Program

SW Test Program Overview

The 28th Annual SW Test Workshop will be held at the Rancho Bernardo Inn in San Diego, California, from June 3-6, 2018. The conference will begin on Sunday morning with a golf tournament and Sunday afternoon with a topical tutorial, followed by a welcome reception, dinner, and a Keynote Speaker. The Technical Program will start Monday morning with 30-minute presentations in theme-oriented sessions. SW Test EXPO 2018 will showcase many of the key suppliers to the wafer probe industry and, as always, there will be ample opportunities for networking. This year, we will also feature two poster sessions during which attendees can meet with authors face-to-face. The conference will conclude on Wednesday at Noon after an awards presentation. Conference registration includes all meals, refreshments, social activities, and technical program and exhibit attendance, as well as the eProceedings.

Sunday, June 3, 2018

7:00 AM – 1:00 PM 7th Annual SW Test William Mann Golf Tournament
7:00 – 8:00 AM Box Breakfast
8:00 AM Tee Off: Scramble, Reverse Shotgun Format
2:00 – 4:00 PM Get Your Tutor On!

Tutorial Chair: Mr. Clark Liu (PTI – HsiChu, Taiwan)

2:00 – 2:30 PM Probe Card Stability during High Temperature Testing

Authors: Ms. Yan Chen (Nidec SV TCL – Tempe, USA), Mr. Trung Ngoc (Nidec SV TCL – Singapore Industrial Park, Thuan An Dist., Vietnam)

 2:30 – 3:00 PM A Novel Measurement Method for Measuring CCC and MAC at once

Authors: Dr. Matthias Schnaithmann (FEINMETALL GmbH – Herrenberg, Germany), Mr. Achim Weiland (FEINMETALL GmbH – Herrenberg, Germany), Mr. Gunther Boehm (FEINMETALL GmbH – Herrenberg, Germany)

 3:00 – 3:30 PM Advances in MEMS Spring Probe Technology for Wafer Test Applications

Authors: Mr. Koji Ogiwara (SV TCL – Tokyo, Japan), Mr. Norihiro Ohta (Nidec-read – Kyoto, Japan)

 3:30 – 4:00 PM New Approach in Pogo Pin Socket Design to Improve Total Cost of Ownership

Author: Mr. Richard Incognito (Texas Instruments – Angeles City, Philippines)

4:00 – 6:00 PM: Registration Open

6:00 – 7:00 PM: Welcome Reception (Aragon Lawn)

7:00 – 8:15 PM: Buffet Dinner (Aragon Ballroom)

8:15  – 9:45 PM Evening Session
8:15 – 8:30 PM Opening Remarks for SW Test 2018
Jerry Broz, Ph.D., SW Test General Chair
8:30 – 9:45 PM KEYNOTE

Brett Debenham
Senior Director of Test Probe Central Engineering
Micron Technology, Inc.

Read more about Brett Debenham

9:45 PM: Networking / Hospitality Suites

Monday, June 4, 2018

7:00 – 8:00 AM: Continental Breakfast

7:00 – 5:00 PM: Registration

8:00 – 8:30 AM Welcome
8:00 – 8:30 AM Welcome to SWTest 2018
Jerry Broz, Ph.D., General Chair
8:30 – 10:00 AM Session #1: Wafer Test Trends and Complications

Session Chair: Jerry Broz, Ph.D., SW Test General Chair

8:30 – 9:00 AM Probe Card Market Update

Presenter: Ms. Lin Fu (VLSI Research – Cambridge, United Kingdom)

9:00 – 9:30 AM Device interface complexity challenges of the next decade

Presenter: Mr. Steve Ledford (Teradyne – North Reading, USA)

9:30 – 10:00 AM 5G: The Next Disruptive Technology in Production Test 

Authors: Mr. Daniel Bock (FormFactor – Beaverton, USA), Mr. Mike Bishop (FormFactor – Beaverton, USA), Mr. Jeff Damm (FormFactor – Beaverton, USA), Mr. Balbir Singh (Intel – Folsom, USA), Mr. Bob Murphy (Intel – Folsom, USA), Mr. Michael Hemena (Intel – Folsom, USA), Mr. Michael Engelhardt (Intel – Folsom, USA)

10:00 – 10:30 AM: Coffee Break

10:30  – 12:00 PM Session #2: Advanced Probing Process!

