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7-:00 AM - 1:00 PM |
2nd Annual SWTW Golf Tournament |
7:00 - 8:00 |
Box Breakfast |
8:00 |
Tee Off: Scramble, Reverse Shotgun Format |
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2:00 PM - 5:00 PM |
Tutorial |
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Tutorial (Part 1): Use of Resource Sharing Techniques to Increase Parallel Test and Test Coverage in Wafer Test
Michael Huebner, Ph.D. (FormFactor) |
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Tutorial (Part 2): Methods of analyzing/predicting scrub margin for pads and bump applications
Tom Watson and Amy Leong (FormFactor) |
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| 4:00 PM
- 6:00 PM REGISTRATION |
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| 6:00 PM
- 7:00 PM WELCOME RECEPTION |
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| 7:00 PM - 8:15 PM BUFFET DINNER |
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8:15 PM - 9:45 PM |
Evening Session |
8:15 - 8:30 |
Probe Year in Review
Jerry Broz, Ph.D., General Chair |
8:30
- 9:45 |
KEYNOTE
Yervant Zorian, Ph.D.
Fellow & Chief Architect, Synopsys, Inc. |
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| 9:45 PM NETWORKING |
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| 7:00 AM - 8:00 AM REGISTRATION & CONTINENTAL BREAKFAST |
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| 8:00 AM - 8:30 AM |
Welcome |
8:00 - 8:30 |
Welcome to SWTW-2013
Jerry Broz, Ph.D., General Chair |
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| 8:30 AM - 10:00 AM |
SESSION 1: Fine Pitch Bump and Pillar Probing |
8:30
- 9:00 |
Utilizing Advanced Modular Space Transformer & Enhanced Probes to Resolve Customer-Specific Challenge
Rehan Kazmi (SV Probe) Mark Ojeda (Spansion) |
9:00
- 9:30 |
Probing Study of Fine-pitch Cu Pillars
Amy Leong (FormFactor.) Alexander Wittig (Globalfoundries) Tin Nguyen (Formfactor) Darko Hulic (Nikad); Mike Slessor (FormFactor) |
9:30
- 10:00 |
Very Small Pitch True Silicon Via Array Probing
Gunther Boehm (FeinMetall GmbH) |
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| 10:00 AM
- 10:30 AM COFFEE BREAK |
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| 10:30 AM
- 12:00 PM |
SESSION 2: Industry Trends and Advanced Packaging Challenges |
10:30
- 11:00 |
Consolidation at the Leading Edge - Time to Review the Options
John West (VLSI Research Europe) |
11:00
- 11:30 |
Trends, Challenges, and Solutions in Advanced SoC Wafer Probe
Mike Slessor (FormFactor) Jarek Kister (FormFactor) Ben Eldridge (FormFactor) Tin Nguyen (Formfactor) Amy Leong (FormFactor Inc. - San Jose, USA) |
11:30
- 12:00 |
Ideal 3D Stacked Die Test
Ira Feldman (Feldman Engineering Corp.) |
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| 12:00 NOON - 1:00 PM LUNCH |
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| 1:00 PM - 2:30 PM |
SESSION 3: Productivity & Accuracy Challenges in Probing |
1:00
- 1:30 |
Accurate Probe Positioning by Using Low CTE Ceramic Substrate for 12 " Testing
Joonyeon Kim (Samsung Electronics) Jooyong Kim (Samsung Electro-Mechanics Co.Ltd) Yunhwi Park (Samsung Electro-Mechanics Co.Ltd) |
1:30
- 2:00 |
Probing@hot Temperature - New Approach to Accuracy
Harald Berger (Robert-Bosch GmbH) Walter Seitz (Robert-Bosch GmbH) |
2:00
- 2:30 |
A New Probe Card Changer to Increase Tester Utilization and Improve Data Integrity
Bryan Root (Celadon Systems, Inc.) Bill Funk (Celadon Systems, Inc.) |
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| 2:30 PM
- 3:00 PM COFFEE BREAK |
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| 3:00 PM
- 4:30 PM |
SESSION 4: Probe Card Design and Repair |
3:00
- 3:30 |
Key Design Practices of High Pincount Cobra Probecard
Joey Wu (MPI Corp) Tony Yu (MPI Corp.) |
3:30
- 4:00 |
Automated Probe Card Repair Based on an Advanced Closed Loop Manufacturing Approach
Stefan Scherer (Alicona Imaging GmbH) Mark Raleigh (Alicona Corporation) Stefan Scherer (Alicona Corp) |
4:00
- 4:30 |
When Brick Wall is Not the Best, PART II (A Touch Down Optimization Study)
Alan Wegleitner (Texas Instruments) Tommie Berry (FormFactor) |
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| 5:00 PM
- 8:00 PM |
EXHIBITS OPEN |
| 5:00 PM - 8:00 PM CARVING STATION DINNER |
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| 8:00 PM NETWORKING |
