Jump to the sections below:

Welcome

Health & Safety

Mobile App

Registration

Scavenger Hunt

Social Event

Program

EXPO Directory

Thank You To Our Corporate Sponsors

Hybrid includes in-person and virtual | Virtual is virtual-only

Platinum Sponsors

nidec s v t c l - hybrid sponsor
PTSL hybrid sponsor
jem - hybrid sponsor
formfactor - hybrid sponsor
mpi - hybrid sponsor
teradyne - hybrid sponsor
TEL - Hybrid sponsor
technoprobe hybrid sponsor
mjc hybrid sponsor
aehr hybrid sponsor
intest ems - hybrid sponsor

Gold Sponsors

oxford lasers - hybrid sponsor
star technologies - hybrid sponsor
posalux - hybrid sponsor
pactech - hybrid sponsor
heraeus - hybrid sponsor
advantest - hybrid sponsor
TIPS technical innovation hybrid sponsor
TSE - hybrid sponsor
ers - hybrid sponsor
yokowo - hybrid sponsor
semics hybrid sponsor
international test solutions - hybrid sponsor
translarity hybrid sponsor

Silver Sponsors

celadon hybrid sponsor
vermont microtechnologies - hybrid sponsor
cohu hybrid sponsor
advanced probing systems hybrid sponsor
DIT disruptive innovation technology hybrid sponsor
onto innovation - hybrid sponsor
pec point engineering hybrid sponsor
feinmetall hybrid sponsor
riff company inc virtual sponsor
chpt hybrid sponsor

Official Media Sponsors

chip scale review logo
semiconductorreview-logo-2022-min

Conference Partners

Chairman’s Welcome to SWTest 2022 Conference and Expo

Wafer Test Technology in San Diego (actually, it’s now Carlsbad)!

Welcome to the OMNI La Costa, Carlsbad, CA and the 31st SWTest Conference and EXPO.

On behalf of the SWTest Executive Team, Program Committee, and Committee Members, I want to warmly welcome you to SWTest 2022 which is being held as a hybrid event.

The global Covid-19 pandemic continues to affect our lives and will so for many years.  Throughout the pandemic, digital solutions have allowed us to remain connected.  At long last we can start travelling and joining social gatherings.  Unfortunately, many technologists outside the US are still being restricted by their respective CDCs, lockdowns, or company polices.  This year, we are holding our second hybrid conference such that our extended test community can attend and participate.  

Nothing beats a face-to-face discussion and networking; however, the health and safety of our attendees, sponsors, exhibitors, and community are the top priority.  Our goal is to provide attendees a relaxed, friendly, and safe environment in which to meet with the top suppliers and service providers to discuss key technologies and capabilities while not competing with the technical sessions.

It is my great pleasure to thank our 11-Platinum, 13-Gold, and 10-Silver sponsors who are supporting the in-person and virtual conference.  We’d also like to thank the almost 55 in-person and virtual exhibitors, the speakers, the committee members, and recognize the volunteers who help make the SWTest Conference and EXPO a “must-attend” event for the wafer test industry.  

SWTest 2022 is a three and a half-day hybrid Conference and Expo.  On Sunday afternoon, the 11th Sponsors Golf Tournament was held on The Legends Golf Course.  On Monday morning, we convene in Costa Del Sol Ballroom for our first visionary keynote presentation by John Yi who serves as an Engineering Fellow at AMD.  The Monday Technical Program has three Podium Sessions and two Poster Sessions.  The EXPO takes place Monday evening in the Costa de la Luna Ballroom with cocktails and food stations.  The SWTest EXPO which showcases key suppliers to the wafer probe industry, will have virtual live audio and video chat, swag giveaways, and a scavenger hunt.  Afterwards, there will be ample opportunities for safe networking within the Sponsor Hospitality Suites.

On Tuesday, we have an update to the SWT-Crew Initiative. Then our second visionary keynote speaker is Rebeca Jimenez who serves as Corporate Vice President for the Advanced SiP Business Unit at Amkor Technology.  The Tuesday Technical Program consists of three sessions and the EXPO is open in the afternoon.  On Tuesday evening our Social Event takes us to the Polynesian Islands with fantastic entertainment, a delicious menu, and ample time to safely reconnect with friends and colleagues.   

On Wednesday morning, the final two technical sessions will be followed by the awards and recognition presentations.   After the conference, the technical program will have ON-DEMAND Access 24/7 from June 9 – July 9, 2022.  Once again, thank you for being a part of the SWTest Conference and enjoy San Diego!

Jerry Broz, PhD
General Chair

SWTest Conferences

Nidec S V T C L sponsor ad

Health and Safety at SWTest 2022

The SWTest Team is encouraging all attendees, sponsors, exhibitors, and staff to be vaccinated prior to attending the SWTest 2022 Conference in San Diego. If vaccination is not possible, we ask that you confirm a negative Covid-19 test within 48 hours of the start of SWTest 2022 on Sunday, June 5th. This is not a requirement to attend, but a request that we all take responsibility for the health and welfare of the conference attendees and within our wafer-test community. 

Out of an abundance of caution, SWTest will require that all attendees (both vaccinated and unvaccinated) wear a mask while inside the Omni La Costa Ballrooms and Expo areas. We also ask that you follow all applicable regulations and make informed choices about travel, onsite, and external engagement. We are continuously monitoring the public health guidance provided by the Centers for Disease Control, the Governor of California, and the San Diego County Health District regarding large gatherings.

Currently, San Diego County is following the CDC’s guidance in recommending the universal wearing of masks by both vaccinated and unvaccinated individuals in indoor public settings. Although the state of California has indicated no social distancing requirements for meetings or gatherings with less than 500 attendees, SWTest is planning to keep a social distancing layout in the conference room during the program. There will be one door for Entry into the General Session room and one door for Exiting. We will have Security Guards stationed to enforce our face mask requirements for attending indoor activities.

We are fortunate to have so much outdoor space available at Omni La Costa and we will use that space as much as possible. Our daily breakfasts and the Tuesday Social and Dinner will all be held out-of-doors on the Luna Lawn and Breezeway. We also recommend that registered attendees download the SWTest mobile app and/or print their final confirmation which contains the registration barcode. This barcode will allow for safe “touchless” registration and badge printing on-site.

At registration, the SWTest Team will be providing masks, hand-sanitizer, and “red-yellow-green” comfort-level badge ribbons that will allow attendees to be aware of each other’s “comfort-level” for engagement. We are working with the Omni Resort staff to create a program that provides a clean, safe and healthy environment throughout the conference for our attendees. 

Omni La Costa is delivering the highest standards in cleanliness and hygiene with a comprehensive system of enhanced health and safety protocols based on the guidelines set forth by the Centers for Disease Control, the California Department of Public Health, the California Hotel & Lodging Association, and the American Hotel & Lodging Association’s Stay Safe industry-wide initiative. Details of the practices followed by Omni La Costa Resort  are outlined at their website – https://www.omnihotels.com/omni-safe-and-clean

Keep in mind that SWTest 2022 is a Hybrid event, providing the opportunity for any attendee to participate virtually if they are uncomfortable for any reason participating in person or following any of SWTest’s health and safety guidelines. All Hybrid registrations include both in-person and virtual attendance.

The evolving nature of this health crisis requires us to remain flexible. The Governor’s Office or the health agencies could issue new guidance at any time that may require us to alter our program.

We are looking forward to a safe environment to get together in person at the beautiful Omni La Costa. And for those who cannot join us in person, we’ll look forward to connecting with you virtually. 

Stay safe and be well.
SWTest Team

P T S L sponsor ad

SWTest Team and Committee Members

SWTest Executive Team

General Chair
Jerry Broz, PhD,
Advanced Probing Systems

Technical Program Chair
Rey Rincon,
Translarity

Finance Chair/Conference Mgmt.
Maddie Harwood,
Conference & Exhibits Management, Inc. (CEM)

Technical Program Committee

  • Jerry Broz, PhD, Advanced Probing Systems
  • John Caldwell, MJC Electronics Corp.
  • Geert Gouwy, IMEC (Belgium)
  • Darren James, Onto Innovation
  • Clark Liu, Taiwan MJC Co. (Taiwan)
  • Patrick Mui, JEM America
  • Mark Ojeda, Infineon (US)
  • Rey Rincon, Translarity
  • Raffaele Vallauri, Technoprobe (Italy)
  • Joey Wu, STAr Technologies (Taiwan)

Steering Committee

  • Davide Appello, STMicroelectronics
  • Karen Armendariz, Celadon Systems
  • Gunther Boehm, FeinMetall GmbH (Germany)
  • Geert Gouwy, IMEC (Belgium)
  • Michael Huebner, PhD, FormFactor, Inc. (Germany)
  • Joonyeon (JY) Kim, Samsung Electronics (Korea)
  • Amy Leong, FormFactor, Inc.
  • Clark Liu, Taiwan MJC Co. (Taiwan)
  • Grace Liu, PhD (Intel Corporation)
  • Mark Ojeda, Infineon (US)
  • Connie Smith, Texas Instruments, Inc.
  • Raffaele Vallauri, Technoprobe (Italy)
  • Joey Wu, STAr Technologies (Taiwan)
  • Alex Yang, MPI Corporation (Taiwan)
J E M sponsor ad

SWTest 2022 Mobile App

The official SWTest app is your go-to guide for the event, keeping you up to date with all the latest news and information.

The SWTest Mobile App is now available to download.
Go to the App store and search for: “vFairs”

The SWTest Mobile App is now available for download however, you will not be able to access information in the app until Monday, June 6 at 7:00 AM PST when we go LIVE!

download on the apple app store
download on google play
  • We will also be utilizing the app to distribute daily passwords for proceedings via push notification and important SWTest announcements.
  • To log into the App, you will need to use the email address associated with your registration.
  • Should you have any questions, please visit the Registration Desk in the Costa Del Sol Foyer.
FormFactor sponsor ad

Registration

Self-check in for registration is located in the Costa Del Sol Foyer of the Conference Center. Self-registering kiosks will allow a “touchless” check-in by scanning your personal barcode located on your confirmation email or in the “My Profile” module on the Mobile App. Scan the barcode and your badge will print at the kiosk. Please bring your badge to the Registration Desk to pick up your badge holder, facemask, and hand sanitizer.

Registration Check-in Hours

  • Sunday, June 5
    11:00 AM – 1:00 PM and 4:00 PM – 6:00 PM
  • Monday, June 6
    7:00 AM – 12:00 PM and 1:00 PM – 5:00 PM
  • Tuesday, June 7
    7:00 AM – 12:00 PM and 1:00 PM – 4:00 PM
  • Wednesday, June 8
    7:30 AM – 10:00 AM

A registration badge is required for admission to events associated with your badge type:

  • Full Conference and Student:
    All Events, including Technical Sessions
  • Exhibitor and Expo Only:
    All Events, except Technical Sessions
  • Companion:
    All receptions, dinners and Tuesday Social Event
M P I Corporation sponsor ad

Scavenger Hunt

Here is how it works:

  1. Download the “vFairs” app from the App Store or Google Play.
  2. Once you are logged in using the email address that you registered with, click on the QR code symbol in the upper right of the app screen.
  3. Below your own QR code, you will see a Scan Code button.
  4. Click on that to scan the booth QR code for the Scavenger Hunt.
  5. Once you have visited ALL Exhibitors participating in the Scavenger Hunt, you will automatically be entered to win a PRIZE!

Winners will be announced during the Tuesday Evening Social Event on June 7.

LET THE HUNT BEGIN!

(no dogs or horses required)

SWTest would like to thank the participating exhibitors for their generous prize contributions and support:

BoothCompanyPrizeWinner
412Advantest$100 Amazon cardTBD
310AEHR Test SystemsApple AirPods ProTBD
207AEM AforeUkkomatti 100 XO Lion of Finland Handcrafted HipflaskTBD
401Celadon Systems, Inc.$100 SpaFinder cardTBD
610Cohu, IncSoundcore Q30 HeadphonesTBD
101DR YIELDSUNNYBAG Explorer+ BackpackTBD
513ERS electronic GmbH$120 Amazon cardTBD
501esmo USASanDisk 1TB Extreme Portable SSDTBD
311FormFactor, Inc$100 Amazon cardTBD
411Heraeus Deutschland GmbH & Co. KGApple AirPodsTBD
605Integrated Technology CorporationION Bluetooth SpeakerTBD
301International Test SolutionsBushnell Wingman GPS Golf SpeakerTBD
407inTEST EMSreMarkable TabletTBD
303JEM America Corp$100 Amazon cardTBD
403MPI CorporationLogitech Ergonomic MouseTBD
300Nidec SV TCLBose Soundlink Flex Portable SpeakerTBD
308Oxford LasersKindle Paperwhite (8gb) *subject to availabilityTBD
405Posalux SACaran d’Ache Palladium-Coated ECRIDOR GOLF Ballpoint PenTBD
211Probe Test SolutionsThe Balvenie Single Malt Scotch WhiskeyTBD
304STAr Technologies, Inc.Apple HomePod MiniTBD
212Technoprobe America Inc.$100 Amazon cardTBD
313TEL – Tokyo Electron US HoldingsNorth Face BackpackTBD
Teradyne sponsor ad

Tuesday Evening Social

luau party

As we move SWTest closer to the coast in Carlsbad, we feel the pull of the Polynesian Islands. So grab your Hawaiian shirt and get ready for a Luau!

This year’s Tuesday Evening Social Event will take us to the Polynesian Islands with Lei Greeters, Tropical Cocktails, a delicious Luau Buffet Dinner and Entertainment by the Pride of Polynesia drummers, dancers and fire performer. We’ll also have a Hawaiian Shirt Contest for 1) the most colorful shirt and 2) the most authentic shirt. So don’t forget to pack your Hawaiian shirt!

The Social Cocktail Hour will also feature a “Keynote Meet & Greet”, where our two Keynote Speakers, John Yi, and Rebeca Jimenez will be there to say hello, chat, and answer questions in an informal setting. The Cocktail Hour will be held in the Costa Del Sol Porte Cochere and Breezeway from 6-7 PM. Immediately following, the Luau Dinner Buffet will be held on the Costa de la Luna Lawn from 7-8 PM. Listen for the conch shell horn and drums to call you to dinner.

After dinner, we’ll announce the winners in this year’s golf tournament, which hosts over 30 teams and 130+ players this year. Then the Pride of Polynesia will take us on a journey through the islands with authentic music and dances from four of the major Polynesian Islands, French Polynesia (Tahiti), Hawaii, Samoa and Aotearoa (New Zealand). And, last but not least, we’ll announce the winners of the EXPO Scavenger Hunt. Then, off to the sponsor hospitality events to continue the evening of fun!

You don’t want to miss this long awaited opportunity to socialize and network with your industry friends and colleagues, not to mention soaking up the ambiance of the Polynesian Islands.

TEL sponsor ad

Program Schedule

Times in PDT | Tentative, subject to change | last revised: 6/2/2022

Monday, June 6, 2022
7:00 – 8:00 Continental Breakfast
7:00 – 12:00 Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2022
Jerry Broz, PhD, SWTest General Chair, Advanced Probing Systems
8:30 – 9:30 KEYNOTE Architecting Test Solutions for the Next Generation of Compute
John Yi,
Product Engineering Organization Fellow
Advanced Micro Devices (AMD)
Abstract

As the world of compute continues to grow from consumer devices to supercomputers to edge compute, new generation of products are being created with ever growing complexity. Future product architectures are evolving to supply the increasing demand for compute power, automation, and data. It is essential to work closely across multiple disciplines from silicon design, DFT, and test hardware/software to ensure success in being able to test these new generation of products with minimal test costs and the highest level of quality & reliability. As compute products continue to push fab process geometries in addition to pushing more complex 2.5D & 3D construction processes, this has required more emphasis on increasing test coverage & capacity for probe test solutions. Probe test requirements will demand higher current capability, tighter pitches, & higher test frequencies while sustaining high production lifetimes & test integrity. This will bring a new level of innovation in probe technologies as new metallurgy and construction schemes are being developed along with enhanced test methods across the industry. This keynote presentation will provide a general compute overview & roadmap, methods of innovating new test solutions, and provide wafer probe test needs going forward.

Biography

John is a Fellow in the Product Engineering organization at AMD and currently manages a team of architects responsible for co-developing new DFT methods & test solutions. His current focus is defining manufacturable test solutions for the challenges of AMD’s heterogenous 2.5D & 3D products. In his previous role, John was responsible for defining the architecture & test strategy for ATE, Burn-in, and System-Level test hardware across the wide spectrum of AMD products. John has been at AMD for 28+ years responsible for driving many test innovations from concept to production deployment. Prior to joining AMD, John graduated from the University of Texas in Austin in Electrical Engineering.

9:30 – 10:00 Break – Poster Session
9:30 – 10:00 POSTER SESSION: Probe Potpourri 1
Magnetic Testing Tutorial – Wafer probing with 3D magnetic stimulation
Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)

Georg Franz has worked in the Semiconductor Industry for 20 years. After receiving his masters degree in mechanical engineering at the Technical University in Vienna, Austria he worked 7 years at Carinthian Tech Research in Villach, where he developed wafer handling equipment and micromanufacturing machines and conducted finite element simulations.

In 2012 he joined T.I.P.S. Messtechnik, a probe card manufacturer focused on power, automotive and sensor devices. His main field of activity is the advancement of test technologies and the development of new products, especially high voltage test and magnetic sensor stimulation.


Hydra Probes – Simplifying and Standardizing Semiconductor Test
Tes Olson (Cohu – St Paul, USA)
Rob Stoner (Cohu – Saint Paul, USA)

Rob Stoner is a Program Manager for the Interface Solution Group (ISG) of Cohu Incorporated. He graduated from Minnesota State University with a BSME and holds an MBA from the University. of St. Thomas. He spent the first 11 years of his career in the Defense industry, where he managed the development and production of avionic and shipboard systems. He joined Cohu in 2021 and has since managed the development of new R&D contactor solutions.


Increasing transparency in wafer test probecard maintenance processes through targeted key performance indicators
Lasse Meyer (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)
Dr. Veronika Haehnel (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)

Dr. Veronika Haehnel joined the FE wafer test division at Infineon Dresden in 2017 and is currently as Staff Engineer Material Science responsible for the management and optimization of the probecard processes including database management, cleaning procedures, KPI creation & tracking as well as all quality and audit relevant topics. Initially, she worked as a Senior Engineer Wafer Test for Chipcard products including wafer test monitoring. Prior to joining Infineon she spent 8 years with Leibniz Institute for Solid State and Materials Research Dresden in basic research of nano- & microstructured electrodeposited systems. She holds a diploma engineering degree and a PhD in Materials Science from Technische Universität Dresden.


Automated temperature calibration routine for prober chucks
Harald Ibele (Sigma Sensors (TCL) GmbH – Sigmaringen, Germany)

Harald Ibele is the Owner, Technical and Quality Manager of Sigma Sensors, an A2LA ISO17025:2017 accredited Temperature Calibration Laboratory He first joined the Semiconductor Industry in 2003 working for a Microelectronic distributor and established an accredited calibration laboratory in 2005. In 2007 he joined a European thermal chuck manufacturer establishing their presence in the US before relocating to Asia to build their support network in 2012. Harald has extensive experience with temperature aspects of waferprobe, custom temperature solutions, prober sealing and thermal upgrades. After having returned to Europe in 2017 he directed global sales and customer support for thermal chucks before starting his own business in 2019. Sigma Sensors is based in Sigmaringen Germany with a newly established branch in the US. Sigma Sensors performs on site, accredited thermal chuck calibrations and manufactures the made for global mobility Cowboy Wafer. He currently lives in Germany and has 4 children.


Small Pad/Small Pitch Dual-Sided Single-Level Space Transformer
Dominik Schmidt (Translarity Inc. – Fremont, USA)

Probe Debris Rating Scale
Karan Maniar (Nidec SV TCL – Tempe, USA)
Kyle Cotner (Nidec SV TCL – Tempe, USA)

Kyle graduated with a Bachelor of Science degree (cum laude) in Mechanical Engineering from the University of Arizona in 2005. He has worked in Germany and in the U.S. for start-ups, mid-size companies, and multinational corporations across the automotive, medical device, and now semiconductor test industries.

Kyle joined the Nidec SV TCL team in late 2015 as the Product Engineering Manager based in Tempe, Arizona. He used his experience from other industries in project management and new product industrialization to improve the operational performance of the product engineering team and quickly came up to speed with the unique aspects of wafer test.

In 2019, Kyle was promoted to Director of Engineering and added overall responsibility for engineering and design to his role. He has focused heavily on removing internal barriers and improving communication to streamline operations, improve quality and performance, and shorten lead time.

In his free time, Kyle enjoys traveling (when Covid allows), golfing, running, and homebrewing.


Novel Micro-Textured Film Offers Promise in Universal Handling during IC Test
Raj Varma (Gel-Pak – Hayward, USA)

Raj Varma has over 26 years of industry experience working in Semiconductor, Packaging and Consumer markets. Raj has been with Gel-Pak as the CTO since 2012. Prior to Delphon he was CTO at Neocork, and various R&D & commercial roles at GLS Corp.

Raj has a B.S in Chemical Engineering, M.S. in Polymer Engineering from the University of Akron, and an MBA from the Illinois Institute of Technology, Chicago. He has presented more than 20 papers at various conferences and holds 6 U.S. and International patents.

10:00 – 12:00 SESSION 1: Innovative Materials and Processes
Session Chair
: Jerry Broz, PhD (SWTest Conference General Chair)
10:00 – 10:30 PALYSIUM – A Revolutionary Material For Probing
Jonas Sorg, Marc Raettig (Heraeus – Hanau, Germany)
Jonas Fecher (Heraeus – Hanau, Germany)
  • Studies in Material Science and Engineering at FAU Erlangen, Germany in 2
  • Ph.D in Material Science at FAU Erlangen, Germany in 2016
  • Project Engineer for CVD Diamond coating at DiaCCon GmbH, Fürth, Germany 2016-2017
  • Since March 2017: Development of precious metal-based alloys for probing applications, Heraeus Precious Metals, Hanau, Germany
10:30 – 11:00 New Ceramic Technology
Noh Tae Hyung (Disruptive Innovation Technology (DIT) – Siheung, Korea)
Paul Kim (Disruptive Innovation Technology (DIT) – Siheung, Korea)

Paul Kim is the head of global sales for GI technology. We have been working together with our partner company (DIT) Disruptive Innovation Technology to perfect a new process to make thin ceramic substrates that can be made into MLC’s and various other products. All the credit for this new technology goes to Mr. Noh, the founding CEO of DIT. I will be the main presenter due to the lack of English proficiency.

11:00 – 11:30 Does Femto Laser micro machining match with guide plates and probes requirements?
Angelo Rizzo (Posalux SA – Biel/Bienne, Switzerland)

Mr. Angelo Rizzo joined Posalux in 2006 and is currently Business Area Manager Electronic.

He is active in the micro-machining world since the beginning of his career and served in different sales and management roles. With a long experience in the micro-drilling/routing of Printed Circuit Boards, he started focusing on the semiconductor industry by introducing high-tech mechanical and Laser machines. More specifically, he was responsible for developing the guide plates and probes micro-machining market. Passionate about technology, today Angelo is working closely with Laser R&D process engineers, the goal being to push applications like square holes and MEMS probes cutting beyond the limit.

Angelo graduated from the University of Neuchâtel, Switzerland with a master degree in International Business Development.

11:30 – 12:00 Methodology to improve WAT probe card Probe Mark and Lifetime
Eric Sik Kiang Lau, Tai Lin Goh, Tee Whay Lim (GLOBALFOUNDRIES – Singapore, Singapore), Yang Qu, Toh Wei Leong, Jean Tan (STAr-Quest Technologies Pte. Ltd. – Singapore, Singapore), Yu-Ming Chien (Star Technologies – Hsinchu City, Taiwan)
Jeffrey Lam (STAr-Quest Technologies Pte. Ltd. – Singapore, Singapore)

Dr. Jeffrey Lam is currently the GM/Vice-President of Engineering at STAr-Quest Technologies. Prior to joining STAr Technologies, Dr. Lam was VP of Product, Test and Failure Analysis with GlobalFoundries for 19 years. He possesses more than 40 years of experience in Process Module, Design Engineering, Product/Yield engineering, Failure Analysis and Test Development Engineering. He has 17 technical patents and more than 100 publications. He has also been the chairman for SEMI “SGPSEA Product & Test Committee” since 2009 and serves as an Adjunct Associate Professor at the National University of Singapore.

Dr. Lam received his B.S and M.S. in Chemical Engineering from UC Berkeley and UC Davis in 1979 and 1981 respectively. He obtained a second M.S in Electrical Engineering and Computer Science from the University of Santa Clara in 1986. In 2014, he received his PhD from the School of Physical and Mathematical Sciences, Nanyang Technological University.

12:00 – 13:00 Enjoy Lunch on the Luna Lawn!
13:00 – 15:00 SESSION 2: High Speed and RF
Session Chair
: Mark Ojeda (Infineon Technologies – San Jose, USA)
13:00 – 13:30 High Speed Digital: How to Optimize a Probe Card for PAM4 to a non-50 Ω device
Daniel Bock (FormFactor – Beaverton, USA)

Daniel Bock got his Ph.D. in Physics at Carnegie Mellon University in 2006, working on Superconducting Nanowire Bolometers in the NanoFabrication Lab. He joined Form Factors RF Product Group in June of 2012. He led the development of the Custom Calibration Substrate (Custom ISS) product line to supplement the standard ISS line to improve the RF calibration methods for multi-DUT, irregular layout probe cards. He is also investigating the increase in digital signals, moving to PAM4 with higher baud rates, to improve wafer test for these devices. He enjoys camping with his family, as well as playing board games.

13:30 – 14:00 Contactless Measurement of RF Voltage Distribution in Antenna Switches at High Spatial Resolution
Prof. Georg Schitter, Martin Schober (TU Wien – Vienna, Austria), Dr. Sergey Bychikhin (Alten Gmbh – Munich, Germany), Dr. Hans-Dieter Wohlmuth (Infineon Technologies AG – Neubiberg, Germany), Dr. Werner Simbürger (High Power Pulse Instruments GmbH – Haar, Germany)
Mathias Poik (TU Wien – Vienna, Austria)

Mathias Poik is PhD student at the Automation and Control Institute (ACIN) at TU Wien, Austria. He received his MSc. in Energy Systems and Automation Technology from TU Wien in 2017. His primary research interests are the development of scanning probe-based methods for the evaluation of integrated circuits, and the development of electrical measurement modes for Atomic Force Microscopy. He currently works on a research project aimed at enabling contactless characterization of RF products on wafer-level at high spatial resolution.

14:00 – 14:30 55GHz Octal-site Wafer Test Probecard for 5G mmWave devices
Peter Cockburn (Cohu – Saint Paul, USA)

Peter Cockburn has worked in the ATE industry for over 30 years at Schlumberger, NPTest, Credence, LTXCredence, Xcerra and now Cohu. He is currently responsible for High Performance Contactor products, including fine-pitch coaxial contactors and probe heads for emerging 5G applications.

After developing realtime and GUI software for ATE systems, he moved into product marketing and launched several new SOC ATE systems and analog test options as well as providing marketing and sales support in USA, Asia and Europe.

As leader of the Test Cell Innovation team, he was responsible for defining and delivering complete test cells to customers to reduce cost, increase uptime and improve quality when testing pressure and motion sensors, microphones and wafer-level packages.

He has an Engineering degree from the University of Southampton, UK.

14:30 – 15:00 5G mmWave: Multi-site RF Probe Cards Enable Lower Cost-of-Test in Mass Production
Ryan Garrison (FormFactor, Inc. – Beaverton, USA)

Ryan Garrison is a Senior Product Business Manager with FormFactor’s Probes BU focused on RF probing solutions. With nearly 20 years at FormFactor, he has held multiple engineering and leadership roles in operations and the development of Analytical RF Probes, Probe Stations, and now Production RF Probes. His current responsibility centers on the business of expanding RF test parallelism for sub-6 GHz and mmW antenna devices. Most recently Ryan lead a team through the development-process-to-product-release of a new probe head effectively doubling the parallelism of RF test using FormFactor’s membrane technology. Prior to joining FormFactor, Ryan graduated from the Oregon State University in Industrial and Manufacturing Engineering.

15:00 – 15:30 Break – Poster Session
15:00 – 15:30 POSTER SESSION: Probe Potpourri 1
Magnetic Testing Tutorial – Wafer probing with 3D magnetic stimulation
Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)

Georg Franz has worked in the Semiconductor Industry for 20 years. After receiving his masters degree in mechanical engineering at the Technical University in Vienna, Austria he worked 7 years at Carinthian Tech Research in Villach, where he developed wafer handling equipment and micromanufacturing machines and conducted finite element simulations.

In 2012 he joined T.I.P.S. Messtechnik, a probe card manufacturer focused on power, automotive and sensor devices. His main field of activity is the advancement of test technologies and the development of new products, especially high voltage test and magnetic sensor stimulation.


Hydra Probes – Simplifying and Standardizing Semiconductor Test
Tes Olson (Cohu – St Paul, USA)
Rob Stoner (Cohu – Saint Paul, USA)

Rob Stoner is a Program Manager for the Interface Solution Group (ISG) of Cohu Incorporated. He graduated from Minnesota State University with a BSME and holds an MBA from the University. of St. Thomas. He spent the first 11 years of his career in the Defense industry, where he managed the development and production of avionic and shipboard systems. He joined Cohu in 2021 and has since managed the development of new R&D contactor solutions.


