
Tel: +1-612-378-2020

Booth Number: Bernardo – #107
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Description:
KJET products include Laser Scriber machine, Breaking machine, and L-Stroke Marking Machine, Laser marking machine. Our services also include cutting and drilling for use in Hard Brittle Materials, Excimer laser Micromachining, and Laser Marking.

Contact:
Vivi | vlo@kjet.com.tw
6F-6, No.81, Shuilee Rd., Hsinchu 30059, Taiwan
Tel: +886-3-575-0210

Booth Number: Tent – #42
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Description:
Distributor of handler, Prober and Wire Probe Head.

Contact:
Max Goto | mgoto@kanematsuusa.com
2043 Zanker Road, San Jose, CA 95131, USA
Tel: +1-847-981-5600

Booth Number: Bernardo – #205
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Description:
Test Probe / Spring Pins Manufacturer

Contact:
Keith Waterman | kwaterman@kita-usa.com
64 Water Street, Attleboro, MA 02703, USA
Tel: +1-774-331-2265 | Fax: +1-508-455-2245

Booth Number: Tent – #41
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Description:
Kyocera provides multilayer ceramic substrates, with single-layer or multilayer thin-film metallization, for DRAM, flash memory and logic device (multi-DUT) wafer probe cards.

Contact:
Iris Labadie | iris.labadie@kyocera.com
8611 Balboa Ave., San Diego, CA 92123, USA
Tel: +1-858-576-2600 | Fax: +1-858-569-9412

Booth Number: Tent – #29
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Description:
LEENO offers you the most comprehensive assortment of test, i.e. Spring Contact Test Probes, IC Test Sockets, WLCSP Probe Card/Probe Head, Secondary Battery Charging Discharging Probes and Parts of Medical Equipment. Our strength is to have customized solutions. Here you can learn more about the wide range of products and services from LEENO.

Contact:
Jay Kim | sjkim@leeno.co.kr
3003 N.1st Street, San Jose, CA 95134, USA
Tel: +82-(0)51-831-3232

Booth Number: Tent – #8
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Description:
Leica Microsystems develops and manufactures microscopes and scientific instruments for the analysis of microstructures and nanostructures. The company is one of the market leaders in compound and stereo microscopy, digital microscopy, confocal laser scanning microscopy, electron microscopy sample preparation, optical coherence tomography, and surgical microscopes.

Contact:
Bob Cowden | bob.cowden@leica-microsystems.com
1700 Leider Lane, Buffalo Grove, IL 60089, USA
Tel: +1-800-248-0223

Booth Number: Tent – #12
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Description:
LeoLSI has been creating cost-effective Multi Channel Switch IC solutions in partnership with customers, who are in Industrial markets for over 10 years.
Many of our industry-experienced Engineers, who are now covering automotive industry, are looking forward to meeting you and to defining the solution which will completely meet your needs.

Contact:
Jintaek Lee | jtlee@leolsi.com
414, Hyoryeong-ro, Seocho-gu, Jungsung Bd. 1F, Seoul 06728, South Korea
Tel: +82-2-581-5510 | Fax: +82-2-518-5509

Booth Number: Bernardo – #207
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Description:
MarTek, Inc., the only Electroglas OEM, is a global supplier of automatic wafer probe systems supporting and manufacturing Electroglas products. MarTek is now the sole owner of all Electroglas IP.

Contact:
John Luis | john@martekprober.com
112 S Rockford Dr. Ste 103, Tempe, AZ 85281, USA
Tel: +1-480-947-5757 | Fax: +1-480-967-5757

melexis inspired engineering logoBooth Number: Bernardo – #200
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Description:
Combining a passion for technology with truly inspired engineering, Melexis designs, develops and delivers innovative micro-electronic solutions that enable designers to turn ideas into applications that support the best imaginable future. The company’s advanced mixed-signal semiconductor sensor and actuator components address the challenges of integrating sensing, driving and communication into next-generation products and systems that improve safety, raise efficiency, support sustainability and enhance comfort.

Melexis is headquartered in Belgium and employs over 1,400 people in 19 locations worldwide. The company is publicly traded on Euronext Brussels (MELE). For more information, visit www.melexis.com.

Contact:
Geert Gouwy | ggo@melexis.com
Rozendaalstraat 12, 8900 Ieper, Belgium

Booth Number: Bernardo – #103
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Description:
Microfriend Inc. is specialized in 3D MEMS probe card for wafer level memory test. Since 2004, Microfriend Inc. have developed a unique construction of probe with MEMS technology, which becomes the best solution for wafer level testing.

Contact:
Wayne Jeong | hsjeong@microfriend.co.kr
10F Seoul Techno Park #232, Gongneung-ro, Nowon-gu, Seoul, S. Korea
Tel: +82-2-944-6440 | Fax: +82-2-944-6403

Booth Number: Tent – #1
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Description:
MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce a portfolio of high performance test sockets: J-Contact and Bee-Contact, for the semiconductor industry.

Contact:
John Jordan | johnj@mjcelectronics.com
11004 Metric Blvd., Austin, TX 78758, USA
Tel: +1-512-276-8951 | Fax: +1-512-276-8955

Booth Number: Tent – #9
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Description:
MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI dedicates in producing state-of-art fine pitch probing tool which enhances the speed of worldwide semiconductor technology migration.

Contact:
Cahris Lin | Cahris.Lin@mpi.com.tw
No. 155, Chung-Ho St.,
Chu-pei City, Hsinchu County, 302 Taiwan (R.O.C.)
Tel: +886-3-555-1771 Ext.8608 | Fax: +886-3-551-8381

Booth Number: #B2
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Description:
NextWave 360 provides full service semiconductor test solutions to our customer’s most critical and time sensitive new products integrations through collaboration and partnerships that allows the continued innovation of solutions that bridge the technology gap.

