2026 Conference Guide and Exhibitor Directory

Booth: 503
www.accretech.com

Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

advancedprobing.com

The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, beryllium copper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material.  Lower your overall cost of testing by using APS’s quality probe needles.

Booth: 207
www.advantest.com

Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC), including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

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Booth: 506
aehr.com

Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide.

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Booth: 304
www.celadonsystems.com

Celadon Systems is committed to providing reliable and innovative probe cards to meet the most rigorous demands of the semiconductor, medical, quantum computing, space and defense industries. Celadon’s probe cards are engineered to excel in extreme temperature conditions from below 2 Kelvin to over 800C.

Specializing in modular and adjustable solutions for MRAM, SiPh/PIC, WLBI, and High Voltage testing, Celadon takes pride in offering the lowest cost of test in the industry with customers achieving millions of touchdowns in both labs and production fabs.

Booth: 514
chromaus.com

Chroma ATE Inc. combines advanced hardware and software through the Chroma 3530 Parametric Test System and the Hyperion Platform to deliver efficient, scalable parametric test solutions for semiconductor advanced wafer manufacturing and reliability labs. Together, they improve test quality while reducing cost and complexity.

The Chroma 3530 Parametric Test System supports both legacy and advanced nodes, providing a cost-effective wafer test solution with seamless data correlation from benchtop characterization to high-volume production testing.

Booth: 210
www.cht-pt.com.tw

CHPT, one of the leading providers of semiconductor test interface products, employs a unique strategy that sets it apart from much of the industry. Our vertically integrated approach operates on an “All in House” business model. By utilizing the talent of our experts in the fields of electronics, chemistry, mechanics, and optics, we are able to create a win-win situation with customers and innovate at the pace of the ever-changing semiconductor industry.

CHPT was established in Taoyuan, Taiwan in 2005, listed for trading on the Taipei Exchange in 2016 (stock code 6510), and relocated to a new R&D operational headquarters in 2019.

Booth: 3
cototechnology.com

Today, Coto is a leading manufacturer of small signal switching products sold into the Automatic Test Equipment, Data Acquisition, Instrumentation, Process Control, Telecommunications, Medical and Security markets.

Booth: 112
cybertechnologies.com

cyberTECHNOLOGIES is a global leader in advanced metrology solutions for probe cards and semiconductor applications.

Its portfolio includes optical probe card measurement systems with integrated rework capabilities, enabling an efficient and streamlined workflow.

Deployed globally by leading IDMs, foundries, and OSATs, cyberTECHNOLOGIES’ metrology systems deliver reliable nano-resolution, high-speed measurements for both high-volume production and advanced R&D across the full process chain.

deringerney.com

Deringer-Ney Inc. specializes in the manufacture of platinum group metal alloys and precision components for the Medical, Automotive, Semiconductor, Industrial and Aerospace industries. In addition to custom alloy development, the company’s fabrication capabilities include precision machining, stamping, insert molding and micro-molding, miniature wire forming, MICROmfg cold heading, and dissimilar metals joining. Our manufacturing facilities create custom solutions for customers that range from prototype to full volume production quantities. ISO 9001 / ISO 13485 / IATF 16949

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Booth: 111
www.dynamic-test.com

PCB Design, SI/PI simulation and validation, PCB Fabrication and assembly services, Probe head manufacturer, final test socket manufacturer, Full-Turkey supplier and fully owned Substrate manufacturer for ATE test market.

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Booth: 412
www.entegris.com

Entegris, Inc. (NASDAQ: ENTG) is a leading supplier of advanced materials and process solutions for semiconductor, life sciences, and other high-tech industries. Our portfolio includes filtration systems, liquid and gas delivery solutions, specialty chemicals, and contamination control technologies. With over 50 years of expertise and a global network of manufacturing and technology centers, Entegris partners with customers to improve process performance and yields through innovation and collaboration.

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Booth: 314
www.esmo-group.com

Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handlers, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan, we are truly global.

We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.

Booth: 414
exaddon.com

Exaddon – Precision at the Smallest Scale

Revolutionizing probe card technology with ultra-high resolution, 3D-printed probes.

Using localized electrochemical deposition, Exaddon fabricates freestanding, ultra-fine pitch probes directly onto substrates—no masks, no lasers, no thermal stress.