Session Chair: Mr. Geert Gouwy (Melexis – Ieper, Belgium)

10:30 – 11:00 AM Effects of Aluminum Pad Stack Thickness On the AOT/POT of a 1-Touchdown Probing Process

Authors: Mr. Alistair Laing (Micron Technology, USA), Ms. Miho Kitayama (Micronics Japan Corp. – Aomori, Japan), Mr. Yuma Tanaka (Micronics Japan Corp. – Aomori, Japan), Mr. Dick Duncan (MJC Electronics – Boise, USA)
Presenter: Mr. Aaron Woodard (Micron Technology, USA)

11:00 – 11:30 AM Probing solutions and inherent customization to enable advanced copper-based 3D integration schemes

Authors: Mr. Dong-pill Yang (Samsung Electronics Co., Ltd – Hwasung city, Korea), Mr. Jung-woo Sung (Samsung Electronics Co., Ltd – Hwasung city , Korea), Mr. Daniele Acconcia (Technoprobe – Cernusco Lombardone, Italy) Dr. Andrea Calaon (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy)
Presenters: Dr. Emanuele Bertarelli (Technoprobe – Cernusco Lombardone, Italy), Mr. Daniel Lee (Technoprobe Korea Co. Ltd – Yongin-city, Korea)

11:30 – 12:00 PM Leading-Edge Wide-I/O2 Memory Probing Challenges: TPEG™ MEMS Solution

Authors: Mr. Ferenc Fodor (IMEC – Leuven, Belgium), Mr. Erik Jan Marinissen (IMEC – Leuven, Belgium), Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Daniele Acconcia (Technoprobe – Cernusco Lombardone, Italy)
Presenter: Mr. Ferenc Fodor (IMEC – Leuven, Belgium)

12:00 – 1:00 PM: Lunch

1:00 – 3:00 PM Session #3: All About The Probe!

Session Chair: Dr. Darren James (Rudolph Technologies – Bloomington, USA)

1:00 – 1:30 PM TPEG Mantis: a new solution for multiple advanced applications 

Authors: Mr. Davide Sangiorgio (STMicroelectronics SPA – Catania, Italy), Mr. Marco Sciurba (STMicroelectronics SPA – Catania, Italy), Mr. Tommaso Masi (Technoprobe SpA – Cernusco Lombardone (LC), Italy), Mr. Riccardo Vettori)

1:30 – 2:00 PM New probe design and development for high current capacity using bi-furcated structure

Presenter: Mr. Joonyeon Kim (Samsung Electronics – Hwasung city, Korea)

2:00 – 2:30 PM Advanced cantilever probes showing similar advantages as their vertical opponent

Contact: Mr. Franz Steger (Texas Instruments Deuschland GmbH – Freising, Germany)

2:30 – 3:00 PM: Coffee Break

Poster Session 1
Probe Optimization

Monday Afternoon
2:30 – 3:00 PM

Session Chair: Mr. John Caldwell (Micron Technology – Boise, USA)

  • Optimizing Probe Tip Cleaning and Shaping using Advanced Polymers
    Author: Mr. Alex Poles (International Test Solutions – Reno, USA)
  • Innovative Laser Micro-Machining Improves Probe Card Fabrication in Many Ways
    Author: Mr. Hung-Lung Chen (KJet Laser Tek Inc. – HsinCHu City, Taiwan)
  • Tri-Temperature Probing: -55C to >125C
    Authors: Mr. Chris Buckholtz (Teradyne, Inc. – Agoura Hills, USA), Mr. Roger Sinsheimer (Teradyne, Inc. – Agoura Hills, USA)
  • Data Driven Comparison and Qualification of WLCSP Probe Technologies
    Author: Mr. Bert Brost (Xcerra Corporation – St. Paul, USA)
3:00 – 4:30 PM Session #4: Dial Up the Frequency!

Session Chair: Mr. Joey Wu (STAr Technologies – Hsinchu, Taiwan)

3:00 – 3:30 PM

PCB Test Solution for 5th Generation Mobile Communications Presenter: Norman Hsu

Contact: Ms. Ching Fang Tseng (Chunghwa Precision Test Tech. Co.,Ltd. – Taoyuan, Taiwan)

3:30 – 4:00 PM WLCSP xWave for high frequency wafer probe applications

Contact: Mr. Jason Mroczkowski (Multitest – St. Paul, USA)

4:00 – 4:30 PM TPEG™ MEMS RF+ Technology for Vertical Probe Heads

Authors: Dr. Andrea Calaon (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Antonio Mola (STMicroelectronics – Tours, France), Mr. Daniele Acconcia (Technoprobe – Cernusco Lombardone, Italy), Mr. Alberto Berizzi (Technoprobe – Cernusco Lombardone, Italy)

4:30 – 5:00 PM Enabling High Parallelism in Production RF Test 

Contact: Mr. Patrick Rhodes (FormFactor – Livermore, USA)

3:00 – 8:00 PM Exhibits Open in Expo Tent and Bernardo Expo Hall
3:00 PM

Expo Scavenger Hunt Begins – Scan all participating exhibitors’ bar codes for a chance to win fabulous prizes!

