SWTest 2021 Conference Guide and Exhibitor Directory

Jump to the sections below:

Welcome

Health & Safety

Mobile App

Registration

Scavenger Hunt

Social Event

Program

EXPO Directory

Thank You To Our Corporate Sponsors

Hybrid includes in-person and virtual | Virtual is virtual-only

Platinum Sponsors

formfactor - hybrid sponsor
PTSP - virtual sponsor
international test solutions - hybrid sponsor
jem - hybrid sponsor
nidec s v t c l - hybrid sponsor
teradyne - hybrid sponsor
mpi - hybrid sponsor
Technoprobe - hybrid sponsor
TEL - Hybrid sponsor
aehr hybrid sponsor

Gold Sponsors

oxford lasers - hybrid sponsor
tips - hybrid sponsor
feinmetall - virtual sponsor
intest ems - hybrid sponsor
heraeus - hybrid sponsor
yokowo - hybrid sponsor
star technologies - hybrid sponsor
mjc - hybrid sponsor
pactech - hybrid sponsor
posalux - hybrid sponsor
TSE - hybrid sponsor
semics virtual sponsor

Silver Sponsors

ers - hybrid sponsor
aps - hybrid sponsor
celadon - hybrid sponsor
vermont microtechnologies - hybrid sponsor
onto innovation - hybrid sponsor
pec point engineering hybrid sponsor
cohu hybrid sponsor
scc south coast circuits - hybrid sponsor
advantest - hybrid sponsor

Official Media Sponsors

Conference Partners

Chairman’s Welcome to SWTest 2021 Conference and Expo

Wafer Test Technology in San Diego!

Welcome to San Diego, Rancho Bernardo Inn, and the 30th SWTest Conference and EXPO.

On behalf of the SWTest Executive Team, Program Committee, and Committee Members, I want to warmly welcome you to SWTest 2021 that will be held as a hybrid event at the beautiful Rancho Bernardo Inn located near San Diego California.

The global Covid-19 pandemic has changed and reshaped the ways we will live our lives for many years.  With continuous restrictions and limitations on travel and gatherings, new digital solutions have allowed us to remain connected.  We hope to bring the value of these newly developed channels to the first hybrid edition of our conference.  

First and foremost, the health and safety of our attendees, sponsors, exhibitors, and community are the top priority.  Our goal is to provide attendees a relaxed, friendly, and safe environment in which to meet with the top suppliers and service providers to discuss key technologies and capabilities while not competing with the technical sessions.

It is my great pleasure to thank all of our 10-platinum, 12-gold, and 9-silver sponsors who are supporting the in-person and virtual conference.  We’d also like to thank the 42 in-person and virtual exhibitors, the speakers, the committee members, and recognize the volunteers who help make the SWTest Conference and EXPO a “must-attend” event for the wafer test industry.  

This year SWTest will be a two and a half-day hybrid Conference and Expo.  On Monday morning our first visionary keynote speaker will be William Miller who is the VP of Engineering at Qualcomm.  The Monday Technical Program will then end at Noon-thirty.  Immediately following the technical session, the 10th Annual Sponsors Golf tournament will be held at the RBI Golf Course.  Our EXPO will take place Monday evening in the Bernardo and Catalina Ballrooms with cocktails and food stations.  The SWTest EXPO which showcases key suppliers to the wafer probe industry, will have live audio and video chat, swag giveaways, and a scavenger hunt.  Afterwards, there will be ample opportunities for safe networking within the Sponsor Hospitality Suites.

On Tuesday, our second visionary keynote speaker will be Dr. Hans Stork who serves as the Senior Vice President and CTO at ON-Semiconductor.  The Tuesday Technical Program will end at Noon and the EXPO will open in the afternoon.  On Tuesday evening we will have our outdoor Social Event that includes cocktails, dinner, and some fun entertainment as well as ample time to safely reconnect with friends and colleagues.   

On Wednesday morning, the final technical session will be held followed by the awards and recognition presentations.   After the conference, the technical program will have ON-DEMAND Access 24/7 from Sep 2 – Oct 2, 2021.  Once again, thank you for being a part of the 30th SWTest Conference and I hope you enjoy San Diego!

Jerry Broz, PhD
General Chair

SWTest Conferences

formfactor sponsor ad

Health and Safety at SWTest 2021

The SWTest Team is encouraging all attendees, sponsors, exhibitors, and staff to be vaccinated prior to attending the SWTest 2021 Conference in San Diego. If vaccination is not possible, we have asked that you confirm a negative Covid-19 test within 72 hours of the start of SWTest 2021 on Monday, Aug 30. This is not a requirement to attend, but a request that we all take responsibility for the health and welfare of the conference attendees and within our wafer-test community.  

Out of an abundance of caution, SWTest will require that all attendees (both vaccinated and unvaccinated) wear a mask while inside the Rancho Bernardo Ballrooms and Expo areas. We also ask that you follow all applicable regulations and make informed choices about travel, onsite, and external engagement. We are continuously monitoring the public health guidance provided by the Centers for Disease Control, the Governor of California, and the San Diego County Health District regarding large gatherings.   

San Diego County is following the CDC’s guidance in recommending the universal wearing of masks by both vaccinated and unvaccinated individuals in indoor public settings.  Although the state of California has indicated no social distancing requirements for meetings or gatherings with less than 500 attendees, SWTest is planning to keep a social distancing layout in the conference room during the program. There will be one door for Entry into the General Session room and one door for Exiting. We will have Security Guards stationed to enforce our face mask requirements for attending indoor activities.

We are fortunate to have so much outdoor space available at RBI and we will use that space as much as possible. Our daily breakfasts and the Tuesday Social and Dinner will all be held out-of-doors in one of the many beautiful lawn areas. We also recommend that registered attendees download the SWTest mobile app and/or print their final confirmation which contains the registration barcode. 

At registration, the SWTest Team will be providing masks, hand-sanitizer, and “red-yellow-green” comfort-level badge ribbons that will allow attendees to be aware of each other’s “comfort-level” for engagement.  Sanitizer stations will be available throughout the hotel, the conference ballroom, and the expo area. We are working with the RBI staff to create a program that provides a clean, safe and healthy environment throughout the conference for our attendees.  

Rancho Bernardo Inn is delivering the highest standards in cleanliness and hygiene with a comprehensive system of enhanced health and safety protocols based on the guidelines set forth by the Centers for Disease Control, the California Department of Public Health, the California Hotel & Lodging Association, and the American Hotel & Lodging Association’s Stay Safe industry-wide initiative. Details of the practices followed by Rancho Bernardo Inn are outlined at their website – https://www.ranchobernardoinn.com/stay/covid-19

The evolving nature of this health crisis requires us to remain flexible. The Governor’s Office or the health agencies could issue new guidance at any time that may require us to alter our program.

