2003 Southwest Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS

Cost of Test Tutorial
Dinner Guest Speaker
Opening Session - Chairman's Welcome
Session 1 - New Probe Technologies
Session 2 - Memory Probing
Session 3 - Vertical Probe Challenges
Session 4 - Metal Stack / Dielectric Characterization
Session 5 - MEMs Technologies
Session 6 - Controlling Contact Resistance
Session 7 - Probe Process Characterization
Session 8 - Advances in Probe Card Analyzers

 




COST OF TEST TUTORIAL
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"
The Impact of Design For Test on the Cost of Test"

Bill Mann
General Chair
Southwest Test Workshop
519 Westminster Ave.
Newport Beach, CA 92663
949-645-3294
william.mann@ieee.org

 

 


 



DINNER SPEAKER
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"
The IC Market Recovery Outlook"

Brian Matas

Vice President

IC Insights, Inc.

Scottsdale, AZ

480-348-1133

 

 


 



CHAIRAMN'S WELCOME
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

Winner - Lifetime Achievement Award
"Welcome to SWTW-2003"

Bill Mann
General Chair
Southwest Test Workshop
519 Westminster Ave.
Newport Beach, CA 92663
949-645-3294
william.mann@ieee.org

 

 




Session 1 - NEW PROBE TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"
Full Wafer Contact Repeatability and Reliability"

Steve Steps

Scott Lindsey, Ph.D.

Aehr Test Systems

400 Kato Terrace

Fremont, CA 94539

510-623-9400

slindsey@aehr.com

ssteps@aehr.com

 

"A High Parallelism, High Bandwidth Probe Card using SiFi MEMS Probes"

Keith Lee

Bob Aldaz

Yu Zhou, Ph.D.

David Yu, Ph.D.

Gert Hohenwarter

Tassos Golnas

Advantest America, Inc.

Buffalo Grove, IL

847-821-3204

 

"Vertical Micro-Probe Design Based on the EFABTM Micro-Fabrication Process"

Chris Bang

Nelsimar Vandelli

MEMGen Corporation

1103 W. Isabel St.

Burbank, CA 91506

818-295-3996

cbang@memgen.com

nvandelli@memgen.com




Session 2 - MEMORY PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  

"
High Throughput Challenges for 300mm Wafer Testing"

Clark Liu

Powerchip Semiconductor Corp

NO 12 LI-HSIN RD.I , SBIP

HsinChu, Taiwan,300

886-3-5792131

clarkl@psc.com.tw

 

Nobuhiro Kawamata

FormFactor, Inc., Asia

Re-Ju Oh-imachi Bldg. 7F

4-13-17, Oh-i, Shinagawa-ku

Tokyo 140-0014

81-3-5746-3100

nkawamata@formfactor.com

Ken Taoka

Tokyo Electron Limited

2381-1 Kitagejo Fujii-cho, Nirasaki City

Yamanashi 
407-8511 Japan

81-551-23-2148


"
Critical Factors in Testing MRAM Devices"

Bill Stevenson

Cypress Semiconductor

3901 North First Street

San Jose, CA 95134-1599

408-456-1926

 

George Asmerom

Chris Taylor

Electroglas Inc.

6024 Silver Creek Valley Rd
San Jose, CA 95138

408-528-3325

 


"
Memory XXL Another Step on the Way to Full Wafer Probing - 256 DUT on Beta-mode"

Klaus Giringer

Gunther Boehm

FEINMETALL GMBH

Zeppelinstraße 8

D- 71083 Herrenberg

0 70 32 / 20 10 - 0

info@feinmetall.de

 

 




Session 3 - VERTICAL PROBE CHALLENGES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"
International SEMATECH Wafer Probe Council Report on Vertical Probing Experiences"

Frederick L. Taber

IBM Microelectronics

Zip 5E1

2070 Route 52

Hopewell Junction, NY 12533

845-894-2348

taber@us.ibm.com

Gavin Gibson

Infineon Technologies

Room 02/352

St Martin Straße 76

D-81541 Munich, Germany

49-89-234-28290

gavin.gibson@infineon.com


"
Hybrid Buckling Beam Contact for Vertical Probe Cards"

Robert Murphy

Wentworth Laboratories, Inc.

