2007 IEEE SW Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS

Tutorial Session - Probe Card Cleaning
Dinner Session - Year in Review and Keynote
Opening Session - Chairman's Welcome and Lifetime Achievement Award
Session 1 - Probe to Pad Mechanisms
Session 2 - Controlling Pad Damage
Session 3 - Strategic Design Methodologies
Session 4 - Large Area Array Probing
Session 5 - Advanced Probe Card Technologies
Session 6 - RF Probing
Session 7 - Probe Potpourri
Session 8 - Probe Interfaces and Connectivity
Session 9 - Probe Challenges
Poster Session

"Probe Tip Clean on Demand"

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DINNER SESSION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Probe Year in Review"

Keynote Speaker - "Sort Test Technology Development"

CHAIRMAN'S WELCOME
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Welcome to Semiconductor Wafer (SW) Test Workshop 2007"

"SWTW Lifetime Achievement Award" as presented by Jerry Broz, Ph.D.

Session 1 - PROBE TO PAD CONTACT MECHANISMS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Mark Inspection as Part of Quality and Reliability Tests In Automotive Devices"

"Effect of Different Wafer Pad Metallizations on ViProbe® Scrub Marks"

Sylvia Ehrler, Ph.D. Feinmetall GmbH

Winner - Best Data Presentation
"Electrical Contact Resistance - The Key Parameter in Probe Card Performance"

January Kister Steve Hopkins Microprobe, Inc.

Session 2 - CONTROLLING PAD DAMAGE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Wafer Probing Scrub Analysis to Optimize KGD Applications"

"Control of Pad Damage Using Prober Operational Parameters"

"Closing the Loop: Incorporating Sort Floor Data to Improve Probe Card Performance"

Session 3 - STRATEGIC DESIGN METHODOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"New Pathfinding and Supplier Investigation Strategy"

"Key Methods in Reducing Pad Crack Risk at Probing Low-k Wafers"

"Design Considerations for Parametric RF Probing in Production Test Environments"

"Measuring Z-Accuracy Using a Force Sensor"

Session 4 - LARGE AREA ARRAY PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Probes A New Dimension in Probe Count"

"Reinforcement of PCB using Advanced Stiffeners for High Pin Count Devices"

"Challenges in Testing High Force 300mm Probe Card Arrays"

Session 5 - ADVANCED PROBE CARD TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Revolutionary Changes in C4 Wafer Test Probe Card Technologies"

"Advanced Probe Card Technology Enables Specialty Memory Wafer Test Requirements"

"3D-MEMS Probe for Fine Pitch Probing"

"Hybrid Wafer Testing Probe Card"

Session 6 - RF PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Multi-site Probing for Consumer RF Applications"

"Advanced Probecard Architecture for Lower-cost RF Wafer Testing"

"Probe Card Characterization in Time and Frequency Domain"

Session 7 - PROBE POURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"ISMI Probe Council Probe Specification Guidelines and Cost of Ownership"

"Challenges of Vertical Probing for the 48 Core 11,700 Bump Count Vega2 Processor"

Winner - Best Technical Presentation
"ROUTE60™ : A New Vertical Probing Technology"

"Low Yield Response in High Volume Production"

Session 8 - INTERFACES AND CONNECTIVITY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Theory and Test Methods for Board-to-Board Interposer Technologies"

Winner - Most Inspirational Presentation
"Thin Film Interposer Probes in Production"

"Stud Bump Technology for Space Transformer Lifetime Improvement on Cobra Probe "

"WSP- Cost Effective Wafer Scale Probing of WLCSP Wafer Level Chip Scale Package"

Session 9 - INTERFACES AND CONNECTIVITY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

"Sort Process and Its Challenges on CMT Platform"

"The Influences of Signal Matching During Parallel Multi-Site Testing"

Winner - Best Presentation, Tutorial in Nature
"Taguchi's Method Applied to Probe Card Development"

POSTER SESSION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Poster

SWTW 2007 Chairs: