2023 SWTest Exhibitors

The SWTest EXPO is the Who’s Who of Industry Leaders in the Semiconductor Wafer Test Industry.

The top probe card, probe equipment and related service suppliers will showcase the latest products and services at SWTest 2023.

Last Updated: November 21, 2023 7:41 am PST

*TCE* stands for Trivia Contest Exhibitor (visit EXPO Trivia Contest for more details)


Booth: #105 *TCE*

Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

accretech tokyo seimitsu
Advanced Probing Systems


The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, beryllium copper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material. Lower your overall cost of testing by using APS’s quality probe needles.

Ed Johnson

advanced probing systems
Aehr Test Systems

Booth: #411 *TCE*

Aehr Test Systems is a worldwide supplier of burn-in test equipment and pioneer of Wafer Level Test & Burn-in (“WLTBI”) FOX platform Wafer level and singulated die/module stabilization and infant mortality test is being commercially adopted across multiple markets – Power devices (Gallium Nitride, Silicon Carbide) – Silicon Photonics (Gallium Arsenide, Indium Phosphide) – 2D/3D sensors (LEDs/VCSELs) – Discrete memories (DRAM, NAND) – MCUs/embedded memories FOX platform has been adopted and validated by industry-leading companies.

Tom Trexler


Booth: #604 *TCE*

AEM Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer level and other advanced packages.

Michael Siebert

aem wafer test solutions
BUSCH Microsystems Consult GmbH

Booth: #102

Positioning systems from Busch: Always unique. Product development, precision, durability – a promise is behind our products: To smartly solve tasks, accurately meet requirements and deliver durable quality. We design and manufacture XY, linear and lifting stages, gantry systems and XYZ axes according to the customer’s requirements. Get a quick overview here or specifically look for systems that match your demands.


busch microsystems
Celadon Systems

Booth: #309 *TCE*

Celadon Systems, a wholly-owned subsidiary of MPI, is a well-established 20-year-old US-based company known for providing “Peace of Mind” probing solutions to the semiconductor industry.
Celadon probe cards are known for thriving in temperature extremes while still delivering accurate and precise test results.
Expect millions of touchdowns with Celadon probe cards. Celadon delivers the lowest cost of test in the industry.
Celadon is an industry leader in parametric probe both in production and in the lab.

Garrett Tranquillo

Chunghwa Precision Test Tech. Co., Ltd.

Booth: #302

Chunghwa Precision Test Tech. Co., Ltd. (CHPT) was founded on Aug. 26, 2005. It was located in Pingzhen Industrial Park, Taoyuan City. CHPT was the high-speed PCB team in the Chunghwa Telecom Laboratories. We have been focusing on the interface board services required for testing in the semiconductor industry since 2001. Our primary products are Load Board for IC test, probe PCB for wafer test, substrate for vertical probe card and DUT board for memory test.

Paul Tai

Cohu, Inc.

Booth: #605

Cohu, Inc. (NASDAQ: Cohu) is a global leader in test and handling equipment, thermal subsystems, interface solutions, vision inspection and MEMS test solutions, and a leader in printed circuit board test. We deliver leading-edge solutions to enable a smarter, safer, and more connected future. Cohu offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop-shop for test and handling equipment, thermal subsystems, test contacting, vision inspection, and MEMS test solutions. Our enhanced product portfolio gives our customers the best possible combination of technologies to match their business and technical needs. Cohu has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods. Learn more: https://www.cohu.com/interface-solutions

Dan Campion

Complete Probe Solutions Inc.

Booth: #201

Complete Probe Solutions is proud to announce the availability of the new APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems.

Kevin Chandler

complete probe solutions inc
Elevate Semiconductor

Booth: #603

Elevate Semiconductor is the world’s leading manufacturer of IC’s for Semiconductor test.

Kurt Erikson

elevate semiconductor

Booth: #300

As a global company working with leading manufacturers to enable ongoing advancement in technology, Entegris has a global infrastructure that includes strategically placed manufacturing sites, R&D facilities, and customer support centers. We make infrastructure investments that put us closer to our customers in all global regions. Our highly skilled team members, facilities and resources are right where you need them to help you solve your most advanced technology challenges. Entegris is a leading supplier of highly engineered cleaning materials used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW). Our critical materials and turnkey products enable device manufactures and foundries to maximize uptime and throughput for substantial cost of test savings.

