2006 Southwest Test Workshop
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Bill Mann |
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"Managing
Subcontracted Testing"
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Mike Campbell Vice President of Engineering Qualcomm |
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CHAIRMAN'S WELCOME
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1 | Session 2 | Session 3
| Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Welcome
to SWTW-2006"
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Bill Mann |
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"SWTW Lifetime
Achievement Award" as presented by
Bill Mann
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K. Reed Gleason
Eric W. Strid Cascade MicroTech |
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Session 1 - HVM (High Volume Manufacturing) CHALLENGES
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| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Multiple Re-Sort Effects on Cu Bump
Technology"
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Weida Qian Zhongkai Xu James Stiehl Chris Tran Intel Corporation
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"Searching For Correlations In HVM Wafer
Testing"
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Zhineng Fan, Ph.D. Youssef Fassi Rey Rincon SV Probe |
Tuan Duong Intel Corporation
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"Development of Next Generation Probe
Card Maintenance Process for Wafer Sort"
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Zhiming Mei Intel Corporation |
Session 2 - MULTI-DUT / HIGH PIN METHODOLOGIES
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
Winner - Best Presentation,
Tutorial in Nature
"Lessons Learned Probing Power
Management Devices in a Multi-DUT Test Format"
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Paul O’Neil Cascade MicroTech Europe |
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"Low Force
Interface for Multi-DUT Logic and Memory Applications"
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Gerald Back Habib Kilicaslan SV Probe |
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"Methodology of
Stable Probe Card Power Path Design for Wafer Level Testing"
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Sayed Mobin Intel Corporation |
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Session 3 - PAD DAMAGE
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Modified Tool for
Developmental Analysis and Real Time QRA Probe Card and Sockets"
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Terence Q. Collier CVInc. |
Winner - Best Data Presentation
"Key Methods in
Reducing Pad Crack Risk at Probing Low-k Wafers"
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Frank Hwang Steve Hsu J. H. Chen TSMC |
Dean Yang Wensen Hung Jacky Tsai Micronics Japan Co. LTD
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"Controlling
Bond Pad Damage at 129C Probing"
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Daniel Fresquez Eddie McClanahan Al Wegleitner Texas Instruments, Inc. |
"Pad Damage
Management on the Test Floor"
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John Strom Applied Precision, LLC |
Session 4 - CRES METHODOLOGIES
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
Winner -
Most Inspirational Presentation
"Novel
Methodologies for Assessing On-line Probe Process Parameters"
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Jerry Broz, Ph.D. Brice Blanc Gene Humphrey International Test Solutions |
Rhett Moore Micron Technology
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Patrick Mui JEM – America
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Co-Winner - Best Technical
Presentation
"Parametric
Study of Contact Fritting for Improved CRes Stability"
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Dr. Christian Degen Oliver Nagler Michael Horn Dr. Florian Kaesen Infineon Technologies AG |
Co-Winner - Best Technical
Presentation
"Fritting – Experiences with Non-ohmic CRES While Wafer Test Probing"
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Jan Martens Philips Semiconductors – Hamburg |
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"CRES Control Using CDA as a Shielding Gas"
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Steve Austin Gary Grayson Al Wegleitner Texas Instruments, Inc. |
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Session 5 - LARGE AREA PROBING
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Prober Stability with Large Probing Area and High Pin-count"
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Gunther Boehm Feinmetall GmbH |
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"One
Touch 300mm Wafer Probing"
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Sunil Wijeyesekera Makarand Shinde FormFactor, Inc. |
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Roger Sinsheimer Xandex |
Session 6 - IMSI SEMATECH and PROBE METROLOGY PANEL
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| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"The Probe-Centric
Future of Test"
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Jack Courtney IBM Microelectronics |
Nadine Aldahhan Freescale |
Michael Egloff AMD |
"Probe
Metrology Panel Discussion"
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Nadine Aldahhan (Freescale) Darren Coil (Intel) Jack Courtney (IBM) Brett Crump (Micron) |
Mike Harris (Texas Instruments) Jens Kober (AMD) Ger Koch (Philips Semiconductor) Frank Pietzschmann (Qimonda) |
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Session 7 - PROBE POURRI
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1 | Session 2 | Session 3
| Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"High
Current Wafer Probing Solution"
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Mark McLaren Integrated Technology Corporation |
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"Maximizing the
Performance of an Atypical Cantilever Probe Wire Material"
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Frederick Taber Consultant |
"Bandwidth
Improvement Techniques on Probe Cards"
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Habib Kilicaslan Bahadir Tunaboylu, Ph.D. SV Probe |
"Implementing
Inkless Wafer Sort"
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Mark Banke Altera Corporation |
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Session 8 - PROBE TEST DATA MANAGEMENT
Top | Session
1 | Session 2 | Session 3
| Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Highly Efficient DPPM Programs
Depend on Pre-production and Post-probe Data Analysis"
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Michael Scott Greg Labonte Test Advantage, Inc. |
"Automated Correlation Wafer
Management and Processing"
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Jeffrey C. Quinton Delphi – Delco |
F. B. Lynch III Steve Sato Electroglas |
"Dynamic
Test-Cell Controller"
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Rob Marcelis Salland Engineering |
SWTW 2006 Chairs:
William Mann, General Chair
Jerry Broz,
Ph.D., International Test Solutions, Technical Program
Chair
Maddie Harwood, CEM Inc., Registration and Finance Chair
Megan White, CEM Inc., EXPO Coordinator
SWTW 2006 Program Committee:
Jack Courtney, IBM Microelectronics
Michael Egloff, AMD
Michael Harris, Texas Instruments
Ken Karklin, Agilent Technologies
Ger Koch, Philips Semiconductor
Scott Mitchell, Texas Instruments
Rey Rincon, Kulicke and Soffa
Phil Seitzer, Agere (Retired)
Roger Sinsheimer, Xandex
Tim Swettlen, Intel
Fred Taber, BiTS Workshop General Chair
Bill Williams, Freescale (Retired)