Program for SWTest 2021

Times in PDT | Tentative, subject to change | last revised: 8/29/2021

Monday, August 30, 2021
7:00 – 8:00 Continental Breakfast
7:00 – 12:30 Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2021
Jerry Broz, PhD, SWTest General Chair, International Test Solutions
8:30 – 9:30 KEYNOTE Rapid growth of 5G/mm-wave beyond Phone into Auto, IOT, Laptops, etc., and the pressure it puts on test, probe, and hardware demands.
William Miller
Vice President of Engineering
Qualcomm Technologies, Inc.
Abstract

During his presentation, Mr. Miller will focus on four key areas.  (1) How the introduction of Qualcomm Technologies, Inc. (QTI), and 5G/mm wave will affect overall business growth beyond Phone into Auto, IOT, Laptops, etc.; (2) Challenges to the industry caused by the slowing of technology and the increasing complexity of our processors and RF products.  Discuss the key statics on die complexity, die size, bump counts, etc.  Review the market demand for vertical ramps and the pressure it puts on the end-to-end suppliers and QTI; (3) Big data, diagnostics, and QTI’s need for machine learning for faster yield learning and for improving quality demanded by the market. (4) Cost of Test, probe, other associated hardware requirements and issues.

Biography

Mr. William Miller is Vice President of Engineering with responsibility for RF, PMIC, and RFFE product testing and characterization as well as Yield and Diagnostic analysis of all Qualcomm’s products. Additionally, William’s team has responsibility for leading-edge technology IP test chip characterization as well as all failure analysis and circuit edit for Qualcomm’s products. William also works with Qualcomm’s Foundries and OSATs to drive process and device improvements to meet Qualcomm’s product requirements. William has over 40 years in the semiconductor industry with experience in all aspects of semiconductor manufacturing and development. Prior to moving to Qualcomm, William was Director of Outsource Engineering and Product and Test Engineering at IBM Microelectronics Division with broad responsibility for managing multiple new products and technologies at the IBM 300mm Fabricator as well at IBM’s partner fabricators. William is also an author of multiple published articles and professional society presentations, patent holder, and former conference chairman of the Advanced Semiconductor Manufacturing Conference and former chairman of the Industrial Advisory Board for the Center for Micro Contamination Control at U of Arizona, RPI, and Northeastern University.

10:00 – Noon SESSION 1: Enabling 5G Test Strategies
Session Chair
: Darren James (Onto Innovation)
10:00 – 10:30 The Digital Revolution: NRZ to PAM4
David Raschko (FormFactor – USA)
10:30 – 11:00 An Advanced Contact Solution Probe Card for RF & 5G using MEMS Coaxial Technology
Tae Kyun Kim (Microfriend – Korea)

Taekyun Kim received the M.S. degrees in mechanical engineering from Yonsei University, Seoul, Korea, in 2005, and he has been a Ph.D candidate in electrical engineering from Yonsei University since 2013. In 2005, he joined Microfriend, Inc., Seoul, Korea, where he manage research and development team. His research interests include circuit design and simulation for signal integrity, power integrity on probe card.

Svetlana Garcia, PhD (Nidec SV TCL USA)

Svetlana C. Sejas-García received the Ph.D. degree in electronics from INAOE, Cholula, Mexico, in 2014. She was an Intern with Intel, Guadalajara, Mexico, in 2008. Since 2014, she has been with the Isola Group, Chandler, AZ, USA, where she was involved in the electrical characterization and modeling of ultralow-loss PCB laminates for high-frequency applications. Now she is a member of Nidec SV TCL, US.

Jong Gwan Yook (Yonsei Univ. – Korea) and Yong Ho Cho (Microfriend – Korea)
11:00 – 11:30 55GHz Octal-site Wafer Test Probecard for 5G mmWave devices
Jason Mroczkowski (COHU – USA)
11:30 – Noon Millimeter-Wave Signal Integrity in a Dense Device-Interface-Board (DIB) Environment
Andrew Westwood (Teradyne, Inc. – USA)

Andrew Westwood is currently serving as the Millimeter-Wave Applications Specialist for Teradyne, Inc in Boston, MA.

As Mobile Communications moves up into 5G/FR2 (including Satcom), I am developing new ATE Hardware and Calibration/Test methods.