Our process enables template-free, submicron-accurate manufacturing of mechanically robust, conductive structures—ideal for next-gen microLED, advanced packaging, and wafer-level test applications.

Booth: 4
exfo.com

Advanced Optics Instrumentation and PIC Wafer Probers

Booth: 6
fab-9.com

Quick turn PCB Manufacturing and PCB Assembly

Booth: 205
www.feinmetall.com

Since 1964 FEINMETALL GmbH is a leading company for contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments.

It does not matter where in the world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe.

Spring contact probes are used to test printed circuit boards, wire harnesses, connectors and other electronic components. We offer a wide range of contact probe varieties for each specific contact-making task, always tailored to the customers’ needs.

Wafer probe cards are used for contacting semiconductor wafers. Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards.

Booth: 415
www.ferrotec.com

Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.

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Booth: 313
formfactor.com

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.

By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

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Booth: 404
gelpak.com

Gel-Pak, a Delphon company,  develops and manufactures a family of elastomer-based carriers, films, and probe cleaning materials designed to improve operational efficiency and provide maximum protection during the handling and processing of delicate devices. Our manufacturing expertise allows us to customize existing products or rapidly develop novel solutions to meet evolving requirements for next generation technologies. Headquartered in Hayward, Calif., Gel-Pak has partnered with the world’s leading semiconductor, medical and electronics companies for more than 45 years.

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Booth: 312
www.herae.us/probing

Heraeus Precious Metals is part of the Heraeus Group and globally leading in the precious metals industry. As a specialist for advanced material solutions in test and measurement applications the company develops and manufactures high-performance precious metal alloys for use in cantilever, vertical, and MEMS probe cards – the critical contact interfaces in wafer testing.

Heraeus materials are also applied in final test environments, including spring-loaded test pins and other back-end test components. These materials offer excellent electrical conductivity, stable contact resistance, outstanding corrosion resistance, and superior mechanical durability.

With precisely engineered alloy systems such as Pt-, Pd-, Rh-, and Cu-based materials, Heraeus ensures reliable and reproducible test performance. In addition to semi-finished forms such as wires, strips, and rods, the company provides tailor-made material solutions to meet specific customer requirements.

Heraeus Precious Metals covers the value chain from trading to precious metals products to refining and recycling. It has extensive expertise in all platinum group metals as well as gold and silver and specialty alloys, backed by deep process and application know-how.

Customers around the globe benefit from Heraeus Precious Metals as a strong partner for precious metal solutions in modern semiconductor and test technologies, as well as from dedicated support in enhancing the efficiency, reliability, and longevity of their test processes.

Booth: 106
hicon-global.com

HiCon provides full wafer probe interposers, high speed board to board connectors, contact pins, and full custom solutions

HiCon is also a leading supplier of patented, high performance socket solutions for CPU, memory, GPU/AI, RF Burn-in, validation, SLT & ATE applications.

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Booth: 605
www.inttechcorp.com

Manufacturer of probe card analyzers and power semiconductor dynamic test systems.

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Booth: 601
integratedtest.com

Integrated Test designs, manufactures and assembles printed circuit boards for semiconductor testing. We work with high-speed materials to achieve speeds up to 224G Flying probe assembly testing and functional testing are available. ITAR and AS9100D certified.

Booth: 511
www.intest-ems.com

inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.

Booth: 606
www.iwinsn.com

IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price.

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Booth: 406
jem-net.co.jp

JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC, Flip-chip, WLCSP), image sensors and parametric test application. As semiconductor factories have expanded globally, JEM organizes a global manufacturing network in Japan, Asia, USA, and Europe to support customers’ needs in each region. JEM expands sales by creating JEM technology roadmap and sales strategies based on demands from global customers and technology roadmap of the semiconductor industry. With our global strategies and proactive development actions, JEM is striving to provide probe cards that exceed the demands of our customers. Our comprehensive probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. In addition, we offer custom design and fabrication services for printed circuit boards and space transformers.

Booth: 100
jfe-shoji-ele.co.jp/en

We don’t just solve problems; we pioneer the future. From micro-semiconductors to mega-industrial gear, our total solutions are tailor-made to your vision. Experience “Things to Imagine,” brought to life by the synergy of today’s mastery and tomorrow’s tech.