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| 7:00 AM - 8:00 AM CONTINENTAL BREAKFAST |
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| 8:00 AM - 10:00 AM |
SESSION 5: Power Delivery Challenges |
8:00
- 8:30 |
Small Probes, High Currents, Short Pulses
Gert Hohenwarter (GateWave Northern, Inc.) |
8:30
- 9:00 |
What Burns My Probes
Richard Studnicki (SanDisk) |
9:00
- 9:30 |
"Sparking" Challenges: AC High Voltage Wafer Test
Georg Franz (T.I.P.S. Messtechnik GmbH) Rainer Gaggl (T.I.P.S. Messtechnik GmbH) |
9:30
- 10:00 |
Next Generation Probe Materials
Edward Smith (Deringer Ney, Inc.) Jason Kumnick (Deringer Ney, Inc.) Art Klein (Deringer Ney, Inc.) |
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| 10:00 AM
- 10:30 AM COFFEE BREAK |
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| 10:30 AM
- 12:00 PM |
SESSION 6: Taking Probing Into New Directions |
10:30
- 11:00 |
A Fine Pitch MEMS Probe Card with Built in Active Device for 3D IC Test Co-Authored: Advantesst & IBM
Greg Medrick (Advantest America, Inc.) Lakshmikanth Namburi (Advantest America, Inc.) Gary Maier (IBM) |
11:00
- 11:30 |
Wafer Translators: High Performance Full Wafer Contact
Morgan Johnson (Advanced Inquiry Systems, Inc.) Mr. Fred Weiss (Advanced Inquiry Systems, Inc.) |
11:30
- 12:00 |
Novel Probe Card with High Count of Needles in Single Sheet for Universal Wafer Testing
Gunsei Kimoto (ProbeAce Co.,Ltd.) |
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| 12:00 NOON - 1:00 PM LUNCH |
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| 1:00 PM - 3:00 PM |
SESSION 7: High Performance Probing in Volume Production |
1:00
- 1:30 |
LPDDR2 and LPDDR3 High Speed Wafer Test for KGD
Yosuke Kawamata (TeraProbe) Takeshi Yanagisawa (ELPIDA Memory Inc) Marc Loranger (Form Factor Inc) |
1:30
- 2:00 |
Full Wafer Probe Cards for Mixed Signal Products
Jan Martens (NXP Semiconductors Germany GmbH) Thomas Dabelstein (NXP Semiconductors Germany GmbH) Marcel Bleyl (NXP Semiconductors Germany GmbH) Simon Allgaier (Feinmetall) |
2:00
- 2:30 |
The Cost of Quality – Challenges of High Volume Memory Wafer Test
John Caldwell (Micron Technology) Alistair Laing (Micron Technology) Aaron Woodard (Micron Technology) Jarod Hunter (Micron Technology) |
2:30
- 3:00 |
High Performance 0.35 mm Pitch Elastomeric Contact and Spring Probe Development by Stamping Process
AJ Park (IWIN CO.,Ltd.) Samuel Park (IWIN Co.,Ltd) |
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| 3:00 PM
- 5:00 PM |
EXHIBITS OPEN |
3:00 - 5:00 |
PM Break - Refreshments Served |
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| 6:00 PM
- 9:00 PM |
SOCIAL: San Diego Heritage Celebration |
6:00 - 9:00 |
Cocktail Reception, Dinner, and Live Entertainment |
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June 12 , 2013 (Wednesday) |
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| 7:00 AM - 8:00 AM CONTINENTAL BREAKFAST |
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| 8:00 AM - 9:30 AM |
SESSION 8: Probe Potpourri |
8:00
- 8:30 |
Study of Cantilever Probes and Probe Marks
Stevan Hunter (ON Semiconductor) |
8:30
- 9:00 |
Probing of Bump Wafer: TPEG MEMS T3 versus Cobra-like Technology
Daniel Newman (STM Singapore) Mohammad Ridwan (STM Singapore) Severine Angles (STM Grenoble) Albert Lim (Technoprobe Asia) Raffaele Vallauri (Technoprobe Spa) Marco Prea (Technoprobe S.p.A.) |
9:00
- 9:30 |
Beyond ISMI: Electric Current Capacity of Vertical Probes Under Pulsed and Transient Signals
Kevin Hughes (Formfactor Inc.) |
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| 9:30 AM
- 10:00 AM COFFEE BREAK |
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| 10:00 AM
- 12:00 PM |
SESSION 9: Challenges of High Frequency Test |
10:00
- 10:30 |
Effect of Wide Pitch at mmWave Frequencies and Design Recommendations
Daniel Bock (Cascade Microtech) |
10:30
- 11:00 |
High Frequency PCB Material Analysis
Jason Mroczkowski (Multitest) |
11:00
- 11:30 |
Multi Wiring Board Technology for Next Generation High Speed Application
Hiroyuki Yamaguchi (Hitachi Chemical Co.,Ltd.) Takehisa Sakurai (Hitachi Chemical Co.America, Ltd.) |
11:30
- 12:00 |
SW Test 2013 Awards Session
Jerry Broz, Ph.D., General Chair |
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| 12:00 NOON - 1:00 PM LUNCH |
