Program for SWTest 2022

Times in PDT | Tentative, subject to change | last revised: 5/8/2022

Monday, June 6, 2022
7:00 – 8:00 Continental Breakfast
7:00 – 12:00 Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2022
Jerry Broz, PhD, SWTest General Chair, Advanced Probing Systems
8:30 – 9:30 KEYNOTE Architecting Test Solutions for the Next Generation of Compute
John Yi,
Product Engineering Organization Fellow
Advanced Micro Devices (AMD)
Abstract

As the world of compute continues to grow from consumer devices to supercomputers to edge compute, new generation of products are being created with ever growing complexity. Future product architectures are evolving to supply the increasing demand for compute power, automation, and data. It is essential to work closely across multiple disciplines from silicon design, DFT, and test hardware/software to ensure success in being able to test these new generation of products with minimal test costs and the highest level of quality & reliability. As compute products continue to push fab process geometries in addition to pushing more complex 2.5D & 3D construction processes, this has required more emphasis on increasing test coverage & capacity for probe test solutions. Probe test requirements will demand higher current capability, tighter pitches, & higher test frequencies while sustaining high production lifetimes & test integrity. This will bring a new level of innovation in probe technologies as new metallurgy and construction schemes are being developed along with enhanced test methods across the industry. This keynote presentation will provide a general compute overview & roadmap, methods of innovating new test solutions, and provide wafer probe test needs going forward.

Biography

John is a Fellow in the Product Engineering organization at AMD and currently manages a team of architects responsible for co-developing new DFT methods & test solutions. His current focus is defining manufacturable test solutions for the challenges of AMD’s heterogenous 2.5D & 3D products. In his previous role, John was responsible for defining the architecture & test strategy for ATE, Burn-in, and System-Level test hardware across the wide spectrum of AMD products. John has been at AMD for 28+ years responsible for driving many test innovations from concept to production deployment. Prior to joining AMD, John graduated from the University of Texas in Austin in Electrical Engineering.

9:30 – 10:00 Break – Poster Session
9:30 – 10:00 POSTER SESSION: Probe Potpourri 1
Magnetic Testing Tutorial – Wafer probing with 3D magnetic stimulation
Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)

Hydra Probes – Simplifying and Standardizing Semiconductor Test
Rob Stoner (Cohu – Saint Paul, USA) and Tes Olson (Cohu – St Paul, USA)

Increasing transparency in wafer test probecard maintenance processes through targeted key performance indicators
Dr. Veronika Haehnel and Lasse Meyer (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)

Automated temperature calibration routine for prober chucks
Harald Ibele (Sigma Sensors (TCL) GmbH – Sigmaringen, Germany)

Small Pad/Small Pitch Dual-Sided Single-Level Space Transformer
Prasanna Chitturi (Translarity Inc. – Fremont, USA)

Probe Debris Rating Scale
Kyle Cotner and Karan Maniar (Nidec SV TCL – Tempe, USA)

Novel Micro-Textured Film Offers Promise in Universal Handling during IC Test
Raj Varma (Gel-Pak – Hayward, USA)
10:00 – 12:00 SESSION 1: Innovative Materials and Processes
Session Chair
: Jerry Broz, PhD (SWTest Conference General Chair)
10:00 – 10:30 PALYSIUM – A Revolutionary Material For Probing
Jonas Sorg, Marc Raettig (Heraeus – Hanau, Germany)
Jonas Fecher (Heraeus – Hanau, Germany)
  • Studies in Material Science and Engineering at FAU Erlangen, Germany in 2
  • Ph.D in Material Science at FAU Erlangen, Germany in 2016
  • Project Engineer for CVD Diamond coating at DiaCCon GmbH, Fürth, Germany 2016-2017
  • Since March 2017: Development of precious metal-based alloys for probing applications, Heraeus Precious Metals, Hanau, Germany
10:30 – 11:00 New Ceramic Technology
Noh Tae Hyung (Disruptive Innovation Technology (DIT) – Siheung, Korea)
Paul Kim (Disruptive Innovation Technology (DIT) – Siheung, Korea)

Paul Kim is the head of global sales for GI technology. We have been working together with our partner company (DIT) Disruptive Innovation Technology to perfect a new process to make thin ceramic substrates that can be made into MLC’s and various other products. All the credit for this new technology goes to Mr. Noh, the founding CEO of DIT. I will be the main presenter due to the lack of English proficiency.