We are looking forward to a safe environment to get together in person at the beautiful Rancho Bernardo Inn at the end of this month. And for those who cannot join us in person, we’ll look forward to connecting with you virtually.

ers sponsor ad
advantest sponsor ad

SWTest Team and Committee Members

SWTest Executive Team

General Chair
Jerry Broz, PhD, International Test Solutions

Technical Program Chair
Reynaldo Rincon, Translarity

Finance Chair/Conference Mgmt.
Maddie Harwood, Conference & Exhibits Mgmt., Inc.

Technical Program Committee

Jerry Broz, International Test Solutions
John Caldwell, Micron Technology
Geert Gouwy, IMEC
Darren James, Onto Innovation
Clark Liu, Powertech Technology, Inc. (Taiwan)
Patrick Mui, JEM America
Mark Ojeda, Infineon
Rey Rincon, Translarity
Raffaele Vallauri, Technoprobe (Italy)
Joey Wu, Member-at-Large (Taiwan)

Steering Committee

Karen Armendariz, Celadon Systems
Gunther Boehm, FeinMetall GmbH (Germany)
Geert Gouwy, IMEC (Belgium)
Michael Huebner, Ph.D., FormFactor, Inc. (Germany)
Amy Leong, FormFactor, Inc.
Clark Liu, Powertech Technology, Inc. (Taiwan)
Mark Ojeda, Infineon
Suz Ramsbottom, Texas Instruments, Inc.
Raffaele Vallauri, Technoprobe (Italy)
Joey Wu, (Member-at-Large)
Alex Yang, MPI Corporation (Taiwan)
Sang Kyu (SK) Yoo, Samsung Electronics (Korea)

oxford lasers sponsor ad

SWTest 2021 Mobile App

swtest 2021 mobile app home screen held up in tropical destination

The official SWTest app is your go-to guide for the event, keeping you up to date with all the latest news and information.

The app is now available to download on the Apple App Store and on Google Play.

download on the apple app store
download on google play
  • We will also be utilizing the app to distribute daily passwords for proceedings via push notifications and important SWTest announcements.
  • To log into the App, you will need to use the email address associated with your registration and the Password: SWTEST21 (all upper case).
  • The app will then ask for various permissions on your phone. For the best experience, we recommend that you allow Aventri Events full access.

Should you have any questions, please visit the Registration Desk in the Aragon Foyer.

intest ems sponsor ad

Registration

The SWTest Registration Desk is located in the Aragon Foyer. Self-registering kiosks will allow a “touchless” check-in by scanning your personal barcode located on your confirmation email or in the “My Profile” module on the Mobile App. Scan the barcode and your badge will print at the kiosk. Please bring your badge to the Registration Desk to pick up your badge holder, facemask, and hand sanitizer.

Registration Check-in Hours

  • Monday, August 30
    7:00 – Noon and 14:00 – 16:00
  • Tuesday, August 31
    7:00 – Noon and 15:00 – 16:30
  • Wednesday, September 1
    7:30 – Noon

A registration badge is required for admission to events associated with your badge type:

  • Full Conference and Student:
    All Events, including Technical Sessions
  • Exhibitor and Expo Only:
    All Events, except Technical Sessions
  • Companion:
    All receptions, dinners and Tuesday Social Event

Scavenger Hunt

Here is how it works:

  1. Download the SWTest Program Mobile App from the App Store or Google Play.
  2. Open the Scavenger Hunt module on the app to view a list of participating exhibitors, their booth number and location.
  3. Visit participating exhibitors and scan the individual exhibitor’s QR code with your mobile device.
  4. Once you have visited ALL exhibitors participating in the Scavenger Hunt, you will automatically be entered to win a PRIZE!

Winners will be announced during the Tuesday Evening Social Event on August 31st.

LET THE HUNT BEGIN!

SWTest would like to thank the participating exhibitors for their generous prize contributions and support:

BoothCompanyPrizeWinner
Advantest$150 Amazon Gift CardSophia Oldeide (ERS)
203AEHR Test SystemsApple Airpods ProJohn Yi (AMD)
220AEM AforeValco Noise-Cancelling HeadphonesMarc Raettig (Heraeus)
207 Celadon Systems, Inc.FitBit Versa 2 SmartwatchChristine Liu (MPI)
306ERS electronic GmbHHandmade Whiskey Set from LeonardoTodd Martin (FormFactor)
212 FormFactor, Inc.Air Omni 6-in-1 Wireless ChargerDuane McCrory (Keysight)
218 Integrated Technology CorporationApple Airpods with Charging CaseGreg Hunt (Nidec SV TCL)
214 International Test SolutionsBushnell Wingman GPS Golf SpeakerKeyvan Khoiy (Teradyne)
201 inTest EMSTaylor Made TP5 Golf Balls (12 pack)Dan Campion (Cohu)
211JEM America Corp.$100 Amazon Gift CardAustin Hsu (Integrated Technology Corp)
210 MPI CorporationHand-Held Deep Tissue Muscle MassagerJanina Freyboth (ATV)
200 Nidec SV TCLAtari Flashback 9Matthias Schnaithmann (Feinmetall)
208 Oxford Lasers, Inc.Amazon Kindle PaperwhiteBernd Otto (PacTech)
305 Prober.comPortland Gift Box of Local GoodiesSteven Resnik (AEM Afore)
PTSLThe Balvenie Single Malt Scotch WhiskeyMarion-Margaret Brosko (Teradyne)
202 STAr Technologies, Inc.Apple HomePod MiniEric Shoemaker (Teradyne)
215 Technoprobe America Inc.$100 American Express Gift CardPrajakta Joshi (Qualcomm)
307 TSEThe Monocular with Smartphone AdapterStuart Pearce (AEM Afore)
heraeus electrical contacts sponsor ad

Tuesday Evening Social

summer county fair tuesday 31 august fun for everyone

Tuesday Social Event – “Any Town, USA” County Fair

We’ve all been cooped up indoors for so long, now is a great time to break loose and enjoy the great outdoors that San Diego does so well. With social distancing and outdoor activities in mind, our Tuesday Social Event will be a “County Fair”- themed extravaganza staged around the Spa Pool, Aragon Lawn and Aragon Patio area.

We’ll have games of skill and strength where you can win prize tickets that can be used for complimentary bar drinks at the Fairgrounds. Try your hand at Skeeball, Ring Toss, Frisbee Golf, Water Golf, Water Balloon Blast, Corn Hole and more. There’s something for everyone, and you can quench your thirst after your big win!

The Midway awaits you; just like when you were a kid. Stroll through the Food Fairs and enjoy your childhood delights, as well as the Chef’s featured specials. Whether you’re craving deep-fried favorites, a movable feast, sweets and treats, or something served on-a-stick, you’ll have more than enough to choose from, so come hungry!