Booth: 202
www.johnstech.com

JOHNSTECH INTERNATIONAL is a global R&D leader in the field of semiconductor testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works hand-in-hand with the world’s most respected OSATs, foundries, and IDMs to develop the most precise and dependable test contactors on the marketplace today.

Booth: 615
www.keysight.com

Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation, and test challenges to create the best product experiences. Through our fusion of technology knowledge, measurement science expertise, and tailored solutions, we deliver intelligent insights throughout the innovation workflow to ensure fast time-to-market with reduced risk.

Booth: 315
www.keystone-photonics.com

Keystone Photonics offers probe heads for wafer-level testing of trench, V-groove, and surface coupling interfaces including testing methods for optical pluggable.

Booth: 405
www.ksmt.com.tw

KEYSTONE MICROTECH(KSMT) provides PCB board design, SI/PI/Thermal simulations, manufacturing, and full component and mechanical assembly on ATE load board, probe card, burn-in board, and system level test boards. We offer global support and are not only providing our customers with a product but with a turnkey service as well.

Booth: 305
www.laserjob.co.jp

From prototype development to mass production, we offer ultra-high precision processing to Probe Card Manufacturers using ultra-short pulsed lasers.

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Booth: 402
lincstech.com

On October 1, 2021 the Lincstech Group made a fresh start as an independent manufacturer specializing in printed wiring boards (PWBs).

As the PWB division of Hitachi Chemical and Showa Denko Materials, we have accumulated distinctive and advanced technologies over the past 50 plus years. We have also built connections and trust with our customers by listening to them and proposing solutions to improve the value of their products and services.

Our company name, Lincstech, is a combination of Link + C + Technology. Our company name incorporates our desire to provide value to our customers by using technology to connect the various “Cs” (communication, collaboration, co-creation…) that we consider important.

At Lincstech we are proud that our printed wiring boards assist our customers in realizing superior value in their products and services.

Booth: 5
lsglobal.co.kr

test socket, interposer, stamped probe pin, test board design and manufacturing

Booth: 515
www.megatouch.co.kr

Megatouch leads the market in core components for secondary battery and semiconductor testing based on the best technology. We provide optimal products that meet our customers’ needs by independently designing the pins, processing components, conducting plating, and assembly, and establishing a quality evaluation system to ensure perfect quality management. We will continue to grow and advance as a company that is always prepared for the future and leads changes.

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Booth: 505
menlomicro.com

Menlo Micro sets a new standard for switches with the Ideal Switch®, a chip-scale platform that overcomes performance, efficiency, and scalability bottlenecks of electromechanical relays (EMRs) and semiconductor-based switches. It’s the first disruptive switching technology in over 30 years and the only platform scalable across both power and frequency domains. The Ideal Switch enables smaller, lighter, faster, more reliable, and energy-efficient systems.  From AI and quantum computing to aerospace, defense and power electronics, the Ideal Switch eliminates bottlenecks and reduces the total cost of ownership across today’s most demanding applications.

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Booth: 213
www.mjc.co.jp

MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.

Booth: 203
mipox.co.jp

We manufacture and sell a wide range of polishing-related products, including precision polishing materials such as polishing films and cleaning sheets mainly for applications that require high-precision polishing performance such as probe pin cleaning.

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Booth: 306
mpi-corporation.com

MPI Corporation, established in 1995, is a global leader in advanced probing technology. Committed to innovation, MPI delivers cutting-edge probing solutions that accelerate the evolution of semiconductor technology worldwide.

Booth: 614
nanofocus.de

NanoFocus AG is a developer, manufacturer, and distributor of measurement technology and software packages for the characterization of technical surfaces.

Booth: 105
nexustest.com

Headquartered in Singapore, NEXUSTEST is a global supplier of high-end test equipment for the optical and semiconductor markets. We design and manufacture advanced test instruments and systems for high-speed optical modules, laser diodes, Silicon Photonics wafers, and Co-Packaged Optics devices. Our portfolio also includes cutting-edge solutions for the production and reliability testing of Silicon (Si) and Silicon Carbide (SiC) wafers as well as the singulated dies.

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Booth: 502
www.nidecsvprobe.com

Nidec SV Probe is a global provider of high-quality semiconductor testing solutions. We supply advanced testing products for some of the most complex AI, Mobile, Automotive and IoT devices. Our extensive and diverse product line includes MEMS Probes and MEMS-based probe cards along with a variety of Vertical and Cantilever Probe Card technologies.

