Program for SWTest Untethered 2020

Times in PDT  |  Program subject to change
last revised: 10/2/2020

Wednesday, November 11, 2020
8:00 – 9:00 Soft Expo Open/Swag Giveaway
9:00 – 10:00 Welcome and Keynote
9:00 – 9:10 Welcome To SWTest Untethered
Jerry Broz, Ph.D.
SWTest Conferences General Chair
9:10 – 10:00 Moore’s Law and the Future of Test
Pooya Tadayon, Ph.D.
Intel Fellow
Technology and Manufacturing Group
Director, Test Probe Technology
Intel Corporation

Moore’s Law has fueled the semiconductor industry for the last 50 years and as scaling has slowed down, attention is being shifted towards die disaggregation and heterogeneous integration. This in turn is driving the need for advanced packaging, which drives the need for a true known-good-die (tKGD) coming out of wafer test. Achieving a tKGD places significant challenges on the test platform and test tooling; these include, but are not limited to, thermal management, power delivery, mechanical state of the device, and test content. Addressing these challenges, in an economically viable way, is key to advancing Moore’s Law and will require a high degree of innovation from players across the industry to enable.
10:00 – 11:00 Presentation Sessions

Session Chair: Geert Gouwy

10:00 – 10:30 Test Challenges and Solutions for Testing Wi-Fi 6E, UWB and 5G NR IF Devices in the 3-12 GHz Range

Jeorge Hurtarte, Ph.D
Teradyne, Inc.

10:30 – 11:00 5G: How to be Heard in a Crowded Room

Daniel Bock, Ph.D.
Formfactor, Inc.

11:00 – 11:30 Break/Expo Open
11:30 – 13:00 Presentation Sessions

Session Chair: Karen Armendariz, Celadon Systems, Inc.

11:30 – 12:00 Opto-electronical probe card for high-volume wafer level test of photonic integrated circuits

Tobias Gnausch
Jenoptik, AG

12:00 – 12:30 Extending burn-in test at full wafer level to reduce overall cost of test at HVM
Alessandro Antonioli, Technoprobe S.p.A. and Sebastiano Grimaldi, STMicroelectronics
12:30 – 13:00 Challenges of Trench Probing
Jory Twitchell, NXP Semiconductor and Karan Maniar, Nidec SV TCL
13:00 – 14:00 Lunch Break/Expo Open
14:00 – 15:00 Welcome and Keynote
14:00 – 14:10 Welcome To SWTest Untethered
Jerry Broz, Ph.D.
SWTest Conferences General Chair
14:10 – 15:00 Probe in the Spotlight – enabling advanced packaging, chiplets, and heterogenous integration
Michael D. Slessor, Ph.D.
Chief Executive Officer
FormFactor, Inc.

To offset the slowing of front-end-driven Moore’s Law and sustain the innovation trajectory that has fueled fifty-plus years of semiconductor industry growth, the development of advanced packaging is rapidly accelerating. As industry focus moves from front-end fab to post-fab integration, wafer probe is taking a prominent role in enabling a variety of advanced-packaging schemes like heterogenous integration of chiplets. This rise in prominence is being driven by two basic trends, one economic and one technical. On the economic front, surprisingly high pre-assembly chiplet yields are required for viable composite product yields, driving increased test fidelity and coverage. On the technical front, chiplet-to-chiplet interconnect structures are at least an order of magnitude denser than traditional flip-chip interconnect, driving a corresponding intensification in both probe pitch and probe count. As a consequence, advanced packaging is driving more probes, on more probe cards, with more challenging requirements for the wafer test community, pushing us into the spotlight previously occupied by our friends in the fab.
15:00 – 15:30 Break/Expo Open
15:30 – 16:30 Presentation Sessions

Session Chair: Patrick Mui, JEM America Corp.

15:30 – 16:00 High-speed PCB electrical characterization with good stability and repeatability
Adolph Cheng and Steven Wu
MPI Corporation
16:00 – 16:30 Innovative strategies for improved test measurements using Kelvin contacts with a Flying prober
Sebastiano Grimaldi, STMicroelectronics and Alessandro Antonioli, Technoprobe S.p.A.
16:30 – 16:45 Awards
16:45 – 18:00 Social Hour/Scavenger Hunt/Expo Open, Swag Giveaway

We’d like to thank our SWTest Untethered 2020 Sponsors

Platinum Sponsors

Gold Sponsors

Silver Sponsors

Official Media Sponsor

Conference Partners

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