SWTest 2023 Conference Guide and Exhibitor Directory
Jump to the sections below:
Thank You To Our Corporate Sponsors
Platinum Sponsors
Gold Sponsors
Silver Sponsors
Official Media Partners
Conference Partners
Chairman’s Welcome to SWTest 2023 Conference and Expo
Wafer Test Technology in Carlsbad, California
Welcome to the SWTest EXPO at the OMNI La Costa, Carlsbad, CA
On behalf of the SWTest Executive Team, Program Committee, and Committee Members, I want to warmly welcome you to the SWTest 2023 Conference and Expo held at the beautiful OMNI La Costa Resort located in scenic Carlsbad, California. Nothing beats a face-to-face discussion, networking, and problem solving and the SWTest Expo is a great place to meet and connect.
It is my absolute great pleasure to thank our 10-Platinum, 12-Gold, and 11-Silver Sponsors who are generously supporting the conference in 2023. We also thank the 62 exhibitors from the Sold-Out Expo, the technical program and poster speakers, the committee members, and (of course) recognize the volunteers who help make the SWTest Conference and EXPO a “must-attend” global event for the wafer test industry.
On Monday SWTest EXPO takes place in the Costa Del Sol Ballroom with great cocktails and delicious food stations. During the EXPO, we will showcase key suppliers to the wafer probe industry, swag giveaways, and a trivia contest. New for SWTest 2023, we will feature a “SWTest Speaker’s Corner” to promote networking and technical discussions with the podium speakers. All speakers, including the Visionary Keynote, will be scheduled at specific meet-and-greet timeslots throughout the Expo to connect with attendees. This is a terrific, relaxed opportunity for asking detailed questions or having deep discussions. Do not miss this excellent chance to connect with the speakers.
On Tuesday afternoon, the SWTest EXPO reopens with refreshments and ample time for extra networking. The “SWTest Speaker’s Corner” will re-open for more one-on-one discussions with the podium presenters
Once again, thank you for being a part of the SWTest Conference and enjoy San Diego!

Jerry Broz, PhD
General Chair
SWTest Conferences
SWTest Team and Committee Members
SWTest Executive Team

General Chair
Jerry Broz, PhD,
Advanced Probing Systems

Technical Program Chair
Rey Rincon,
PTSL

Technical Program Co-Chair
Patrick Mui,
JEM America

Finance Chair/Conference Management
Maddie Harwood,
Conference & Exhibits Management, Inc. (CEM)
SWTest SD Technical Program Committee
- Jerry Broz, PhD, Advanced Probing Systems (US)
- John Caldwell, MJC Electronics Corp. (US)
- Geert Gouwy, IMEC (Belgium)
- Darren James, Onto Innovation (US)
- Clark Liu, Taiwan MJC Co. (Taiwan)
- Patrick Mui, JEM America (US)
- Mark Ojeda, Infineon (US)
- Rey Rincon, PTSL (US)
- Raffaele Vallauri, Technoprobe (Italy)
- Joey Wu, Member-at-Large (Taiwan)
SWTest SD Steering Committee
- Davide Appello, STMicroelectronics (US)
- Karen Armendariz, Celadon Systems (US)
- Gunther Boehm, Feinmetall GmbH (Germany)
- Geert Gouwy, IMEC (Belgium)
- Michael Huebner, PhD, FormFactor, Inc. (Germany)
- Joonyeon (JY) Kim, Samsung Electronics (Korea)
- Amy Leong, FormFactor, Inc. (US)
- Alistair Liang, Micron Technology (US)
- Clark Liu, Taiwan MJC Co. (Taiwan)
- Grace Liu, PhD, Intel Corporation (US)
- Mark Ojeda, Infineon (US)
- Connie Smith, Texas Instruments (US)
- Raffaele Vallauri, Technoprobe (Italy)
- Joey Wu, Member-at-Large (Taiwan)
SWTest 2023 Mobile App

