(Each presentation is in Adobe Acrobat format) |
| Fred Taber Probe Project Chair IBM Microelectronics ZIP 5E1 2070 Route 52 Hopewell Junction, NY 12533 845-894-2348 taber@us.ibm.com |
OPENING SESSION
| Bill Mann General Chair Southwest Test Workshop Newport Beach, CA 92660 949-645-3294 william.mann@ieee.org |
Session 1 - HIGH PERFORMANCE PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"Providing an Envelope of Solutions for Probing High Power (>100W) Die at Sort"
| Tim Swettlen Intel Corp. 2200 Mission College Blvd Santa Clara, CA 95054 408-653-7846 tim.swettlen@intel.com |
Winner - Best Data
Presentation
"Silicon
Finger Technology and the Photo-Finger Technology for High-Performance
Probe"
| Ted Khoury Advantest America, Inc 1100 Busch Pkwy. Buffalo Grove, IL 60089 847-634-2552 t.khoury@advantest.com |
Robert Aldaz Dr. David Yu Gert Hohenwarter Advantest America, Inc 1100 Busch Pkwy. Buffalo Grove, IL 60089 |
"RF Signal Characterization of Probe Cards"
| K. Helmreich A. Lechner Advantest Test Engineering Solutions GmbH Stefan-George-Ring 8 Munchen, Germany k.helmreich@advantest.de a.lechner@advantest.de |
Session 2 - VERTICAL PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
Winner - Most Inspirational Presentation
"A High Performance C4 Probe: TFI"
| Gobinda Das, Ph.D. Fredrick Taber IBM Microelectronics ZIP 5E1 2070 Route 52 Hopewell Junction, NY 12533 845-894-9967 gdas@us.ibm.com taber@us.ibm.com |
"Area Array Probe Card Interposer"
| Raphael Robertazzi IBM T.J. Watson Research Center Building 801 Rt 134 MS 13-257 Yorktown Heights, NY 10598 914-945-3620 tazzi@us.ibm.com |
"Micro-Probe's Apollo Vertical Card"
| Stephen G. Hopkins Micro-Probe 2281 Las Palmas Drive Carlsbad, CA 92009 760-603-0631 shopkins@micron.net |
Session 3 - PROBE PROCESS ASSESSMENT I - CAPABILITY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"Distribution and Integrity of Probe Card Analyzer Data"
| Scott Dobbins Seagate Technology 1 Disc Drive MS NRE110 Bloomington, MN 55435 952-844-7145 scott.d.dobbins@seagate.com |
"Verification of Probing Accuracy"
| Larry Hendler Hendler Enterprises 6024 Silver Creek Valley Rd San Jose, CA 95138 408-528-3280 lhendler@electroglas.com |
Jeff Hintzke Electroglas 6024 Silver Creek Valley Rd San Jose, CA 95138 408-528-3157 jhintzke@electroglas.com |
| Peter Binkhoff ELMOS Semiconductor AG Heinrich-Hertz-Str. 1 Dortmund NRW D44227 Germany +49-231-7549-291 pbinkhoff@elmos.de |
Session 4 - PROBE PROCESS ASSESSMENT II - METHODS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"Optimal Wafer Illumination for Machine Vision Applications on Silicon Wafers"
| John R. Goulding Electro Scientific Industries, Inc. 13900 NW Science Park Drive Portland, Oregon USA 97229 503-672-5821 gouldingj@esi.com |
"Effects of Z-Stage Motion control on Probe Contact Force"
| Martín Martínez ProbeSolutions – ESACORP 743 E. Goldenrod Str. Phoenix, AZ., 85048 480-460-3727 martin.martinez@ESACORP.net |
Uday Nayak Electroglas, Inc. 6024 Silver Creek Valley Road San Jose, CA. 95138 408-528-3399 unayak@electroglas.com |
"Wafer
Heat Distribution Analysis during Heated Chuck Wafer Probing
using
Automated Visual Inspection"
| Thomas Dabelstein Hans-Uwe Nitschke Philips Semiconductors Stresemannallee 101 D-22529 Hamburg - Germany +49 (0)40 56 13-32 78 Thomas.Dabelstein@philips.com Hans-uwe.Nitschke@philips.com |
Mike Clay Semiconductor Technology and Instruments, Inc. 2701 E. Pres. George Bush Hwy Plano, Texas 75074 972-461-0373 mike.clay@sti-i.com |
Session 5 - PROBER AND PROBE CARD ANALYZER PERFORMANCE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"Prober and Probe Card Analyzer Performance Under Load"
| Raymond Kraft, Ph.D. Applied Precision, Inc. 1040 12th Avenue NW Issaquah, WA 98027 425-557-1000 rkraft@api.com |
"Probe Card Metrology for Mixed Signal Cards"
| Rod Schwartz Russ Allred Daniel Koselki Integrated Technology Corporation 1228 N. Stadem Drive Tempe, Arizona 85281 USA 480-968-3459 rod@inttechcorp.com |
"300-mm Probing-Error Analysis"
| Uday Nayak Electroglas, Inc. 6024 Silver Creek Valley Rd. San Jose, CA 95138 408-528-3399 unayak@electroglas.com |
"What Kind of Probe Card Analyzer Do We Really Need on the Wafer Test Floor?"