Increasing transparency in wafer test probecard maintenance processes through targeted key performance indicators
Lasse Meyer (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)
Dr. Veronika Haehnel (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)

Dr. Veronika Haehnel joined the FE wafer test division at Infineon Dresden in 2017 and is currently as Staff Engineer Material Science responsible for the management and optimization of the probecard processes including database management, cleaning procedures, KPI creation & tracking as well as all quality and audit relevant topics. Initially, she worked as a Senior Engineer Wafer Test for Chipcard products including wafer test monitoring. Prior to joining Infineon she spent 8 years with Leibniz Institute for Solid State and Materials Research Dresden in basic research of nano- & microstructured electrodeposited systems. She holds a diploma engineering degree and a PhD in Materials Science from Technische Universität Dresden.


Automated temperature calibration routine for prober chucks
Harald Ibele (Sigma Sensors (TCL) GmbH – Sigmaringen, Germany)

Harald Ibele is the Owner, Technical and Quality Manager of Sigma Sensors, an A2LA ISO17025:2017 accredited Temperature Calibration Laboratory He first joined the Semiconductor Industry in 2003 working for a Microelectronic distributor and established an accredited calibration laboratory in 2005. In 2007 he joined a European thermal chuck manufacturer establishing their presence in the US before relocating to Asia to build their support network in 2012. Harald has extensive experience with temperature aspects of waferprobe, custom temperature solutions, prober sealing and thermal upgrades. After having returned to Europe in 2017 he directed global sales and customer support for thermal chucks before starting his own business in 2019. Sigma Sensors is based in Sigmaringen Germany with a newly established branch in the US. Sigma Sensors performs on site, accredited thermal chuck calibrations and manufactures the made for global mobility Cowboy Wafer. He currently lives in Germany and has 4 children.


Small Pad/Small Pitch Dual-Sided Single-Level Space Transformer
Dominik Schmidt (Translarity Inc. – Fremont, USA)

Probe Debris Rating Scale
Karan Maniar (Nidec SV TCL – Tempe, USA)
Kyle Cotner (Nidec SV TCL – Tempe, USA)

Kyle graduated with a Bachelor of Science degree (cum laude) in Mechanical Engineering from the University of Arizona in 2005. He has worked in Germany and in the U.S. for start-ups, mid-size companies, and multinational corporations across the automotive, medical device, and now semiconductor test industries.

Kyle joined the Nidec SV TCL team in late 2015 as the Product Engineering Manager based in Tempe, Arizona. He used his experience from other industries in project management and new product industrialization to improve the operational performance of the product engineering team and quickly came up to speed with the unique aspects of wafer test.

In 2019, Kyle was promoted to Director of Engineering and added overall responsibility for engineering and design to his role. He has focused heavily on removing internal barriers and improving communication to streamline operations, improve quality and performance, and shorten lead time.

In his free time, Kyle enjoys traveling (when Covid allows), golfing, running, and homebrewing.


15:30 – 17:00 SESSION 2A: Pushing the Test Limits
Session Chair
: Jerry Broz, PhD (SWTest Conference General Chair)
15:30 – 16:00 3D IC probe card solution
Brian Chang (Chunghwa Precision Test Tech.Co., Ltd. – Santa Clara)

Brian Chang is CHPT USA office manager, managing CHPT US sales/design/FAE team. Brian has worked for CHPT since 2003, was a PCB designer until 2005, then got promoted to PCB manager. 2006 setup Hsinchu office and serviced customer locally, 2010 established US office and got promoted as an office manager.

Paul Tai (Chunghwa Precision Test Tech. Co., Ltd – Santa Clara)

Sales manager for CHPT North America

16:00 – 16:30 Automated temperature calibration: Tackling the challenge of temperature accuracy and uniformity measurements in wafer probing
Bengt Haunerland (ERS electronic GmbH – Munich, Germany)

Bengt Haunerland joined ERS electronic GmbH in 2018 and is today Head of Software and Electronics. He has a Master’s degree in Electronics Engineering from Simon Fraser University in Canada.

16:30 – 17:00 Advancing Probe Card Parallelism for SOC Devices
Johann Heitzer (Infineon – Munich, Germany), Cameron Harker (FormFactor – Livermore, USA)
Pouya Dastmalchi (FormFactor Inc. – Livermore, USA)

Pouya Dastmalchi got his PhD in EE from LSU and joined FormFactor in 2016. Worked in probecard design team as an EDE for over 3 years and currently he is an Application Eng. Manager for SoC products working closely with different Semiconductor Wafer Test Groups.

17:00 Technical Sessions Adjourn and EXPO Opens at 17:00
17:00 – 20:00 SWTest EXPO – 2022
17:00 – 20:00 SWTest 2022 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
20:00 Sponsor Hospitality Suites and Events
Technoprobe sponsor ad
Tuesday, June 7, 2022
7:00 – 8:00 Continental Breakfast
7:00 – Noon Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2022
Jerry Broz, PhD, SWTest General Chair, Advanced Probing Systems

Introduction to the SWT Crew Initiative
Karen Armendariz (Celadon Systems) and Amy Leong (FormFactor)
8:30 – 9:30 KEYNOTE Advanced Packaging and Test Enabling Our Digital Society
Rebeca Jimenez,
Corporate Vice President Advanced SiP Business Unit
Amkor Technology, Inc
Abstract

Semiconductors are the building blocks of our modern digital society and allow us to be connected anywhere and everywhere. We interact with semiconductors every day through almost everything we do, whether using our smartphones, personal electronics, connected homes or our cars, which have become digital cockpits, immersed with advanced safety features. All of these digital interactions require massive computing and connectivity power to process, store and transfer data. Join me as we explore innovations in advanced packaging and test technology and how they enable further transformation in our digital society with a focus on the key catalysts of 5G, High Performance Computing, IoT and Automotive applications.

Biography

Rebeca Jimenez joined Amkor in 2014 and is currently Corporate Vice President, Advanced SiP Business Unit. Prior to assuming her current role, Ms. Jimenez served in various sales and strategic program management roles. She has more than 25 years of experience in the global semiconductor industry. Prior to joining Amkor, she spent 15 years with IDT (previously ICS) in both test engineering and operations roles as well as management positions. In addition, Ms Jimenez worked in various engineering and engineering management roles at Motorola. She holds a BS in Electrical Engineering from Arizona State University, as well as an MS in Electrical Engineering from National Technological University.

9:30 – 10:00 Coffee Break
10:00 – 12:00 SESSION 3: Reducing Costs (Cost of Ownership)
Session Chair: Karen Armendariz (Celadon Systems – USA)
10:00 – 10:30 The Use of Artificial Intelligence and Big Data in the Production of Advanced Vertical Guide Plates
Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)

Alan has a degree from the University of Glasgow, Scotland in Theoretical Chemistry, and a doctorate in laser spectroscopy from the University of Cambridge. Whilst at Cambridge he gained a Research Scholarship to study at the Max Plank Institute in Gottingen, Germany. He has worked for several companies specialising in the “Applications of Lasers” and has been working in the field of lasers for over 35 years. At Oxford Lasers, Alan has held a number of positions including managing Research and Development as well as Sales and is currently a Director at Oxford Lasers with responsibility for Business Development. Alan has extensive knowledge on the use of lasers in the area of laser micro-machining covering a multitude of applications in particular the drilling of guide plates used in probe cards for wafer test. He has published numerous technical papers and patents and has written articles for a variety of magazines. Last year at SW Test he was awarded the “People’s Choice Award” for his presentation.

10:30 – 11:00 Control System for Enhancing the Life and Capability of Legacy, Modern and Mixed-Floor Probe Systems
Albert Soto (Soto Technologies International – Pflugerville, USA)

Albert has 40 years of experience in the Robotics/Automation/Semiconductor industries. He started his career in 1982 at IBM implementing Robotics and Automation applications on the RT-PC Unix computers project. In 1988 transferred to Motorola MOS Digital/Analog semiconductor test group as Test Engineer for a decade ending as Test Director. Albert is currently the President/CEO of Soto Technologies which focuses on Prober Cell Controllers that standardize and enhance legacy probers to be more competitive with newer models. Also focuses on Test Data Analysis/STDF tools and non-intrusive machine OEE/Utilization tracking for wafer sort and final test. He has a diverse skill set ranging from hardware/embedded design using MCU/FPGA’s, machine shop skills and C/C++ programming for Embedded/Windows/LINUX systems. He holds a BSEE from University of Puerto Rico and has published articles at IEEE symposiums and is active in Martial Arts.

11:00 – 11:30 Probe Card Total Cost of Ownership in the Era of Complexity
Steve Ledford (Teradyne – North Reading, USA)

Steve has 33 years experience in the semiconductor industry. He started his career with Motorola Semiconductor developing products for wireless applications. In 2000 he switched to the ATE equipment market during the birth of the SOC test market bringing multiple generations of systems, instrumentation, applications, and services to market for the past 22 years. Steve is currently the General Manager of the Device Interface Solutions business unit of Teradyne. He holds a Bachelors degree in Electrical Engineering from the University of Florida and a Masters of Business Administration from the University of Alabama. Steve has published over 20 articles in leading industry journals and conferences and is an inventor for more than 10 patents.

11:30 – 12:00 Assessing the Overall Cost of Ownership
Bert Brost (Technoprobe – San Jose , USA)
Mike Palumbo (Technoprobe – San Jose , USA)

Mike holds a BSEE degree from George Mason University in Fairfax VA. He spent the first 14 years of his career working at IBM facilities in East Fishkill, NY and Manassas, VA. Where he worked as test engineer evaluating the degradation of parametric test structures caused by ionizing radiation for IBM’s space products group. Next Mike joined Intel Corporation where he spent 22 years in Hillsboro, OR. Where the majority of those year he worked as a parametric test engineer. The last four years Mike worked as a commodity development engineer managing the creation of wafer level full die probe cards. Mike’s entire semiconductor career has been spent developing test solutions for evaluating next generation silicon process development products. Mike is now a director of new business development and product marketing at Technoprobe.

