2001 Southwest Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS

SEMATECH Project Update
Opening Session
Session 1 - High Performance Probing
Session 2 - Vertical Probing
Session 3 - Probe Process Assessment I: Capability
Session 4 - Probe Process Assessment II: Methods
Session 5 - Prober and Probe Card Analyzer Performance
Session 6 - Memory Probe
Session 7 - New Probe Technologies
Session 8 - Probe and Package Assembly
Session 9 - Probe Potpourri



SEMATECH PROJECT UPDATE

"International SEMATECH Wafer Probe Benchmarking Project"
Fred Taber
Probe Project Chair
IBM Microelectronics
ZIP 5E1
2070 Route 52
Hopewell Junction, NY 12533
845-894-2348
taber@us.ibm.com
   


OPENING SESSION

"Welcome to SWTW-2001"
Bill Mann
General Chair
Southwest Test Workshop
Newport Beach, CA 92660
949-645-3294
william.mann@ieee.org
   


Session 1 - HIGH PERFORMANCE PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Providing an Envelope of Solutions for Probing High Power (>100W) Die at Sort"
Tim Swettlen
Intel Corp.
2200 Mission College Blvd
Santa Clara, CA 95054
408-653-7846
tim.swettlen@intel.com

Winner - Best Data Presentation
"Silicon Finger Technology and the Photo-Finger Technology for High-Performance Probe"
Ted Khoury
Advantest America, Inc
1100 Busch Pkwy.
Buffalo Grove, IL 60089
847-634-2552
t.khoury@advantest.com
Robert Aldaz
Dr. David Yu
Gert Hohenwarter
Advantest America, Inc
1100 Busch Pkwy.
Buffalo Grove, IL 60089
 

"RF Signal Characterization of Probe Cards"
K. Helmreich
A. Lechner
Advantest Test Engineering Solutions GmbH
Stefan-George-Ring 8
Munchen, Germany
k.helmreich@advantest.de
a.lechner@advantest.de


Session 2 - VERTICAL PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

Winner - Most Inspirational Presentation
"A High Performance C4 Probe: TFI"
Gobinda Das, Ph.D.
Fredrick Taber
IBM Microelectronics
ZIP 5E1
2070 Route 52
Hopewell Junction, NY 12533
845-894-9967
gdas@us.ibm.com
taber@us.ibm.com
 

"Area Array Probe Card Interposer"
Raphael Robertazzi
IBM T.J. Watson Research Center
Building 801 Rt 134
MS 13-257
Yorktown Heights, NY 10598
914-945-3620
tazzi@us.ibm.com
   

"Micro-Probe's Apollo Vertical Card"
Stephen G. Hopkins
Micro-Probe
2281 Las Palmas Drive
Carlsbad, CA 92009
760-603-0631
shopkins@micron.net
   


Session 3 - PROBE PROCESS ASSESSMENT I - CAPABILITY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Distribution and Integrity of Probe Card Analyzer Data"
Scott Dobbins
Seagate Technology
1 Disc Drive
MS NRE110
Bloomington, MN 55435
952-844-7145
scott.d.dobbins@seagate.com
   

"Verification of Probing Accuracy"
Larry Hendler
Hendler Enterprises
6024 Silver Creek Valley Rd
San Jose, CA 95138
408-528-3280
lhendler@electroglas.com
Jeff Hintzke
Electroglas
6024 Silver Creek Valley Rd
San Jose, CA 95138
408-528-3157
jhintzke@electroglas.com
 

"ELMO Clean: One Year Later"
Peter Binkhoff
ELMOS Semiconductor AG
Heinrich-Hertz-Str. 1
Dortmund NRW D44227
Germany
+49-231-7549-291
pbinkhoff@elmos.de
 


Session 4 - PROBE PROCESS ASSESSMENT II - METHODS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Optimal Wafer Illumination for Machine Vision Applications on Silicon Wafers"
John R. Goulding
Electro Scientific Industries, Inc.
13900 NW Science Park Drive
Portland, Oregon USA 97229
503-672-5821
gouldingj@esi.com
   

"Effects of Z-Stage Motion control on Probe Contact Force"
Martín Martínez
ProbeSolutions – ESACORP
743 E. Goldenrod Str.
Phoenix, AZ., 85048
480-460-3727
martin.martinez@ESACORP.net
Uday Nayak
Electroglas, Inc.
6024 Silver Creek Valley Road
San Jose, CA. 95138
408-528-3399
unayak@electroglas.com
 

"Wafer Heat Distribution Analysis during Heated Chuck Wafer Probing using
Automated Visual Inspection
"
Thomas Dabelstein
Hans-Uwe Nitschke
Philips Semiconductors
Stresemannallee 101
D-22529 Hamburg - Germany
+49 (0)40 56 13-32 78
Thomas.Dabelstein@philips.com

Hans-uwe.Nitschke@philips.com
Mike Clay
Semiconductor Technology and Instruments, Inc.
2701 E. Pres. George Bush Hwy
Plano, Texas 75074
972-461-0373
mike.clay@sti-i.com


Session 5 - PROBER AND PROBE CARD ANALYZER PERFORMANCE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Prober and Probe Card Analyzer Performance Under Load"
Raymond Kraft, Ph.D.
Applied Precision, Inc.
1040 12th Avenue NW
Issaquah, WA 98027
425-557-1000
rkraft@api.com
   

"Probe Card Metrology for Mixed Signal Cards"
Rod Schwartz
Russ Allred
Daniel Koselki
Integrated Technology Corporation
1228 N. Stadem Drive
Tempe, Arizona 85281 USA
480-968-3459
rod@inttechcorp.com