11:00 – 11:30 Does Femto Laser micro machining match with guide plates and probes requirements?
Angelo Rizzo (Posalux SA – Biel/Bienne, Switzerland)

Mr. Angelo Rizzo joined Posalux in 2006 and is currently Business Area Manager Electronic.

He is active in the micro-machining world since the beginning of his career and served in different sales and management roles. With a long experience in the micro-drilling/routing of Printed Circuit Boards, he started focusing on the semiconductor industry by introducing high-tech mechanical and Laser machines. More specifically, he was responsible for developing the guide plates and probes micro-machining market. Passionate about technology, today Angelo is working closely with Laser R&D process engineers, the goal being to push applications like square holes and MEMS probes cutting beyond the limit.

Angelo graduated from the University of Neuchâtel, Switzerland with a master degree in International Business Development.

11:30 – 12:00 Methodology to improve WAT probe card Probe Mark and Lifetime
Eric Sik Kiang Lau, Tai Lin Goh, Tee Whay Lim (GLOBALFOUNDRIES – Singapore, Singapore), Yang Qu, Toh Wei Leong, Jean Tan (STAr-Quest Technologies Pte. Ltd. – Singapore, Singapore), Yu-Ming Chien (Star Technologies – Hsinchu City, Taiwan)
Jeffrey Lam (STAr-Quest Technologies Pte. Ltd. – Singapore, Singapore)

Dr. Jeffrey Lam is currently the GM/Vice-President of Engineering at STAr-Quest Technologies. Prior to joining STAr Technologies, Dr. Lam was VP of Product, Test and Failure Analysis with GlobalFoundries for 19 years. He possesses more than 40 years of experience in Process Module, Design Engineering, Product/Yield engineering, Failure Analysis and Test Development Engineering. He has 17 technical patents and more than 100 publications. He has also been the chairman for SEMI “SGPSEA Product & Test Committee” since 2009 and serves as an Adjunct Associate Professor at the National University of Singapore.

Dr. Lam received his B.S and M.S. in Chemical Engineering from UC Berkeley and UC Davis in 1979 and 1981 respectively. He obtained a second M.S in Electrical Engineering and Computer Science from the University of Santa Clara in 1986. In 2014, he received his PhD from the School of Physical and Mathematical Sciences, Nanyang Technological University.

12:00 – 13:00 Enjoy Lunch on the Luna Lawn!
13:00 – 15:00 SESSION 2: High Speed and RF
Session Chair
: Mark Ojeda (Infineon Technologies – San Jose, USA)
13:00 – 13:30 High Speed Digital: How to Optimize a Probe Card for PAM4 to a non-50 Ω device
Daniel Bock (FormFactor – Beaverton, USA)

Daniel Bock got his Ph.D. in Physics at Carnegie Mellon University in 2006, working on Superconducting Nanowire Bolometers in the NanoFabrication Lab. He joined Form Factors RF Product Group in June of 2012. He led the development of the Custom Calibration Substrate (Custom ISS) product line to supplement the standard ISS line to improve the RF calibration methods for multi-DUT, irregular layout probe cards. He is also investigating the increase in digital signals, moving to PAM4 with higher baud rates, to improve wafer test for these devices. He enjoys camping with his family, as well as playing board games.