Information on the Mobile App will be available in May 2023
The official SWTest app is your go-to guide for the event, keeping you up to date with all the latest news and information.
The SWTest 2023 Conference Mobile App is now available to download.
Go to the App store and search for “SWTest” or click on the App store links below.
While the app is available to download, you will not be able to access information in the app until Sunday, June 4th at 7:00 AM PST when we go LIVE!
- We will also be utilizing the app to distribute daily passwords for proceedings via push notification and important SWTest announcements.
- To log into the App, you will need to use the email address associated with your registration.
- Should you have any questions, please visit the Registration Desk in the Costa De la Luna Foyer.
Registration
Self-check in for registration is located in the Costa de la Luna Foyer of the Conference Center. Self-registering kiosks will allow a “touchless” check-in by scanning your personal QR Code located on your check-in email sent on June 2nd or you can enter your last name or email used to register.
- If you have your QR code, please hover the QR Code over the camera of MS Surface tablet. The document on your smartphone should be facing the camera located at the top of the MS Surface tablet.
- If you do not have a QR code, please enter your email or last name to find your registration.
- Proceed to the registration desk where staff will hand you your badge and other conference related materials.
Registration Check-in Hours
- Sunday, June 4
13:30 – 17:00 - Monday, June 5
7:00 – Noon and 13:30 – 16:00 - Tuesday, June 6
7:00 – Noon and 13:30 – 15:00 - Wednesday, June 7
8:00 – 11:00
A registration badge is required for admission to events associated with your badge type:
- Full Conference and Student:
All Events, including Technical Sessions - Exhibitor and Expo Only:
All Events, except Technical Sessions - Companion:
All receptions, dinners and Tuesday Social Event
EXPO Trivia Contest
New This Year!
The SWTest EXPO Trivia Contest increases traffic to the exhibitors’ booth and encourages engagement while attendees are given the chance to win great prizes!
Here is how it works:
- Grab a printed sheet of questions/answers from the registration desk or the EXPO entrance.
- Visit the participating exhibitors to learn the correct answer.
- Download the “SWTest 2023 Conference” mobile app from the App Store.
Use your registration email to login and search for the Trivia Contest icon.
Enter ALL of your answers AT ONE TIME and submit them prior to June 6th at 5:30pm.
** IMPORTANT **
You must submit your answers ALL AT ONE time, you cannot go in and enter multiple times. So use the printed sheet to gather your answers before submitting them in the app.
Winners will be announced during the Tuesday Evening Social Event on June 6.
How Do I Participate?
In the SWTest Mobile App, there will be an icon labelled “Trivia Contest”. Within that icon, there will be questions or statements on the participating exhibitors with one correct answer and two incorrect answers.
You will need to visit each of the participating visitors and interact with the booth personnel to learn which is the correct answer.
To find out the participating exhibitors:
- There will be signage in the registration foyer and the entrances to all EXPO areas with the list of participating exhibitors, prizes, and rules on how to win.
- The electronic EXPO Directory will indicate each Trivia Contest Exhibitor with a star next to their listing: *TCE* (for Trivia Contest Exhibitor)
- The exhibitor listing on the SWTest Website and the SWTest Mobile App will indicate Trivia Contest Exhibitor with a star next to listing: *TCE* (for Trivia Contest Exhibitor)
Enter your answers into the mobile app after you’ve gathered all the answers using the pre-printed sheets. All answers will need to be entered by 5:30pm on Tuesday, June 6th.
Everyone who answers more than 70% of the questions correctly, will be entered to win one of the participating exhibitors’ prizes.
The winners will be announced during the Tuesday Night Social Event between 7:30 and 9pm. Each announced winner will have 60 seconds to choose their prize before the next winner is announced!
SWTest would like to thank the participating exhibitors for their generous prize contributions and support:
EXHIBITOR | BOOTH # | PRIZE |
---|---|---|
ACCRETECH | 105 | Titanium Tumbler (350cc) |
Aehr Test Systems | 411 | Apple AirPods Pro (2nd Gen) |
AEM | 604 | Finnish designed VALCO VKM25 noise cancelling headphones |
Celadon Systems | 309 | $100 VISA Gift Card |
ERS electronic GmbH | 204 | Apple AirPods Pro |
esmo USA | 608 | Wenger/Vitorinox 17″ Laptop Backpack (made in Switzerland) |
FormFactor | 403 | $100 Amazon Gift Card |
Heraeus Deutschland GmbH & Co. KG | 408 | Belkin BOOST CHARGE PRO 3-in-1Wireless Charging Stand with MagSafe |
Integrated Technology Corporation | 104 | Belkin BOOST↑CHARGE PRO 3-in-1 Wireless Charging Stand with MagSafe |
Integrated Test Corp | 200 | Bluetooth Earbuds |
inTEST EMS | 206 | Remarkable Tablet |
JEM | 203 | JBL Flip 6 – Portable Bluetooth Speaker |
Laser Job Inc. | 500 | Suntory’s Yamazaki Single Malt Whisky 700ML |
LUKEN Technologies | 112 | TECHSKIN Tech Fit Premium Golf Pouch |
MJC | 510 | $100 Amazon Gift Card |
MPI Corporation | 307 | $100 Amazon Gift Card |
Nidec SV Probe | 400 | $100 Amazon Gift Card |
Oxford Lasers | 404 | Sony Noise Cancelling Wireless Headphones |
Posalux SA | 211 | A beautiful Swatch, the iconic Swiss watch brand |
Pozzetta | 602 | $100 Amazon Gift Card |
PTSL | 406 | Balvenie Caribbean Cask Aged 14 Years Single Malt Scotch |
Qualmax Inc. | 110 | Apple AirPods (2nd Gen) |
SEMICS Inc. | 507 | $100 Amazon Gift Card |
Smiths Interconnect | 512 | Marshall Emberton Portable Bluetooth Speaker – Black |
SPEA S.p.A. | 301 | Apple AirPods |
STAr Technologies, Inc. | 606 | Apple HomePod Mini |
Synergie Cad Group | 212 | Apple iPad |
T.I.P.S. Messtechnik GmbH | 611 | Fluke Handheld Multimeter |