"300-mm Probing-Error Analysis"
Uday Nayak
Electroglas, Inc.
6024 Silver Creek Valley Rd.
San Jose, CA 95138
408-528-3399
unayak@electroglas.com
   

"What Kind of Probe Card Analyzer Do We Really Need on the Wafer Test Floor?"
Frank Pietzschmann
Infineon Technologies Dresden
P.O. Box 10 09 40
01076 Dresden, Germany
++49 351 886 2032
frank.pietzschmann@infineon.com


Session 6 - MEMORY PROBE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"High Parallelism Memory Test Advances based on MicroSpring Contact Technology"
Thomas Homorodi
Form Factor, Inc.
2140 Research Drive
Livermore, CA 94550
925-456-3813
thomorodi@formfactor.com
Robert Martin
Form Factor, Inc.
2140 Research Drive
Livermore, CA 94550
925-456-3813
rmartin@formfactor.com
 

"KGD solution - At Speed Wafer Testing and Full Contact WLBI after Flip Chip Bumping"
An-Hong Liu , Ph.D.
ChipMOS Technologies, Inc.
No.5 NAN-KO Rd.7
Science-Based Industrial Park,
Tainan, Taiwan, R.O.C.
886-6-5052388, x 7108
john_liu@chipmos.com.tw
Yuan-Ping Tseng
ChipMOS Technologies, Inc.
No.1 R&D Rd.1
Science-Based Industrial Park
Hsinchu, Taiwan, R.O.C.
886-3-7550055 Ext.1206
noty_tseng@chipmos.com.tw

"MASKROM Auto Fail Bit Map Monitoring Algorithm and Applied Effect In Mass Production"
Dong-Seok Chae
Jae-Gyu Kim
Sung-Bu Jun
Jun-Kyue Bae
MASKROM Team Samsung Electronics
Korea
82-031-209-2070
dschae@samsung.co.kr

Winner - Best Technical Presentation
"Enabling X144 Flash Memory Test"
Roger Sinsheimer
Xandex, Inc.
1125 N. McDowell Blvd.
Petaluma, CA 94954
707 763-7799 x124
rsinsheimer@xandex.com
Ken Karklin
Agilent Technologies


Session 7 - NEW PROBE TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Silicon Probe: Semiconductor Testing Probe Utilizing Silicon Whiskers Grown by VLS (Vapor Liquid Solid) Method"
Yasunori Chiba
M. Kanai
T. Matsuo
H. Takizawa
Tokyo Cathode Laboratory Co.,Ltd.
1-49-1 Itabashi, Itabashi-ku
Tokyo, JAPAN 173-0004
03-3962-3510
chiba@tclab.co.jp
 

"Silicon Whiskers Probe Card"
Noriaki Nakazaki
Takuya Tsuruta
TOHO Electronics, Inc.
Tokyo, JAPAN
nakazaki@toho-inc.co.jp
 

"Fine Pitch Micro Probe Tips using Thin Film Amorphous Alloy under the Micro-Machining Fabrication Technology"
K. Wada
H. Kitazume
W. Narazaki
S. Motoyama
M. Miyazaki
T. Takoshima
Y. Maeda
Advantest Laboratories Ltd.
+81-22-392-8731
Tokyo, Japan
wada@atl.advantest.co.jp
S. Hata
A. Shimokohbe
Precision and Intelligence Laboratory
Tokyo Institute of Technology
+81-45-924-5094
Tokyo, Japan


Session 8 - PROBE AND PACKAGE ASSEMBLY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Wire Bondability Related to Probing"
Dominique Langlois
Altis Semiconductor Corbeil-Essonnes
France
+33 1 60 88 6933
Dominique.Langlois@altissemiconductor.com
Eugene Lim
Infineon Technologies Asia Pacific Pte. Ltd.
Singapore
065-840-0457
eugene.lim@infineon.com

"Building the Framework of an Integral Process to Ensure Fine Pitch Wire Bond and Probe Compatibility"
Kenneth Thompson
Sheila Chopin
Soosan Yoong
Motorola – Austin
Austin, TX
kenneth.e.thompson@motorola.com
r15179@email.sps.mot.com
r41887@email.sps.mot.com

"How Bad's the Damage? - Evaluating Probe Damage on Aluminum, Solder, Gold, UBM, and Copper Pads"
Ken Smith
Cascade MicroTech
Portland, OR
503-601-1955
Ken_Smith@cmicro.com
   


Session 9 - PROBE POTPOURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"35um Pitch Fine Pitch Probe Card"
Japan Micronics    


"Always Trouble with Planarity and Alignment? Solved with Vertical Probe Cards"
Klaus Giringer
Gunther Boehm
Feinmetall GmbH
Germany-71083 Herrenberg
47-7032-2001-140
K.Giringer@Feinmetall.de
   
 



SWTW 2001 Program Committee Members:
Bill Mann, General Chair, william.mann@ieee.org
Rey Rincon, Texas Instruments, Program Chair, r-rincon@ti.com
Jerry Broz, Texas Instruments,
Technical Program Vice-Chair, j-broz@ti.com
Fred Taber, IBM, taber@ibm.com
Rahima Mohammed, Intel, rahima.k.mohammed@intel.com
Bill Williams, Motorola, rxfp60@email.sps.mot.com
Phil Seitzer, Lucent, seitzer@lucent.com
Tom Foerster, Conexant, thomas.foerster@conexant.com
Craig Rickey, Agilent Technologies, craig_rickey@agilent.com
January Kister, K&S Test Division, january.kister@probecard.com
Mike Bonham, "At Large", mkbonhamsr@aol.com