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1994 Southwest Test Workshop
One-hundred and fifty-two test professionals attended
the two-and-a-half-day long 1994 edition of the Southwest Test
Workshop on May 23-25 at the San Diego Princess Hotel, Mission
Bay, California. Sixty-six companies were represented, with two-thirds
of the attendees from microelectronic manufacturers and one-third
from companies who supply services and equipment to the wafer-sort
industry. The 1994 workshop was the first in the series to focus
on wafer-level testing, addressing a need perceived by Bill Mann,
the workshop organizer. Workshop participants generally agreed
that the meeting was indeed timely and was apparently the first
national technical forum on wafer-level testing.
The program consisted of 26 technical presentations,
two open discussions, two panel discussions, and a guest speaker.
One-third of the presentations were from industry and two-thirds
from vendors. The vendors generally did a very good job addressing
issues and discussing technology instead of presenting product
sales pitches. While there were a few who momentarily lost control
and reverted to "sales" mode, the audience quickly
snapped them back into line. In the post-workshop survey, 83%
of the attendees felt that the numerous vendor presentations
worked out well. Even the 17% attendees who thought there was
a little too much "selling" going on rated the overall
workshop as 13% excellent, 50% very good, and 25% good.
The workshop began Sunday evening, May 22, with
registration, a reception, and a buffet Mexican dinner. A panel
discussion on the mechanical and electrical interface between
probers and testers followed. Three prober vendors and three
ATE vendors discussed their experiences, alliances, and some
lessons learned.
Formal technical presentations began Monday morning
with the participants discussing needle-probe cards and membrane
cards. After lunch, the three major production-prober manufacturers
presented their vision of next-generation equipment. Bill had
planned that everyone would then participate in a miniature golf
tournament to promote professional networking, but workshop attendance
was much larger than the hotel's course could hold. Consequently,
the more athletic attendees golfed while the rest enjoyed an
impromptu panel on probe-card technologies.
That evening, everyone enjoyed dinner and then
heard from guest speaker Jim Mulady, a veteran in microelectronic
testing, now editor-publisher of the Final Test Report. The presentations
continued Tuesday with probe-card standardization, sub- contracted
probe-card fabrication issues, and open discussion. The next
session dealt with the impact on the sort business of the JEDEC
Known-Good-Die standard. Experiences with hot-chuck probing were
described, followed by another open discussion. That afternoon
the workshop discussed off-line inking and inkless probing. On
Tuesday evening everyone enjoyed a beautiful Sunset Dinner Cruise
around Mission Bay. Wednesday, the workshop addressed the demands
of new higher- performance devices. Presentations described ultra-high-performance
probe cards, extremely low-capacitance prober-tester interfaces,
and area-array die probing (flip chip or C4 type devices). The
final theme was identifying and correcting probe-card wearout.
The workshop was an almost overwhelming success.
Originally planned for 50 to 75 participants, it quickly grew
and registration had to be limited to 150 participants two weeks
before the workshop. Wafer testing has always been a critical
and highly specialized area of microelectronic testing, and the
attendees truly appreciated the opportunity for a national technical
forum on the topic. The overall rating from attendees was 45%
excellent, 45% very good, and 8% good.
The workshop's success has led to a special panel
session at ITC '94. Panelists who participated in the workshop
will present workshop highlights and then will join an open discussion
with the audience. The panel session will be held on Monday evening,
October 3, at the Sheraton Washington Hotel, Washington DC. |