Technoprobe America Inc | 310 | $100 Amazon Gift Card |
TEL | 210 | Golf Balls, Golf Towel, and Two Wine Tumblers |
TFE Inc | 303 | $150 VISA Gift Card |
Translarity | 503 | Golf Player Pack: Rangefinder, Speaker, Divot Tool & Hub – Blue Tees Golf |
Turbodynamics | 103 | Turbodynamics Thermos & Lunch Box |
Tuesday Evening Social
Program Schedule
Times in PDT | Tentative, subject to change
Sunday, June 4
Time | Event | Location |
---|---|---|
7:00 a.m. – 8:00 a.m. | Golfers Breakfast | Valley Promenade |
8:00 a.m. – 1:00 p.m. | William Mann Memorial Golf Tournament | Starter Area – Legends Course |
1:30 – 5:00 p.m. | Conference Registration Check-In | Costa de la Luna Foyer |
5:30 – 7:30 p.m. | Sponsors/Committee Mixer | Orchid Terrace |
6:00 – 8:00 p.m. | Attendee Welcome Mixer | Bar Traza |
Monday, June 5
Time | Event | Location |
---|---|---|
7:00 – 8:00 a.m. | Continental Breakfast | Costa de la Luna Courtyard/Lawn |
7:00 – 8:00 a.m. | Speakers’ Breakfast | Las Palmas 1 and 2 |
7:00 a.m. – Noon | Exhibitor Check-in | Costa de la Luna Foyer |
7:00 a.m. – 4:00 p.m | Registration Check-In | Costa de la Luna Foyer |
8:00 – 9:30 a.m. | Welcome & Keynote Speaker | Costa de la Luna Ballroom |
8:00 – 8:15 a.m. | Opening Remarks for SWTest 2023 Jerry Broz, PhD, SWTest General Chair, Advanced Probing Systems | Costa de la Luna Ballroom |
8:15 – 9:30 a.m. | ![]() Test in the 3D NAND Zettabyte Era: How to achieve quality and minimize cost Luca Fasoli, PhD Senior Vice President, Silicon Technology & Manufacturing Western Digital, Inc. | Costa de la Luna Ballroom |
9:30 – 10:00 a.m. | Coffee Break and Poster Session | Costa de la Luna Foyer |
10:00 – 10:30 a.m. | Welcome to SWTest 2023 Jerry Broz, PhD (SWTest Conference Chair – Longmont, USA) | Costa de la Luna Ballroom |
10:30 a.m. – Noon | Technical Session 1: RF Applications Session Chair: Mark Ojeda (Infineon Semiconductor – USA) | Costa de la Luna Ballroom |
10:30 a.m. – 11:00 a.m. | On Membrane Attenuators for 60 GHz Loopback Transceiver Testing Herve Pozin-Roux, Nicolas Falcot, Philippe Tribolo, and Benoit Gubert (ST Microelectronics – France) and Andrew Nelson (FormFactor – USA) | Costa de la Luna Ballroom |
11:00 a.m. – 11:30 a.m. | High Speed and Fine Pitch Phantom Technology. Advanced Solution for RF Test Over 53 Gbps and Fine Pitch at 70µm Giulia Rottoli (Technoprobe SpA – Italy) and Dale Ventura (Marvell Technology- USA) | Costa de la Luna Ballroom |
11:30 a.m. – Noon | Enabling high speed loopback tests for Serdes, PCIE Gen5/6 on Probe using embedded Capacitors on the MLO Quaid Joher Furniturewala (Advantest America Inc. – USA) | Costa de la Luna Ballroom |
Noon – 1:30 p.m. | Enjoy Lunch and Networking with Colleagues and Attendees! | Costa de la Luna Courtyard/Lawn |
Noon – 4:00 p.m. | Exhibitor Setup | Costa Del Sol Ballroom |
1:30 – 3:00 p.m. | Technical Session 2: Probecard Optimizations Session Chair: Michael Huebner, PhD (FormFactor – USA) | Costa de la Luna Ballroom |
1:30 – 2:00 p.m. | Overcoming New Challenges in Advanced Vertical Probe Card Guide Plate Drilling Chris Stokes, Alan Ferguson PhD, and Dimitris Karnakis (Oxford Lasers Ltd – UK) | Costa de la Luna Ballroom |
2:00 – 2:30 p.m. | Reinventing RF Wafer Probes Don Thompson (PTSL – USA) | Costa de la Luna Ballroom |
2:30 – 3:00 p.m. | Fully Automated Integrated Silicon Photonic Wafer Test Golam Bappi (Ayar Labs – USA) and Dan Rishavy (FormFactor – USA) | Costa de la Luna Ballroom |
3:00 – 3:30 p.m. | Coffee Break and Poster Session | Costa de la Lune Foyer |
3:30 – 5:00 p.m. | Technical Session 3: Fine Pitch & High Parallelism Session Chair: Raffaele Vallauri (Technoprobe SpA – Italy) | Costa de la Luna Ballroom |
3:30 – 4:00 p.m. | Staying Ahead of the Probe Card Complexity Curve Eric Shoemaker and Steve Ledford (Teradyne, Inc – USA) | Costa de la Luna Ballroom |
4:00 – 4:30 p.m. | Challenges and Innovations in Developing High-Density, Low-Power DPS Solutions for 5nm and Smaller Process Geometries in ATE Tim Bakken (Elevate Semiconductor – USA) | Costa de la Luna Ballroom |
4:30 – 5:00 p.m. | MEMS Probe Cards for Advanced High-Volume Inline Process Control Monitoring (PCM) and End-of-Line Wafer-Acceptance Tests (WAT) Choon-Leong Lou, Yu-Ming Chien, Daniel Lo, Tee Whay Lim, Jee Fong Jong, Eric Sik Kiang Lau (STAr Technologies – Taiwan) | Costa de la Luna Ballroom |
5:00 – 8:00 p.m. | SWTest 2023 EXPO – Supplier and Sponsor EXPO with new Speakers’ Corner! | Costa Del Sol Ballroom |
5:00 – 5:30 p.m. | Come chat with our Keynote Speaker – Dr Luca Fasoli – at the Speakers’ Corner | Costa Del Sol Ballroom |
5:30 – 8:00 p.m. | Speakers’ Corner – Chat with some of the Speakers from the Technical Sessions | Costa Del Sol Ballroom |
8:00 – 10:00 p.m. | Sponsor Hospitality Suites and Events |
Poster Session
Session Chair: John Caldwell (MJC Electronics Corporation – USA)
- Reducing to thermal soak time of probe card with tunable power of heater in space transformer
Kwangjae OH, Kyoungtae MOON, Yong Ho CHO (PROTEC MEMS Technology – South Korea) - Micro-Textured Film Offers Promise in Universal Handling of Microelectronics
Raj VARMA (Delphon – USA) - Pushing Temperature Limits of High Voltage Wafer Test
Georg FRANZ (T.I.P.S. Messtechnik GmbH – Austria) - High speed probe card using flexible multilayer polyimide fabricated by 3D MEMS Process
Tae Kyun KIM, Yong Ho CHO (PROTEC MEMS Technology – South Korea), and Jong Gwan YOOK (Yonsei University – South Korea) - Importance of ceramic substrates with low thermal expansion coefficient in semiconductor wafer testing
Chiseung IN, Dae Hyeong LEE, Dooyun CHUNG, Junghwan CHO, Huntae KIM, Yujin CHOI, and Seungho HAN (SEMCNS – South Korea) - Simplifying the Process of Probe Card Design Through Software Automation
Adam SCHULTZ (Cohu – USA) - Full Wafer MSP Contact and the Challenges of Material Deflection
Gordon COWAN (Probe Test Solutions Ltd – UK) - Optimizing Probe Head Design Using a J-Tuned™ Process on Spring Probe Technology