Sandrine Demal

ERS electronic GmbH

Booth: #204 *TCE*

ERS electronic GmbH, based in Germering close to Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing. ERS also supplies the Advanced Packaging market with its fully automatic and manual debonding and warpage adjust tools used for Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies up to 650 x 650 mm format. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide.

Bernd Krafthöfer

esmo USA

Booth: #608 *TCE*

Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan, we are truly global. We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.

Homan Amin

esmo semicon
Feinmetall GmbH

Booth: #208

Since 1964 FEINMETALL GmbH is a leading company for spring contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments. It does not matter where in this world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe. Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards. Even for the most difficult contact-making tasks, highly specialized development and engineering teams we find the best possible solutions for our customers.

Helmut Seefeldt

Feinmetall GmbH logo

Booth: #402

Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.

John Wu


Booth: #403 *TCE*

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

Cameron Harker

Heraeus Deutschland GmbH & Co. KG

Booth: #408 *TCE*

Heraeus Precious Metals is globally leading in the precious metals industry. For the use of probe cards and the wafer test industry, the product range comprises a variety of alloys for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and/or withstand corrosion effects strongly. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to recycling. It has extensive expertise in all platinum group metals as well as gold and silver. By 2025 Heraeus Precious Metals will be the first company in the industry that operates carbon neutral.

Nail Akrouti

Instec, Inc.

Booth: #311

Instec manufactures precision temperature-controlled scientific instruments for optical measurements. Applications include electrical probing, biological research, material science, and more. Instec offers many standard products for use with all optical systems and offers customization to match any instrument or specifications.

Alec Laws

Integrated Technology Corporation

Booth: #104 *TCE*

Manufacturer of probe card analyzers and power semiconductor dynamic test systems.

Mark McLaren

itc - integrated technology corporation
Integrated Test Corporation

Booth: #200 *TCE*

PCB Design, Simulation, Fabrication, assembly and test hardware solutions in Dallas, TX. Certified WBE and WOSB

Dana Freeman

integrated test

Booth: #206 *TCE*

inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.

William Ira Wyckoff

intest ems
IWIN Co., Ltd.

Booth: #505

IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price

AJ Park


Booth: #203 *TCE*

JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC, Flip-chip, WLCSP), image sensors and parametric test application. As semiconductor factories have expanded globally, JEM organizes a global manufacturing network in Japan, Asia, USA, and Europe to support customers’ needs in each region. JEM expands sales by creating JEM technology roadmap and sales strategies based on demands from global customers and technology roadmap of the semiconductor industry. With our global strategies and proactive development actions, JEM is striving to provide probe cards that exceed the demands of our customers. Our comprehensive probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. In addition, we offer custom design and fabrication services for printed circuit boards and space transformers.

Karen Wong

Johnstech International

Booth: #305

JOHNSTECH INTERNATIONAL is a global R&D leader in the field of microcircuit testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works together with the world’s most respected OSATs, foundries, and EDA companies to develop the most precise and dependable test contactors and test sockets on the marketplace today. For more info, visit www.johnstech.com.

Kaitlin Betlach

Kyocera International, Inc.

Booth: #113

Kyocera, the world leader of fine ceramics, offers a wide selection of ceramic multilayer packages and substrates for space transformer, automotive, consumer device, infrastructure, industrial, testing, medical, etc.

Sho Hokonohara


Booth: #101

Founded in 1999, LASEA designs and manufactures workstations and special machines for applications in marking, engraving, cutting, drilling, texturing, thin film removal, welding and micromachining. With 180 employees over 6 global sites, LASEA has installed more than 1500 machines in 30 countries across 5 continents. As a pioneer in the use of femtosecond lasers since 2003, LASEA continually invests in order to stay at the forefront of innovation. With a strong team of experts in optics, mechanical engineering and automation, LASEA develops new technologies and processes for the most complex and demanding applications in the Electronics Test industry.

Robert Braunschweig

lasea laser solutions
Laser Job Inc.

Booth: #500 *TCE*

We are providing Laser Drilling services to Probe Card Manufacturers.

Yoshitaka Yamaguchi

laser job
LST America Inc.

