Program for SWTest 2021

Times in PDT | Tentative, subject to change | last revised: 7/22/2021

Monday, August 30, 2021
7:00 – 8:00 Continental Breakfast
7:00 – 12:30 Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2021
Jerry Broz, PhD, SWTest General Chair, International Test Solutions
8:30 – 9:30 KEYNOTE

Rapid growth of 5G/mm-wave beyond Phone into Auto, IOT, Laptops, etc., and the pressure it puts on test, probe, and hardware demands.

William Miller
Vice President of Engineering
Qualcomm Technologies, Inc.

Abstract: During his presentation, Mr. Miller will focus on four key areas.  (1) How the introduction of Qualcomm Technologies, Inc. (QTI), and 5G/mm wave will affect overall business growth beyond Phone into Auto, IOT, Laptops, etc.; (2) Challenges to the industry caused by the slowing of technology and the increasing complexity of our processors and RF products.  Discuss the key statics on die complexity, die size, bump counts, etc.  Review the market demand for vertical ramps and the pressure it puts on the end-to-end suppliers and QTI; (3) Big data, diagnostics, and QTI’s need for machine learning for faster yield learning and for improving quality demanded by the market. (4) Cost of Test, probe, other associated hardware requirements and issues.

Biography: Mr. William Miller is Vice President of Engineering with responsibility for RF, PMIC, and RFFE product testing and characterization as well as Yield and Diagnostic analysis of all Qualcomm’s products. Additionally, William’s team has responsibility for leading-edge technology IP test chip characterization as well as all failure analysis and circuit edit for Qualcomm’s products. William also works with Qualcomm’s Foundries and OSATs to drive process and device improvements to meet Qualcomm’s product requirements. William has over 40 years in the semiconductor industry with experience in all aspects of semiconductor manufacturing and development. Prior to moving to Qualcomm, William was Director of Outsource Engineering and Product and Test Engineering at IBM Microelectronics Division with broad responsibility for managing multiple new products and technologies at the IBM 300mm Fabricator as well at IBM’s partner fabricators. William is also an author of multiple published articles and professional society presentations, patent holder, and former conference chairman of the Advanced Semiconductor Manufacturing Conference and former chairman of the Industrial Advisory Board for the Center for Micro Contamination Control at U of Arizona, RPI, and Northeastern University.

10:00 – Noon SESSION 1: Enabling 5G Test Strategies
Session Chair
: Darren James (Onto Innovation)
10:00 – 10:30 Millimeter-Wave Signal Integrity in a Dense Device-Interface-Board (DIB) Environment
Andrew Westwood (Teradyne, Inc. – USA)
10:30 – 11:00 The Digital Revolution: NRZ to PAM4
Daniel Bock, PhD and David Raschko (FormFactor – USA)
11:00 – 11:30 An Advanced Contact Solution Probe Card for RF & 5G using MEMS Coaxial Technology
Tae Kyun Kim (Microfriend – Korea) and Svetlana Garcia, PhD (Nidec SV TCL USA)
Jong Gwan Yook (Yonsei Univ. – Korea) and Yong Ho Cho (Microfriend – Korea)
11:30 – Noon 55GHz Octal-site Wafer Test Probecard for 5G mmWave devices
Jason Mroczkowski (COHU – USA)
Noon SWTest Conference Adjournment for Day 1

Enjoy Lunch on your own!

12:30 –  22:00 Bill Mann Memorial Benefit Golf Tournament
SWTest 2021 – Supplier and Sponsor EXPO
12:30 – 16:30 Bill Mann Memorial Benefit Golf Tournament
Enjoy the Best Ball Scramble and Help Support Student Travel
14:00 – 17:00 Registration
17:00 – 20:00 SWTest EXPO OPEN w/ Dinner Served at RECEPTION STATIONS
Meet, Greet, and Reconnect with Colleagues
20:00 – 22:00 Sponsor Hospitality Suites
Tuesday, August 31, 2021
7:00 – 8:00 Continental Breakfast
7:00 – Noon Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2021
Jerry Broz, PhD, SWTest General Chair, International Test SolutionsIntroduction to the SWT Crew Initiative
Karen Armendariz (Celadon Systems), Amy Leong (FormFactor) and Suz Ramsbottom (Texas Instruments)
8:30 – 9:30 KEYNOTE

The Growing Challenge of Testing Automotive Analog and Sensor Systems.