13:30 – 14:00 Contactless Measurement of RF Voltage Distribution in Antenna Switches at High Spatial Resolution
Prof. Georg Schitter, Martin Schober (TU Wien – Vienna, Austria), Dr. Sergey Bychikhin (Alten Gmbh – Munich, Germany), Dr. Hans-Dieter Wohlmuth (Infineon Technologies AG – Neubiberg, Germany), Dr. Werner Simbürger (High Power Pulse Instruments GmbH – Haar, Germany)
Mathias Poik (TU Wien – Vienna, Austria)

Mathias Poik is PhD student at the Automation and Control Institute (ACIN) at TU Wien, Austria. He received his MSc. in Energy Systems and Automation Technology from TU Wien in 2017. His primary research interests are the development of scanning probe-based methods for the evaluation of integrated circuits, and the development of electrical measurement modes for Atomic Force Microscopy. He currently works on a research project aimed at enabling contactless characterization of RF products on wafer-level at high spatial resolution.

14:00 – 14:30 55GHz Octal-site Wafer Test Probecard for 5G mmWave devices
Peter Cockburn (Cohu – Saint Paul, USA)
14:30 – 15:00 5G mmWave: Multi-site RF Probe Cards Enable Lower Cost-of-Test in Mass Production
Ryan Garrison (FormFactor, Inc. – Beaverton, USA)
15:00 – 15:30 Break – Poster Session
15:00 – 15:30 POSTER SESSION: Probe Potpourri 1
Magnetic Testing Tutorial – Wafer probing with 3D magnetic stimulation
Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)

Hydra Probes – Simplifying and Standardizing Semiconductor Test
Rob Stoner (Cohu – Saint Paul, USA) and Tes Olson (Cohu – St Paul, USA)

Increasing transparency in wafer test probecard maintenance processes through targeted key performance indicators
Dr. Veronika Haehnel and Lasse Meyer (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)

Automated temperature calibration routine for prober chucks
Harald Ibele (Sigma Sensors (TCL) GmbH – Sigmaringen, Germany)

Small Pad/Small Pitch Dual-Sided Single-Level Space Transformer
Prasanna Chitturi (Translarity Inc. – Fremont, USA)

Probe Debris Rating Scale
Kyle Cotner and Karan Maniar (Nidec SV TCL – Tempe, USA)
15:30 – 17:00 SESSION 2A: Pushing the Test Limits
Session Chair
: Jerry Broz, PhD (SWTest Conference General Chair)
15:30 – 16:00 3D IC probe card solution
Brian Chang (Chunghwa Precision Test Tech.Co., Ltd. – Santa Clara), Paul Tai (Chunghwa Precision Test Tech. Co., Ltd – Santa Clara)
16:00 – 16:30 Automated temperature calibration: Tackling the challenge of temperature accuracy and uniformity measurements in wafer probing
Bengt Haunerland (ERS electronic GmbH – Munich, Germany)
16:30 – 17:00 Advancing Probe Card Parallelism for SOC Devices
Pouya Dastmalchi (FormFactor Inc. – Livermore, USA), Johann Heitzer (Infineon – Munich, Germany), Cameron Harker (FormFactor – Livermore, USA)
17:00 Technical Sessions Adjourn and EXPO Opens at 17:00
17:00 – 20:00 SWTest EXPO – 2022
17:00 – 20:00 SWTest 2022 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
20:00 Sponsor Hospitality Suites and Events
Tuesday, June 7, 2022
7:00 – 8:00 Continental Breakfast
7:00 – Noon Registration
8:00 – 9:30 Welcome and Visionary Keynote Speaker
8:00 – 8:30 Opening Remarks for SWTest 2022
Jerry Broz, PhD, SWTest General Chair, Advanced Probing Systems

Introduction to the SWT Crew Initiative
Karen Armendariz (Celadon Systems) and Amy Leong (FormFactor)
8:30 – 9:30 KEYNOTE Advanced Packaging and Test Enabling Our Digital Society
Rebeca Jimenez,
Corporate Vice President Advanced SiP Business Unit
Amkor Technology, Inc
Abstract

Semiconductors are the building blocks of our modern digital society and allow us to be connected anywhere and everywhere. We interact with semiconductors every day through almost everything we do, whether using our smartphones, personal electronics, connected homes or our cars, which have become digital cockpits, immersed with advanced safety features. All of these digital interactions require massive computing and connectivity power to process, store and transfer data. Join me as we explore innovations in advanced packaging and test technology and how they enable further transformation in our digital society with a focus on the key catalysts of 5G, High Performance Computing, IoT and Automotive applications.