Booth: #610

LST has been providing test solutions since 2008 in South Korea. Our expertise is in the test socket, interposer, probe pin, test board, SMT, and assembly. Customized solutions are also welcome to be discussed. Short lead times, reasonable pricing, and highly reliable quality are the factors of LST.

Andy Lee

LUKEN Technologies

Booth: #112 *TCE*

M-POGO Pin – Silicon socket has excellent precision by MEMS processing and is easy to implement fine spacing. – Customize the socket probe according to the customer’s specifications.

Da Yeong An

luken technologies
Megatouch Co. Ltd

Booth: #312

Megatouch has own contact technology and supply high quality pin of Semiconductor, Interposer and Battery to everywhere. New concept Interposer and electroformed body to achieve the industry leader. Our goal is providing excellent quality product to global.

Alex Lee


Booth: #510 *TCE*

MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.

John Caldwell

mjc logo
MPI Corporation

Booth: #307 *TCE*

MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI is dedicated to producing a state-of-the-art probing tool that enhances the speed of worldwide semiconductor technology migration.

Cahris Lin

Nidec SV Probe

Booth: #400 *TCE*

Nidec SV Probe is a global provider of high-quality semiconductor testing solutions. Our extensive product line includes the innovative MEMS Probes and MEMS-based probe cards along with a variety of Vertical and Cantilever Probe Card technologies. Our proprietary MEMSFlex™ Probes are fully customizable, capable of both wafer/final test, and can be utilized for many advanced devices including RF, 5G, Mobile, Auto & IoT. We also have analytical and simulation capabilities along with full turnkey services for probe cards and final test. Our unmatched worldwide infrastructure provides coverage for major semiconductor regions around the world with full design & manufacturing capabilities for our probe technologies in USA, China, Japan, Korea, Taiwan & Singapore. Contact us at sales@nidecsvprobe.com to learn more!

Gary Luu

NTK Technologies, Inc.

Booth: #202

At NTK Technologies, we build robust packages for complex applications. However, our innovation helps to advance many of the technologies and products that improve people’s lives. Computers, optical communication, wireless networks, medical devices, automotive, space and aeronautics — many of the applications in these markets would not be possible without the technology that NTK provides. Whether it’s IC packaging, peizoelectronics, ceramic filters, fine ceramics, or ceramic cutting tools, NTK is there providing these vital components that make it possible for the technologies that we use every day to exist.

Otto Liang

ntk technologies ngk spark plugs
Oxford Lasers

Booth: #404 *TCE*

Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.

Alan Ferguson

oxford lasers
Point Engineering

Booth: #511

Point Engineering is a leading manufacturer of customized high-end MEMS pins. 

Point’s proprietary MEMS technology takes advantages of ceramic (Al2O3) wafer by using it as a mold for electroplating process. 

Applying of this unique membrane with high aspect ratio(1:30) enables exact patterning and more precise features to be produced upon customer’s requirements.

Our product portfolio includes various type of MEMS pins (cantilever, buckling, spring, POGO, socket pin) and guide-plate development & processing service.

We provide innovative options for our customers to meet their technical needs along with design & simulation capabilities and cutting-edge MEMS manufacturing system.


Posalux SA

Booth: #211 *TCE*

Experiencing challenges to process small holes and tiny probes? As a machine tool manufacturer, Posalux offers reliable µ-machining solutions for mass production environments. To best answer your requirements of small holes with tight pitch as well as wafer and wire probes, we develop new ways to produce and manufacture parts. With our FEMTO-LASER μ-machining equipment, you will be able to perform various processes like drilling, cutting, and turning in almost all materials.

Valentin Beuchat


Booth: #602 *TCE*

Pozzetta Products designs and manufactures solutions for the packaging, storage, and transportation of critical devices, including probe cards, probe heads, wafers, photomasks, and filters.

Collin Sloan

pozzetta products creating secure environments

Booth: #501

Prober.com is one of the longest running companies dedicated to refurbishment and resale of wafer prober lines. We offer complete sourcing and parts support for our customers. We pride ourselves in the satisfaction of our customers and we partner with them to provide solutions to capacity needs in a timely manner. We work with our customers to plan for large and small capacity increases as well as integrating thermal and OCR solutions for their changing test requirements.