Don’t miss this opportunity for some good old-fashioned fun competition
and long-awaited social engagement with your friends and colleagues!

star technologies sponsor ad

Program Schedule

Times in PDT | Tentative, subject to change | last revised: 8/29/2021

Monday, August 30, 2021
7:00 – 8:00 Continental Breakfast
7:00 – 12:30 Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2021
Jerry Broz, PhD, SWTest General Chair, International Test Solutions
8:30 – 9:30 KEYNOTE Rapid growth of 5G/mm-wave beyond Phone into Auto, IOT, Laptops, etc., and the pressure it puts on test, probe, and hardware demands.
William Miller
Vice President of Engineering
Qualcomm Technologies, Inc.
Abstract

During his presentation, Mr. Miller will focus on four key areas.  (1) How the introduction of Qualcomm Technologies, Inc. (QTI), and 5G/mm wave will affect overall business growth beyond Phone into Auto, IOT, Laptops, etc.; (2) Challenges to the industry caused by the slowing of technology and the increasing complexity of our processors and RF products.  Discuss the key statics on die complexity, die size, bump counts, etc.  Review the market demand for vertical ramps and the pressure it puts on the end-to-end suppliers and QTI; (3) Big data, diagnostics, and QTI’s need for machine learning for faster yield learning and for improving quality demanded by the market. (4) Cost of Test, probe, other associated hardware requirements and issues.

Biography

Mr. William Miller is Vice President of Engineering with responsibility for RF, PMIC, and RFFE product testing and characterization as well as Yield and Diagnostic analysis of all Qualcomm’s products. Additionally, William’s team has responsibility for leading-edge technology IP test chip characterization as well as all failure analysis and circuit edit for Qualcomm’s products. William also works with Qualcomm’s Foundries and OSATs to drive process and device improvements to meet Qualcomm’s product requirements. William has over 40 years in the semiconductor industry with experience in all aspects of semiconductor manufacturing and development. Prior to moving to Qualcomm, William was Director of Outsource Engineering and Product and Test Engineering at IBM Microelectronics Division with broad responsibility for managing multiple new products and technologies at the IBM 300mm Fabricator as well at IBM’s partner fabricators. William is also an author of multiple published articles and professional society presentations, patent holder, and former conference chairman of the Advanced Semiconductor Manufacturing Conference and former chairman of the Industrial Advisory Board for the Center for Micro Contamination Control at U of Arizona, RPI, and Northeastern University.

10:00 – Noon SESSION 1: Enabling 5G Test Strategies
Session Chair
: Darren James (Onto Innovation)
10:00 – 10:30 The Digital Revolution: NRZ to PAM4
David Raschko (FormFactor – USA)
10:30 – 11:00 An Advanced Contact Solution Probe Card for RF & 5G using MEMS Coaxial Technology
Tae Kyun Kim (Microfriend – Korea)

Taekyun Kim received the M.S. degrees in mechanical engineering from Yonsei University, Seoul, Korea, in 2005, and he has been a Ph.D candidate in electrical engineering from Yonsei University since 2013. In 2005, he joined Microfriend, Inc., Seoul, Korea, where he manage research and development team. His research interests include circuit design and simulation for signal integrity, power integrity on probe card.

Svetlana Garcia, PhD (Nidec SV TCL USA)

Svetlana C. Sejas-García received the Ph.D. degree in electronics from INAOE, Cholula, Mexico, in 2014. She was an Intern with Intel, Guadalajara, Mexico, in 2008. Since 2014, she has been with the Isola Group, Chandler, AZ, USA, where she was involved in the electrical characterization and modeling of ultralow-loss PCB laminates for high-frequency applications. Now she is a member of Nidec SV TCL, US.

Jong Gwan Yook (Yonsei Univ. – Korea) and Yong Ho Cho (Microfriend – Korea)
11:00 – 11:30 55GHz Octal-site Wafer Test Probecard for 5G mmWave devices
Jason Mroczkowski (COHU – USA)
11:30 – Noon Millimeter-Wave Signal Integrity in a Dense Device-Interface-Board (DIB) Environment
Andrew Westwood (Teradyne, Inc. – USA)

Andrew Westwood is currently serving as the Millimeter-Wave Applications Specialist for Teradyne, Inc in Boston, MA.

As Mobile Communications moves up into 5G/FR2 (including Satcom), I am developing new ATE Hardware and Calibration/Test methods.

Prior to that I served for 16 years at HP/Agilent/Keysight as a Master Applications Engineer working on T&M for HS-Digital, Millimeter-Wave RF, Signal Integrity, Materials Science and Optical/Microwave Components.

Prior to joining HP, I served at Hughes Network Systems and Filtronic-Comtek Corp, working on the development of Satcom Microwave, Basestation/eNB microwave equipment and Ku-band Direct-TV systems.

Noon SWTest Conference Adjournment for Day 1
Enjoy Lunch on your own!
12:30 –  22:00 Bill Mann Memorial Benefit Golf Tournament
SWTest 2021 – Supplier and Sponsor EXPO
12:30 – 16:30 Bill Mann Memorial Benefit Golf Tournament
Enjoy the Best Ball Scramble and Help Support Student Travel
14:00 – 17:00 Registration
17:00 – 20:00 SWTest EXPO OPEN w/ Dinner Served at RECEPTION STATIONS
Meet, Greet, and Reconnect with Colleagues
20:00 – 22:00 Sponsor Hospitality Suites
celadon sponsor ad
advanced probing systems sponsor ad
Tuesday, August 31, 2021
7:00 – 8:00 Continental Breakfast
7:00 – Noon Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2021
Jerry Broz, PhD, SWTest General Chair, International Test Solutions

Introduction to the SWT Crew Initiative
Karen Armendariz (Celadon Systems), Amy Leong (FormFactor) and Suz Ramsbottom (Texas Instruments)
8:30 – 9:30 KEYNOTE The Growing Challenge of Testing Automotive Analog and Sensor Systems.
Hans Stork, PhD
Senior Vice President and CTO
ON Semiconductor
Abstract

Automotive systems are facing an accelerated introduction of electronic components, driven by megatrends such as electrification and autonomous driving. This leads to an explosion of ever more complex sensors generating an abundance of data/sec that need to be processed real-time to drive a wide variety of electronic and mechanical systems in the car. Furthermore, those systems need to function in hostile environments (e.g., high electromagnetic fields, high temperatures, etc.) while quality needs to be guaranteed at the ppb level and cost is a constant challenge.  As a result, testing of such electronic components becomes significantly more complex both in the amount and variety of functions to be tested: testing speed, signal integrity and accuracy, test coverage, and cost.

Biography

Dr. Hans Stork is Senior Vice President and Chief Technology Officer (CTO) at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, design libraries, as well as packaging technologies and assembly support.  Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and CTO of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the CTO of Texas Instruments. Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.  Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC and has served on the boards of Sematech and the SRC.  He is a longstanding member of the SIA Technology Strategy Committee.  He authored more than 100 cited papers and holds 11 U.S. patents.  He was elected IEEE Fellow in 1994, and served on several IEEE conference program committees, and is currently vice-chair of the Technical Field Awards Council and a member of the Awards Policy and Portfolio Review Committee.  Dr. Stork was born in Soest, The Netherlands, and received the Ingenieur degree in electrical engineering from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.