Biography

Rebeca Jimenez joined Amkor in 2014 and is currently Corporate Vice President, Advanced SiP Business Unit. Prior to assuming her current role, Ms. Jimenez served in various sales and strategic program management roles. She has more than 25 years of experience in the global semiconductor industry. Prior to joining Amkor, she spent 15 years with IDT (previously ICS) in both test engineering and operations roles as well as management positions. In addition, Ms Jimenez worked in various engineering and engineering management roles at Motorola. She holds a BS in Electrical Engineering from Arizona State University, as well as an MS in Electrical Engineering from National Technological University.

9:30 – 10:00 Coffee Break
10:00 – 12:00 SESSION 3: Reducing Costs (Cost of Ownership)
Session Chair: Karen Armendariz (Celadon Systems – USA)
10:00 – 10:30 The Use of Artificial Intelligence and Big Data in the Production of Advanced Vertical Guide Plates
Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)
10:30 – 11:00 Control System for Enhancing the Life and Capability of Legacy, Modern and Mixed-Floor Probe Systems
Albert Soto (Soto Technologies International – Pflugerville, USA)
11:00 – 11:30 Probe Card Total Cost of Ownership in the Era of Complexity
Steve Ledford (Teradyne – North Reading, USA)
11:30 – 12:00 Assessing the Overall Cost of Ownership
Mike Palumbo and Bert Brost (Technoprobe – San Jose , USA)
12:00 – 13:00 Enjoy Lunch on the Luna Lawn!
13:00 – 15:00 SESSION 4: New Probe Technologies
Session Chair: Connie Smith (Texas Instruments)
13:00 – 13:30 Probing challenges using magnetic field
Jory Twitchell (NXP Semiconductor) and Brandon Mair (TechnoProbe America)
13:30 – 14:00 UFO Probe™ Card – New dimensions in wafer-level test of photonic integrated circuits
Tobias Gnausch (Jenoptik Optical Systems GmbH – Jena, Germany)
14:00 – 14:30 Extreme Power Probing – Challenges of 3000A and more
Dr. Rainer Gaggl, Diana Damian, Sebastian Salbrechter (TIPS Messtechnik- Austria)
14:30 – 15:00 Copper pad probing with vertical technologies featuring hard metal tip: ARIANNA™ probe family
Dr. Alberto Pagani, Erwin Verardi, Mattia De Nicola (STMicroelectronics – Italy) Salvatore De Siena, Dr. Emanuele Bertarelli, Raffaele Vallauri (Technoprobe Italy
15:00 Technical Sessions Adjourn and EXPO Opens
15:00 – 17:00 SWTest EXPO – 2022
15:00 – 17:00 SWTest 2022 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
17:00 – 18:00 SWT Crew Social Event
18:00 – 21:00 SWTest Social Event – Luau Party
18:00 – 21:00 SWTest 2022 – Supplier and Sponsor EXPO
Communicate, Collaborate and Celebrate!
21:00 Sponsor Hospitality Suites and Events
Wednesday, June 8, 2022
7:00 – 8:00 Continental Breakfast
8:00 – 9:30 SESSION 5: Pads, Bumps, and Defects
Session Chair: Dr. Michael Huebner (FormFactor)
8:00 – 8:30 An Advanced Method for Pad Stack Crack Assessment during Probe-Over-Active-Area
Dr. Oliver Nagler, Dr. Marianne Unterreitmeier, Dr. Eric Liau (Infineon Technologies Germany), Mark Ojeda (Infineon Technologies – USA)
8:30 – 9:00 On Shifting Defect Detection in Quantum Chips From Cryogenic to Ambient Temperature
Francesco Lorenzelli, Roy Li, Erik Jan Marinissen, Fahd Ayyalil Mohiyaddin, Michele Stucchi, Georges Gielen (IMEC – Leuven, Belgium)
9:00 – 9:30 Reducing test time by exploiting scan ATPG-based patterns targeting high density
Francesco Angione, Prof. Paolo Bernardi, Giusy Iaria, Prof. Matteo Sonza Reorda (Politecnico di Torino – Italy) Davide Appello, Giuseppe Garozzo, Vincenzo Tancorre, Roberto Ugioli (ST Microelectronics – Italy)
9:30 – 10:00 Novel reverse engineering way of fine pitch pre-bump probe head development in pureplay foundries to enable early-stage yield learning and DFA support via PBI/RDL MEMS technology
Chan Yin Hong Patrick, Chithambaram Shaalini, Chen Changqing (GlobalFoundries – Singapore, Singapore), Dr. Jeffrey Lam, Yang Qu (Star-Quest – Singapore), Dr. Choon-Leong Lou (STAr Technologies – Taiwan), Dr. Szu Huat Goh (Qualcomm)
10:00 – 10:15 Coffee Break
10:15 – 12:00 SESSION 6: Changes on the Horizon
Session Chair Patrick Mui (JEM America)
10:15 – 10:45 Advances in Vertical Probing for High-Speed Digital Test at Wafer Sort
David Raschko (FormFactor – USA)
10:45 – 11:15 Shifting Left = More Wafer Probe
Dave Armstrong (Advantest – USA)
11:15 – 11:45 The semiconductor industry is fast adapting to a new reality. How can suppliers of probe cards keep up?
John West (Yole Intelligence – London, United Kingdom)
11:45 – 12:00 SWTest 2022 Awards and Adjournment