Valts TREIBERGS and James HATTIS (Johnstech – USA)
Tuesday, June 6
Time | Event | Location |
---|---|---|
7:00 – 8:00 a.m. | Continental Breakfast | Costa de la Luna Courtyard/Lawn |
7:00 – 8:00 a.m. | Committee Breakfast | Las Palmas 1 and 2 |
7:00 a.m. – 3:30 p.m. | Registration Check-In | Costa le la Luna Foyer |
8:00 – 8:30 a.m. | Update on SWT Crew Initiative and Mentoring Program Karen Armendariz (Celadon Systems) and Amy Leong (FormFactor) | Costa de la Luna Ballroom |
8:30 – 9:30 a.m. | Technical Session 4: RF Design Considerations Session Chair: Karen Armendariz (Celadon Systems – USA) | Costa de la Luna Ballroom |
8:30 – 9:00 a.m. | Pyramid Probe: RF Calibration and Probe Aging Considerations in HVM High Speed IO Devices Daniel Bock, PhD (FormFactor – USA) and Walter Contrata (Marvell – USA) | Costa de la Luna Ballroom |
9:00 – 9:30 a.m. | High Speed Probe Card architecture for High End Devices Xin-Reng Foo and Chee Hoe Lin (AMD – Singapore) | Costa de la Luna Ballroom |
9:30 – 10:00 a.m. | Coffee Break and Poster Session | Costa de la Luna Foyer |
10:00 – Noon | Technical Session 5: High Power Testing Challenges Session Chair: Amy Leong (FormFactor Inc. – USA) | Costa de la Luna Ballroom |
10:00 – 10:30 a.m. | Maximizing CCC in a Probe Card and the March to an Unburnable Probe David Raschko and Hadi Najar (FormFactor – USA) | Costa de la Luna Ballroom |
10:30 – 11:00 a.m. | High Heat Dissipation: Facing New Challenges with High-Power Testing at the Wafer Level Lane Huston (Micron Technology, Inc. – USA) | Costa de la Luna Ballroom |
11:00 – 11:30 a.m. | Dynamic high wattage wafer test, a novel approach to keep DUT temperature constant Klemens Reitinger (ERS electronic GmbH – Germany) | Costa de la Luna Ballroom |
11:30 – Noon | High Voltage Probing goes Multi-Site Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Austria) | Costa de la Luna Ballroom |
Noon – 1:30 p.m. | Enjoy Lunch and Networking with Colleagues and Attendees! | Costa de la Luna Courtyard/Lawn |
1:30 – 3:00 p.m. | Technical Session 6: Probecard Mechanical Characteristics Session Chair: Connie Smith (Texas Instruments) | Costa de la Luna Ballroom |
1:30 – 2:00 p.m. | Considerations for Vertical High Probe Count Testing Keith Martin (FormFactor – USA) | Costa de la Luna Ballroom |
2:00 – 2:30 p.m. | Optimization of thermomechanical characteristics of a probe card ChoongSik Kim, Dong Il Kim, In Buhm Chung, and Daejyeong Lee, Dooyun Chung (AMST – South Korea) | Costa de la Luna Ballroom |
2:30 – 3:00 p.m. | Challenges and Improvement Actions for HPC Wafer Testing Kenny Tang and Oscar Lee (TSMC – Taiwan) | Costa de la Luna Ballroom |
3:00 – 5:00 p.m. | SWTest 2023 EXPO – Supplier and Sponsor EXPO with new Speakers’ Corner! | Costa Del Sol Ballroom |
3:30 – 5:00 p.m. | Speakers’ Corner – Chat with some of the Speakers from the Technical Sessions | Costa Del Sol Ballroom |
5:00 – 6:00 p.m. | SWT CREW Mixer | Costa Del Sol Side Lawn |
6:00 – 9:00 p.m. | SWTest 2023 Social Event | Costa de la Luna Lawn, Foyer & Ballroom |
9:00 p.m. – 10:00 p.m. | Sponsor Hospitality Suites and Events |
Poster Session
Session Chair: John Caldwell (MJC Electronics Corporation – USA)
- Reducing to thermal soak time of probe card with tunable power of heater in space transformer
Kwangjae OH, Kyoungtae MOON, Yong Ho CHO (PROTEC MEMS Technology – South Korea) - Micro-Textured Film Offers Promise in Universal Handling of Microelectronics
Raj VARMA (Delphon – USA) - Pushing Temperature Limits of High Voltage Wafer Test
Georg FRANZ (T.I.P.S. Messtechnik GmbH – Austria) - High speed probe card using flexible multilayer polyimide fabricated by 3D MEMS Process
Tae Kyun KIM, Yong Ho CHO (PROTEC MEMS Technology – South Korea), and Jong Gwan YOOK (Yonsei University – South Korea) - Importance of ceramic substrates with low thermal expansion coefficient in semiconductor wafer testing
Chiseung IN, Dae Hyeong LEE, Dooyun CHUNG, Junghwan CHO, Huntae KIM, Yujin CHOI, and Seungho HAN (SEMCNS – South Korea) - Simplifying the Process of Probe Card Design Through Software Automation
Adam SCHULTZ (Cohu – USA) - Full Wafer MSP Contact and the Challenges of Material Deflection
Gordon COWAN (Probe Test Solutions Ltd – UK) - Optimizing Probe Head Design Using a J-Tuned™ Process on Spring Probe Technology
Valts TREIBERGS and James HATTIS (Johnstech – USA)
Wednesday, June 7
Time | Event | Location |
---|---|---|
7:00 – 8:00 a.m. | Continental Breakfast | Costa de la Luna Courtyard/Lawn |
7:00 – 10:00 a.m. | Exhibitor Teardown | Costa Del Sol Ballroom |
8:00 – 9:30 a.m. | Technical Session 7: Probe Potpourri Session Chair: Jerry Broz, PhD (SWTest Conference Chair – USA) | Costa de la Luna Ballroom |
8:00 – 8:30 a.m. | Flying Probe Card Design for Medical and Other Challenging Applications Luca Fanelli (SPEA S.p.A. – Italy) | Costa de la Luna Ballroom |
8:30 – 9:00 a.m. | Automotive as a key driver for Test Demand Panchami Phadke (TechInsights Inc. – USA) | Costa de la Luna Ballroom |
9:00 – 9:30 a.m. | Bump test seminar and future ubump demand research Zach Hsieh (MPI Corporation – Taiwan) | Costa de la Luna Ballroom |
9:30 – 10:00 a.m. | Coffee Break | Costa de la Luna Foyer |
10:00 – 11:30 a.m. | Technical Session 8: Probecard Design Optimization Session Chair: Patrick Mui (JEM America) | Costa de la Luna Ballroom |
10:00 – 10:30 a.m. | Automated multi-temperature calibration routine for prober chucks on a 300mm production wafer prober Austin Ibele and Harald Ibele (Sigma Sensors (TCL) GmbH – Germany) | Costa de la Luna Ballroom |
10:30 – 11:00 a.m. | Burn-in test system controlled in real temperature Junas Na (SEMICS – South Korea) | Costa de la Luna Ballroom |
11:00 – 11:30 a.m. | Thermal challenges in fine pitch testing solutions Pang-Chi Huang, Paul Tai, and Kyle Daly (CHPT. Co., Ltd. – USA) | Costa de la Luna Ballroom |
11:30 a.m. – Noon | SWTest 2023 Awards and Adjournment See you June 3-5, 2024 at the Omni La Costa Resort! Travel Safe and Stay Healthy! | Costa de la Luna Ballroom |
Exhibitor Directory
EXPO Map