Dennis Bonciolini


Booth: #406 *TCE*

PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

David Glatley

Qualmax Inc.

Booth: #110 *TCE*

Semiconductor probe and probe head manufacturer.

Behrouz Sadrabadi

qualmax experience maximum quality
R&D Altanova, Advantest Group

Booth: #410

Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

Junko Nakaya

Reid-Ashman Manufacturing

Booth: #213

Reid-Ashman Manufacturing Incorporated is a fully integrated engineering, manufacturing, and service company specializing in providing solutions for the semiconductor test industry. Established in “The Silicon Valley”, California in 1978; we are now headquartered in Saint George, Utah with sales and service personnel located around the world. Although we provide world-class engineering and manufacturing services for virtually any industry, we are primarily known for inventing the test head manipulator. It is our goal to continually lead through innovation, quality, and dedication to our customers and their evolving needs. Reid-Ashman is a vertically integrated organization, maintaining control of the entire manufacturing process. All production, engineering, QA, machine-shop, crating, paint-shop, shipping & receiving, and main-office functions are located in three buildings on the 5 acre Reid-Ashman site in St. George, Utah.

Martin Kurtz

reid ashman
Riff Company Inc.

Booth: #111

Machine shop specializing in ceramic drilling and machining

Daniel McCormick

riff company co
Rika Denshi America Inc.

Booth: #109

Rika Denshi offers a broad array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing.

Pete Blitchington


Booth: #507 *TCE*

The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.” SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns. SEMICS has always brought ‘trust’ to our partners. Offering “trust“ is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far. SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.


Sigma Sensors (TCL) GmbH

Booth: #311

Sigma Sensors is the first and only dedicated ISO17025:2017 accredited Temperature Calibration Laboratory with a focus on temperature wafer manufacture and calibration. Sigma Sensors provides accredited and non-accredited traceable thermal calibrations for chucks, calibration wafers, ovens, freezers, fluid baths and any other thermal requirements from -80C to +425C. Sigma Sensors is a registered vendor to 40% of the top 10 Semiconductor IDMS globally providing on site calibrations and calibration systems. Sigma Sensors (TCL) GmbH, a subsidiary of TekSense Holding LLC Operational HQ Sigmaringen Germany with representation in the US and South East Asia.

Harald Ibele

sigma sensors
Smiths Interconnect

Booth: #512 *TCE*

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.

Peter Ursu

smiths interconnect

Booth: #301 *TCE*

Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

Sara Monfreda

STAr Technologies, Inc.

Booth: #606 *TCE*

STAr’s MEMS probe cards enables WAT tests for femto-ampere low-leakage current tests and 35um-pitch requirements. STAr further enables SoC ICs tests with MEMS vertical probe cards down to 45um pitch and >2A driving current. Our one-touch 3D MEMS micro-cantilever probe cards can significantly lower Cost-of-Test for Flash memory ICs by enabling tri-temperature tests with just one probe card. In addition, STAr supplies MEMS probe cards to CMOS image sensor (CIS) customers with C-PHY tests at >3.5GSPS and with next generation 6GSPS in development.

star technologies
Synergie Cad Group

Booth: #212 *TCE*

YOUR PARTNER FOR ALL TEST SOLUTIONS We are the preferred partner of large and small semiconductor industry players since 1986. With over 30 years of experience, our high-performance solutions maximize yield improvements while ensuring the most competitive cost of test over our product lifetime.

Malcolm Owens

Technoprobe America Inc

Booth: #310 *TCE*

Technoprobe is a leading provider of the most advanced wafer test solutions for the semiconductor industry. Headquartered in Cernusco Lombardone (LC), in Italy, Technoprobe has 14 offices worldwide, in Europe, Asia and the United States. The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio, ranging from Cantilever , 2D-3D MEMS Vertical and Spring pin technology, motherboards, final test boards, advanced micromachining, AI, and advanced manufacturing capable of meeting complex requirements and reducing the overall cost of test.

Marita F. Villarreal


Booth: #210 *TCE*

As a leading global company of innovative semiconductor and flat panel display (FPD) production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.

Doug Heins


Booth: #502

Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers and interface hardware make sure that new products work right the first time, every time. Our portfolio of industrial automation solutions helps manufacturers to develop and deliver new products quickly, efficiently and cost-effectively.