Booth: 114
www.ntktechnicalceramics.com

With NTK’s technology and expertise, developed through many years of ceramic package manufacturing, NTK provides benefits below to the customers.
-Flexible shape capability by strictly controlled green sheet lamination technology
-Range of applications from single-layer to multilayer ceramics
-Bonding a variety of metal fittings to ceramics
-Wide-variety of plating options to produce reliable surface finish
-Broad selection of Standard Tools
-Flexible production capability, accepting small-quantity orders to high volume production requirements
-Quick delivery

Booth: 307
www.oxfordlasers.com

Oxford Lasers is the Home of Laser Innovation since 1977.

We provide ultra-high precision laser services and systems to advanced manufacturing industries worldwide including probe card companies.

Our capabilities extend to applications in micromachining, trimming and imaging. Our world-class facility in Oxford, UK supported by our experienced multi-disciplinary team, provides an extensive range of products supporting semiconductor, pharmaceutical, medical technology and aerospace industries.

We excel at micromachining a wide range of materials and features for products such as Guide Plates. Unparalleled in the industry, Oxford Lasers has expertise in laser technologies including applying machine learning into our production process for enhanced performance and pinpoint accuracy.

Booth: 215
www.pointeng.co.kr

Point Engineering specializes in designing and manufacturing advanced MEMS probes and probe heads for semiconductor wafer and package testing.

Our cutting-edge MEMS buckling probes (ultra-short length, high current capacity) and fine-pitch spring probes empower leading customers to break performance barriers.

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Booth: 407
posalux.com

We are a Swiss machine tools manufacturer offering outstanding micro-machining solutions for mass production since 1943.

Through our mechanical & Femto-LASER technologies, we drill, mill, route, and cut ceramics, polymers, and precious metals dedicated to Test Equipment applications. Bring a new perspective to your challenges!

Booth: 103
princeizant.com

Prince & Izant provides brazing alloy and high-purity precious metal products, solutions, and support to global industrial and high-technology manufacturing industries. We understand that our customers’ manufacturing processes rely on our ability to quote, order, ship, and support quickly and flexibly. We stock products at various manufacturing stages, allowing us to provide quick lead times.

Booth: 214
probing.com.cn

Probe Card Tester System Maker

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Booth: 507
probetestsolutions.com

PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

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Booth: 212
www.qualmax.com

Semiconductor probe and probe head manufacturer.

Booth: 204
reidashman.com

Established in 1979 and based in St. George, Utah, Reid-Ashman Manufacturing is a distinguished provider of complete solutions for semiconductor test equipment integration. Our company excels in delivering superior custom engineering designs and manufacturing services, specializing in Test Head Manipulators, Mechanical Docking, and Electrical Interfacing.

Committed to excellence, we prioritize the delivery of exceptional quality across all facets of our products and services. With a global presence, our seasoned team ensures that our solutions adhere to the most rigorous industry standards. At Reid-Ashman Manufacturing, our objective is to consistently lead the market through a commitment to innovation, uncompromising quality, and dedicated responsiveness to our clients’ evolving needs.

Booth: 303
www.samtec.com

Samtec is a privately held, $1 Billion (USD) global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Rugged, Power, RF, Board-to-Board and Cable-to-Board Systems.

Booth: 113
santec.com

Santec is a global photonics engineering company and a leading manufacturer of Tunable Lasers, Optical Test and Measurement Products, and Advanced Optical Components. Santec’s test equipment is optimized for fast and accurate WDM and Cable Assembly testing as well as automated testing of optical components and devices in the production environment. Advanced components for optical networks include tunable filters, attenuators and tap-photodetectors.

Booth: 413
www.semics.com

The culture of SEMICS encourages all challenges, regardless of the result.

SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.

SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns.

SEMICS has always brought ‘trust’ to our partners. Offering “trust“ is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far.

SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.

Booth: 115
semiera.com

Semiera provides high-precision manufacturing solutions for the semiconductor test industry, specializing in critical components and consumables used throughout wafer test and related applications. Our core offerings include precision socket machining, high-performance ceramic and advanced material components, probe tips, probe pins, high-frequency and high-speed cables, and other test-related accessories.