Exhibitors
*TCE* stands for Trivia Contest Exhibitor (visit EXPO Trivia Contest for more details)
ACCRETECH
Booth: #105 *TCE*
www.accretech.jp
Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

Advanced Probing Systems
The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, beryllium copper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material. Lower your overall cost of testing by using APS’s quality probe needles.
Ed Johnson
ejohnson@advancedprobing.com

Aehr Test Systems
Booth: #411 *TCE*
aehr.com
Aehr Test Systems is a worldwide supplier of burn-in test equipment and pioneer of Wafer Level Test & Burn-in (“WLTBI”) FOX platform Wafer level and singulated die/module stabilization and infant mortality test is being commercially adopted across multiple markets – Power devices (Gallium Nitride, Silicon Carbide) – Silicon Photonics (Gallium Arsenide, Indium Phosphide) – 2D/3D sensors (LEDs/VCSELs) – Discrete memories (DRAM, NAND) – MCUs/embedded memories FOX platform has been adopted and validated by industry-leading companies.
Tom Trexler
ttrexler@aehr.com
AEM
Booth: #604 *TCE*
aem.com.sg
AEM Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer level and other advanced packages.
Michael Siebert
michael.siebert@aem.com.sg
BUSCH Microsystems Consult GmbH
Booth: #102
www.busch-microsystems-consult.de
Positioning systems from Busch: Always unique. Product development, precision, durability – a promise is behind our products: To smartly solve tasks, accurately meet requirements and deliver durable quality. We design and manufacture XY, linear and lifting stages, gantry systems and XYZ axes according to the customer’s requirements. Get a quick overview here or specifically look for systems that match your demands.

Celadon Systems
Booth: #309 *TCE*
www.celadonsystems.com
Celadon Systems, a wholly-owned subsidiary of MPI, is a well-established 20-year-old US-based company known for providing “Peace of Mind” probing solutions to the semiconductor industry.
Celadon probe cards are known for thriving in temperature extremes while still delivering accurate and precise test results.
Expect millions of touchdowns with Celadon probe cards. Celadon delivers the lowest cost of test in the industry.
Celadon is an industry leader in parametric probe both in production and in the lab.
Garrett Tranquillo
garrett.tranquillo@celadonsystems.com

Chunghwa Precision Test Tech. Co., Ltd.
Booth: #302
www.cht-pt.com.tw
Chunghwa Precision Test Tech. Co., Ltd. (CHPT) was founded on Aug. 26, 2005. It was located in Pingzhen Industrial Park, Taoyuan City. CHPT was the high-speed PCB team in the Chunghwa Telecom Laboratories. We have been focusing on the interface board services required for testing in the semiconductor industry since 2001. Our primary products are Load Board for IC test, probe PCB for wafer test, substrate for vertical probe card and DUT board for memory test.
Paul Tai
paul_tai@chpt.com
Cohu, Inc.
Booth: #605
www.cohu.com
Cohu, Inc. (NASDAQ: Cohu) is a global leader in test and handling equipment, thermal subsystems, interface solutions, vision inspection and MEMS test solutions, and a leader in printed circuit board test. We deliver leading-edge solutions to enable a smarter, safer, and more connected future. Cohu offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop-shop for test and handling equipment, thermal subsystems, test contacting, vision inspection, and MEMS test solutions. Our enhanced product portfolio gives our customers the best possible combination of technologies to match their business and technical needs. Cohu has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods. Learn more: https://www.cohu.com/interface-solutions
Dan Campion
dan.campion@cohu.com
Complete Probe Solutions Inc.
Booth: #201
completeprobesolutions.com
Complete Probe Solutions is proud to announce the availability of the new APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems.
Kevin Chandler
kchandler@completeprobesolutions.com
Elevate Semiconductor
Booth: #603
elevatesemi.com
Elevate Semiconductor is the world’s leading manufacturer of IC’s for Semiconductor test.
Kurt Erikson
kerikson@elevatesemi.com

Entegris
Booth: #300
www.entegris.com
As a global company working with leading manufacturers to enable ongoing advancement in technology, Entegris has a global infrastructure that includes strategically placed manufacturing sites, R&D facilities, and customer support centers. We make infrastructure investments that put us closer to our customers in all global regions. Our highly skilled team members, facilities and resources are right where you need them to help you solve your most advanced technology challenges. Entegris is a leading supplier of highly engineered cleaning materials used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW). Our critical materials and turnkey products enable device manufactures and foundries to maximize uptime and throughput for substantial cost of test savings.
Sandrine Demal
sandrinedemal32@gmail.com

ERS electronic GmbH
Booth: #204 *TCE*
www.ers-gmbh.com
ERS electronic GmbH, based in Germering close to Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing. ERS also supplies the Advanced Packaging market with its fully automatic and manual debonding and warpage adjust tools used for Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies up to 650 x 650 mm format. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide.
Bernd Krafthöfer
krafthoefer@ers-gmbh.de
esmo USA
Booth: #608 *TCE*
www.esmo-group.com
Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan, we are truly global. We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.
Homan Amin
sales@esmo-usa.com

Feinmetall GmbH
Booth: #208
www.feinmetall.com
Since 1964 FEINMETALL GmbH is a leading company for spring contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments. It does not matter where in this world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe. Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards. Even for the most difficult contact-making tasks, highly specialized development and engineering teams we find the best possible solutions for our customers.
Helmut Seefeldt
helmut.seefeldt@feinmetall.de
Ferrotec
Booth: #402
www.ferrotec.com
Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.
John Wu
john.wu@ferrotec.com