Prior to that I served for 16 years at HP/Agilent/Keysight as a Master Applications Engineer working on T&M for HS-Digital, Millimeter-Wave RF, Signal Integrity, Materials Science and Optical/Microwave Components.

Prior to joining HP, I served at Hughes Network Systems and Filtronic-Comtek Corp, working on the development of Satcom Microwave, Basestation/eNB microwave equipment and Ku-band Direct-TV systems.

Noon SWTest Conference Adjournment for Day 1
Enjoy Lunch on your own!
12:30 –  22:00 Bill Mann Memorial Benefit Golf Tournament
SWTest 2021 – Supplier and Sponsor EXPO
12:30 – 16:30 Bill Mann Memorial Benefit Golf Tournament
Enjoy the Best Ball Scramble and Help Support Student Travel
14:00 – 17:00 Registration
17:00 – 20:00 SWTest EXPO OPEN w/ Dinner Served at RECEPTION STATIONS
Meet, Greet, and Reconnect with Colleagues
20:00 – 22:00 Sponsor Hospitality Suites
Tuesday, August 31, 2021
7:00 – 8:00 Continental Breakfast
7:00 – Noon Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2021
Jerry Broz, PhD, SWTest General Chair, International Test Solutions

Introduction to the SWT Crew Initiative
Karen Armendariz (Celadon Systems), Amy Leong (FormFactor) and Suz Ramsbottom (Texas Instruments)
8:30 – 9:30 KEYNOTE The Growing Challenge of Testing Automotive Analog and Sensor Systems.
Hans Stork, PhD
Senior Vice President and CTO
ON Semiconductor
Abstract

Automotive systems are facing an accelerated introduction of electronic components, driven by megatrends such as electrification and autonomous driving. This leads to an explosion of ever more complex sensors generating an abundance of data/sec that need to be processed real-time to drive a wide variety of electronic and mechanical systems in the car. Furthermore, those systems need to function in hostile environments (e.g., high electromagnetic fields, high temperatures, etc.) while quality needs to be guaranteed at the ppb level and cost is a constant challenge.  As a result, testing of such electronic components becomes significantly more complex both in the amount and variety of functions to be tested: testing speed, signal integrity and accuracy, test coverage, and cost.

Biography

Dr. Hans Stork is Senior Vice President and Chief Technology Officer (CTO) at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, design libraries, as well as packaging technologies and assembly support.  Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and CTO of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the CTO of Texas Instruments. Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.  Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC and has served on the boards of Sematech and the SRC.  He is a longstanding member of the SIA Technology Strategy Committee.  He authored more than 100 cited papers and holds 11 U.S. patents.  He was elected IEEE Fellow in 1994, and served on several IEEE conference program committees, and is currently vice-chair of the Technical Field Awards Council and a member of the Awards Policy and Portfolio Review Committee.  Dr. Stork was born in Soest, The Netherlands, and received the Ingenieur degree in electrical engineering from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.

10:00 – Noon SESSION 2: Advanced Technologies
Session Chair: Karen Armendariz (Celadon Systems – USA)
10:00 – 10:30 Exploring Parametric and Test Structure Challenges
Mike Palumbo (Technoprobe – USA)

Career: IBM Corporation – 14 years split between East Fishkill, NY (2 years) and Manassas, VA (12 years). Parametric test engineer of wafer level and packaged parts for radiation hardened space products.
Intel Corporation – 22 years in Hillsboro, OR. Primarily (18 years) as parametric wafer level test engineer for silicon process development group. Later (last 4 years) as commodity development engineer of full die wafer level probe cards.

Education: BSEE from George Mason University in Fairfax, VA

10:30 – 11:00 Evaluation of a MEMS Probing Solution for Scrub Mark Visibility on Automotive Devices with Nickel Palladium pads
Karan Maniar (Nidec SV TCL – USA)

I am a Senior Product and Process Engineer with Nidec SV TCL in San Jose, California. I am responsible for working with the Nidec SV TCL Engineering Team on various product development and capability enhancement projects. I have experience with a several design and simulation software platforms and analytical equipment. I am a graduate of Mumbai University, India and Arizona State University holding both a Bachelor of Science and a Master’s Degree in Mechanical Engineering.