Contact:
Bud Stevens | bstevens@nextwave-360.com
343 Caledonia Street, Saint Johnsbury, VT 05819, USA
Tel: +82-(0)51-831-3232

Booth Number: Tent – #32
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Description:
TBD

Contact:
JB Hollstein | jhollstein@svprobe.com
7810 S. Hardy Drive, #109, Tempe, AZ 85284, USA
Tel: +1-480-635-4700 | Fax: +1-480-558-7440

Booth Number: Tent – #21
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Description:
NTK Technologies is a leader in IC Ceramic Packaging. Large and small scale Ceramic STFs are manufactured for high-speed/high density probe-cards for semiconductor wafer test. NTK supports fast paced product cycle times with our advanced design and production flows featuring high precision processes for fast turn-around with the highest quality.

Contact:
Mariel Stoops | mstoops@ntktech.com
3979 Freedom Circle Drive, Santa Clara, CA 95054, USA
Tel: +1-408-727-5180 | Fax: +1-408-727-5076

Booth Number: Bernardo – #202
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Description:
TBD

Contact:
John Roy | jwroy@opteclasersystems.com
11622 El Camino Real #100, San Diego, CA 92130, USA
Tel: +1-858-220-1070

Booth Number: Tent – #20
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Description:
Laser Micro Machining. We use the power of laser light to make extremely precise alterations to just about any material. Your quality manufacturing partner in laser micro-hole drilling for probe card, guide plate production.

Contact:
Andrew Webb | andy.webb@opteksystems.com
12 Pilgrim Road, Greenville, SC 29607, USA
Tel: +1-864-272-2640 | Fax: +1-864-272-2630

Booth Number: Tent – #33
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Description:
TBD

Contact:
Alan Ferguson | alan.ferguson@oxfordlasers.com
2 Shaker Road, Unit B104, Shirley, MA 01464, USA
Tel: +1-978-425-0755 | Fax: +1-978-425-4487

Booth Number: Tent – #11
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Description:
PacTech USA Packaging Technologies, Inc. offers contract wafer bumping services using low-cost
UBM (electro-less Ni/Au), solder stencil printing, and solder ball placement for quickturn and mass production. PacTech USA also provides product demonstrations, training, and sales support. PacTech designs and manufactures wafer bumping and assembly equipment for flip chip, WLCSP, and interposers. PacTech is the worldwide leader in laser reflow and heating technology, implemented in systems for solder jetting (SB2) and flip chip attachment (LAPLACE)

Contact:
Richard McKee | richard.mckee@pactech.com
328 Martin Ave, Santa Clara, CA 95050, USA
Tel: +1-408-579-4212

Booth Number: Tent – #18
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Description:
TBD

Contact:
Larry Furman | larry@plastronics.com
2601 Texas Drive, Irving, TX 75062, USA
Tel: +1-972-258-2580 | Fax: +1-972-258-6771

Booth Number: Bernardo – #102
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Description:
Leader in micro technologies for mass production, Posalux is a Swiss company specialized in mechanical engineering, focusing on markets needing high-tech equipments.
Our main markets are Electronics, Automotive, Medical and Watch industry.

Contact:
Fernando Martinez | fmartinez@posalux.com
Rue Fritz-Oppliger 18, Biel/Bienne, 2504 Switzerland
Tel: +41 (0)32-344-75-00 | Fax: +41 (0)32-344-77-01

Booth Number: Tent – #40
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Description:
Prober.com specializes in the refurbishment and resale of wafer probers, as well as integration of Thermal Chucks and OCR solutions.

We can provide onsite inspections, service and operations training.

We also are manufacturer representatives for SEMICS OPUS3 and SYNAX Handlers.

Contact:
Jacqueline Bonciolini | jacqueline@prober.com
15532 SW Pacific Hwy., Suite C1B 501, Oregon, OR 97224, USA
Tel: +1-503-822-5182 | Fax: +1-503-822-5182

Booth Number: Tent – #28
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Description:
R&D Altanova specializes in advanced automated test equipment interface boards for the semi-conductor test market. Solutions include the simulation, design, layout, fabrication, and component & mechanical assembly of test interface boards. R&D Altanova is the leading provider of full turn-key test interface solutions to many of the world’s largest integrated device manufacturers, fabless semiconductor companies and semiconductor foundries.

Contact:
Seyed Paransun | sparansun@rdaltanova.com
3601 S Clinton Ave, South Plainfield, NJ 07080, USA
Tel: +1-844-732-5826 | Fax: +1-732-549-1388

Booth Number: Tent – #16
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Booth Number: Bernardo – #209
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Rudolph Technologies LogoBooth Number: Tent – #38
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Booth Number: Tent – #25
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Booth Number: Tent – #14
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Technoprobe LogoBooth Number: Tent – #34
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Booth Number: Tent – #10
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Booth Number: Tent – #39
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Tokyo ElectronBooth Number: Tent – #24
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Booth Number: Tent – #15
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Booth Number: Bernardo – #210
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Booth Number: Tent – #19
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Booth Number: Tent – #35
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Booth Number: Bernardo – #105
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Booth Number: Bernardo – #203
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EXPO Maps

2018 Sponsors

Platinum Sponsors

Technoprobe Logo

Gold Sponsors

Rudolph Technologies Logo
Tokyo Electron
melexis inspired engineering logo

Silver Sponsors

Feinmetall GmbH logo 2018

Industry Sponsors