5:00 PM Reception & Carving Station Dinner in Bernardo Hall Expo and Expo Tent

Tuesday, June 5, 2018

7:00 – 8:00 AM: Continental Breakfast

7:00 AM – 3:00 PM: Registration Open

8:00 – 10:00 AM Session #5: Extreme Wafer Probing (ONE)!

Session Chair: Ms. Karen Armendariz (Celadon Systems – Burnsville, USA)

8:00 – 8:30 AM Break the Myth of Wafer Probing On Cu for Fan-out Wafer Level Packaging (FOWLP)

Authors: Ms. Amy Leong (FormFactor Inc. – San Jose, USA), Mr. Chang-Hoon Hyun (Samsung Electronics/S.LSI Division – Yongin-City, Korea), Mr. Ashish Bhardwaj (FormFactor Inc. – Livermore, USA), Mr. KH Kim (FormFactor Inc – Bundang-Gu Sungnam-Si, Korea)

8:30 – 9:00 AM Micro burn-in techniques at wafer-level test to implement cost effective solutions

Authors: Mr. Geert Gouwy (Melexis – Ieper, Belgium), Dr. Alessandro Antonioli (Technoprobe – Cernusco Lombardone, Italy), Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Arnaud Devos (Melexis – B-Ieper, Belgium)

9:00 – 9:30 AM Carbon Nanotube Based Microprobe Design for Electromechanical Probing Applications at Wafer Level Chip Scale and Wafer Level Packaging

Authors: Mr. Mehmet Tas (University of Surrey – Guildford, United Kingdom), Dr. Vlad Stolojan (University of Surrey – Guildford, United Kingdom), Mr. Mark Baker (University of Surrey – Guildford, United Kingdom), Mr. Jedidiah Bentz (Smiths Interconnect plc – Stuart, USA) Dr. Keir Boxshall (Smiths Group – London, United Kingdom)

9:30 – 10:00 AM A second study on chuck automatic tilting and chuck force sensing for minimizing probe pin damage and optimization of overdrive

Presenter/Author: Mr. Byung-Hyun Shin (Semics – Gwangju-si, Korea)

10:00 – 10:30 AM: Coffee Break

Poster Session 2
Probe Infrastructure – Equipment

Tuesday Morning
10:00 – 10:30 AM

Session Chair: Mr. Mark Ojeda (Cypress Semiconductor – San Jose, USA)

  • Improvements in Laser Drilled Hole Geometries for Probe Card Applications (Poster)
    Authors
    : Mr. Andrew webb (OpTek Systems Inc. – Greenville, USA), Dr. Mike Osborne (OpTek Systems Ltd. – Abingdon, United Kingdom)
  • Improvements in small pitch capability
    Author
    : Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)
  • Temperature Test on Wafer Level – History and outlook in the days of advanced packaging in semiconductor
    Author(s): Mr. Harald Ibele (ERS electronic GmbH – Germering, Germany)
  • Modern Probe Card Analysis… Addressing Emerging Needs Cost-Effectively
    Authors: Mr. Kjell Lundberg (Rudolph Technologies – North Bend, USA), Mr. Greg Olmstead (Rudolph Technologies – North Bend, USA), Mr. Audria Hurst (Rudolph Technologies – North Bend, USA), Mr. John Strom (Rudolph Technologies – North Bend, USA)
10:30 AM – 12:00 PM Session #6: Extreme Wafer Probing (TWO)!