| Frank Pietzschmann Infineon Technologies Dresden P.O. Box 10 09 40 01076 Dresden, Germany ++49 351 886 2032 frank.pietzschmann@infineon.com |
Session 6 - MEMORY PROBE
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"High Parallelism Memory Test Advances based on MicroSpring Contact Technology"
| Thomas Homorodi Form Factor, Inc. 2140 Research Drive Livermore, CA 94550 925-456-3813 thomorodi@formfactor.com |
Robert Martin Form Factor, Inc. 2140 Research Drive Livermore, CA 94550 925-456-3813 rmartin@formfactor.com |
"KGD solution - At Speed Wafer Testing and Full Contact WLBI after Flip Chip Bumping"
| An-Hong Liu , Ph.D. ChipMOS Technologies, Inc. No.5 NAN-KO Rd.7 Science-Based Industrial Park, Tainan, Taiwan, R.O.C. 886-6-5052388, x 7108 john_liu@chipmos.com.tw |
Yuan-Ping Tseng ChipMOS Technologies, Inc. No.1 R&D Rd.1 Science-Based Industrial Park Hsinchu, Taiwan, R.O.C. 886-3-7550055 Ext.1206 noty_tseng@chipmos.com.tw |
"MASKROM Auto Fail Bit Map Monitoring Algorithm and Applied Effect In Mass Production"
| Dong-Seok Chae Jae-Gyu Kim Sung-Bu Jun Jun-Kyue Bae MASKROM Team Samsung Electronics Korea 82-031-209-2070 dschae@samsung.co.kr |
Winner - Best Technical
Presentation
"Enabling
X144 Flash Memory Test"
| Roger Sinsheimer Xandex, Inc. 1125 N. McDowell Blvd. Petaluma, CA 94954 707 763-7799 x124 rsinsheimer@xandex.com |
Ken Karklin Agilent Technologies |
Session 7 - NEW PROBE TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"Silicon Probe: Semiconductor Testing Probe Utilizing Silicon Whiskers Grown by VLS (Vapor Liquid Solid) Method"
| Yasunori Chiba M. Kanai T. Matsuo H. Takizawa Tokyo Cathode Laboratory Co.,Ltd. 1-49-1 Itabashi, Itabashi-ku Tokyo, JAPAN 173-0004 03-3962-3510 chiba@tclab.co.jp |
| Noriaki Nakazaki Takuya Tsuruta TOHO Electronics, Inc. Tokyo, JAPAN nakazaki@toho-inc.co.jp |
| K. Wada H. Kitazume W. Narazaki S. Motoyama M. Miyazaki T. Takoshima Y. Maeda Advantest Laboratories Ltd. +81-22-392-8731 Tokyo, Japan wada@atl.advantest.co.jp |
S. Hata A. Shimokohbe Precision and Intelligence Laboratory Tokyo Institute of Technology +81-45-924-5094 Tokyo, Japan |
Session 8 - PROBE AND PACKAGE ASSEMBLY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"Wire Bondability Related to Probing"
| Dominique Langlois Altis Semiconductor Corbeil-Essonnes France +33 1 60 88 6933 Dominique.Langlois@altissemiconductor.com |
Eugene Lim Infineon Technologies Asia Pacific Pte. Ltd. Singapore 065-840-0457 eugene.lim@infineon.com |
"Building the Framework of an Integral Process to Ensure Fine Pitch Wire Bond and Probe Compatibility"
| Kenneth Thompson Sheila Chopin Soosan Yoong Motorola – Austin Austin, TX kenneth.e.thompson@motorola.com r15179@email.sps.mot.com r41887@email.sps.mot.com |
"How Bad's the Damage? - Evaluating Probe Damage on Aluminum, Solder, Gold, UBM, and Copper Pads"
| Ken Smith Cascade MicroTech Portland, OR 503-601-1955 Ken_Smith@cmicro.com |
Session 9 - PROBE POTPOURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9
"35um Pitch Fine Pitch Probe Card"
| Japan Micronics |
"Always Trouble with Planarity and Alignment? Solved with Vertical Probe Cards"
| Klaus Giringer Gunther Boehm Feinmetall GmbH Germany-71083 Herrenberg 47-7032-2001-140 K.Giringer@Feinmetall.de |
SWTW 2001 Program Committee Members:
Bill Mann, General Chair, william.mann@ieee.org
Rey Rincon, Texas Instruments, Program Chair, r-rincon@ti.com
Jerry Broz, Texas Instruments, Technical Program Vice-Chair, j-broz@ti.com
Fred Taber, IBM, taber@ibm.com
Rahima Mohammed, Intel, rahima.k.mohammed@intel.com
Bill Williams, Motorola, rxfp60@email.sps.mot.com
Phil Seitzer, Lucent, seitzer@lucent.com
Tom Foerster, Conexant, thomas.foerster@conexant.com
Craig Rickey, Agilent Technologies, craig_rickey@agilent.com
January Kister, K&S Test Division, january.kister@probecard.com
Mike Bonham, "At Large", mkbonhamsr@aol.com