FormFactor
Booth: #403 *TCE*
formfactor.com
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.
Cameron Harker
cameron.harker@formfactor.com

Heraeus Deutschland GmbH & Co. KG
Booth: #408 *TCE*
www.herae.us/probing
Heraeus Precious Metals is globally leading in the precious metals industry. For the use of probe cards and the wafer test industry, the product range comprises a variety of alloys for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and/or withstand corrosion effects strongly. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to recycling. It has extensive expertise in all platinum group metals as well as gold and silver. By 2025 Heraeus Precious Metals will be the first company in the industry that operates carbon neutral.
Nail Akrouti
nail.akrouti@heraeus.com
Instec, Inc.
Booth: #311
instec.com
Instec manufactures precision temperature-controlled scientific instruments for optical measurements. Applications include electrical probing, biological research, material science, and more. Instec offers many standard products for use with all optical systems and offers customization to match any instrument or specifications.
Alec Laws
sales@instec.com
Integrated Technology Corporation
Booth: #104 *TCE*
www.inttechcorp.com
Manufacturer of probe card analyzers and power semiconductor dynamic test systems.
Mark McLaren
markm@inttechcorp.com
Integrated Test Corporation
Booth: #200 *TCE*
integratedtest.com
PCB Design, Simulation, Fabrication, assembly and test hardware solutions in Dallas, TX. Certified WBE and WOSB
Dana Freeman
dfreeman@integratedtest.com

inTEST EMS
Booth: #206 *TCE*
www.intest-ems.com
inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.
William Ira Wyckoff
b.wyckoff@intest-ems.com

IWIN Co., Ltd.
Booth: #505
www.iwinsn.com
IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price
AJ Park
aj@iwinsn.com

JEM
Booth: #203 *TCE*
jem-net.co.jp
JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC, Flip-chip, WLCSP), image sensors and parametric test application. As semiconductor factories have expanded globally, JEM organizes a global manufacturing network in Japan, Asia, USA, and Europe to support customers’ needs in each region. JEM expands sales by creating JEM technology roadmap and sales strategies based on demands from global customers and technology roadmap of the semiconductor industry. With our global strategies and proactive development actions, JEM is striving to provide probe cards that exceed the demands of our customers. Our comprehensive probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. In addition, we offer custom design and fabrication services for printed circuit boards and space transformers.
Karen Wong
sales@jemam.com

Johnstech International
Booth: #305
www.johnstech.com
JOHNSTECH INTERNATIONAL is a global R&D leader in the field of microcircuit testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works together with the world’s most respected OSATs, foundries, and EDA companies to develop the most precise and dependable test contactors and test sockets on the marketplace today. For more info, visit www.johnstech.com.
Kaitlin Betlach
kbetlach@johnstech.com
Kyocera International, Inc.
Booth: #113
global.kyocera.com
Kyocera, the world leader of fine ceramics, offers a wide selection of ceramic multilayer packages and substrates for space transformer, automotive, consumer device, infrastructure, industrial, testing, medical, etc.
Sho Hokonohara
sho.hokonohara@kyocera.com
LASEA Inc.
Booth: #101
www.lasea.com
Founded in 1999, LASEA designs and manufactures workstations and special machines for applications in marking, engraving, cutting, drilling, texturing, thin film removal, welding and micromachining. With 180 employees over 6 global sites, LASEA has installed more than 1500 machines in 30 countries across 5 continents. As a pioneer in the use of femtosecond lasers since 2003, LASEA continually invests in order to stay at the forefront of innovation. With a strong team of experts in optics, mechanical engineering and automation, LASEA develops new technologies and processes for the most complex and demanding applications in the Electronics Test industry.
Robert Braunschweig
rbraunschweig@lasea.com

Laser Job Inc.
Booth: #500 *TCE*
www.laserjob.co.jp
We are providing Laser Drilling services to Probe Card Manufacturers.
Yoshitaka Yamaguchi
y-yamaguchi@laserjob.co.jp
LST America Inc.
Booth: #610
www.lst-tek.co.kr
LST has been providing test solutions since 2008 in South Korea. Our expertise is in the test socket, interposer, probe pin, test board, SMT, and assembly. Customized solutions are also welcome to be discussed. Short lead times, reasonable pricing, and highly reliable quality are the factors of LST.
Andy Lee
andy@lst-tek.co.kr
LUKEN Technologies
Booth: #112 *TCE*
www.luken.co.kr
M-POGO Pin – Silicon socket has excellent precision by MEMS processing and is easy to implement fine spacing. – Customize the socket probe according to the customer’s specifications.
Da Yeong An
dyan@luken.co.kr

Megatouch Co. Ltd
Booth: #312
www.megatouch.co.kr
Megatouch has own contact technology and supply high quality pin of Semiconductor, Interposer and Battery to everywhere. New concept Interposer and electroformed body to achieve the industry leader. Our goal is providing excellent quality product to global.
Alex Lee
alex@megatouch.co.kr

MJC
Booth: #510 *TCE*
www.mjc.co.jp
MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.
John Caldwell
johnc@mjcelectronics.com

MPI Corporation
Booth: #307 *TCE*
mpi-corporation.com
MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI is dedicated to producing a state-of-the-art probing tool that enhances the speed of worldwide semiconductor technology migration.
Cahris Lin
cahris.lin@mpi-corporation.com

Nidec SV Probe
Booth: #400 *TCE*
www.nidecsvprobe.com
Nidec SV Probe is a global provider of high-quality semiconductor testing solutions. Our extensive product line includes the innovative MEMS Probes and MEMS-based probe cards along with a variety of Vertical and Cantilever Probe Card technologies. Our proprietary MEMSFlex™ Probes are fully customizable, capable of both wafer/final test, and can be utilized for many advanced devices including RF, 5G, Mobile, Auto & IoT. We also have analytical and simulation capabilities along with full turnkey services for probe cards and final test. Our unmatched worldwide infrastructure provides coverage for major semiconductor regions around the world with full design & manufacturing capabilities for our probe technologies in USA, China, Japan, Korea, Taiwan & Singapore. Contact us at sales@nidecsvprobe.com to learn more!
Gary Luu
sales@nidecsvprobe.com