Session Chair: Ms. Amy Leong (FormFactor Inc. – San Jose, USA)

10:30 – 11:00 AM Known Good “Power” Die: Diced Wafer Test at 7 kV and 1000 A 

Authors: Dr. Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Villach, Austria), Mr. Mauro Serra (CREA s.r.l. – Torino, Italy), Mr. Ernest Fischer (INFOTECH AG – Solothurn, Switzerland)

11:00 – 11:30 AM Vertical MEMS Probe Card Applied to High Speed Loopback Test of Network Communication IC 

Authors: Mr. Haiyong Song ( Hisilicon Technologies Co., Ltd. A Huawei Company – ShangHai, China), Mr. Zheng Li ( Hisilicon Technologies Co., Ltd. A Huawei Company – ShangHai, China), Mr. Adolph Cheng (MPI Corporation – Chu-Pei, Taiwan), Mr. Fred Chou (MPI Corporation – Chu-Pei, Taiwan), Mr. Alex Wei (MPI Corporation – Chu-Pei, Taiwan), Ms. Jessie Deng (MPI Corporation – Chu-Pei, Taiwan), Mr. Zach Hsieh (MPI Corporation – Chu-Pei, Taiwan), Mr. Bobby Chen (MPI Corporation – Chu-Pei, Taiwan)

11:30 – 12:00 AM A Real Life Pad Crack Study 

Authors: Mr. Gunther Boehm (FEINMETALL GmbH – Herrenberg, Germany), Mr. Jory Twitchell (NXP, USA)

12:00 AM Noon – 1:00 PM: Lunch

1:00 – 3:00 PM Session #7: Probe Cleaning and Wafer Inspection!

Session Chair: Ms. Suz Ramsbottom

1:00 – 1:30 PM Fast Probe Mark Inspection (PMI) 

Contact: Mr. Imran Ahmed (Texas Instruments Inc – Dallas, USA)

1:30 – 2:00 PM Cleaning Material Evaluations on Advanced MEMS and Vertical Technologies 

Contact: Mr. Vincent Ellis (Texas Instruments, Inc. – Dallas, USA)

2:00 – 2:30 PM OCR Automation 

Contact: Mr. Hector Moreno (Texas Instruments Inc. – Dallas, USA)

2:30 – 3:00 PM Test Cell Co-Planarity Optimization

Presenter/Author: Mr. Troy Harnisch (Teradyne, Inc. – Agoura Hills, USA)

3:00 – 5:00 PM Exhibits Open
3:00 – 5:00 PM PM Break – Refreshments Served in both Expo Tent and Bernardo Expo Hall

Expo Scavenger Hunt Continues – Scan all participating exhibitors’ bar codes for a chance to win fabulous prizes!

Wednesday, June 6, 2018

7:00 – 8:00 AM: Continental Breakfast

7:30 – 10:00 AM: Registration Open

8:00 – 10:00 AM Session #8: Probe Potpourri!

Session Chair: Dr. Michael Huebner (FormFactor – Livermore, USA)

8:00 – 8:30 AM Design and Analysis of Space Transformer with Hybrid Circuit Design on Probe Card 

Authors: Mr. Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea), Mr. Yong Ho Cho (Microfriend Inc. – Nowongu, Korea), Mr. SangKyu Yoo (Samsung Electronics – Hwasung City, Korea), Mr. Jong Gwan Yook (Yonsei Univ. – Shinchon-dong, Korea)

8:30 – 9:00 AM Automated Probe-Mark Analysis 

Author(s): Ms. Yu-Rong Jian (National Tsing Hua University – Hsinchu, Taiwan), Mr. Ferenc Fodor (IMEC – Leuven, Belgium), Mr. Erik Jan Marinissen (IMEC – Leuven, Belgium), Prof. Cheng-Wen Wu (National Tsing Hua University – Hsinchu, Taiwan)  

9:00 – 9:30 AM New Probe Testing Methodology-Over Current Analysis of Probe Presenter: Norman Hsu 

Author: Ms. Ching Fang Tseng (Chunghwa Precision Test Tech. Co.,Ltd. – Taoyuan, Taiwan) 

9:30 – 10:00 AM Advances in metrology for guide plate analysis 

Presenter: Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)

10:00 – 10:30 AM: Coffee Break

10:30 – 11:30 AM Session #9: High Performance Space Transformers & PCB’s!

Session Chair: Mr. Rey Rincon (SWTest – Austin, USA)

10:30 – 11:00 AM Sub-milliOhm impedances on a thick probe card? No problem! 

Contact: Mr. Sandeep Sankararaman (R&D Altanova – San Jose, USA)

11:00 – 11:30 AM An introduction for novel multi-layer thin film substrates applied in space transformers 

Contact: Dr. Chih-Kuang Yang (Princotest Co. Ltd. – Hsinchu city, Taiwan)

11:30 AM – 12:00 Noon: Awards Ceremony and Conference Closing

2018 Sponsors

Platinum Sponsors

Technoprobe Logo

Gold Sponsors

Rudolph Technologies Logo
Tokyo Electron
melexis inspired engineering logo

Silver Sponsors

Feinmetall GmbH logo 2018

Industry Sponsors