Eric Shoemaker

Test Tooling Solutions Group

Booth: #600

Being in the business since 1979, TTS Group dedicates itself to bring the best possible solutions to help our customers solve some of the most challenging issues in semiconductor test and tooling today. Right from R&D to design to simulation to validation, we focus on lowering the total cost of final test through relentless pursuit of innovation, yield, quality, reliability and on-time delivery for our customers. Our solutions range from probe heads, probe pins, and test contactors.

Mehdi Attaran

TFE inc.

Booth: #303 *TCE*

TFE was established in 2003 as the manufacturer of semiconductor IC testing equipment. As a global enterprise opening a positive and progressive future, we take creative and innovative management and realization of human values as our top priority. Based on long investments and advanced manpower, we have prepared total solution in semiconductor IC testing through continued R&D. With advanced technology, we have accomplished solid, steady growth. TFE aims at creating Customer Benefit throughout maximizing the mutual synergy of all Final Test hardware including Handler Change Kit, Test Socket, Device Interface Boards & Burn In Test Board. TFE is expert and No. 1 supplier for Memory, Non-Memory Pick & Place handler Change Kits & Test board in Korea. Not only Fast delivery, Reasonable prices and Reliable Quality, ‘TFE provides our own unique idea to improve Test environments.(Higher Yield, Less Jam rate & damage on devices)’.

Fred Megna

T.I.P.S. Messtechnik GmbH

Booth: #611 *TCE*

Probe Cards for High Power, Magnetic, Pressure, Radiation Sensors, Mixed Signal Devices, Automotive RADAR Power KGD – Contact Units TIPS Probe Refresher

Rainer Gaggl


Booth: #503 *TCE*

Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.

Greg Hunt


Booth: #509

As a Technology and Science Enabler in the field of Semiconductor Test and Display Test, TSE has eveloped the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994, it has engaged as a leader in interface systems for Semiconductor Test. Main Products: Probe Card, Interface Board, Load Board, STO-ML(STF)

Shin-Je Woo


Booth: #103 *TCE*

At Turbodynamics, we view ourselves as a service provider for cutting-edge technology in the semiconductor industry. We provide our customers with solutions for their automatic test equipment that are individually tailored to their needs. And we develop innovative solutions on our own initiative. Our first product, the compact locking element P-DockⓇ, is now successfully in use worldwide and forms the benchmark in semiconductor test. The success story of P-DockⓇ we repeat according to the same principles: listen to our customers, develop solutions and deliver reliably.

Benedikt Pongratz

Vermont Microtechnologies

Booth: #107

Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.

Caleb Harwood

vermont microtechnologies
WILL Instrument

Booth: #613

Will Instrument is providing the equipment for vertical probe card manufacturing. In SWTest 2023 exhibition, we’d like to introduce our brand new equipment, Automated Vertical Probe Pin Insert System. We’re looking forward to meet you in our booth, and hope you experience the latest technology that we’re offering!

Harry An

WinWay Technology

Booth: #413

WinWay Technology Co., Ltd. designs, manufactures, processes, and sells optoelectronic product test fixtures, integrated circuit test interfaces, and fixtures and their components in Taiwan, the United States, China, Europe, Canada, and Asia. Its products include coaxial, spring probe, and PoP sockets; elastomers; vertical and WLCSP probe cards; and thermal control systems, high performance heat sink lids, high performance test sockets, changeover kits, direct docking probe cards, burn-in sockets, and contact element products. The company also engages in the provision of professional and technical support services; and import and export trade of related products. It serves semiconductor, optical, information technology, and optoelectronics industries.

Irene Li

Yokowo America Corporation

Booth: #401

As a fine connector specialist, backed by mold tooling, micro precision machining, microwave and MEMS technologies and capabilities, Yokowo develops and supplies wide variety of wafer sort testing and final test solution to memory, RF, Logic, Sensor and analog Semi-conductor companies.

Naoto Hasaka


*TCE* stands for Trivia Contest Exhibitor (visit EXPO Trivia Contest for more details)

2023 Floorplan

swtest 2023 floorplan april 30 2023 update

2023 Exhibitor Listing Coming Soon