10:00 – Noon SESSION 2: Advanced Technologies
Session Chair: Karen Armendariz (Celadon Systems – USA)
10:00 – 10:30 Exploring Parametric and Test Structure Challenges
Mike Palumbo (Technoprobe – USA)

Career: IBM Corporation – 14 years split between East Fishkill, NY (2 years) and Manassas, VA (12 years). Parametric test engineer of wafer level and packaged parts for radiation hardened space products.
Intel Corporation – 22 years in Hillsboro, OR. Primarily (18 years) as parametric wafer level test engineer for silicon process development group. Later (last 4 years) as commodity development engineer of full die wafer level probe cards.

Education: BSEE from George Mason University in Fairfax, VA

10:30 – 11:00 Evaluation of a MEMS Probing Solution for Scrub Mark Visibility on Automotive Devices with Nickel Palladium pads
Karan Maniar (Nidec SV TCL – USA)

I am a Senior Product and Process Engineer with Nidec SV TCL in San Jose, California. I am responsible for working with the Nidec SV TCL Engineering Team on various product development and capability enhancement projects. I have experience with a several design and simulation software platforms and analytical equipment. I am a graduate of Mumbai University, India and Arizona State University holding both a Bachelor of Science and a Master’s Degree in Mechanical Engineering.

Kyle Cotner (Nidec SV TCL – USA)
Erwin Verardi (STMicroelectronics – Italy)

Erwin is currently a Process Engineer in EWS at STMicroelectronics and has been with them for the last 9 years. He has a degree in Material Science from Milan University where he focused on Silica Aerogel and Hydrogel synthesis. As a visiting student to the US, he studied electrochemistry specifically on Ni H2 Evolution and TiO2. In 2020, he earned a SixSigma Black Belt degree. His favorite hobby is b&w photography. Erwin and his wife and two kids live in Milan.

Mattia De Nicola (STMicroelectronics – Italy)
11:00 – 11:30 Towerless vs Towered Probe Solutions; What is the most effective application for my wafer test interface?
William Wyckoff (inTEST EMS – USA)

Bill graduated from the University of Vermont with a BSEE and MSEE. He spent 18 years with IBM in Burlington Vermont responsible for DRAM and SRAM probe and final test hardware and applications. Bill joined Teradyne in 2000 with roles as the Factory Apps Manager, West Coast Applications Manager and Interface Test Hardware Marketing Manager. Bill joined inTEST EMS in 2019 as the Division Marketing Manager

Wally Haley (Qualcomm – USA)

Wally Joined Qualcomm as a technician in 1996, then Spent a few years at Ericsson as an associate engineer before moving to Northrop/Grumman as a EE. He returned to Qualcomm in 2005 where he has been designing probe HW ever since.

11:30 – Noon Production Parametric Probe – An Essential Guide to Lowering Cost of Test While Probing Very Small Pads
Riley Kaiser (Celadon Systems – USA)

Riley Kaiser is a Technical Sales and Field Applications Engineer at Celadon Systems, where he first spent two years as a mechanical engineer in the R&D department before joining the sales team. His educational background is in mechanical engineering and applied mathematics, and he has professional experience in product development, R&D, and technical sales.


Karen Armendariz (Celadon Systems – USA)
Jungtae Hwang (Global Foundries – USA)

Jungtae Hwang is a test engineer in Globalfoundries over 4 years in massive wafer manufacturing environment and has multiple years of experiences for manufacturing, qualifying and troubleshooting of various probe card applications. Also, specialized in advanced operation and troubleshooting for the probe card analyzers.

Noon SWTest Conference Adjournment for Day 2
Enjoy Lunch on your own!
14:30 – 16:30 Registration
15:00 –  22:00 SWTest 2021 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
15:00 – 16:30 SWTest EXPO OPEN w/ Refreshments
Meet, Greet, and Reconnect with Colleagues
16:30 – 17:30 SWT Crew Social Hour
Learn about the SWT Crew Initiative
17:30 – 21:00 Cocktails, Dinner, and SWTest Social Event
Communicate, Collaborate and Celebrate!
21:00 – 22:00 Sponsor Hospitality Suites
vermont microtechnologies sponsor ad
onto innovation sponsor ad
Wednesday, September 1, 2021
7:00 – 8:00 Continental Breakfast
7:30 – 10:00 Registration
8:00 – 9:30 SESSION 3: Large Array Probing
Session Chair: Mark Ojeda (Infineon – USA)
8:00 – 8:30 Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probecards
Cameron Harker (FormFactor – USA)

Cameron Harker joined FormFactor in Dec. 2007 and is serving as Sr. Director of Marketing for the Probes business unit. Cameron has over 30 years of engineering, sales and marketing leadership experience. He has held several customer facing roles including leading global account teams as well as service in product and technical marketing leadership positions. Prior to joining FormFactor, Cameron held various positions at Asyst Technologies, KLA-Tencor and On-Semi. Cameron holds a B.S in Physics from the University of Utah.

Yohannes Desta, and Pouya Dastmalchi (FormFactor – USA)
8:30 – 9:00 Determine Thermal Expansion/Shrinkage Matching Between Wafer and Probe Card
Woo Young Han (Onto Innovation – USA)

Received Electrical Engineering degree from University of Toronto. Has been working in wafer inspection and metrology for over 20 years. Currently working as Product Marketing manager at Onto Innovation.

9:00 – 9:30 Probe to pad alignment improvement over wide temperature range for automotive applications with large probe array size, high parallelism and small pads size
Raffaele Vallauri, Tommaso Masi, and Alessandro Cito (Technoprobe – Italy)
Emanuele Bertarelli, PhD (Technoprobe – Italy)

Emanuele Bertarelli, Ph.D. is R&D Manager, working in the R&D and Process Engineering Team in Technoprobe Italy headquarter since 2011. He is currently heading the probe R&D team and he is responsible for Technoprobe R&D Laboratories.

Prior to joining Technoprobe, Emanuele Bertarelli was Doctoral and Post-Doctoral Researcher at the Technical University of Milano, Italy, and at the University of Freiburg, Germany. He published more than 20 international scientific papers and issued 4 international patents during regarding academic and industrial research and development activities.

Mattia De Nicola (STMicroelectronics – Italy)
Sebastien Usai (STMicroelectronics – France)

Sébastien USAI is Senior Process Technician in STMicroelectronics. He is responsible of Probecards for the EWS Rousset, France. Additionally Sébastien has mission to support Production and Engineering teams. With over 20 years in the semiconductor industry, he is well versed in all aspects of Probecards manufacturing, development and use. Prior to move to STMicroelectronics three years ago, Sébastien worked respectively for Cerprobe, Kulicke & Soffa and Synergie Cad Probe occupying different positions from Probecards wiring Operator to Application Engineer through CAM Design, R&D and team management. He also travelled a lot abroad to support customers and colleagues in Europe, Asia and America. His career is the fruit of a passion for the world of industry and probing.