12:00 – 13:00 Enjoy Lunch on the Luna Lawn!
13:00 – 15:00 SESSION 4: New Probe Technologies
Session Chair: Connie Smith (Texas Instruments)
13:00 – 13:30 Probing challenges using magnetic field
Jory Twitchell (NXP Semiconductor)

Jory Twitchell works for NXP Semiconductors and has been with the company for 22 years. He currently works as a hardware development engineer. He oversees the development of wafer test hardware for business lines worldwide working with internal production partners to ensure the hardware meets their requirements. Jory is happy to have the opportunity to be back at SWTW in person to present to everyone.

Brandon Mair (TechnoProbe America)

Brandon Mair is currently a strategic account manager for Technoprobe America Inc. Previous to this role, he had various roles at Texas Instruments spanning a total of 11 years. These positions ranged from Probe Manager to Equipment Engineering in some of the TI Fabs. He has attended numerous SWTW conferences over the last ten years and collaborated with many suppliers in the room today. Brandon is happy to be here in person with everyone!

13:30 – 14:00 UFO Probe™ Card – New dimensions in wafer-level test of photonic integrated circuits
Tobias Gnausch (Jenoptik Optical Systems GmbH – Jena, Germany)

Tobias Gnausch, Product Manager at JENOPTIK, received his diploma in physics from the University of Jena in 2005. He worked as a mechanical engineer and developer for interferometric stylus measurement systems at BOSCH. In 2008, he joined JENOPTIK as an optical designer for diffractive optical elements and systems. From 2012, he was responsible for the product management of UV- micro optics for Semiconductor Equipment. Beginning of 2016, he took over the product responsibility of a new business sector within the Business Unit Micro-Optics, which included a product development for wafer-level testing of PICs.

14:00 – 14:30 Extreme Power Probing – Challenges of 3000A and more
Sebastian Salbrechter (TIPS Messtechnik- Austria)
Dr. Rainer Gaggl (TIPS Messtechnik- Austria)

Rainer Gaggl, born in 1966, married, 3 kids, holds a PhD in Physics from the Technical University of Graz. He is passionate for micro-mechanics and aviation: 1994 Guiness Book of Records – “The smallest piston aircraft engine in the world.”

Milestones in his career:

  • 1996: PhD in Experimental Physics at TU Graz
  • 1996-1997: R&D engineer at Philips Display Components, responsible for high voltage processes in electron beam picture tubes production
  • 1997: founding T.I.P.S. Messtechnik GmbH as a “spin-off” of Siemens Bauelemente as a one-man company in this time
  • to date: Managing Director of T.I.P.S. : Austria, 80+ workforce company in Austria

He is managing director in T.I.P.S. and responsible for product and process development as well as strategic sales activities. The main focus in his work is on test interfaces for High Power Devices, Automotive ASICS, Sensors and MEMS devices, Automotive RADAR. High Voltage, High Currents and probe cards with sensor stimuli are some of his “playgrounds as a physicist” and he holds several patents in that field.

Diana Damian (TIPS Messtechnik- Austria)
  • 2015-present T.I.P.S. Messtechnik GmbH, Villach, Austria
  • R&D Support
  • Probes production
  • Probecard tests
  • 2014 – Researcher, Charinthian Tech Research AG, Villach
  • Master thesis work: MOEMS-based laser scanning for light-driven microfluidics
  • 2012-2014 Master Degree in Medical Technology, Fachhochschule Kaernten, Klagenfurt (Austria)
  • 2009-2012 Bachelor Degree in Medical Physics, Faculty of Physics, University of Bucharest (Romania)
14:30 – 15:00 Copper pad probing with vertical technologies featuring hard metal tip: ARIANNA™ probe family
Mattia De Nicola (STMicroelectronics – Italy) Dr. Emanuele Bertarelli, Raffaele Vallauri (Technoprobe – Italy)
Dr. Alberto Pagani (STMicroelectronics – Italy)

Alberto Pagani received master degree in Electronic Engineering in 2000 from Politecnico di Milano, Italy. In the same year, he joined STMicroelectronics, Agrate Brianza, Italy.

From 2000 to 2006 he worked in wafer sort department as Process and Test Engineer on Flash memories. Since 2006, he is in charge of Test R&D and Competitive Intelligence. He is member of STMicroelectronics Technical Staff and internal teacher. His work is mainly focused on innovative testing / probing technologies and new product / technology development for new markets.

Dr. Pagani’s awards include 2010 Sesames Award and 2010 RFID Italy award. He was also the winner of the 2016 VLSI Test Symposium Best Special Session Award. He holds more than 100 patents in USA, Europe and China in several technical fields.

Erwin Verardi (STMicroelectronics – Italy)

Erwin Verardi’s Current job: STM, sr. EWS process Eng.
Main job activities: probe card techno qualification, new silicon qualification, data analysis, support for R&D projects, support for Failure Analysis, ww prober software reference
Education: Material Science degree
Add.: Six Sigma Black belt

Salvatore De Siena (Technoprobe – Italy)

Salvatore De Siena is R&D Lab Manager, working in Technoprobe Italy headquarter since 2018. Previously he worked as Process Engineer for Technology team and Process Kaizen Engineer – team leader, following in particular probe head manufacturing processes. He is currently responsible for Technoprobe R&D Laboratories.

15:00 Technical Sessions Adjourn and EXPO Opens
15:00 – 17:00 SWTest EXPO – 2022
15:00 – 17:00 SWTest 2022 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
17:00 – 18:00 SWT Crew Social Event
18:00 – 21:00 SWTest Social Event – Luau Party
21:00 Sponsor Hospitality Suites and Events
M J C sponsor ad
Wednesday, June 8, 2022
7:00 – 8:00 Continental Breakfast
8:00 – 9:30 SESSION 5: Pads, Bumps, and Defects
Session Chair: Dr. Michael Huebner (FormFactor)
8:00 – 8:30 An Advanced Method for Pad Stack Crack Assessment during Probe-Over-Active-Area
Dr. Marianne Unterreitmeier, Dr. Eric Liau (Infineon Technologies Germany), Mark Ojeda (Infineon Technologies – USA)
Dr. Oliver Nagler (Infineon Technologies Germany)

Dr. Oliver Nagler finalized his diploma degree (Dipl.-Ing.) of aerospace engineering at the Technical University of Munich in 1994 and received his physical doctorate degree (Dr.-Ing.) in electrical engineering from the Bundeswehr der Universität, Munich in 2008. He started his career as a research engineer at the Fraunhofer Institut for Solid State Technology in Munich in 1995. Since 1999, he’s been an employee at Infineon Technologies AG, Neubiberg, Germany, currently in the department of Test Technology and Innovation. He is a lead principal for contact technologies and head of Infineon’s R&D probing lab. Oliver holds several patents and international publications in probing technology and processes. In cooperation with national and international universities, he is regularly supervising bachelor, master, and Ph.D. students.

8:30 – 9:00 On Shifting Defect Detection in Quantum Chips From Cryogenic to Ambient Temperature
Roy Li, Erik Jan Marinissen, Fahd Ayyalil Mohiyaddin, Michele Stucchi, Georges Gielen (IMEC – Leuven, Belgium)
Francesco Lorenzelli (IMEC – Leuven, Belgium)

Francesco Lorenzelli received a Master’s Degree cum Laude in Electrical Engineering at the University of Bologna in October 2020, with the Thesis: “Development of Innovative Algorithms and Tools to Test Advanced Technology Cell Libraries”, with Prof. Cecilia Metra as main supervisor, Martin Omana and Erik Jan Marinissen as co-supervisors, in a joint project with Cadence Design Systems, TU Eindhoven and IMEC.

He is currently a PhD student at IMEC, with a project on testing of circuits for quantum computers. His focus is testing of silicon spin qubit devices at ambient or at mildly lowered temperatures.

9:00 – 9:30 Reducing test time by exploiting scan ATPG-based patterns targeting high density
Prof. Paolo Bernardi, Giusy Iaria, Prof. Matteo Sonza Reorda (Politecnico di Torino – Italy) Davide Appello, Giuseppe Garozzo, Vincenzo Tancorre, Roberto Ugioli (ST Microelectronics – Italy)
Francesco Angione (Politecnico di Torino – Italy)

Francesco Angione is a Computer Engineering with an M.Sc., Embedded Systems track, obtained from Politecnico di Torino in 2020. Currently, he is a Ph.D. student at Politecnico di Torino in the CAD & Reliability group. His main interests are real-time operating systems, computer architectures, and their dependability applied to automotive System-on-Chip.

9:30 – 10:00 Novel reverse engineering way of fine pitch pre-bump probe head development in pureplay foundries to enable early-stage yield learning and DFA support via PBI/RDL MEMS technology
Chan Yin Hong Patrick, Chithambaram Shaalini, Chen Changqing (GlobalFoundries – Singapore, Singapore), Dr. Jeffrey Lam, Yang Qu (Star-Quest – Singapore), Dr. Choon-Leong Lou (STAr Technologies – Taiwan), Dr. Szu Huat Goh (Qualcomm)
Dr. Jeffrey Lam (Star-Quest – Singapore)

Dr. Jeffrey Lam is currently the GM/Vice-President of Engineering at STAr-Quest Technologies. Prior to joining STAr Technologies, Dr Lam was VP of Product, Test and Failure Analysis with GlobalFoundries for 19 years. He possesses more than 40 years of experience in Process Module, Design Engineering, Product/Yield engineering, Failure Analysis and Test Development Engineering. He has 17 technical patents and more than 100 publications. He has been the chairman for SEMI SEA Product & Test Committee since 2009 and serves as an Adjunct Associate Professor at the National University of Singapore.

Dr. Lam received his B.S and M.S. in Chemical Engineering from UC Berkeley and UC Davis in 1979 and 1981 respectively. He obtained a second M.S in Electrical Engineering and Computer Science from the University of Santa Clara in 1986. In 2014, he received his PhD from the School of Physical and Mathematical Sciences, Nanyang Technological University.