101 Commerce Drive

Brookfield, CT  06804

408-919-1875 x 29

rmurphy@wentworthlabs.com

   

"
Ultimate Frequency Limitations of Cobra Probe Contactors"

Raphael Robertazzi

IBM T.J. Watson Research Center

Building 801 Rt 134

MS 13-257

Yorktown Heights, NY 10598

914-945-3620

tazzi@us.ibm.com

   

Winner - Best Presentation, Tutorial in Nature
"
Predicting the Performance of Sort Tooling to 40 Gb/s"

Brett Grossman

Intel Corp.

2501 NW 229th Street
RA2-215

Hillsboro, OR 97124

971-214-5107

Brett.Grossman@intel.com

Bryan Boots

Ansoft Corporation

3800 Arapahoe Boulevard

Suite 250

Boulder, CO 80303

303-541-9525

bboots@ansoft.com

 




Session 4 - METAL STACK / DIELECTRIC CHARACTERIZATION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  


"
Multi-site Probing for Wafer-Level Reliability"

Louis Solis De Ancona

Agilent Technologies

5301 Stevens Creek Blvd

M/S 54L-WY

Santa Clara, CA 95051

 

Sharad Prasad

David Pachura

LSI LOGIC

1621 Barber Ln

MS AD-222

Milpitas, CA 95035

 

 


Winner - Best Technical Presentation
"
A Novel In-situ Methodology to Characterize Bond Pad and Dielectric Mechanical Behavior during Wafer Level Test"

Cheryl Hartfield

Texas Instruments, Inc.

13560 N. Central Expressway

Dallas, TX 75265 USA

Hartfield@ti.com

972-995-6007

 

Tom Moore, Ph.D.

Omniprobe, Inc.

7738 Forest Lane, Ste. 426

Dallas, TX 75230

moore@omniprobe.com

972-840-8815

 

Jerry Broz, Ph.D.

Point Technologies, Inc.

6859 N. Foothills Hwy

Boulder, CO 80302

jerry@pointtech.com

800-557-7059

 


"
Vertical Probe Development for Copper Probing Challenges"

Bahadir Tunaboylu, Ph.D.

Kulicke & Soffa Industries

1150 N. Fiesta Blvd.

Gilbert, AZ 85233

 

Ethan Caughey

Intel Corp.

2200 Mission College Blvd

Santa Clara, CA 95054

 

 


"MicroForce™ Probing for low-k ILD Testing"

Rod Martens, Ph.D.

Form Factor, Inc.

2140 Research Drive

Livermore, CA 94550

925-456-3813

rmartens@formfactor.com

Abdel Abdelrahman

Intel Corp.

2200 Mission College Blvd

Santa Clara, CA 95054

abdel.abdelrahman@intel.com

 

Steve Martinez

Tokyo Electron Limited

2400 Grove Boulevard

Austin, Texas 78741

512-424-1414

smartinez@aus.telusa.com




Session 5 - MEMS TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 

"
MEMs Technology in Testing"

Richard Chuang

SCS Hightech Inc.

1F, No.40, Industry E. 4th rd.,

Science-Based Industrial Park

Hsin-Chu, Taiwan 300

Taiwan. R.O.C.
03-6662828 ext. 3201

 

 


Winner - Best Data Presentation
"
The New Probe Tip Fabricated by MEMS (LIGA Process) for No-cleaning Test"

Tsuyoshi Haga

K.Okada

J.Yorita

Y.Hirata

Harima R&D Department

Sumitomo Electric Industries, LTD.

haga-tsuyoshi@sei.co.jp

S.Shimada

Analysis Technology Research Center

Osaka R&D Laboratories

Sumitomo Electric Industries, LTD.


"
A Comparison of Scrub Marks & Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards"

Jae-Ha Lee

Byung-Ho Jo, Ph.D.

Phicom Ltd.

153-801, 60-29, Gasan-dong

Kumchon-gu

Seoul Korea

02-3282-1900


"Multi-die Testing using Silicon Micro-Cantilever Probe Card"

Dong Il Kim, Ph.D.

AMST Co., Ltd.