See you in 2023!
Travel Safe and Stay Healthy!

SWTest 2022 ON-Demand – Probe Potpourri 2
June 9 – July 9, 2022
Introduction of new probe, VPT (Vertical Probe Transformed)
Tadashi Rokkaku (Probe Innovation USA, LLC – Irving, USA), Kazunori Kobayashi (Sinko Corporation – Niigata, Japan)
Next Generation DRAM Temperature Requirements and Impacts to Full Wafer Contactor Probe Card Performance
Myungjin Lee (FormFactor – Livermore, USA), Hyun Ae Lee (Samsung – Suwon, Korea)

Coming Soon

We’d Like to Thank the Following Companies for Sponsoring SWTest 2022

Hybrid includes in-person and virtual | Virtual is virtual-only

Platinum Sponsors

nidec s v t c l - hybrid sponsor
PTSL hybrid sponsor
jem - hybrid sponsor
formfactor - hybrid sponsor
mpi - hybrid sponsor
teradyne - hybrid sponsor
TEL - Hybrid sponsor
technoprobe hybrid sponsor
mjc - hybrid sponsor
aehr hybrid sponsor
intest ems - hybrid sponsor

Gold Sponsors

oxford lasers - hybrid sponsor
star technologies - hybrid sponsor
posalux - hybrid sponsor
pactech - hybrid sponsor
heraeus - hybrid sponsor
advantest - hybrid sponsor
TIPS technical innovation hybrid sponsor
TSE - hybrid sponsor
ers - hybrid sponsor
yokowo - hybrid sponsor
semics hybrid sponsor
international test solutions - hybrid sponsor
translarity hybrid sponsor

Silver Sponsors

celadon hybrid sponsor
vermont microtechnologies - hybrid sponsor
cohu hybrid sponsor
advanced probing systems hybrid sponsor
DIT disruptive innovation technology hybrid sponsor
onto innovation - hybrid sponsor
pec point engineering hybrid sponsor
feinmetall hybrid sponsor
riff company inc virtual sponsor
chpt hybrid sponsor

Official Media Sponsors

CSR-logo-2020
semiconductor review logo

Conference Partners