NTK Technologies, Inc.
Booth: #202
www.ntktech.com
At NTK Technologies, we build robust packages for complex applications. However, our innovation helps to advance many of the technologies and products that improve people’s lives. Computers, optical communication, wireless networks, medical devices, automotive, space and aeronautics — many of the applications in these markets would not be possible without the technology that NTK provides. Whether it’s IC packaging, peizoelectronics, ceramic filters, fine ceramics, or ceramic cutting tools, NTK is there providing these vital components that make it possible for the technologies that we use every day to exist.
Otto Liang
oliang@ntktech.com

Oxford Lasers
Booth: #404 *TCE*
www.oxfordlasers.com
Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.
Alan Ferguson
Alan.Ferguson@oxfordlasers.com

Point Engineering
Booth: #511
www.pointeng.co.kr
Point Engineering is a leading manufacturer of customized high-end MEMS pins.
Point’s proprietary MEMS technology takes advantages of ceramic (Al2O3) wafer by using it as a mold for electroplating process.
Applying of this unique membrane with high aspect ratio(1:30) enables exact patterning and more precise features to be produced upon customer’s requirements.
Our product portfolio includes various type of MEMS pins (cantilever, buckling, spring, POGO, socket pin) and guide-plate development & processing service.
We provide innovative options for our customers to meet their technical needs along with design & simulation capabilities and cutting-edge MEMS manufacturing system.

Posalux SA
Booth: #211 *TCE*
posalux.com
Experiencing challenges to process small holes and tiny probes? As a machine tool manufacturer, Posalux offers reliable µ-machining solutions for mass production environments. To best answer your requirements of small holes with tight pitch as well as wafer and wire probes, we develop new ways to produce and manufacture parts. With our FEMTO-LASER μ-machining equipment, you will be able to perform various processes like drilling, cutting, and turning in almost all materials.
Valentin Beuchat
vbeuchat@posalux.com
Pozzetta
Booth: #602 *TCE*
pozzetta.com
Pozzetta Products designs and manufactures solutions for the packaging, storage, and transportation of critical devices, including probe cards, probe heads, wafers, photomasks, and filters.
Collin Sloan
collin.sloan@pozzetta.com
Prober.com
Booth: #501
www.prober.com
Prober.com is one of the longest running companies dedicated to refurbishment and resale of wafer prober lines. We offer complete sourcing and parts support for our customers. We pride ourselves in the satisfaction of our customers and we partner with them to provide solutions to capacity needs in a timely manner. We work with our customers to plan for large and small capacity increases as well as integrating thermal and OCR solutions for their changing test requirements.
Dennis Bonciolini
dennis@prober.com

PTSL
Booth: #406 *TCE*
probetestsolutions.com
PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.
David Glatley
dglatley@probetestsolutions.com
Qualmax Inc.
Booth: #110 *TCE*
www.qualmax.com
Semiconductor probe and probe head manufacturer.
Behrouz Sadrabadi
bsadrabadi@qualmax.com

R&D Altanova, Advantest Group
Booth: #410
www.advantest.com
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.
Junko Nakaya
junko.nakaya@advantest.com
Reid-Ashman Manufacturing
Booth: #213
reidashman.com
Reid-Ashman Manufacturing Incorporated is a fully integrated engineering, manufacturing, and service company specializing in providing solutions for the semiconductor test industry. Established in “The Silicon Valley”, California in 1978; we are now headquartered in Saint George, Utah with sales and service personnel located around the world. Although we provide world-class engineering and manufacturing services for virtually any industry, we are primarily known for inventing the test head manipulator. It is our goal to continually lead through innovation, quality, and dedication to our customers and their evolving needs. Reid-Ashman is a vertically integrated organization, maintaining control of the entire manufacturing process. All production, engineering, QA, machine-shop, crating, paint-shop, shipping & receiving, and main-office functions are located in three buildings on the 5 acre Reid-Ashman site in St. George, Utah.
Martin Kurtz
mkurtz@reidashman.com

Riff Company Inc.
Booth: #111
www.riff-co.com
Machine shop specializing in ceramic drilling and machining
Daniel McCormick
dan@riff-co.com
Rika Denshi America Inc.
Booth: #109
rikadenshi.com
Rika Denshi offers a broad array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing.
Pete Blitchington
pete.blitchington@us.rikadenshi.com

SEMICS Inc.
Booth: #507 *TCE*
www.semics.com
The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.” SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns. SEMICS has always brought ‘trust’ to our partners. Offering “trust“ is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far. SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.
Sigma Sensors (TCL) GmbH
Booth: #311
sigma-sensors.com
Sigma Sensors is the first and only dedicated ISO17025:2017 accredited Temperature Calibration Laboratory with a focus on temperature wafer manufacture and calibration. Sigma Sensors provides accredited and non-accredited traceable thermal calibrations for chucks, calibration wafers, ovens, freezers, fluid baths and any other thermal requirements from -80C to +425C. Sigma Sensors is a registered vendor to 40% of the top 10 Semiconductor IDMS globally providing on site calibrations and calibration systems. Sigma Sensors (TCL) GmbH, a subsidiary of TekSense Holding LLC Operational HQ Sigmaringen Germany with representation in the US and South East Asia.
Harald Ibele
harald.ibele@sigma-sensors.com

Smiths Interconnect
Booth: #512 *TCE*
www.smithsinterconnect.com
Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.
Peter Ursu
peter.ursu@smithsinterconnect.com
SPEA S.p.A.
Booth: #301 *TCE*
www.spea.com
Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.
Sara Monfreda
sara.monfreda@spea.com

STAr Technologies, Inc.
Booth: #606 *TCE*
www.star-quest.com
STAr’s MEMS probe cards enables WAT tests for femto-ampere low-leakage current tests and 35um-pitch requirements. STAr further enables SoC ICs tests with MEMS vertical probe cards down to 45um pitch and >2A driving current. Our one-touch 3D MEMS micro-cantilever probe cards can significantly lower Cost-of-Test for Flash memory ICs by enabling tri-temperature tests with just one probe card. In addition, STAr supplies MEMS probe cards to CMOS image sensor (CIS) customers with C-PHY tests at >3.5GSPS and with next generation 6GSPS in development.