Kyle Cotner (Nidec SV TCL – USA)
Erwin Verardi (STMicroelectronics – Italy)

Erwin is currently a Process Engineer in EWS at STMicroelectronics and has been with them for the last 9 years. He has a degree in Material Science from Milan University where he focused on Silica Aerogel and Hydrogel synthesis. As a visiting student to the US, he studied electrochemistry specifically on Ni H2 Evolution and TiO2. In 2020, he earned a SixSigma Black Belt degree. His favorite hobby is b&w photography. Erwin and his wife and two kids live in Milan.

Mattia De Nicola (STMicroelectronics – Italy)
11:00 – 11:30 Towerless vs Towered Probe Solutions; What is the most effective application for my wafer test interface?
William Wyckoff (inTEST EMS – USA)

Bill graduated from the University of Vermont with a BSEE and MSEE. He spent 18 years with IBM in Burlington Vermont responsible for DRAM and SRAM probe and final test hardware and applications. Bill joined Teradyne in 2000 with roles as the Factory Apps Manager, West Coast Applications Manager and Interface Test Hardware Marketing Manager. Bill joined inTEST EMS in 2019 as the Division Marketing Manager

Wally Haley (Qualcomm – USA)

Wally Joined Qualcomm as a technician in 1996, then Spent a few years at Ericsson as an associate engineer before moving to Northrop/Grumman as a EE. He returned to Qualcomm in 2005 where he has been designing probe HW ever since.

11:30 – Noon Production Parametric Probe – An Essential Guide to Lowering Cost of Test While Probing Very Small Pads
Riley Kaiser (Celadon Systems – USA)

Riley Kaiser is a Technical Sales and Field Applications Engineer at Celadon Systems, where he first spent two years as a mechanical engineer in the R&D department before joining the sales team. His educational background is in mechanical engineering and applied mathematics, and he has professional experience in product development, R&D, and technical sales.


Karen Armendariz (Celadon Systems – USA)
Jungtae Hwang (Global Foundries – USA)

Jungtae Hwang is a test engineer in Globalfoundries over 4 years in massive wafer manufacturing environment and has multiple years of experiences for manufacturing, qualifying and troubleshooting of various probe card applications. Also, specialized in advanced operation and troubleshooting for the probe card analyzers.

Noon SWTest Conference Adjournment for Day 2
Enjoy Lunch on your own!
14:30 – 16:30 Registration
15:00 –  22:00 SWTest 2021 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
15:00 – 16:30 SWTest EXPO OPEN w/ Refreshments
Meet, Greet, and Reconnect with Colleagues
16:30 – 17:30 SWT Crew Social Hour
Learn about the SWT Crew Initiative
17:30 – 21:00 Cocktails, Dinner, and SWTest Social Event
Communicate, Collaborate and Celebrate!
21:00 – 22:00 Sponsor Hospitality Suites
Wednesday, September 1, 2021
7:00 – 8:00 Continental Breakfast
7:30 – 10:00 Registration
8:00 – 9:30 SESSION 3: Large Array Probing
Session Chair: Mark Ojeda (Infineon – USA)
8:00 – 8:30 Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probecards
Cameron Harker (FormFactor – USA)

Cameron Harker joined FormFactor in Dec. 2007 and is serving as Sr. Director of Marketing for the Probes business unit. Cameron has over 30 years of engineering, sales and marketing leadership experience. He has held several customer facing roles including leading global account teams as well as service in product and technical marketing leadership positions. Prior to joining FormFactor, Cameron held various positions at Asyst Technologies, KLA-Tencor and On-Semi. Cameron holds a B.S in Physics from the University of Utah.

Yohannes Desta, and Pouya Dastmalchi (FormFactor – USA)
8:30 – 9:00 Determine Thermal Expansion/Shrinkage Matching Between Wafer and Probe Card
Woo Young Han (Onto Innovation – USA)

Received Electrical Engineering degree from University of Toronto. Has been working in wafer inspection and metrology for over 20 years. Currently working as Product Marketing manager at Onto Innovation.

9:00 – 9:30 Probe to pad alignment improvement over wide temperature range for automotive applications with large probe array size, high parallelism and small pads size
Raffaele Vallauri, Tommaso Masi, and Alessandro Cito (Technoprobe – Italy)
Emanuele Bertarelli, PhD (Technoprobe – Italy)

Emanuele Bertarelli, Ph.D. is R&D Manager, working in the R&D and Process Engineering Team in Technoprobe Italy headquarter since 2011. He is currently heading the probe R&D team and he is responsible for Technoprobe R&D Laboratories.