10:00 – 10:15 Coffee Break
10:15 – 12:00 SESSION 6: Changes on the Horizon
Session Chair: Patrick Mui (JEM America)
10:15 – 10:45 Advances in Vertical Probing for High-Speed Digital Test at Wafer Sort
David Raschko (FormFactor – USA)

David Raschko currently works as a Product Marketing Manager at FormFactor where he manages their Apollo product line focused on the Logic and Foundry market. Prior to his current role at FormFactor, David worked as a Product Engineer at FormFactor where he was responsible for developing and growing the mmWave Probe Card business in the 5G AIP market. Raschko received his MBA from Washington State University in 2021 with a finance concentration and completed his M.S. in Applied Physics at the University of Oregon in 2015 with a focus in Optics

10:45 – 11:15 Shifting Left = More Wafer Probe
Dave Armstrong (Advantest – USA)

In his capacity as Principal Test Strategist, Dave Armstrong works directly with customers and Advantest’s global R&D teams to define develop and deliver creative solutions to the most demanding test challenges. Additionally, Dave is chairs multiple working groups exploring the photonic device testing roadmap.

Prior to joining Advantest in 2004, Dave spent over two decades in HP/Agilent’s IC test group working with customers to test industry leading devices. Prior to joining HP Dave worked in the semiconductor industry in areas of IC and system design, product/yield engineering, as well as test engineering. Dave Armstrong received degrees in Electrical, Computer, and Environmental Engineering from the University of Michigan in 1974.

11:15 – 11:45 The semiconductor industry is fast adapting to a new reality. How can suppliers of probe cards keep up?
John West (Yole Intelligence – London, United Kingdom)

John is a Senior Division Director at Yole Intelligence and has more than 20 years of experience working in the semiconductor industry. His special areas of interest cover probe cards, test and burn-in sockets, device interface boards, and the key enabling technologies used in wafer fab equipment.

11:45 – 12:00 SWTest 2022 Awards and Adjournment

See you in 2023!
Travel Safe and Stay Healthy!

A E H R sponsor ad
SWTest 2022 ON-Demand – Probe Potpourri 2
June 9 – July 9, 2022
Introduction of new probe, VPT (Vertical Probe Transformed)
Kazunori Kobayashi (Sinko Corporation – Niigata, Japan)
Tadashi Rokkaku (Probe Innovation USA, LLC – Irving, USA)

Educational background

  • 1974: Graduating Kyoto University engineering department precise engineering department master’s course

Professional Career

  • 1974-1997: Mitsubishi Heavy Industries, Ltd.
  • Engaged in Machine Tool Design and R&D
  • 2001-2003: OHT Corporation
  • Experienced FPD Inspection Machine Division Manager
  • 2005-2008: Apex Advanced Technology Corporation
  • Experienced Director Production general manager,
  • 2012: Founded Probe Innovation, Inc.
  • 2015 Founded Probe Innovation USA, LLC
Next Generation DRAM Temperature Requirements and Impacts to Full Wafer Contactor Probe Card Performance
Hyun Ae Lee (Samsung – Suwon, Korea)
Myungjin Lee (FormFactor – Livermore, USA)

MJ has been with FormFactor for over 10 years and is currently serving as Director of Product Marketing in the probes business unit. In this role, he has responsibility for Memory Probe card solutions specifically for the DRAM market. With over 25 years of experience in the Semiconductor Memory industry, MJ has held various roles in product marketing, sales, product engineering at Formfactor, SK Hynix, Micron, and Samsung.

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Exhibitor Directory

EXPO Map

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Exhibitors

advanced probing systems hybrid sponsor

Advanced Probing Systems, Inc. — Hybrid Silver Sponsor

AdvancedProbing.com

Description:
The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, berylliumcopper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material. Lower your overall cost of testing by using APS’s quality probe needles.

Contact:
Ed Johnson | ejohnson@advancedprobing.com
465 S. Pierce Avenue #200, Louisville, CO 80027 USA
+1-303-939-9384

advantest - hybrid sponsor

Advantest — Hybrid Gold Sponsor

Booth: 412
Advantest.com

Description:
For 65+ years Advantest has pioneered the development of semiconductor test and handling solutions, becoming the leading global provider of ATE by working closely with industry leaders to deliver innovative solutions and superior value. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world.

Contact:
Keith Schaub | keith.schaub@advantest.com
3061 Zanker Road, San Jose, CA 95134 USA
+1-917-568-5395

aehr hybrid sponsor

AEHR Test Systems — Hybrid Platinum Sponsor

Booth: 310
AEHR.com

Description:
Aehr Test Systems is a worldwide supplier of burn-in test equipment and pioneer of Wafer Level Test & Burn-in (“WLTBI”) FOX platform
Wafer level and singulated die/module stabilization and infant mortality test is being commercially adopted across multiple markets
– Power devices (Gallium Nitride, Silicon Carbide)
– Silicon Photonics (Gallium Arsenide, Indium Phosphide) – 2D/3D sensors (LEDs/VCSELs)
– Discrete memories (DRAM, NAND)
– MCUs/embedded memories
FOX platform has been adopted and validated by industry leading companies

Contact:
Tom Trexler | ttrexler@aehr.com
400 Kato Terrace, Fremont, CA 94539 USA
+1-510-623-9400 x266

aem afore hybrid

AEM Afore — Hybrid

Booth: 207
AEM.com.sg

Description:
Afore Wafer Level Test Solutions are a key offering under AEM’s Test Cells Solutions Business that has established leadership positions in developing and deploying application-specific test solutions for MEMS devices and offering wafer and frame probing stations suitable for R&D, wafer sort, and Final Test.

Contact:
Michael Siebert | michael.siebert@aem.com.sg
Vakiotie 5 Lieto, 21420 Finland
+358-44-084-8900

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celadon hybrid sponsor

Celadon Systems, Inc. — Hybrid Silver Sponsor

Booth: 401
CeladonSystems.com

Description:
Celadon Systems, a wholly-owned subsidiary of MPI, is a well-established 20-year-old US-based company known for providing “Peace of Mind” probing solutions to the semiconductor industry.
Celadon probe cards are known for thriving in temperature extremes while still delivering accurate and precise test results.
Expect millions of touchdowns with Celadon probe cards. Celadon delivers the lowest cost of test in the industry.
Celadon is an industry leader in parametric probe both in production and in the lab.

Contact:
Garrett Tranquillo | garrett.tranquillo@celadonsystems.com
13795 Frontier Court, Burnsville, MN 55337 USA
+1-952-232-1698

chpt hybrid sponsor

Chunghwa Precision Test Tech. Co., Ltd. (CHPT) — Hybrid Silver Sponsor

Booth: 500
CHT-PT.com.tw

Description:
CHPT, one of the leading providers of semiconductor test interface products, employs a unique strategy that sets it apart from much of the industry. Our vertically integrated approach operates on an “All in House” business model. By utilizing the talent of our experts in the fields of electronics, chemistry, mechanics, and optics, we are able to create a win-win situation with customers and innovate at the pace of the ever-changing semiconductor industry.

Contact:
Jessica Yu | jessica.yu@chpt.com
No.12, Gongye 3rd Rd., Pingzhen Dist., Taoyuan City 324 Taiwan
+886-3469-1234

cohu hybrid sponsor

Cohu, Inc. — Hybrid Silver Sponsor

Booth: 610
Cohu.com

Description:
Cohu, Inc. (NASDAQ: Cohu) offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop-shop for test and handling equipment, thermal subsystems, test contacting, vision inspection & metrology and MEMS test solutions.
Cohu’s product portfolio is focused on increasing yield, reducing cost of test and accelerating time-to-market. We deliver leading-edge solutions that enable a smarter, safer, and more connected future.
Learn more: https://www.cohu.com/interface-solutions

Contact:
Dan Campion | dan.campion@cohu.com
4444 Centerville Road, Suite 105, St Paul, MN 55127 USA
+1-715-497-9283

Complete Probe Solutions, Inc. — Hybrid

Booth: 210
CompleteProbeSolutions.com

Description:
Complete Probe Solutions is proud to announce the availability of the new APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems

Contact:
Kevin Chandler | kchandler@completeprobesolutions.com
393-E Tomkins Court, Gilroy, CA 95020 USA
+1-408-755-5567

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DIT disruptive innovation technology hybrid sponsor

DIT (Disruptive Innovation Technology) — Hybrid Silver Sponsor

Booth: 506
gitechnology.co.kr

Description:
Equipped with special Ceramic manufacturing technology to adopt with various semi-conductor products (e.g. Substrate for Probe card etc.)

Contact:
Paul Kim | pk@gitechnology.co.kr
Samyang Techno Park, 13 Siheung-si, Gyeonggi-do, 15086 South Korea
+82-10-2553-9127

dr yield hybrid

DR YIELD — Hybrid

Booth: 101
DRYIELD.com

Description:
DR YIELD has been the innovation leader for data-driven yield analysis applications in the semiconductor industry since 2005.
We provide the YieldWatchDog solution that gives you deep insight into your semiconductor test and manufacturing data. Advanced data analytics based on intelligent algorithms enables data-based decision making to increase yields and profits.

Contact:
Krista Tropper | sales@dryield.com
Opernring 4, 8010 Graz, Austria
+43-316-225-7140

ers - hybrid sponsor

ERS electronic GmbH — Hybrid Gold Sponsor

Booth: 513
ERS-GmbH.com

Description:
ERS electronic GmbH, based around Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing.
Visit our website www.ers-gmbh.com for more information

Contact:
Bernd Krafthoefer | krafthoefer@ers-gmbh.de
Stettiner Strasse 3, Germering, 82110 Germany
+49-08-989-4132-0

esmo group usa hybrid

esmo USA — Hybrid

Booth: 501
esmo-group.com

Description:
Established in 2001, esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, and the United States, we are truly global. We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.