Erziz Salam and Diperi Robert (STMicroelectronics – France)
9:30 – 10:00 Coffee Break
10:00 – 12:30 SESSION 4: Large Array Probing
Session Chair Patrick Mui (JEM America)
10:00 – 10:30 Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3GHz/6Gbps
Alan Liao (FormFactor – Livermore, USA)

Alan Liao has been with FormFactor since August 2008. Alan was electrical design engineer in FormFactor designed first 300mm full wafer contact probe card for SmartPhone DRAM wafer sort testing. Alan also participate as electrical R&D engineer to continuously improve and develop Probe Card technology meets advance memory testing requirement. In 2012, Alan moved to customer design engineer position to be the technical interface with key north America DRAM customer. During 2014, Alan joined in product marketing as SoC product manager and oversees whole Asia Region.

Mr. Liao holds an M.S. in Analog Circuit Design and Analysis from Silicon Valley University (SJSU) and a B.S. in Electrical Engineering from the University of California, Los Angeles (UCLA).

10:30 – 11:00 Next Generation SmartMatrix Probe Card Technology Enables 3000-Parallelism 1TD Test for 1Z DRAM Process Node
Joe Ceremuga (FormFactor – USA)

MSME Mechanical Engineer with 20 years of experience in MEMs Systems and the Metrology field; of which, 10 years of experience in probe card development at FormFactor. Past employers include Sandia National Laboratories and Carl Zeiss X-ray Microscopy. Currently holds the position of Director of Product Engineering for DRAM and Flash memory probecards. Enjoys fishing, hunting, golf, and anything that involves a grill or bbq

Cameron Harker (FormFactor – USA)

Cameron Harker joined FormFactor in Dec. 2007 and is serving as Sr. Director of Marketing for the Probes business unit. Cameron has over 30 years of engineering, sales and marketing leadership experience. He has held several customer facing roles including leading global account teams as well as service in product and technical marketing leadership positions. Prior to joining FormFactor, Cameron held various positions at Asyst Technologies, KLA-Tencor and On-Semi. Cameron holds a B.S in Physics from the University of Utah.

11:00 – 11:30 A Vertical Probe Solution for the High-Density 5G Market
Don Thompson (R&D Altanova – USA)

Don Thompson is the director of engineering at R&D Altanova. Don started his career at Teradyne, working there for 11 years designing high speed instrument interfaces and has now spent nearly 20 years as a signal integrity expert in the ATE industry. He leads a team of more than 100 engineers designing and building the most challenging ATE interfaces for industry leading customers around the world.

Svetlana Garcia, PhD (Nidec SV TCL USA)

Svetlana C. Sejas-García received the Ph.D. degree in electronics from INAOE, Cholula, Mexico, in 2014. She was an Intern with Intel, Guadalajara, Mexico, in 2008. Since 2014, she has been with the Isola Group, Chandler, AZ, USA, where she was involved in the electrical characterization and modeling of ultralow-loss PCB laminates for high-frequency applications. Now she is a member of Nidec SV TCL, US.

11:30 – Noon Evaluating the High Temperature Creep Performance of MEMS Vertical Technology Probes
Dominik Schmidt (Translarity – USA)

Bios: Dr. Schmidt is President at Translarity Corp and he oversees other technology investments at QVT Financial. Prior to joining QVT in May 2013, Dr. Schmidt was employed by Intel Corporation as Senior Director of Wireless Engineering from 2004 to 2010 and as Chief Technology Officer in the Intel Foundry from 2010 to 2013. Between 2000 and 2004, Dr. Schmidt co-founded and was the Chief Executive Officer of Airify Communications Corporation, a wireless multi-protocol semiconductor company, which was sold to Intel in August 2004. Prior to that he also co-founded Pixel Devices International, a CMOS imaging company, in 1997, which was sold to Agilent in 2002. He has taught at U.C. Berkeley, Tsinghua University in Beijing and the International Technological University and written more than 70 technical papers and has over 90 patents granted or pending. Dr. Schmidt earned a B.S. in Electrical Engineering/Materials Science from U.C., Berkeley, an M.S. in Electrical Engineering, an M.S. Management and a Ph.D., Electrical Engineering in 2003 all from Stanford University.

Raul Molina, Rambod Tabasi (Translarity – USA)
12:00 – 12:30 SWTest 2021 Awards and Adjournment

See you in 2022!
Travel Safe and Keep Healthy.

international test solutions sponsor ad

Exhibitor Directory

EXPO Map

map of expo space
mjc sponsor ad

Exhibitors

aps - hybrid sponsor

Advanced Probing Systems, Inc. — Hybrid

AdvancedProbing.com

Description:
The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, berylliumcopper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material. Lower your overall cost of testing by using APS’s quality probe needles.

Contact:
Edward Johnson
ejohnson@advancedprobing.com
P.O. Box 17548, Boulder, CO 80308 USA
+1-303-939-9384

advantest - hybrid sponsor

Advantest — Hybrid

Advantest.com

Description:
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, artificial intelligence (AI), machine learning, smart medical devices and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world.

Contact:
Dave Armstrong
dave.armstrong@advantest.com
3061 Zanker Road, San Jose, CA 95134 USA
+1-917-568-5395

aehr hybrid sponsor

AEHR Test Systems — Hybrid

Booth: 203
AEHR.com

Description:
AEHR Test Systems provides complete test solutions across the IC manufacturing flow to improve quality, reliability and yield. Aehr has developed several innovative products, including the FOX-P™ family for full wafer contact and singulated die/module stress testing for logic, memory, optical and power ICs. Aehr’s unique probe interface, WaferPak is capable of testing wafers up to 300mm in a single touch-down enabling IC manufacturers to perform stress and thermal testing of full wafers.

Contact:
Tom Trexler
ttrexler@aehr.com
400 Kato Terrace, Fremont, CA 94539 USA
+1-510-623-9400 x266

jem sponsor ad

AEM Afore — Hybrid

Booth: 220
Afore.fi

Description:
Established in 1995 AFORE develops and produces innovative and application-specific test solutions for a range of applications like test and calibration of MEMS devices.We are specialized in wafer level test solutions delivering physical stimuli like acceleration, yaw-rate, vacuum and pressure enabling full characterization during development as well as complete test and trim operations in mass production.

Contact:
Ari Kuukkala
sales.afore@aem.com.sg
Vakiotie 5 Lieto, 21420 Finland
+358-44-084-8900

celadon - hybrid sponsor

Celadon Systems, Inc. — Hybrid

Booth: 207
CeladonSystems.com

Description:
Celadon produces high-performance probe cards for production parametric, multi-probe, modeling & characterization, burn-in and wafer level reliability applications. Celadon probe cards thrive in extreme test environments, deliver accurate measurements and precise data, with the lowest cost of test in the industry.

