2009 IEEE SW Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS
Tutorial Session - Applied Metrology and Case Studies Tutorial
Dinner Session - Year in Review and Keynote
Opening Session - Chairman's Welcome
Session 1 - Large Area Array Probing
Session 2 - Signal Integrity
Session 3 - Sort Floor Data Analysis Methods
Session 4 - High Temperature Probing Challenges
Session 5 - Controlling Contact Resistance (CRES)
Session 6 - RF Probing Practices
Session 7 - Damage Control and Low Force Probing
Session 8 - Standards and Methods
Session 9 - Probe Potpourri

 

Download the SW Test 2009 Summary to be published in CPMT Newsletter.
Tutorials - APPLIED METROLOGY AND CASE STUDIES TUTORIAL
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
 

"Applied Metrology and Tool Gauge Studies"

Jerry Broz, Ph.D.
General Chair
SW Test Workshop		 Brett Crump
Technical Program Chair
 SW Test Workshop

 

 

"Assessing Metrology Tool Capability"

Jeff Greenberg
Rudolph Technologies

 

 


"Case studies of Wafer Sort Floor Problems "
Darren James
SW Test Committee
Rudolph Technologies

 

 

 


 DINNER SESSION
 Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Probe Year in Review"

Jerry Broz, Ph.D.
 General Chair
SW Test Workshop

  

 


Keynote Speaker - "Test Economics Driving Test Technology"

Risto Puhakka
President
VLSI Research

 

  



CHAIRMAN'S WELCOME AND OVERVIEW
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Welcome to Semiconductor Wafer (IEEE SW Test) Workshop 2009"

Jerry Broz, Ph.D.
General Chair
SW Test Workshop

  

 



Session 1 - LARGE ARRAY PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Highest Parallel Test for DRAM Enabled through Advanced TRE (Tester Resource Enhancement)"

Michael Huebner, Ph.D.
FormFactor, Inc.		  

 


"How to Buckle Under Pressure"
Scott Lindsey, Ph.D.
Chris Buckholtz
Aehr Test Systems		 Simon Allgaier Gunther Boehm Feinmetall GmbH

 


"Evaluation of Low Pressure MEMS Probes"
Scott Clegg
Krzysztof Dabrowiecki
Probelogic		 Shoichi Asanuma
TOTO
 

Darren James
Rudolph Technologies
 


"A Challenge of 150k Probes on 300mm"

Satoshi Sasaki
Yoshiro Nakata
Chip Test Technology Research Lab
Association of Super-Advanced Electronics Technologies		  

 



Session 2 - SIGNAL INTEGRITY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

 Winner - Best Presentation, Tutorial in Nature
"'Issues in Power Delivery System Performance Verification"

Gert Hohenwarter
GateWave Northern		  

 


"Kelvin Contactors for Wafer Scale Test"

Jim Brandes
Everett Charles Technologies		  

 


Winner - Most Inspirational Presentation
"Optimization of Wafer Level Test Hardware using Signal Integrity Simulation"

Jason Mroczkowski
Ryan Satrom
Everett Charles Technologies

 

 



Session 3 - SORT FLOOR DATA
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"A Probe Data Collection System - Test Head Cum-map (THC)"

Mark Winn
Intel Corp.

    


"Test Data Validation"

Rob Marcelis
Salland Engineering		    


"High Speed 3D Probe Mark Inspection"

Brad Lawrence
Aceris-3D Instruments		    


"Cost Effective Probe Card Metrology Tools"

Rod Schwartz
Integrated Technology Corp		    



Session 4 - HIGH TEMPERATURE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

 Winner - Best Data Presentation
"Hot Spot: High Temperature Probing"

Wolfgang Schaefer, Ph.D.
Gunther Boehm
Feinmetall GmbH

  

 


"'Improving Scrub Performance and Reducing Soak Time with a New Mechanism to Stabilize Probe Card Temperature"

Cameron Harker
Jeff Lin
Stuart Pearce
FormFactor, Inc.