With a focus on precision, reliability, and customization, Semiera helps customers meet demanding requirements for electrical performance, mechanical accuracy, and long-term durability in advanced test environments.

Booth: 403
standexdetect.com

Standex Electronics Detect is a global manufacturer of relays, reed switch-based sensors, custom magnetics, and electro-mechanical components. We serve critical markets including semiconductor testing, automatic test equipment (ATE), battery management systems (BMS), medical devices, industrial applications, and renewable energy. As the market leader in reed switch production, we offer vertically integrated manufacturing that ensures supply chain reliability and product consistency. We combine this with advanced contact technologies to deliver high-performance, reliable solutions for complex applications. Our acquisition of Sanyu Switch further expanded our relay portfolio with new package types, including high-frequency solutions. With manufacturing operations in the U.S., Mexico, Germany, India, Japan, and China, and sales offices across North America, Europe, and Asia, Standex Electronics generates annual revenues exceeding $400 million. We are a wholly owned subsidiary of Standex International Corporation (NYSE: SXI), a diversified, publicly traded company.

Booth: 612
www.star-quest.com

STAr delivers innovative probe card solutions for the most demanding semiconductor testing applications. We excel in SoC IC testing with our Optima MEMS vertical high pin count probe cards (down to 35µm pitch and >2A currents across tri-temperature).

STAr’s one-touch 3D MEMS probe cards significantly lower the Cost-of-Test for Flash memory ICs with single-card tri-temperature testing. For CMOS image sensors (CIS), we offer 3D MEMS probe cards supporting >3.5GSPS C-PHY tests, with next-gen 6GSPS in development.

STAr also introduced Zeus Membrane Probe Cards for signal-critical RF applications, featuring tunable components, adjustable contact force, high channel density, and versatile RF connectors. Additionally, our MEMS WAT probe cards support femto-ampere low-leakage current WAT tests with 35µm pitch capability.

STAr is dedicated to providing our customers with the most advanced and reliable probe card solutions.

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Booth: 504
www.synergie-cad.com

PCB Design, Manufacture and Assembly – Full In House Turnkey PCB Solution

Booth: 512
technoprobe.com

Innovation Begins with Us

Technoprobe (XMIL: TPRO) is a leading provider of the most advanced wafer test solutions for the semiconductor industry.

The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio capable of meeting complex testing requirements and reducing the overall cost of test.

Technoprobe works relentlessly to keep pace with the constant evolution of semiconductors. Our culture to drive Innovation leads us to explore new concepts, to push Technology beyond its limits, and to use customization as a guiding principle to enable the next generation products.

Technoprobe strives to be the technology leader to help build our customers’ future.

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Booth: 613
www.tel.com

As a leading global company of innovative semiconductor and flat panel display (FPD) production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.

Booth: 513
teradyne.com

Teradyne designs, develops, and manufactures automated test equipment and advanced robotics systems. Its test solutions for semiconductors and electronics products enable Teradyne’s customers to consistently deliver on their quality standards. Its advanced robotics business includes collaborative robots and mobile robots that support manufacturing and warehouse operations for companies of all sizes. For more information, visit teradyne.com. Teradyne® is a registered trademark of Teradyne, Inc., in the U.S. and other countries.

Booth: 104
tts-grp.com

Being in the business since 1979, TTS Group dedicates itself to bring the best possible solutions to help our customers solve some of the most challenging issues in semiconductor test and tooling today. Right from R&D to design to simulation to validation, we focus on lowering the total cost of final test through relentless pursuit of innovation, yield, quality, reliability and on-time delivery for our customers. Our solutions range from probe heads, probe pins, and test contactors.

Booth: 602
www.tips.co.at

Probe Cards for HV/HC power device test (Si, SiC, GaN)
Known Good Die Test (KGD) for power device (Si, SiC: IGBT, MOSFET, Diode…)
Probe Cards for Sensors (MEMS, pressure, magnetic, gas, radiation…)
Vertical Probe Cards for Automotive ASICS, RADAR
Docking solutions for High Power probe cards (probe card, signal tower, load board suitable for automatic probe card changer)

Booth: 302
relay.com/tw

With over 35 years of engineering excellence, Toward Technologies is a global leader in switching solutions. Our product lineup includes Opto-MOSFET relays, Reed relays, RF MEMS switches, and relay modules, trusted in semiconductor testing, battery management systems (BMS), and energy storage applications.