404-2, Woncheondong, Paldalgu

Suwon Kyonggido 442-823

+82-31-217-6168

dikim@amst.co.kr

 

 



Session 6 - CONTROLLING CONTACT RESISTANCE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  

"
On the Way to 30-um Pads - A New Generation of Kerf Cards"

Swen Harder

Formfactor Inc.

Maximilianstrasse 35

80539 Munich, Germany

+491738657835

sharder@formfactor.com

Frank Pietzschmann

Infineon Technologies Dresden

P.O. Box 10 09 40

01076 Dresden, Germany

+49 351 886 2032

frank.pietzschmann@infineon.com

 


"
Controlling Contact Resistance with Probe Tip Shape and Cleaning Recipe Optimization"

Scott Stalnaker

Clint Churchill

Vail McBride

Kelly Burnside

AMI Semiconductor

2300 Buckskin Road

Pocatello, ID 83201

 

Jerry Broz, Ph.D.

Point Technologies, Inc.

6859 N. Foothills Hwy

Boulder, CO 80302

jerry@pointtech.com

800-557-7059

Gene Humphrey

International Test Solutions
2479 Chardonnay Way

Livermore, CA 94550

geneh@inttest.net

 


"
Off-Line Chemical Cleaning Technology for Removal of Solder Contaminant from Cobra® Vertical Technology Probe Tips"

Bill Fulton

Wentworth Laboratories, Inc.

101 Commerce Drive

Brookfield, CT  06804

408-919-1875

bfulton@wentworthlabs.com

 

 

 




Session 7 - PROBE PROCESS CHARACTERIZATION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"
New Tools for Probing Process Management"

Cary Kiest

Electroglas

1749 SW Airport Avenue

Corvallis, OR 97333

USA

541.738.2233

ckiest@electroglas.com

Jim Andersen

Applied Precision, LLC

1040 12th Avenue NW

Issaquah, WA 98027

425-657-1348

 

 


"
A Computer-based Probing C.O.O. Model"

Oliver Nagler

Gavin Gibson

Infineon Technologies AG

Corporate Test - Probing Technologies

Munich, Germany


"
A Statistical Method for Eliminating False Counts Due to Debris, Using Automated Visual Inspection for Probe Marks"

Max Guest

Mike Clay

August Technology – Plano TX

4900 West 78th Street

Bloomington, Minnesota 55435

952-820-0080

 


Winner - Most Inspirational Presentation
"44 Micron Pitch Probe Capabilities Assessment"

Bill Williams

Tony Angelo

S.S. Yan

Tu-Anh Tran

Stephen Lee

Matt Ruston

Motorola - Chandler
Chandler, AZ

 

 




Session 8 - ADVANCES IN PROBE CARD ANALYZERS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 

"Test and Maintenance of Very High Pin Count Cards"

Rod Schwartz

Daniel Kosecki

Integrated Technology Corporation

1228 N. Stadem Drive

Tempe, Arizona 85281 USA

480-968-3459  X363

rod@inttechcorp.com

dank@inttechcorp.com


"
Performance of a Next Generation High Speed, High Precision, Probe Card Analyzer"

Jeffrey S. Greenberg

Raymond Kraft, Ph.D.

Applied Precision, LLC

1040 12th Avenue NW

Issaquah, WA 98027

425-657-1348

jgreenberg@api.com

rkraft@api.com


"
Future Trends in Wafer Level Test"

Bill Mann

General Chair

519 Westminster Ave.

Newport Beach, CA 92663

949-645-3294

william.mann@ieee.org


 



SWTW 2003 Chairs:

William Mann, General Chair

Jerry Broz, Ph.D., Point Technologies, Technical Program Chair

Maddie Harwood, CEM Inc., Registration and Finance Chair
 

SWTW 2003 Program Committee:

Michael Egloff, AMD

Tom Foerster, Jazz Semiconductor

Gavin Gibson, Infineon Technologies

Michael Harris, Texas Instruments

Ken Karklin, Agilent Technologies

Ger Koch, Philips Semiconductor

Rey Rincon, Kulicke and Soffa

Phil Seitzer, Agere Systems

Roger Sinsheimer, Xandex

Tim Swettlen, Intel

Fred Taber, IBM Microelectronics

Bill Williams, Motorola