Prior to joining Technoprobe, Emanuele Bertarelli was Doctoral and Post-Doctoral Researcher at the Technical University of Milano, Italy, and at the University of Freiburg, Germany. He published more than 20 international scientific papers and issued 4 international patents during regarding academic and industrial research and development activities.

Mattia De Nicola (STMicroelectronics – Italy)
Sebastien Usai (STMicroelectronics – France)

Sébastien USAI is Senior Process Technician in STMicroelectronics. He is responsible of Probecards for the EWS Rousset, France. Additionally Sébastien has mission to support Production and Engineering teams. With over 20 years in the semiconductor industry, he is well versed in all aspects of Probecards manufacturing, development and use. Prior to move to STMicroelectronics three years ago, Sébastien worked respectively for Cerprobe, Kulicke & Soffa and Synergie Cad Probe occupying different positions from Probecards wiring Operator to Application Engineer through CAM Design, R&D and team management. He also travelled a lot abroad to support customers and colleagues in Europe, Asia and America. His career is the fruit of a passion for the world of industry and probing.

Erziz Salam and Diperi Robert (STMicroelectronics – France)
9:30 – 10:00 Coffee Break
10:00 – 12:30 SESSION 4: Large Array Probing
Session Chair Patrick Mui (JEM America)
10:00 – 10:30 Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3GHz/6Gbps
Alan Liao (FormFactor – Livermore, USA)

Alan Liao has been with FormFactor since August 2008. Alan was electrical design engineer in FormFactor designed first 300mm full wafer contact probe card for SmartPhone DRAM wafer sort testing. Alan also participate as electrical R&D engineer to continuously improve and develop Probe Card technology meets advance memory testing requirement. In 2012, Alan moved to customer design engineer position to be the technical interface with key north America DRAM customer. During 2014, Alan joined in product marketing as SoC product manager and oversees whole Asia Region.

Mr. Liao holds an M.S. in Analog Circuit Design and Analysis from Silicon Valley University (SJSU) and a B.S. in Electrical Engineering from the University of California, Los Angeles (UCLA).

10:30 – 11:00 Next Generation SmartMatrix Probe Card Technology Enables 3000-Parallelism 1TD Test for 1Z DRAM Process Node
Joe Ceremuga (FormFactor – USA)

MSME Mechanical Engineer with 20 years of experience in MEMs Systems and the Metrology field; of which, 10 years of experience in probe card development at FormFactor. Past employers include Sandia National Laboratories and Carl Zeiss X-ray Microscopy. Currently holds the position of Director of Product Engineering for DRAM and Flash memory probecards. Enjoys fishing, hunting, golf, and anything that involves a grill or bbq

Cameron Harker (FormFactor – USA)

Cameron Harker joined FormFactor in Dec. 2007 and is serving as Sr. Director of Marketing for the Probes business unit. Cameron has over 30 years of engineering, sales and marketing leadership experience. He has held several customer facing roles including leading global account teams as well as service in product and technical marketing leadership positions. Prior to joining FormFactor, Cameron held various positions at Asyst Technologies, KLA-Tencor and On-Semi. Cameron holds a B.S in Physics from the University of Utah.

11:00 – 11:30 A Vertical Probe Solution for the High-Density 5G Market
Don Thompson (R&D Altanova – USA)

Don Thompson is the director of engineering at R&D Altanova. Don started his career at Teradyne, working there for 11 years designing high speed instrument interfaces and has now spent nearly 20 years as a signal integrity expert in the ATE industry. He leads a team of more than 100 engineers designing and building the most challenging ATE interfaces for industry leading customers around the world.

Svetlana Garcia, PhD (Nidec SV TCL USA)

Svetlana C. Sejas-García received the Ph.D. degree in electronics from INAOE, Cholula, Mexico, in 2014. She was an Intern with Intel, Guadalajara, Mexico, in 2008. Since 2014, she has been with the Isola Group, Chandler, AZ, USA, where she was involved in the electrical characterization and modeling of ultralow-loss PCB laminates for high-frequency applications. Now she is a member of Nidec SV TCL, US.