We specialize in high-speed, high-frequency, precision, and space-optimized switching solutions, engineered to meet the demands of next-generation electronics.

Our customization capabilities span from PCB layout and hardware design to firmware and software development, empowering customers to overcome complex integration challenges and accelerate time-to-market.

Toward Technologies — Enriching Your Design.

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Booth: 7
translarity.com

Translarity is a growing leader in the semiconductor test industry, delivering innovative wafer test solutions that power the technology shaping our digital world. Headquartered in Silicon Valley, with operations in California, Texas, the Philippines, Taiwan, and Vietnam, we serve leading semiconductor manufacturers and their global supply chain partners.

Our mission is to revolutionize semiconductor wafer testing through innovation and excellence. With over 100 patents and a focus on full-wafer testing, we provide solutions that combine low cost, high performance, and fast cycle times using cutting-edge MEMS probe technology. Join our dynamic and growing team as we continue to address the evolving needs of the semiconductor industry.

Booth: 206
www.tse21.com

The i3unify integrated solution provides a comprehensive portfolio of test interconnect hardware, including probe cards, interface boards, and test sockets, all designed within TSE’s vertically integrated architecture. This ensures seamless compatibility, enhanced performance, and reliability across platforms while streamlining implementation and reducing dependency on multiple vendors. The unified approach simplifies installation, after-sales support, and optimization, enabling innovative, customized solutions that maximize efficiency and customer satisfaction.

As the ultimate test interconnect solution for semiconductor testing, i3unify supports diverse applications, including AI, high-speed networks, advanced data centers, and autonomous vehicles. It redefines connectivity, unlocking limitless possibilities and driving transformative opportunities for our customers through cutting-edge innovation and exceptional user experience.

Booth: 604
www.turbodynamics.com

At Turbodynamics, we view ourselves as a service provider for cutting-edge technology in the semiconductor industry. We provide our customers with solutions for their automatic test equipment that are individually tailored to their needs. And we develop innovative solutions on our own initiative.

Our first product, the compact locking element P-DockⓇ, is now successfully in use worldwide and forms the benchmark in semiconductor test. The success story of P-DockⓇ we repeat according to the same principles: listen to our customers, develop solutions and deliver reliably.

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Booth: 610
XingR.com

“Probing The Future”

XingR is a leading semiconductor company specializing in the design, development, and manufacturing of probe cards for chip functionality testing. With over 30 years of experience, our dedicated R&D and manufacturing team is committed to delivering reliable products to our customers every day.

Comprehensive and Advanced Probe Cards: XingR offers a full range of technologies, including MEMS, cantilever, membrane, vertical probe cards, and substrates for high-speed, high-power wafer-level testing. Our solutions serve a wide variety of applications, including advanced SoC, ASIC, DDI, CIS, AI, AR/VR, Automotive, 5G/6G, and Data-Center.

Patented Technology and Quality Assurance: Our core patent technology and standardized processes ensure quality assurance. Over the past 25 years, we have accumulated over 90 intellectual property rights, global customer resources, confidentiality controls, and agile services, making XingR an innovator in the probe card industry today.

Booth: 607
yokowo.co.jp

Yokowo proposes a broad spectrum of fine connectors and test systems for front to back-end testing, which excel in signal integrity and are capable of testing the high-speed performance of semiconductors and electronic components amid trends towards higher density, greater integration and higher frequency. With complete before- and after-sales service systems, Yokowo answers the needs of customers.

Booth: 2
ytec.com.tw/en

YTEC (YoungTek Electronics) specializes in semiconductor test-related equipment and integrated test solutions, supported by local technical service in the United States. By combining YTEC’s extensive manufacturing expertise with responsive U.S. market support, we help customers enhance test efficiency, quality, and reliability.

Booth: 107
zeroonetest.com

Zero One stands as a preeminent turnkey provider in the ATE interface industry. We deliver an all-encompassing solution for high-quality ATE Board (Device Interface Board). Our offerings are characterized by rapid delivery and cost – effectiveness, covering the entire process from design, simulation, fabrication to component assembly. In addition, we specialize in Vertical Probe Card, handling every aspect from the design and fabrication of Probe Card PCB, MLO design, probe head design to assembly.