Synergie Cad Group
Booth: #212 *TCE*
www.synergie-cad.com
YOUR PARTNER FOR ALL TEST SOLUTIONS We are the preferred partner of large and small semiconductor industry players since 1986. With over 30 years of experience, our high-performance solutions maximize yield improvements while ensuring the most competitive cost of test over our product lifetime.
Malcolm Owens
malcolm.owens@synergie-cad.us

Technoprobe America Inc
Booth: #310 *TCE*
technoprobe.com
Technoprobe is a leading provider of the most advanced wafer test solutions for the semiconductor industry. Headquartered in Cernusco Lombardone (LC), in Italy, Technoprobe has 14 offices worldwide, in Europe, Asia and the United States. The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio, ranging from Cantilever , 2D-3D MEMS Vertical and Spring pin technology, motherboards, final test boards, advanced micromachining, AI, and advanced manufacturing capable of meeting complex requirements and reducing the overall cost of test.
Marita F. Villarreal
marita.villarreal@technoprobe.com

TEL
Booth: #210 *TCE*
www.tel.com
As a leading global company of innovative semiconductor and flat panel display (FPD) production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.
Doug Heins
doug.heins@us.tel.com

Teradyne
Booth: #502
teradyne.com
Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers and interface hardware make sure that new products work right the first time, every time. Our portfolio of industrial automation solutions helps manufacturers to develop and deliver new products quickly, efficiently and cost-effectively.
Eric Shoemaker
eric.shoemaker@teradyne.com
Test Tooling Solutions Group
Booth: #600
tts-grp.com
Being in the business since 1979, TTS Group dedicates itself to bring the best possible solutions to help our customers solve some of the most challenging issues in semiconductor test and tooling today. Right from R&D to design to simulation to validation, we focus on lowering the total cost of final test through relentless pursuit of innovation, yield, quality, reliability and on-time delivery for our customers. Our solutions range from probe heads, probe pins, and test contactors.
Mehdi Attaran
mehdiattaran@tts-grp.com
TFE inc.
Booth: #303 *TCE*
tfe.co.kr
TFE was established in 2003 as the manufacturer of semiconductor IC testing equipment. As a global enterprise opening a positive and progressive future, we take creative and innovative management and realization of human values as our top priority. Based on long investments and advanced manpower, we have prepared total solution in semiconductor IC testing through continued R&D. With advanced technology, we have accomplished solid, steady growth. TFE aims at creating Customer Benefit throughout maximizing the mutual synergy of all Final Test hardware including Handler Change Kit, Test Socket, Device Interface Boards & Burn In Test Board. TFE is expert and No. 1 supplier for Memory, Non-Memory Pick & Place handler Change Kits & Test board in Korea. Not only Fast delivery, Reasonable prices and Reliable Quality, ‘TFE provides our own unique idea to improve Test environments.(Higher Yield, Less Jam rate & damage on devices)’.
Fred Megna
Fred@tfe.co.kr

T.I.P.S. Messtechnik GmbH
Booth: #611 *TCE*
www.tips.co.at
Probe Cards for High Power, Magnetic, Pressure, Radiation Sensors, Mixed Signal Devices, Automotive RADAR Power KGD – Contact Units TIPS Probe Refresher
Rainer Gaggl
office@tips.co.at

Translarity
Booth: #503 *TCE*
translarity.com
Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.
Greg Hunt
greg.hunt@translarity.com

TSE
Booth: #509
www.tse21.com
As a Technology and Science Enabler in the field of Semiconductor Test and Display Test, TSE has eveloped the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994, it has engaged as a leader in interface systems for Semiconductor Test. Main Products: Probe Card, Interface Board, Load Board, STO-ML(STF)
Shin-Je Woo
jmlee@tse21.com
Turbodynamics
Booth: #103 *TCE*
www.turbodynamics.com
At Turbodynamics, we view ourselves as a service provider for cutting-edge technology in the semiconductor industry. We provide our customers with solutions for their automatic test equipment that are individually tailored to their needs. And we develop innovative solutions on our own initiative. Our first product, the compact locking element P-DockⓇ, is now successfully in use worldwide and forms the benchmark in semiconductor test. The success story of P-DockⓇ we repeat according to the same principles: listen to our customers, develop solutions and deliver reliably.
Benedikt Pongratz
benedikt.pongratz@turbodynamics.com
Vermont Microtechnologies
Booth: #107
vermontmicrodrilling.com
Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.
Caleb Harwood
caleb@vtmicro.com
WILL Instrument
Booth: #613
www.willinstrument.com
Will Instrument is providing the equipment for vertical probe card manufacturing. In SWTest 2023 exhibition, we’d like to introduce our brand new equipment, Automated Vertical Probe Pin Insert System. We’re looking forward to meet you in our booth, and hope you experience the latest technology that we’re offering!
Harry An
ahs@willinstrument.com
WinWay Technology
Booth: #413
www.winwayglobal.com
WinWay Technology Co., Ltd. designs, manufactures, processes, and sells optoelectronic product test fixtures, integrated circuit test interfaces, and fixtures and their components in Taiwan, the United States, China, Europe, Canada, and Asia. Its products include coaxial, spring probe, and PoP sockets; elastomers; vertical and WLCSP probe cards; and thermal control systems, high performance heat sink lids, high performance test sockets, changeover kits, direct docking probe cards, burn-in sockets, and contact element products. The company also engages in the provision of professional and technical support services; and import and export trade of related products. It serves semiconductor, optical, information technology, and optoelectronics industries.
Irene Li
irene.li@winwayglobal.com

Yokowo America Corporation
Booth: #401
yokowotestsocket.com
As a fine connector specialist, backed by mold tooling, micro precision machining, microwave and MEMS technologies and capabilities, Yokowo develops and supplies wide variety of wafer sort testing and final test solution to memory, RF, Logic, Sensor and analog Semi-conductor companies.
Naoto Hasaka
n-hasaka@jp.yokowo.com
*TCE* stands for Trivia Contest Exhibitor (visit EXPO Trivia Contest for more details)
2023 Floorplan

SWTest 2024

See You Next Year at SWTest 2024
June 3 – 5, 2024
at the Omni La Costa Resort!
Travel safe and stay healthy!
SWTest Asia 2023