Contact:
Garrett Tranquillo
garrett.tranquillo@celadonsystems.com
13795 Frontier Court, Burnsville, MN 55337 USA
+1-952-232-1698

cohu hybrid sponsor

Cohu — Hybrid

Booth: 403
Cohu.com

Description:
Cohu, Inc. (NASDAQ: Cohu) is a global leader in test and handling equipment, interface solutions, thermal subsystems, vision inspection and MEMS test solutions, and a leader in printed circuit board test. We deliver leading-edge solutions to enable a smarter, safer, and more connected future and offer the broadest portfolio of equipment and services for back-end semiconductor manufacturing. Learn more.

Contact:
Tes Olson
tes.olson@cohu.com
4444 Centerville Road, Suite 105, St Paul, MN 55127 USA
+1-715-497-9283

pac tech sponsor ad

Complete Probe Solutions, Inc. — Hybrid

Booth: 219
CompleteProbeSolutions.com

Description:
Complete Probe Solutions is proud to announce the availability of the new APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems

Contact:
Kevin Chandler
kchandler@completeprobesolutions.com
393-E Tomkins Court, Gilroy, CA 95020 USA
+1-408-755-5567

ers - hybrid sponsor

ERS electronic GmbH — Hybrid

Booth: 306
ERS-GmbH.com

Description:
ERS electronic GmbH, based around Munich, has been providing innovative thermal solutions for the industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing. Today, thermal chuck systems developed by ERS such as AC3 and AirCool® PRIME are integral components in all larger-sized wafer probers across the semiconductor industry.

Contact:
Bernd Krafthoefer
krafthoefer@ers-gmbh.de
Stettiner Strasse 3, Germering, 82110 Germany
+49-08-989-4132-0

feinmetall - virtual sponsor

Feinmetall GmbH — Virtual

Virtual Booth Only
Feinmetall.com

Description:
Feinmetall as long-term supplier to the semiconductor industry with leading-edge technology for automotive applications masters all areas of probe cards for wafer test: from feasibility studies to design and fabrication of the probe card up to turnkey solutions and full repair-shop-management. We offer superior contacting solutions to our customers and worldwide local service.

Contact:
Dr. Matthias Schnaithmann
matthias.schnaithmann@feinmetall.de
Zeppelinstr. 8, Herenberg 71083 Germany
+49-70-322-0012-08

nidec sv tcl sponsor ad

Ferrotec — Hybrid

Booth: 304
Ferrotec.com

Description:
Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market.

Contact:
John Wu
jwu@ferrotec.com
3945 Freedom Circle #450, Santa Clara, CA 95054 USA
+1-408-964-7700

formfactor - hybrid sponsor

FormFactor, Inc. — Hybrid

Booth: 212
FormFactor.com

Description:
FormFactor, Inc. (NASDAQ:FORM), is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America.

Contact:
Carole Garner
carole.garner@formfactor.com
7005 Southfront Road, Livermore, CA 94551 USA
+1-925-550-7530

heraeus - hybrid sponsor

Heraeus Deutschland GmbH & Co. KG — Hybrid

Booth: 221
Heraeus-Electrical-Contacts.com

Description:
Manufacturing products for the semiconductor industry requires precision, experience, as well as materials and process expertise, along with the appropriate hardware. Heraeus has led the way in the production of ultrafine wires and advanced alloys for more than 50 years. When it comes to the production of cantilever, vertical and probe needles Heraeus is the right choice.

Contact:
Marc Raettig
marc.raettig@heraeus.com
Heraeusstrasse 12-14, Hanau 63450 Germany
+49-17-153-7207-2

teradyne sponsor ad

Integrated Technology Corporation — Hybrid

Booth: 218
IntTechCorp.com

Description:
Integrated Technology Corporation has been serving the needs of our customers for more than 35 years. We provide solutions for metrology and testing equipment in many areas. Test, analysis, and repair of IC probe cards, Innovative metrology and inspection solutions, Solutions for dynamic testing.

Contact:
Mark McLaren
markm@inttechcorp.com
1228 N Stadem Drive, Tempe, AZ 85281 USA
+1-480-612-2182

international test solutions - hybrid sponsor

International Test Solutions — Hybrid

Booth: 214
IntTest.net

Description:
Since 1999, International Test Solutions has been the leading global supplier of highly engineered cleaning materials supporting the semiconductor industry. ITS products are used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW).

Contact:
Cooper Smith
coopers@cmcmaterials.com
1595 Meadow Wood Lane, Reno, NV 89502 USA
+1-775-284-9220

intest ems - hybrid sponsor

inTEST EMS — Hybrid

Booth: 201
inTest-Semicon.com

Description:
inTEST EMS designs and manufactures engineered solutions for ATE and other electronic tests, as well as industrial process applications. Our products are used by semiconductor manufacturers to perform development, qualifying and final testing of integrated circuits (ICs) and wafers, and for other electronic tests across a range of industries.

Contact:
Bill Wyckoff
b.wyckoff@intest-ems.com
47777 Warm Springs Blvd, Freemont, CA 94539 USA
+1-408-678-9187

tips sponsor ad

IWIN Co., Ltd. — Hybrid

Booth: 401
IWINsn.com

Description:
IWIN test probe for high signal integrity at extremely high speed test. We’ve achieved remarkable results in increasing the performance of probe by stamping technology. We have not only realized making probe shorter, but also achieved innovative structural development that can show powerful characteristics with existing probe lengths. Based on our technology, we promise to provide the best solution for your test environment.

Contact:
AJ Park
aj@iwinsn.com
201 CBTP Yangcheongri, Ochang, Cheongju Chungbuk 28115 Korea
+82-43-212-7580

jem - hybrid sponsor

JEM America Corp. — Hybrid

Booth: 211
JEMAm.com

Description:
JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC) and image sensors. Our probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. We have international manufacturing and support facilities.

Contact:
Karen Wong
sales@jemam.com
3000 Laurelview Court, Fremont, CA 94538 USA
+1-408-306-8623

Johnstech International — Hybrid

Booth: 300
Johnstech.com

Description:
Johnstech International is a global R&D leader in the field of microcircuit testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works together with the world’s most respected OSATs, foundries, and EDA companies to develop the most precise and dependable test contactors and test sockets on the marketplace today.

Contact:
Jamieson Wardall
jbwardall@johnstech.com
1210 New Brighton Blvd., Minneapolis, MN 55413 USA
+1-612-378-2020

mpi sponsor ad

KYOCERA International, Inc. — Hybrid

Booth: 402
Kyocera.com

Description:
KYOCERA Corporation is known as global leader of the Ceramic Technologies. our cutting-edge ceramic technologies provide solutions to many applications in the industry. For the Probe card, our unique and various material options help achieving the requirement for the next gen probe card.

Contact:
Testuya Kinoshita
tetsuya.kinoshita@kyocera.com
49070 Milmont Drive, Fremont, CA 94538 USA
+1-510-871-0578

mjc - hybrid sponsor

MJC Electronics Corporation — Hybrid

Booth: 204
MJC.co.jp

Description:
MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets, for the semiconductor industry.