11:30 – Noon Evaluating the High Temperature Creep Performance of MEMS Vertical Technology Probes
Dominik Schmidt (Translarity – USA)

Bios: Dr. Schmidt is President at Translarity Corp and he oversees other technology investments at QVT Financial. Prior to joining QVT in May 2013, Dr. Schmidt was employed by Intel Corporation as Senior Director of Wireless Engineering from 2004 to 2010 and as Chief Technology Officer in the Intel Foundry from 2010 to 2013. Between 2000 and 2004, Dr. Schmidt co-founded and was the Chief Executive Officer of Airify Communications Corporation, a wireless multi-protocol semiconductor company, which was sold to Intel in August 2004. Prior to that he also co-founded Pixel Devices International, a CMOS imaging company, in 1997, which was sold to Agilent in 2002. He has taught at U.C. Berkeley, Tsinghua University in Beijing and the International Technological University and written more than 70 technical papers and has over 90 patents granted or pending. Dr. Schmidt earned a B.S. in Electrical Engineering/Materials Science from U.C., Berkeley, an M.S. in Electrical Engineering, an M.S. Management and a Ph.D., Electrical Engineering in 2003 all from Stanford University.

Raul Molina, Rambod Tabasi (Translarity – USA)
12:00 – 12:30 SWTest 2021 Awards and Adjournment

See you in 2022!
Travel Safe and Keep Healthy.

SWTest 2021 ON-Demand
Sept. 2 – Oct. 2, 2021
3D magnetic sensor stimulation – new solutions for wafer probing
Georg Franz (T.I.P.S. Messtechnik GmbH – Austria)

since 2012 T.I.P.S. Messtechnik GmbH, CTO, R&D product and process development, FEM analysis. Test interfaces for automotive, power semiconductors, sensor, and MEMS devices. 2002-2010 Carinthian Tech Research AG R&D engineer for MEMS sensors, wafer handling equipment, micromanufacturing machines. Equipment development and FEM analysis. master’s degree in mechanical engineering, Technical University Vienna, Austria. 52 years old, married, 2 children.

Sebastian Salbrechter (T.I.P.S. Messtechnik GmbH – Austria)

since 2017 T.I.P.S. Messtechnik GmbH, R&D: product and test bench development, Test interfaces for automotive sensor devices
2014-2017 LEC Large Engine Competence Center, Graz/Austria, Team leader “Sensor developement and test rigs”
2014 PhD in Mechanical Engineering at Graz University of Thechnology, Institute of Internal Combustion Engines and Thermodynamics, Titel: “Simlulation of thermal behavior during engine warm-up”
39 years old, married, 1 daughter

Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Austria)
Solutions to New Challenges in Advanced Vertical Guide Plates
Alan Ferguson, PhD (Oxford Lasers – United Kingdom)

Alan undertook his first degree at the University of Glasgow, Scotland, in Theoretical Chemistry and gained his PhD from the University of Cambridge in Laser Spectroscopy. Whilst at Cambridge he gained a Research Scholarship to study at a Max Plank Institute in Gottingen, Germany.

He has worked for several companies specialising in the “Applications of Lasers” and has been working in the field of lasers for over 30 years. At Oxford Lasers, Alan has held a number of positions including managing Research and Development and Sales and is currently the Director of Oxford Lasers with responsibility for Business Development. Alan has extensive knowledge of the use of lasers in the area of laser micro-machining covering a multitude of applications in particular the drilling of guide plates used in wafer test. He has published numerous technical papers and patents and has written articles for a variety of magazines. He is currently on the Technical Committee of SW Test Asia.

Probe Card Total Cost of Ownership – Consumable economics in the Era of Complexity
Steve Ledford (Teradyne – USA)

Steve has 32 years’ experience in the semiconductor industry. He started his career with Motorola Semiconductor developing products for wireless applications. In 2000 he switched to the ATE equipment market during the birth of the SOC test market bringing multiple generations of systems, instrumentation, applications, and services to market for the past 21 years. Steve is currently the General Manager of the Device Interface Solutions business unit of Teradyne. He holds a Bachelor’s degree in Electrical Engineering from the University of Florida and a Masters of Business Administration from the University of Alabama. Steve has published over 20 articles in leading industry journals and conferences and is an inventor of more than 10 patents.

