SWTest 2021 Program

Awarded Presentations

Best Overall Presentation

The Digital Revolution: NRZ to PAM4

Author/Presenter: David Raschko (FormFactor – USA)


Best Presentation, Tutorial in Nature

Millimeter-Wave Signal Integrity in a Dense Device-Interface-Board (DIB) Environment

Author/Presenter: Andrew Westwood (Teradyne, Inc. – USA)

Best Data Presentation

Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probecards

Author/Presenter: Cameron Harker (FormFactor – USA)


Probe to pad alignment improvement over wide temperature range for automotive applications with large probe array size, high parallelism and small pads size

Authors/Presenters: Emanuele Bertarelli, PhD (Technoprobe – Italy), Sebastien Usai (STMicroelectronics – France)

Most "Inspirational" Presentation

Evaluation of a MEMS Probing Solution for Scrub Mark Visibility on Automotive Devices with Nickel Palladium pads

Authors/Presenters: Karan Maniar (Nidec SV TCL – USA), Erwin Verardi (STMicroelectronics – Italy)

Monday Keynote Presentation

Rapid growth of 5G/mm-wave beyond Phone into Auto, IOT, Laptops, etc., and the pressure it puts on test, probe, and hardware demands.

William Miller
Vice President of EngineeringQualcomm Technologies, Inc.

Tuesday Keynote Presentation

The Growing Challenge of Testing Automotive Analog and Sensor Systems.

Hans Stork, PhD
Senior Vice President and CTO
ON Semiconductor

Session #1: Enabling 5G Test Strategies

Session Chair: Darren James (Onto Innovation)

The Digital Revolution: NRZ to PAM4

Author/Presenter: David Raschko (FormFactor – USA)


An Advanced Contact Solution Probe Card for RF & 5G using MEMS Coaxial Technology

Authors/Presenters: Tae Kyun Kim (Microfriend – Korea), Svetlana Garcia, PhD (Nidec SV TCL USA), Jong Gwan Yook (Yonsei Univ. – Korea) and Yong Ho Cho (Microfriend – Korea)


55GHz Octal-site Wafer Test Probecard for 5G mmWave devices

Author/Presenter: Jason Mroczkowski (COHU – USA)


Millimeter-Wave Signal Integrity in a Dense Device-Interface-Board (DIB) Environment

Author/Presenter: Andrew Westwood (Teradyne, Inc. – USA)

Session #2: Advanced Technologies

Session Chair: Session Chair: Karen Armendariz (Celadon Systems – USA)

Exploring Parametric and Test Structure Challenges

Author/Presenter: Mike Palumbo (Technoprobe – USA)


Evaluation of a MEMS Probing Solution for Scrub Mark Visibility on Automotive Devices with Nickel Palladium pads

Authors/Presenters: Karan Maniar (Nidec SV TCL – USA), Kyle Cotner (Nidec SV TCL – USA), Erwin Verardi (STMicroelectronics – Italy), Mattia De Nicola (STMicroelectronics – Italy)


Towerless vs Towered Probe Solutions; What is the most effective application for my wafer test interface?

Authors/Presenters: William Wyckoff (inTEST EMS – USA), Wally Haley (Qualcomm – USA)


Production Parametric Probe – An Essential Guide to Lowering Cost of Test While Probing Very Small Pads

Authors/Presenters: Riley Kaiser (Celadon Systems – USA), Karen Armendariz (Celadon Systems – USA), Jungtae Hwang (Global Foundries – USA)

Session #3: Large Array Probing

Session Chair: Mark Ojeda (Infineon – USA)

Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probecards

Authors/Presenters: Cameron Harker (FormFactor – USA), Yohannes Desta and Pouya Dastmalchi (FormFactor – USA)


Determine Thermal Expansion/Shrinkage Matching Between Wafer and Probe Card

Authors/Presenters: Woo Young Han (Onto Innovation – USA)


Probe to pad alignment improvement over wide temperature range for automotive applications with large probe array size, high parallelism and small pads size

Authors/Presenters: Raffaele Vallauri, Tommaso Masi, and Alessandro Cito (Technoprobe – Italy), Emanuele Bertarelli, PhD (Technoprobe – Italy), Mattia De Nicola (STMicroelectronics – Italy), Sebastien Usai (STMicroelectronics – France), Erziz Salam and Diperi Robert (STMicroelectronics – France)

Session #4: Large Array Probing

Session Chair: Patrick Mui (JEM America)

Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3GHz/6Gbps

Author/Presenter: Alan Liao (FormFactor – Livermore, USA)


Next Generation SmartMatrix Probe Card Technology Enables 3000-Parallelism 1TD Test for 1Z DRAM Process Node

Authors/Presenters: Joe Ceremuga (FormFactor – USA), Cameron Harker (FormFactor – USA)


A Vertical Probe Solution for the High-Density 5G Market

Authors/Presenters: Don Thompson (R&D Altanova – USA), Svetlana Garcia, PhD (Nidec SV TCL USA)


Evaluating the High Temperature Creep Performance of MEMS Vertical Technology Probes

Authors/Presenters: Dominik Schmidt (Translarity – USA), Raul Molina, Rambod Tabasi (Translarity – USA)

ON-Demand

3D magnetic sensor stimulation – new solutions for wafer probing

Authors/Presenters: Georg Franz (T.I.P.S. Messtechnik GmbH – Austria), Sebastian Salbrechter (T.I.P.S. Messtechnik GmbH – Austria), Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Austria)


Solutions to New Challenges in Advanced Vertical Guide Plates

Author/Presenter: Alan Ferguson, PhD (Oxford Lasers – United Kingdom)


Probe Card Total Cost of Ownership – Consumable economics in the Era of Complexity

Authors/Presenters: Steve Ledford (Teradyne – USA), Eric Shoemaker (Teradyne – USA)


High Power Goes Vertical

Authors/Presenters: Sebastian Salbrechter (T.I.P.S. Messtechnik GmbH – Austria), Mauro Serra (CREA s.r.l. – Italy)


High Power Wafertest – how to keep the temperature under control

Author/Presenter: Klemens Reitinger (ERS electronic GmbH – Germany)


WLCSP Spring Probe Pointing Accuracy and Wobble

Author/Presenter: Bert Brost (Technoprobe – USA)


Challenges & Resolutions for Spring Probe Application in WLCSP Testing

Authors/Presenters: Tim Wooden and Frank Zhou, PhD (Smiths Interconnect – USA)

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