2004 Southwest Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS

Wafer Level Test Tutorial
Dinner Guest Speaker
Opening Session - Chairman's Welcome
Session 1 - Memory Probing
Session 2 - High Power Testing
Session 3 - Micro-Electronic Machine Technologies
Session 4 - Low-K Dielectric / Low Force Probing
Session 5 - Probe Card Analysis / Troubleshooting
Session 6 - Probe Process Characterization
Session 7 - Probe Pourri
Session 8 - Challenges, Challenges, and More Challenges

 

"Probe Card Tracking Operations Within SEMATECH Probe Council Member Companies"

"Cost-Effective Fully Tested Die with High Frequency and High Throughput Wafer Test Solution"

Masahide Ozawa Elpida Memory, Inc. 3-1-35 Minamihashimoto, Sagamihara Kanagawa, Japan 229-1197 +81-42-775-7117 ozawa-masahide@Elpida.com

Nobuhiro Kawamata FormFactor Inc., Asia Re-Ju Oh-imachi Bldg. 7F 4-13-17 Oh-i, Shinagawa-ku Tokyo, Japan 140-0014 +81-3-5746-3100 nkawamata@formfactor.com

"Adventures in Extreme Parallel Probing"

Roger Sinsheimer Xandex, Inc. 1125 N. McDowell Blvd. Petaluma, CA 94954 707 763-7799 x124 707 529-0873 (cell) rsinsheimer@xandex.com

Session 2 - HIGH POWER TESTING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  

"New Methodology for Vertical Probe Current Carrying Capacity Characterization"

Ron Kirby Intel Corporation 2501 NW 229th St. M/S RA1-321 Hillsboro, OR 97133 971-214-7012 ronald.m.kirby@intel.com

Hongfei Yan Intel Corporation 5000 W. Chandler Blvd. M/S CH2-112 Chandler, AZ 85226 480-552-4132 hongfei.yan@intel.com

"Vertical Probing Goes Power: Multi-Site Wafer Probing of Automotive ICs"

Rainer Gaggl, Ph.D. T.I.P.S. Messtechnik GmbH Getreideweg 1, A-9500 Villach, Austria +43 4242 319720 r.gaggl@tips.co.at

"Power Delivery Challenges of High Power Device at Sort"

Sayed Mobin Kevin Zhu Intel Corporation 2200 Mission College Blvd Santa Clara, CA 95054 408-765-6836 (W) 408-765-1252 (W) sayed.h.mobin@intel.com Kevin.zhu@intel.com

Session 3 - MICRO-ELECTRONIC MACHINED TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"Cantilever Based Ultra Fine Pitch Probing"

Christian Leth Petersen CAPRES Vancouver, Canada 604-322-9696 (work) 604-518-0660 (cell) clp@capres.com

Peter Folmer Nielsen Dirch Petersen CAPRES A/S Lyngby, Denmark pfn@capres.com clp@capres.com

"Study on Microprobe Processing by LIGA on Si - Fundamental Study for 3-D Model"

Teppei Kimura Japan Electronic Materials Corp. 2-5-13 Nishinagasu-Cho Amagasaki-City 660-0805, Japan +81-6-6482-8983 kimura@jem-net.co.jp

Tadashi Hattori Himeji Institute of Technology 3-1-2 Koto, Kamigori, Ako Hyogo 678-1205, Japan +81-791-58-0016 hattori@lasti.himeji-tech.ac.jp

Session 4 - LOW K DIELECTRIC / REDUCED FORCE PROBE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  


"Non-Damage Probing and Analysis of ILD Damage at Scrub Marks"

J. Yorita T. Haga Y. Hirata Osaka R&D Laboratories Sumitomo Electric Industries, LTD. 3-12-1, Kouto, Kamigori ,Ako Hyogo, 678-1205 Japan + 81-791-58-0652 yorita-jun@sei.co.jp

"Optimization of MicroSpring® Contact Design Parameters for Low Pressure Probing"

Rod Martens, Ph.D. Form Factor, Inc. 2140 Research Drive Livermore, CA 94550 925-456-3890 rmartens@formfactor.com

Larry Levy Form Factor, Inc. 2140 Research Drive Livermore, CA 94550 llevy@formfactor.com

Winner - Best Data Presentation
"Evaluation of Cantilever Probe-Induced Dielectric Cracks in Cu/Low-k Devices"

"Integrating Microhardness Testing into IC Evaluation"

Session 5 - PROBE CARD ANAYSIS / TROUBLESHOOTING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 
 

Winner - Most Inspirational Presentation
"Structural Stability of Shelf Probe Cards"

"Probe Card Troubleshooting Techniques"

Session 6 - PROBE PROCESS CHARACTERIZATION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  

"Dynamic Outlier Algorithm Selection for Quality Improvement and Test Program Optimization"

Session 7 - PROBE POURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"Gram Force Measurement Technology for a Low Cost Analyzer"

Winner - Most Innovative Technology Presentation
"Wireless Probe Card"

Session 8 - CHALLENGES, CHALLENGES, AND MORE CHALLENGES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 

"Challenges in 10GHz Transimpedance Amplifier (TIA) Production Testing"

Bill Williams, Freescale Semiconductor