Contact:
Steven Roybal
stevenr@mjcelectronics.com
11004 Metric Blvd., Austin, TX 78758 USA
+886-963-73-2015

mpi - hybrid sponsor

MPI Corporation — Hybrid

Booth: 210
MPI-Corporation.com

Description:
MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI dedicates in producing state-of-the-art fine pitch probing tool which enhances the speed of the worldwide semiconductor technology migration.

Contact:
Cahris Lin
cahris.lin@mpi-corporation.com
No. 155, Chung-Ho St., Chu-pei City, Hsinchu County, 302 Taiwan
+886-3-555-1771 Ext.8608

technoprobe sponsor ad
nidec s v t c l - hybrid sponsor

Nidec SV TCL — Hybrid

Booth: 200
SVProbe.com

Description:
Nidec SV TCL is a global provider of high-quality semiconductor testing solutions. Our extensive product line includes innovative MEMS Probe Cards along with a wide variety of other advanced probing technologies. Our proprietary MEMS Probes are fully customizable, capable of both wafer/final test, and can be utilized for many complex devices including RF, 5G, Mobile, Auto & IoT. In addition to analytical and simulation capabilities, we also offer full turnkey services for probe cards and final test.

Contact:
Greg Hunt
ghunt@nidecsvtcl.com
7810 S. Hardy Drive, #109, Tempe, AZ 85284 USA
+1-480-635-4700

NTK Technologies, Inc. — Hybrid

Booth: 302
NTKTech.com

Description:
NTK Technologies is a leader in IC Ceramic Packaging. Large and small-scale Ceramic STFs are manufactured for high-speed/high-density probe-cards for semiconductor wafer test. NTK supports fast-paced product cycle times with our advanced design and production flows featuring high precision processes for fast turn-around with the highest quality.

Contact:
Otto Liang
oliang@ntktech.com
3979 Freedom Circle, Ste 400 , Santa Clara, CA 95054 USA
+1-602-692-3684

onto innovation - hybrid sponsor

Onto Innovation — Hybrid

Booth: 400
OntoInnovation.com

Description:
Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include: Unpatterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; metal interconnect composition; factory analytics; and lithography for advanced semiconductor packaging. Our breadth of offerings across the entire semiconductor value chain helps our customers solve their most difficult yield, device performance, quality, and reliability issues. Onto Innovation strives to optimize customers’ critical path of progress by making them smarter, faster and more efficient. Headquartered in Wilmington, Massachusetts, Onto Innovation supports customers with a worldwide sales and service organization. Additional information can be found at www.ontoinnovation.com.

Contact:
Darren James
darren.james@ontoinnovation.com
16 Jospin Road, Wilmington, MA 01887 USA
+1-415-902-7065

ptsl sponsor ad
oxford lasers - hybrid sponsor

Oxford Lasers, Inc. — Hybrid

Booth: 208
OxfordLasers.com

Description:
Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.

Contact:
Alan Ferguson
alan.ferguson@oxfordlasers.com
2 Shaker Road, Unit B104, Shirley, MA 01464 USA
+1-978-425-0755

pactech - hybrid sponsor

Pac Tech USA Packaging Technologies, Inc. — Hybrid

Booth: 213
PacTech.com

Description:
PacTech is comprised of three business units: Equipment Manufacturing: ENIG/ENEPIG plating, Laser solder jetting, WL-solder ball transfer, Laser bonders for cantilever assembly/repair. Subcontract Services: Bumping Services including ENIG/ENEPIG for UBM/OPM. Electroplating, Solder Balling, RDL, Backmetal, Wafer Thinning & Dicing, AOI, X-Ray, SEM, FIB. Chemistry: Pre-Treatment and Process Chemistry for Enig/enepig.

Contact:
Bernd Otto
bernd.otto@pactech.com
328 Martin Ave., Santa Clara, CA 95050 USA
+1-408-588-1925

pec point engineering hybrid sponsor

Point Engineering Co., Ltd. — Hybrid

Booth: 404
PointEng.co.kor

Description:
PEC has been serving the needs of our customers who play in the Display and Semiconductor fields for more than 24 years. Our providing technologies are ceramic coating and substrate that can control specified micro-patterns by MEMs process. Now we have shown a unique ceramic substrate, using AAO(Anodic Aluminum Oxide), in the finer mold for various micro-pins and guide plates for logic devices and memory devices also.

Contact:
David Song
thsong@pointeng.co.kr
89 Asan Valley-ro, Asan City, Rep. of Korea
+8210-5755-2743

tel sponsor ad
posalux - hybrid sponsor

Posalux SA — Hybrid

Booth: 206
Posalux.com

Description:
Founded in 1943, POSALUX is a leading manufacturer of micro-technology machines intended for mass production. From our headquarters in Biel/Bienne, Switzerland, we engineer and produce world-renowned system solutions. Our clients are distinguished companies leading the electronic, automotive, watch and medical industries.

Contact:
Angelo Rizzo
arizzo@posalux.ch
Rue Fritz-Oppliger 18, Biel/Bienne, 2504 Switzerland
+41-0-32-344-75-00

PTSP - virtual sponsor

Probe Test Solutions — Virtual

Virtual Booth Only
ProbeTestSolutions.com

Description:
PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

Contact:
Jordan Mackellar
jmackellar@probetestsolutions.com
1 Argyle Crescent, Hamilton, Glasgow, South Lanarkshire, ML3 9BQ UK
+44-0-1698-745268

Prober.com — Hybrid

Booth: 305
Prober.com

Description:
Prober.com is one of the longest running companies dedicated to refurbishment and resale of wafer prober lines. We offer complete sourcing and parts support for our customers. We pride ourselves in the satisfaction of our customers and we partner with them to provide solutions to capacity needs in a timely manner. We work with our customers to plan for large and small capacity increases as well as integrating thermal and OCR solutions for their changing test requirements.

Contact:
Dennis Bonciolini
sales@prober.com
15532 SW Pacific Hwy., Suite C1B 501, OR 97224 USA
+1-503-822-5182

tse sponsor ad

R&D Altanova — Hybrid

Booth: 301
RDAltanova.com

Description:
R&D Altanova is the leading provider of full turn-key test interface solutions to many of the world’s largest integrated device manufacturers, fabless semiconductor companies and semiconductor foundries. Headquartered in New Jersey, R&D Altanova has offices and support teams around the world, including California, Pennsylvania, Costa Rica, Shanghai, and Taiwan.

Contact:
Bassam Asfoor
basfoor@rdaltanova.com
3601 S Clinton Ave, South Plainfield, NJ 07080 USA
+1-480-226-5900

Rika Denshi — Hybrid

Booth: 303
RikaDenshi.com

Description:
Rika Denshi offers a broad array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing. We also design and manufacture test contactors.

Contact:
Pete Blitchington
pete.blitchington@us.rikadenshi.com
112 Frank Mossberg Dr, Attleboro, MA 02703 USA
+1-508-226-2080

semics virtual sponsor

SEMICS Inc. — Virtual

Virtual Booth Only
Semics.com

Description:
Semics Inc. is a global leading technology-based wafer probing solution supplier for high-end devices. Since our establishment, SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns.