    

 

"Optical SerDes Test Interface for High-Speed and Parallel Testing"

Sanghoon Lee, Ph.D.
Sejang Oh
Kyeongseon Shin
Wuisoo Lee
Samsung Electronics		  

 



Session 5 - CONTROLLING CONTACT RESISTANCE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Clean the Wafer, Not the Probe Card"

Terence Q. Collier
CVInc

 


"Investigating Copper Metallurgy Effects for Sort Process and Cleaning Performance Metrics"
Jan Martens
NXP Semiconductors
(Hamburg)		 Simon Allgaier
Feinmetall GmbH		 Jerry Broz, Ph.D.
International Test Solutions


"Advances in Offline Reshaping and Cleaning for Cantilever, Vertical and Lithographic Probe Cards– Tip Diameter Control for POAA"

Rainer Gaggl, Ph.D.
T.I.P.S. Messtechnik GmbH

Dominique Langlois
Altis Semiconductor


"The UltraSound CLEANER™ - A Non Destructive Cleaning Solution for PC, Optimizing Test Floor Yield and COO"

Herve Alle
SEMI Consulting



Session 6 - RF PROBING PRACTICES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Overcoming Challenges of High Multi-site, High Multi-port RF Wafer Sort Testing"

Daniel Watson
Teradyne		  


"mmWave RFIC Probing Systems for Engineering and Production Test"

Mark Roos
Roos Instruments

Roger Hayward
Cascade Microtech

 

 

"MicroProbe Vx-RF Probe Card Technology"

Mike Slessor, Ph.D.
January Kister
MicroProbe		 Christian Degan, Ph.D.
Oliver Nagler, Ph.D.
Mahmoud Nouri
Infineon GmbH



Session 7 - DAMAGE CONTROL AND LOW FORCE PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"High Speed Pre-Probe Wafer Inspection"

Brad Lawrence
Aceris-3D Instruments		    

 


"MEMS Technology - Enabling Design Flexibility for Fine Pitch Probing"

Bahadir Tunaboylu, Ph.D. Gerald Back
SV Probe


 


 


Winner - Best Technical Presentation
"An Experimental Work and Analysis of Vertical Cobra Probing on Low-k Wafers"

Yuan Huang
Gary Liu
Thompson Hsu
United Microelectronics Corp (UMC)

Wensen Hung
Cahris Lin
Dean Yang
MPI – Taiwan



Session 8 - STANDARDS AND METHODS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Effective Integration of Advanced Probe Card Technologies from Development to Production Test Floors"

James Tong
Norm Armendariz, Ph.D.
Texas Instruments


"50-um Pitch Vertical Probing"

John Wolfe
Norm Armendariz, Ph.D.
James Tong
 Texas Instruments

Fred Megna
Sato Minoru
Micronics Japan (MJC)


"ISMI Probe Council - Current Carrying Capability Measurement Standard"

Boyd Daniels
ISMI Probe Council Chair

 

 

"Rapid Diagnostics Using a Prober Based PCA"

Sammy Mok
VeraConnex

 


 Session 9 - PROBE POTPOURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Brittle Fracture of Ceramics - Introduction to Mechanical Behavior of Ceramics"

Krzysztof Dabrowiecki
Scott Clegg
Probelogic


"The Integration of RC Springprobe™ Technology into Massively Parallel, Discrete Node, Low Force Space Transformers"

Gordon A. Vinther
Ardent Concepts

 

 

SWTW 2009 Chairs:

  • Dr. Jerry Broz, International Test Solutions, General Chair

  • Brett Crump, Micron Technologies, Technical Program Chair

  • William Mann, General Chair Emeritus

  • Maddie Harwood, CEM, Inc.,Finance Chair

  • Meredith M. Griffith, CEM, Inc., Registration / EXPO Coordinator
     

SWTW 2009 Steering Committee:

  • Warren "Stu" Crippen, Intel

  • Darren James, Rudolph Technologies

  • Roger Hayward, Cascade Microtech

  • Ken Karklin, AeroVironment, Technical Program Committee

  • Jan Martens,  NXP Semiconductors Germany GmbH

  • Rod Martens, FormFactor, Inc.

  • Patrick Mui, JEM-America, Technical Program Committee

  • Frank Pietzschmann, Qimonda AG

  • Rey Rincon, Freescale Semiconductor

  • Fred Taber, BiTS Workshop, Proceedings Coordinator

 
 

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee, IEEE CPMT Society, IEEE Computer Society or the IEEE Test Technology Council.

Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a workshop environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.
 

 

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