Contact:

Homan Amin | sales@esmo-usa.com
1020 Winding Creek Rd, Ste 120 Roseville, CA 95678 USA
+1-916-709-0398

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feinmetall hybrid sponsor

Feinmetall GmbH — Hybrid Silver Sponsor

Booth: 607
Feinmetall.com

Description:
Feinmetall as long-term supplier to the semiconductor industry with leading-edge technology for automotive applications masters all areas of probe cards for wafer test: from feasibility studies to design and fabrication of the probe card up to turnkey solutions and full repair-shop-management. We offer superior contacting solutions to our customers and worldwide local service.

Contact:
Dr. Matthias Schnaithmann | matthias.schnaithmann@feinmetall.de
Zeppelinstr. 8, Herenberg 71083 Germany
+49-70-322-0012-08

Ferrotec — Hybrid

Booth: 201
Ferrotec.com

Description:
Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.

Contact:
John Wu | john.wu@ferrotec.com
3945 Freedom Circle #450, Santa Clara, CA 95054 USA
+1-408-964-7700

formfactor - hybrid sponsor

FormFactor, Inc. — Hybrid Platinum Sponsor

Booth: 311
FormFactor.com

Description:

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.

By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

Contact:
Carole Garner | carole.garner@formfactor.com
7005 Southfront Road, Livermore, CA 94551 USA
+1-925-550-7530

harbor electronics hybrid

Harbor Electronics — Hybrid

Booth: 111
Harbor-Electronics.com

Description:
The World’s Largest PCB Supplier to the ATE Market

  • Helping you find the right ATE solutions
  • Out-of-the-Box Quality
  • Follow ISO standards to protect the environment
  • End to end service from design to manufacturing

Contact:
Erin Chen | erin.chen@harbor-electronics.com
3021 Kenneth Street, Santa Clara, CA 95054 USA
+1-408-568-0080

Heraeus sponsor ad
heraeus - hybrid sponsor

Heraeus Deutschland GmbH & Co. KG — Hybrid Gold Sponsor

Booth: 411
Heraeus-Electrical-Contacts.com

Description:
Heraeus is a leading manufacturer of precious metal based materials for the use of probe cards and the wafer test industry. A variety of alloys is available for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and / or withstand corrosion effects strongly. Customers benefit from outstanding precious metal expertise right at the heart of probe cards, the interface between wafer and the tester’s periphery.

Contact:
Marc Raettig | marc.raettig@heraeus.com
Heraeusstrasse 12-14, Hanau 63450 Germany
+49-17-153-7207-2

Integrated Technology Corporation — Hybrid

Booth: 605
IntTechCorp.com

Description:
Integrated Technology Corporation has been serving the needs of our customers for more than 35 years. We provide solutions for metrology and testing equipment in many areas. Test, analysis, and repair of IC probe cards, Innovative metrology and inspection solutions, Solutions for dynamic testing.

Contact:
Mark McLaren | markm@inttechcorp.com
1228 N Stadem Drive, Tempe, AZ 85281 USA
+1-480-612-2182

integrated test corp hybrid

Integrated Test Corp — Hybrid

Booth: 103
IntegratedTest.com

Description:
Design, Manufacture, Component Assembly, and Test of ATE Printed Circuit Boards and Test Interface Hardware.

Contact:
Tim Barr | tbarr@integratedtest.com
10365 Sanden Dr, Dallas, TX 75238 USA
+1-214-843-8645

international test solutions - hybrid sponsor

International Test Solutions — Hybrid Gold Sponsor

Booth: 301
IntTest.net

Description:
International Test Solutions (ITS) is a leading global supplier of highly engineered cleaning materials supporting the semiconductor industry. ITS products are used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW).

ITS provides critical materials and turnkey products that enable device manufactures and foundries to maximize uptime and throughput for substantial cost of test savings.

Contact:
Bret Humphrey | bret.humphrey@cmcmaterials.com
1595 Meadow Wood Lane, Reno, NV 89502 USA
+1-775-284-9220

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intest ems - hybrid sponsor

inTEST EMS — Hybrid Platinum Sponsor

Booth: 407
inTest-Semicon.com

Description:
inTEST EMS designs and manufactures engineered solutions for ATE and other electronic tests, as well as industrial process applications. Our products are used by semiconductor manufacturers to perform development, qualifying and final testing of integrated circuits (ICs) and wafers, and for other electronic tests across a range of industries.

Contact:
Bill Wyckoff | b.wyckoff@intest-ems.com
47777 Warm Springs Blvd, Freemont, CA 94539 USA
+1-408-678-9187

IWIN Co., Ltd. — Hybrid

Booth: 510
IWINsn.com

Description:
IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price

Contact:
AJ Park | aj@iwinsn.com
#206 CBTP OChang, Cheongwon, Cheongju, 28115 South Korea
+82-106-417-7580

jem - hybrid sponsor

JEM America Corp. — Hybrid Platinum Sponsor

Booth: 303
JEMAm.com

Description:
JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC) and image sensors. Our probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. We have international manufacturing and support facilities.

Contact:
Karen Wong | kwong@jemam.com
3000 Laurelview Court, Fremont, CA 94538 USA
+1-408-306-8623

KYOCERA International, Inc. — Hybrid

Booth: 113
Kyocera.com

Description:
KYOCERA Corporation is known as global leader of the Ceramic Technologies. our cutting-edge ceramic technologies provide solutions to many applications in the industry. For the Probe card, our unique and various material options help achieving the requirement for the next gen probe card.

Contact:
Joshua Castleberry | joshua.castleberry@kyocera.com
49070 Milmont Drive, Fremont, CA 94538 USA
+1-510-871-0578

T I P S sponsor ad
martek hybrid

MarTek, Inc. — Hybrid

Booth: 503
MartekProber.com

Description:
MarTek Probers, OEM of Electroglas Intellectual Property and Probers are made in Tempe, Arizona USA.
We continue to support Electroglas Models EG6000 (300mm), 4090u+ and 4080 (200mm) and 2001X (150mm).
MarTek offers sales of new and refurbished probers to factory specifications which include EG Commander Software licenses.
MarTek is seeking OEM partners or Industry Investors to modernize it’s 300mm prober and reintroduce the EG6000 prober to full production and market sales.

Contact:
John Luis | john@martekprober.com
112 S Rockford Dr. Ste 103, Tempe, AZ 85281 USA
+1-480-947-5757

mjc hybrid sponsor

MJC Electronics Corporation — Hybrid Platinum Sponsor

Booth: 410
MJC.co.jp

Description:
MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets, for the semiconductor industry.

Contact:
Steven Roybal | stevenr@mjcelectronics.com
11004 Metric Blvd., Austin, TX 78758 USA
+886-963-73-2015

mpi - hybrid sponsor

MPI Corporation — Hybrid Platinum Sponsor

Booth: 403
MPI-Corporation.com

Description:
MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI dedicates in producing state-of-the-art fine pitch probing tool which enhances the speed of the worldwide semiconductor technology migration.

Contact:
Cahris Lin | cahris.lin@mpi-corporation.com
No. 155, Chung-Ho St., Chu-pei City, Hsinchu County, 302 Taiwan
+886-3-555-1771 Ext.8608

nidec s v t c l - hybrid sponsor

Nidec SV TCL — Hybrid Platinum Sponsor

Booth: 300
SVProbe.com

Description:
Nidec SV TCL is a global provider of semiconductor testing products including a range of innovative, customizable MEMS Probes and diverse line of probe cards. Visit the Nidec SV TCL booth during the Expo to learn more about our MEMSFlex™ Probe Card technologies and the rest of our broad line of application-specific test solutions.

Contact:
Gary Luu | gluu@nidecsvtcl.com
7810 S. Hardy Drive, #109, Tempe, AZ 85284 USA
+1-480-635-4700

T S E sponsor ad

NTK Technologies, Inc. — Hybrid

Booth: 302
NTKTech.com

Description:
At NTK Technologies, we build robust packages for complex applications. However, our innovation helps to advance many of the technologies and products that improve people’s lives. Computers, optical communication, wireless networks, medical devices, automotive, space and aeronautics — many of the applications in these markets would not be possible without the technology that NTK provides. NTK is an ISO9002/14001certified company. As the technologies in our lives continue to advance, NTK will be there providing the support necessary to achieve the visions of tomorrow.

Contact:
Otto Liang | oliang@ntktech.com
3979 Freedom Circle, Ste 400 , Santa Clara, CA 95054 USA
+1-602-692-3684

onto innovation - hybrid sponsor

Onto Innovation — Hybrid Silver Sponsor

Booth: 608
OntoInnovation.com

Description:
Onto Innovation is a leader in process control with a portfolio of leading-edge technologies that include: Unpatterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging.

Contact:
Darren James | darren.james@ontoinnovation.com
16 Jospin Road, Wilmington, MA 01887 USA
+1-415-902-7065

optek systems hybrid

OpTek Systems Inc. — Hybrid

Booth: 203
OptekSystems.com

Description:
Precision machining/drilling equipment and contract manufacturing services for the production of guide plates and other precision components used in wafer test. Locations in the USA, UK and AP.

Contact:
Andrew Webb | andy.webb@opteksystems.com
10 Elizabeth Drive, Chelmsford, MA 1824 USA
+1-978-652-8331

oxford lasers - hybrid sponsor

Oxford Lasers, Inc. — Hybrid Gold Sponsor

Booth: 308
OxfordLasers.com

Description:
Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.

Contact:
Alan Ferguson | alan.ferguson@oxfordlasers.com
2 Shaker Road, Unit B104, Shirley, MA 01464 USA
+1-978-425-0755

E R S sponsor ad
pactech - hybrid sponsor

Booth: 612
PacTech.com

PacTech – Packaging Technologies GmbH — Hybrid Gold Sponsor

Description:
Pac Tech – Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is specialized in equipment manufacturing for high volume production: Laser bonders for cantilever assembly and cantilever repair, manual & automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders.