Hans Stork, PhD
Senior Vice President and CTO
ON Semiconductor

Abstract: Automotive systems are facing an accelerated introduction of electronic components, driven by megatrends such as electrification and autonomous driving. This leads to an explosion of ever more complex sensors generating an abundance of data/sec that need to be processed real-time to drive a wide variety of electronic and mechanical systems in the car. Furthermore, those systems need to function in hostile environments (e.g., high electromagnetic fields, high temperatures, etc.) while quality needs to be guaranteed at the ppb level and cost is a constant challenge.  As a result, testing of such electronic components becomes significantly more complex both in the amount and variety of functions to be tested: testing speed, signal integrity and accuracy, test coverage, and cost.

Dr. Hans Stork is Senior Vice President and Chief Technology Officer (CTO) at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, design libraries, as well as packaging technologies and assembly support.  Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and CTO of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the CTO of Texas Instruments. Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.  Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC and has served on the boards of Sematech and the SRC.  He is a longstanding member of the SIA Technology Strategy Committee.  He authored more than 100 cited papers and holds 11 U.S. patents.  He was elected IEEE Fellow in 1994, and served on several IEEE conference program committees, and is currently vice-chair of the Technical Field Awards Council and a member of the Awards Policy and Portfolio Review Committee.  Dr. Stork was born in Soest, The Netherlands, and received the Ingenieur degree in electrical engineering from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.

10:00 – Noon SESSION 2: Advanced Technologies
Session Chair: Karen Armendariz (Celadon Systems – USA)
10:00 – 10:30 Evaluation of a MEMS Probing Solution for Scrub Mark Visibility on Automotive Devices with Nickel Palladium pads
Karan Maniar and Kyle Cotner (Nidec SV TCL – USA)
Erwin Verardi and Mattia De Nicola (STMicroelectronics – Italy)
10:30 – 11:00 Production Parametric Probe – An Essential Guide to Lowering Cost of Test While Probing Very Small Pads
Riley Kaiser, Karen Armendariz (Celadon Systems – USA)
Jungtae Hwang (Global Foundries – USA)
11:00 – 11:30 Exploring Parametric and Test Structure Challenges
Mike Palumbo (Technoprobe – USA)
11:30 – Noon Towerless vs Towered Probe Solutions; What is the most effective application for my wafer test interface?
William Wyckoff (inTEST EMS – USA) and Wally Haley (Qualcomm – USA)  
Noon SWTest Conference Adjournment for Day 2

Enjoy Lunch on your own!