Eric Shoemaker (Teradyne – USA)

Eric has 18 years of experience in the semiconductor industry. He started his career with Allegro MicroSystems developing magnetic sensing solutions for automotive applications. In 2019 he transitioned to the ATE equipment market, joining Teradyne’s Device Interface Solutions business unit as Director of Marketing & Business Development. He holds a Bachelor’s degree in Electrical Engineering and a Master’s of Engineering Management from Dartmouth College. Eric is an inventor on over 10 patents.

High Power Goes Vertical
Sebastian Salbrechter (T.I.P.S. Messtechnik GmbH – Austria)

since 2017 T.I.P.S. Messtechnik GmbH, R&D: product and test bench development, Test interfaces for automotive sensor devices
2014-2017 LEC Large Engine Competence Center, Graz/Austria, Team leader “Sensor developement and test rigs”
2014 PhD in Mechanical Engineering at Graz University of Thechnology, Institute of Internal Combustion Engines and Thermodynamics, Titel: “Simlulation of thermal behavior during engine warm-up”
39 years old, married, 1 daughter

Mauro Serra (CREA s.r.l. – Italy)
High Power Wafertest – how to keep the temperature under control
Klemens Reitinger (ERS electronic GmbH – Germany)

Klemens graduated from the University of Applied Sciences in Vienna (Austria) with a Master’s degree in Mechanical Engineering. He joined ERS electronic in 1992 and has been CEO since 2001. He’s the inventor of the AirCool®-family of ERS Thermal Chucks and owner of many patents in Fan-Out Wafer Level Packaging manufacturing equipment, with more than 10 years of experience in thermal debonding and warpage adjustment.

WLCSP Spring Probe Pointing Accuracy and Wobble
Bert Brost (Technoprobe – USA)

Bert is a Technoprobe USA Senior Manager, responsible for Business Development and Product Marketing. With more than 35 years of experience in backend test, Bert has held senior management positions with Cohu, Xcerra, Johnstech International and Control Data Corporation. Bert started his career in engineering with Micro Component Technology designing test electronics and later worked as an engineer for Sick Optik Elektronic GmbH. Bert holds several undergraduate degrees and an MBA from the University of St. Thomas, in Minnesota.

Challenges & Resolutions for Spring Probe Application in WLCSP Testing
Tim Wooden (Smiths Interconnect – USA)

Tim Wooden is an expert in semiconductor package test, with extensive experience in the design, development, and manufacturing of advanced semiconductor test solutions. Working in the field for the past 14 years on System Level, RF Testing, Digital SoC, High Power, Advanced Thermal and Fine Pitch solutions. With specific expertise in Mechanical Design, Product Development, Marketing and Business Development, Tim has worked for Smiths Interconnect for two years and currently holds the position of Product Line Manager- Semiconductor Test Sockets

Tim graduated from San Jose State in 2001 with his B.S. Degree in Mechanical Engineering

Frank Zhou, PhD (Smiths Interconnect – USA)

We’d Like to Thank the Following Companies for Sponsoring SWTest 2021

Hybrid includes in-person and virtual | Virtual is virtual-only

Platinum Sponsors

formfactor - hybrid sponsor
PTSP - virtual sponsor
international test solutions - hybrid sponsor
jem - hybrid sponsor
nidec s v t c l - hybrid sponsor
teradyne - hybrid sponsor
mpi - hybrid sponsor
Technoprobe - hybrid sponsor
TEL - Hybrid sponsor
aehr hybrid sponsor

Gold Sponsors

oxford lasers - hybrid sponsor
tips - hybrid sponsor
feinmetall - virtual sponsor
intest ems - hybrid sponsor
heraeus - hybrid sponsor
yokowo - hybrid sponsor
star technologies - hybrid sponsor
mjc - hybrid sponsor
pactech - hybrid sponsor
posalux - hybrid sponsor
TSE - hybrid sponsor
semics virtual sponsor

Silver Sponsors

ers - hybrid sponsor
aps - hybrid sponsor
celadon - hybrid sponsor
vermont microtechnologies - hybrid sponsor
onto innovation - hybrid sponsor
pec point engineering hybrid sponsor
cohu hybrid sponsor
scc south coast circuits - hybrid sponsor
advantest - hybrid sponsor

Official Media Sponsors

Conference Partners

Back to top