Contact:
Thomas Oppert | oppert@pactech.de
328 Martin Ave., Santa Clara, CA 95050 USA
+1-408-588-1925

pec point engineering hybrid sponsor

Point Engineering Co., Ltd. — Hybrid Silver Sponsor

Booth: 504
PointEng.co.kor

Description:
PEC has been serving the needs of our customers who play in the Display and Semiconductor fields for more than 24 years. Our providing technologies are ceramic coating and substrate that can control specified micro-patterns by MEMs process. Now we have shown a unique ceramic substrate, using AAO(Anodic Aluminum Oxide), in the finer mold for various micro-pins and guide plates for logic devices and memory devices also.

Contact:
Colin Park | colinpark@pointeng.co.kr
10th floor, The First Tower III 602, Dongtangiheung-ro, Hwaseong-si, Gyeonggi-do, 18469, Korea
+8210-5755-2743

posalux - hybrid sponsor

Posalux SA — Hybrid Gold Sponsor

Booth: 405
Posalux.com

Description:
Founded in 1943, POSALUX is a leading manufacturer of micro-technology machines intended for mass production. From our headquarters in Biel/Bienne, Switzerland, we engineer and produce world-renowned system solutions. Our clients are distinguished companies leading the electronic, automotive, watch and medical industries.

Contact:
Angelo Rizzo | arizzo@posalux.ch
Rue Fritz-Oppliger 18, Biel/Bienne, 2504 Switzerland
+41-0-32-344-75-00

PTSL hybrid sponsor

Probe Test Solutions — Hybrid Platinum Sponsor

Booth: 211
ProbeTestSolutions.com

Description:
PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

Contact:
Jordan Mackellar | jmackellar@probetestsolutions.com
1 Argyle Crescent, Hamilton, Glasgow, South Lanarkshire, ML3 9BQ UK
+44-0-1698-745268

International Test Solutions sponsor ad

Prober.com — Hybrid

Booth: 409
Prober.com

Description:
Prober.com is one of the longest running companies dedicated to refurbishment and resale of wafer prober lines. We offer complete sourcing and parts support for our customers. We pride ourselves in the satisfaction of our customers and we partner with them to provide solutions to capacity needs in a timely manner. We work with our customers to plan for large and small capacity increases as well as integrating thermal and OCR solutions for their changing test requirements.

Contact:
Dennis Bonciolini | dennis@prober.com
15532 SW Pacific Hwy., Suite C1B 501, OR 97224 USA
+1-503-822-5182

riff company inc virtual sponsor

Riff Company Inc. — Virtual Silver Sponsor

Riff-Co.com

Description:
Manufacturer of ceramic and engineering grade plastic products including precision micro drilling and milling. Probe card guide plate manufacturer for 30 years.

Contact:
Daniel McCormick | dan@riff-co.com
1484 Highland Ave, Suite 7, Cheshire, CT 6410 USA
+1-203-631-2839

Rika Denshi — Hybrid

Booth: 205
RikaDenshi.com

Description:
Rika Denshi offers a broad new array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing.

Contact:
Pete Blitchington | pete.blitchington@us.rikadenshi.com
112 Frank Mossberg Dr, Attleboro, MA 02703 USA
+1-508-226-2080

semics hybrid sponsor

SEMICS Inc. — Hybrid Gold Sponsor

Booth: 512
Semics.com

Description:
Semics Inc. is a global leading technology-based wafer probing solution supplier for high-end devices. Since our establishment, SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns.

Contact:
Sales Team | sales1@semics.com
732-37, Gyeongchung-daero, Gonjiam-eup, Gwangju-si, Gyeonggi-do Korea
+82-10-3326-0409

Celadon sponsor ad

Sigma Sensors (TCL) GmbH — Hybrid

Booth: 209
Sigma-Sensors.com

Description:
ISO17025 accredited thermal calibration of wafer prober chucks and burn-in ovens. Manufacture of accredited calibration wafers from -60 to +200C, 150/200/300mm with up to 18 sensors, PT100 4-wire.
On site and in lab thermal calibrations servicing the US, Europe and Southeast Asia.
Lowest measurement uncertainties and user friendly design made for global mobility.

Contact:
Harald Ibele | harald.ibele@sigma-sensors.com
Eulogiusstr 5 Pfullendorf, D-88630 Germany
+49-15-207-0488-88

smiths interconnect hybrid

Smiths Interconnect — Hybrid

Booth: 511
SmithsInterconnect.com

Description:
Smiths Interconnect’s test socket and probe card solutions utilize IDI contact technology to ensure superior quality and reliability in semiconductor test applications. Our best-in-class engineering, development and technical expertise ensure support of automated, system level and development test platforms.

Contact:
Peter Ursu | peter.ursu@smithsinterconnect.com
Room 1180-1194, 11F, No.968 West Beijing Road, Garden Square, Shanghai 200040 China
+86-18-9511-1830-0

star technologies - hybrid sponsor

STAr Technologies Inc. — Hybrid Gold Sponsor

Booth: 304
STAr-Quest.com

Description:
2022 marks the 21th anniversary of STAr Technologies, headquartered in Hsinchu, Taiwan and branches out to USA, Japan, Singapore, South Korea and China. STAr is the world leading supplier of WAT and CIS probe cards and has continuously improved our technologies, lead time and cost-of-ownership for the customers.

Contact:
Paul Meyer | star_mkt@star-quest.com
1885 Lundy Avenue, Suite 101, San Jose, CA 95131 USA
+1-408-416-0777

TIPS technical innovation hybrid sponsor

T.I.P.S. Messtechnik GmbH — Hybrid Gold Sponsor

Booth: 202
TIPS.co.at

Description:
Probe Cards and Test Interfaces for: High Voltage, High Current Devices (Si, SiC, GaN), Sensors (Pressure, Magnetic, Light, X-Ray….), Automotive/Power ASICs, Automotive RADAR, TIPS Probe Refresher TPR-HD, ”Doubling Probe Card Lifetime”, Precise Tip Shape Control, Maintain Probe Card Performance over Lifetime.

Contact:
Rainer Gaggl | office@tips.co.at
Europastrasse 5, Villach, 9524 Austria
+43-664-1054217

Cohu sponsor ad
technoprobe hybrid sponsor

Technoprobe America Inc. — Hybrid Platinum Sponsor

Booth: 212
Technoprobe.com

Description:
Technoprobe is one of the world’s leading providers of advanced wafer testing solutions for the semiconductor industry. The company offers design, development and manufacturing of advanced wafer probe cards. Our mission is to be a strategic partner to our customers and their overall success.

Contact:
Marita Villarreal | marita.villarreal@technoprobe.com
2526 Qume Drive Ste#27, San Jose, CA 95131 USA
+1-408-483-2448

TEL - Hybrid sponsor

TEL – Tokyo Electron U.S. Holdings — Hybrid Platinum Sponsor

Booth: 313
TEL.com

Description:
As a leading global company of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network of approximately 75 locations in 16 countries in the U.S., Europe, and Asia.

Contact:
Blake Nogay | blake.nogay@us.tel.com
2400 Grove Boulevard, Austin, TX 78741 USA
+1-512-424-1000

teradyne - hybrid sponsor

Teradyne, Inc. — Hybrid Platinum Sponsor

Booth: 402
Teradyne.com

Description:
Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers and interface hardware make sure that new products work right the first time, every time. And our portfolio of industrial automation solutions helps manufacturers to develop and deliver new products quickly, efficiently, and cost-effectively.

Contact:
Eric Shoemaker | eric.shoemaker@teradyne.com
600 Riverpark Drive, North Reading, MA 01864 USA
+1-978-370-2700

translarity hybrid sponsor

Translarity, Inc. — Hybrid Gold Sponsor

Booth: 606
Translarity.com

Description:
Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.

Contact:
Greg Hunt | greg.hunt@translarity.com
46575 Fremont Blvd., Fremont, CA 94538, USA
+1-602-692-2367

Advanced Probing Systems sponsor ad
TSE - hybrid sponsor

TSE — Hybrid Gold Sponsor

Booth: 413
TSE21.com

Description:
“Toward the Company Creating the Future Value of Technology”
As a Technology and Science Enabler in the field of Semiconductor Test and Display Test, TSE has eveloped the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994, it has engaged as a leader in interface systems for Semiconductor Test. Main Products: Probe Card, Interface Board, Load Board, STO-ML(STF)

Contact:
Woo Shin-Je | sjwoo@tse21.com
78, 4sandan 5-gil,  jiksan-eup, Seobuk-gu, Cheonan-si, Chungnam, 31040 South Korea
+82-0-41-580-9700

vermont microtechnologies - hybrid sponsor

Vermont Microtechnologies — Hybrid Silver Sponsor

Booth: 306
VermontMicroDrilling.com

Description:
Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.

Contact:
Caleb Harwood | caleb@vtmicro.com
4693 Garland Hill Rd. Barnet, VT 05821 USA
+1-802-633-2300

xallent hybrid

Xallent INC. — Hybrid

Booth: 200
Xallent.com

Description:
Xallent INC. designs, develops, manufactures, and markets advanced hardware and software tools for micro and nanoscale probing measurements. Xallent’s patented probe cards, probe heads, wafer probers, and software are used for the most demanding applications in the imaging, electrical, and mechanical testing of semiconductor devices and thin film materials.

Contact:
Kwame Amponsah | kwame.amponsah@xallent.com
95 Brown Rd MS 1035, STE 271 Ithaca, NY 14850 USA
+1-424-262-0515

yokowo - hybrid sponsor

Yokowo America Corporation — Hybrid Gold Sponsor

Booth: 400
Yokowo.co.jp

Description:
Yokowo offers a broad spectrum of fine connectors and test systems for front to back-end testing, which excel in signal integrity and are capable of testing the high-speed performance of semiconductors and electronic components amid trends towards higher density, greater integration and higher frequency.

Contact:
Naoto Hasaka | n-hasaka@jp.yokowo.com
301 W Warner Road, Suite 112, Tempe, AZ 85284 USA
+1-408-315-8678

Onto Innovation sponsor ad

SWTest Asia 2022

SWTest Asia is scheduled for October of 2022 at the Sheraton Hsinchu, Taiwan. Dates to be announced soon.

C H P T sponsor ad