Contact:
Sales Team
smkim2@semics.com
732-37, Gyeongchung-daero, Gonjiam-eup, Gwangju-si, Gyeonggi-do Korea
+82-10-3326-0409

aehr sponsor ad

Sigma Sensors (TCL) GmbH — Hybrid

Booth: 308
Sigma-Sensors.com

Description:
SIGMA SENSORS TCL GMBH provides ISO17025:2017 accredited / traceable on-site thermal chuck temperature calibrations from -60C° to +200C°. It also manufactures and calibrates temperature wafers for wafer-test and R&D with measurement uncertainties as low as ±0.05K k=2.

Contact:
Harald Ibele
harald.ibele@sigma-sensors.com
Eulogiusstr 5 Pfullendorf, D-88630 Germany
+49-15-207-0488-88

scc south coast circuits - hybrid sponsor

South Coast Circuits — Hybrid

SCCircuits.com

Description:
South Coast Circuits is a leading provider of time-critical, technologically advanced PCB services, focused on the semiconductor industry. Our capabilities include HDI technology, ATE, Flex, and Rigid-Flex.

Contact:
Amanda Burgesser
amandaburgesser@gmail.com
3506 W. Lake Center Drive, Suite A, Santa Ana, CA 92704 USA
+1-949-294-9639

star technologies - hybrid sponsor

STAr Technologies Inc. — Hybrid

Booth: 202
STAr-Quest.com

Description:
2021 marks the 20th anniversary of STAr Technologies, headquartered in Hsinchu, Taiwan and branches out to USA, Japan, Singapore, South Korea and China. STAr is the world leading supplier of WAT and CIS probe cards and has continuously improved our technologies, lead time and cost-of-ownership for the customers.

Contact:
Paul Meyer
meyer_paul@star-quest.com
1885 Lundy Avenue, Suite 101, San Jose, CA 95131 USA
+1-408-416-0777

cohu sponsor ad
point engineering sponsor ad
tips - hybrid sponsor

T.I.P.S. Messtechnik GmbH — Virtual

TIPS.co.at

Description:
Probe Cards and Test Interfaces for: High Voltage, High Current Devices (Si, SiC, GaN), Sensors (Pressure, Magnetic, Light, X-Ray….), Automotive/Power ASICs, Automotive RADAR, TIPS Probe Refresher TPR-HD, ”Doubling Probe Card Lifetime”, Precise Tip Shape Control, Maintain Probe Card Performance over Lifetime.

Contact:
Rainer Gaggl
office@tips.co.at
Europastrasse 5, Villach, 9524 Austria
+43-664-1054217

Technoprobe - hybrid sponsor

Technoprobe America Inc. — Hybrid

Booth: 215
Technoprobe.com

Description:
Technoprobe is one of the world’s leading providers of advanced wafer testing solutions for the semiconductor industry. The company offers design, development and manufacturing of advanced wafer probe cards. Our mission is to be a strategic partner to our customers and their overall success.

Contact:
Marita Villarreal
marita.villarreal@technoprobe.com
2526 Qume Drive Ste#27, San Jose, CA 95131 USA
+1-408-483-2448

TEL - Hybrid sponsor

TEL – Tokyo Electron U.S. Holdings — Hybrid

Booth: 216
TEL.com

Description:
As a leading global company of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network of approximately 75 locations in 16 countries in the U.S., Europe, and Asia.

Contact:
Doug Heins
doug.heins@us.tel.com
2400 Grove Boulevard, Austin, TX 78741 USA
+1-512-424-1000

semics sponsor ad
teradyne - hybrid sponsor

Teradyne, Inc. — Hybrid

Booth: 217
Teradyne.com

Description:
Teradyne is the Future of Electronic Test and Industrial Automation. We deliver a completely integrated test solution backed by over 50 years of stability, innovation and global reach. Teradyne partners with you to ensure your success through all stages-seamless deployment, strategy definition, test development and high-volume production.

Contact:
Eric Shoemaker
eric.shoemaker@teradyne.com
600 Riverpark Drive, North Reading, MA 01864 USA
+1-978-370-2700

TSE - hybrid sponsor

TSE — Hybrid

Booth: 307
TSE21.com

Description:
“Toward the Company Creating the Future Value of Technology”
As a Technology and Science Enabler in the field of Semiconductor Test and Display Test, TSE has eveloped the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994, it has engaged as a leader in interface systems for Semiconductor Test. Main Products: Probe Card, Interface Board, Load Board, STO-ML(STF)

Contact:
Dongwoo Kim
kevinkim@tse21.com
78, 4sandan 5-gil,  jiksan-eup, Seobuk-gu, Cheonan-si, Chungnam, 31040 South Korea
+82-0-41-580-9700

vermont microtechnologies - hybrid sponsor

Vermont Microtechnologies — Hybrid

Booth: 209
VermontMicroDrilling.com

Description:
Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.

Contact:
Caleb Harwood
caleb@vtmicro.com
4693 Garland Hill Rd. Barnet, VT 05821 USA
+1-802-633-2300

yokowo - hybrid sponsor

Yokowo America Corporation — Hybrid

Booth: 205
Yokowo.co.jp

Description:
Yokowo offers a broad spectrum of fine connectors and test systems for front to back-end testing, which excel in signal integrity and are capable of testing the high-speed performance of semiconductors and electronic components amid trends towards higher density, greater integration and higher frequency.

Contact:
Shigeki Oka
shigeki.oka@yokowo.com
301 W Warner Road, Suite 112, Tempe, AZ 85284 USA
+1-408-315-8678

south coast circuits sponsor ad

SWTest Asia 2022

SWTest Asia will be postponed until October of 2022

We’d Like to Thank the Following Companies for Sponsoring SWTest 2021

Hybrid includes in-person and virtual | Virtual is virtual-only

Platinum Sponsors

formfactor - hybrid sponsor
PTSP - virtual sponsor
international test solutions - hybrid sponsor
jem - hybrid sponsor
nidec s v t c l - hybrid sponsor
teradyne - hybrid sponsor
mpi - hybrid sponsor
Technoprobe - hybrid sponsor
TEL - Hybrid sponsor
aehr hybrid sponsor

Gold Sponsors

oxford lasers - hybrid sponsor
tips - hybrid sponsor
feinmetall - virtual sponsor
intest ems - hybrid sponsor
heraeus - hybrid sponsor
yokowo - hybrid sponsor
star technologies - hybrid sponsor
mjc - hybrid sponsor
pactech - hybrid sponsor
posalux - hybrid sponsor
TSE - hybrid sponsor
semics virtual sponsor

Silver Sponsors

ers - hybrid sponsor
aps - hybrid sponsor
celadon - hybrid sponsor
vermont microtechnologies - hybrid sponsor
onto innovation - hybrid sponsor
pec point engineering hybrid sponsor
cohu hybrid sponsor
scc south coast circuits - hybrid sponsor
advantest - hybrid sponsor

Official Media Sponsors

Conference Partners

Back to top