14:30 – 16:30 Registration
15:00 –  22:00 SWTest 2021 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
15:00 – 16:30 SWTest EXPO OPEN w/ Refreshments
Meet, Greet, and Reconnect with Colleagues
16:30 – 17:30 SWT Crew Social Hour
Learn about the SWT Crew Initiative
17:30 – 21:00 Cocktails, Dinner, and SWTest Social Event
Communicate, Collaborate and Celebrate!
21:00 – 22:00 Sponsor Hospitality Suites
Wednesday, September 1, 2021
7:00 – 8:00 Continental Breakfast
7:30 – 10:00 Registration
8:00 – 9:30 SESSION 3: Large Array Probing
Session Chair: Mark Ojeda (Infineon – USA)
8:00 – 8:30 Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probecards
Cameron Harker, Yohannes Desta, and Pouya Dastmalchi (FormFactor – USA)
8:30 – 9:00 Determine Thermal Expansion/Shrinkage Matching Between Wafer and Probe Card
Woo Young Han (Onto Innovation – USA)
9:00 – 9:30 Probe to pad alignment improvement over wide temperature range for automotive applications with large probe array size, high parallelism and small pads size
Alessandro Antonioli, PhD,  Raffaele Vallauri, Tommaso Masi, Emanuele Bertarelli, PhD, and Alessandro Cito (Technoprobe – Italy)
Mattia De Nicola (STMicroelectronics – Italy) and Erziz Salam, Diperi Robert, Sebastien Usai (STMicroelectronics – France)
9:30 – 10:00 Coffee Break
10:00 – 12:30 SESSION 4: Large Array Probing
Session Chair: Patrick Mui (JEM America)
10:00 – 10:30 Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3GHz/6Gbps
Alan Liao (FormFactor – Livermore, USA)
10:30 – 11:00 Next Generation SmartMatrix Probe Card Technology Enables 3000-Parallelism 1TD Test for 1Z DRAM Process Node
Joe Ceremuga and Cameron Harker (FormFactor – USA) 
11:00 – 11:30 A Vertical Probe Solution for the High-Density 5G Market
Don Thompson (R&D Altanova – USA) and Svetlana Garcia, PhD (Nidec SV TCL – USA)
11:30 – Noon Evaluating the High Temperature Creep Performance of MEMS Vertical Technology Probes
Raul Molina, Rambod Tabasi, and Dominik Schmidt (Translarity – USA)  
12:00 – 12:30 SWTest 2021 Awards and Adjournment

See you in 2022!
Travel Safe and Keep Healthy.

SWTest 2021 ON-Demand
Sept. 2 – Oct. 2, 2021
Machine Learning: Predictive modeling of Trimming Offset during Probing
Renante De la Cruz and Michael Trinidad (On Semiconductor – Philippines)
3D magnetic sensor stimulation – new solutions for wafer probing
Georg Franz, Sebastian Salbrechter, and Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Austria)
Solutions to New Challenges in Advanced Vertical Guide Plates
Alan Ferguson, PhD (Oxford Lasers – United Kingdom)
Probe Card Total Cost of Ownership – Consumable economics in the Era of Complexity
Steve Ledford and Eric Shoemaker (Teradyne – USA)
A Fine Pitch Parametric Probe Card for On-Wafer Testing
Mehmet Ozdogan, Kwame Amponsah, PhD, and Pardeep Kumar (XALLENT – USA)
High Power Goes Vertical
Sebastian Salbrechter (TIPS Messtechnik GmbH – Austria) and Mauro Serra (CREA s.r.l. – Italy)
High Power Wafertest – how to keep the temperature under control
Klemens Reitinger (ERS electronic GmbH – Germany)
WLCSP Spring Probe Pointing Accuracy and Wobble
Bert Brost (Technoprobe – USA)
Challenges & Resolutions for Spring Probe Application in WLCSP Testing
Tim Wooden and Frank Zhou, PhD (Smiths Interconnect – USA)

We’d Like to Thank the Following Companies for Sponsoring SWTest 2021

Hybrid includes in-person and virtual | Virtual is virtual-only

Platinum Sponsors

formfactor - hybrid sponsor
PTSP - virtual sponsor
international test solutions - hybrid sponsor
jem - hybrid sponsor
nidec s v t c l - hybrid sponsor
teradyne - hybrid sponsor
mpi - hybrid sponsor
Technoprobe - hybrid sponsor
TEL - Hybrid sponsor
aehr hybrid sponsor

Gold Sponsors

oxford lasers - hybrid sponsor
tips - hybrid sponsor
feinmetall - virtual sponsor
intest ems - hybrid sponsor
heraeus - hybrid sponsor
yokowo - hybrid sponsor
star technologies - hybrid sponsor
mjc - hybrid sponsor
pactech - hybrid sponsor
posalux - hybrid sponsor
TSE - hybrid sponsor
semics virtual sponsor

Silver Sponsors

ers - hybrid sponsor
aps - hybrid sponsor
celadon - hybrid sponsor
vermont microtechnologies - hybrid sponsor
onto innovation - hybrid sponsor
pec point engineering hybrid sponsor
cohu hybrid sponsor
scc south coast circuits - hybrid sponsor

Official Media Sponsor

Conference Partners

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