SWTest Exhibitors

The SWTest EXPO is the Who’s Who of Industry Leaders in the Semiconductor Wafer Test Industry.

The top probe card, probe equipment and related service suppliers will showcase the latest products and services at SWTest 2023.

Last Updated: January 17, 2023 6:05 pm PST

Booth: TBD

Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

Advanced Probing Systems

Booth: TBD

The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, beryllium copper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material. Lower your overall cost of testing by using APS’s quality probe needles.

Jerry Broz

advanced probing systems
Aehr Test Systems

Booth: TBD

Aehr Test Systems is a worldwide supplier of burn-in test equipment and pioneer of Wafer Level Test & Burn-in (“WLTBI”) FOX platform Wafer level and singulated die/module stabilization and infant mortality test is being commercially adopted across multiple markets – Power devices (Gallium Nitride, Silicon Carbide) – Silicon Photonics (Gallium Arsenide, Indium Phosphide) – 2D/3D sensors (LEDs/VCSELs) – Discrete memories (DRAM, NAND) – MCUs/embedded memories FOX platform has been adopted and validated by industry-leading companies.

Tom Trexler


Booth: TBD

AEM Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer level and other advanced packages.

Michael Siebert

Celadon Systems

Booth: TBD

Celadon Systems, a wholly-owned subsidiary of MPI, is a well-established 20-year-old US-based company known for providing “Peace of Mind” probing solutions to the semiconductor industry.
Celadon probe cards are known for thriving in temperature extremes while still delivering accurate and precise test results.
Expect millions of touchdowns with Celadon probe cards. Celadon delivers the lowest cost of test in the industry.
Celadon is an industry leader in parametric probe both in production and in the lab.

Garrett Tranquillo

Chunghwa Precision Test Tech. Co., Ltd.

Booth: TBD

Chunghwa Precision Test Tech. Co., Ltd. (CHPT) was founded on Aug. 26, 2005. It was located in Pingzhen Industrial Park, Taoyuan City. CHPT was the high-speed PCB team in the Chunghwa Telecom Laboratories. We have been focusing on the interface board services required for testing in the semiconductor industry since 2001. Our primary products are Load Board for IC test, probe PCB for wafer test, substrate for vertical probe card and DUT board for memory test.

Brian Chang

Complete Probe Solutions Inc.

Booth: TBD

Complete Probe Solutions is proud to announce the availability of the new APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems.

Kevin Chandler


Booth: TBD

As a global company working with leading manufacturers to enable ongoing advancement in technology, Entegris has a global infrastructure that includes strategically placed manufacturing sites, R&D facilities, and customer support centers. We make infrastructure investments that put us closer to our customers in all global regions. Our highly skilled team members, facilities and resources are right where you need them to help you solve your most advanced technology challenges. Entegris is a leading supplier of highly engineered cleaning materials used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW). Our critical materials and turnkey products enable device manufactures and foundries to maximize uptime and throughput for substantial cost of test savings.

Sandrine Demal

ERS electronic GmbH

Booth: TBD

ERS electronic GmbH, based in Germering close to Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing. ERS also supplies the Advanced Packaging market with its fully automatic and manual debonding and warpage adjust tools used for Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies up to 650 x 650 mm format. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide.

Bernd Krafthöfer

esmo USA

Booth: TBD

Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan, we are truly global. We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.

Homan Amin

Feinmetall GmbH

Booth: TBD

Since 1964 FEINMETALL GmbH is a leading company for spring contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments. It does not matter where in this world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe. Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards. Even for the most difficult contact-making tasks, highly specialized development and engineering teams we find the best possible solutions for our customers.

Helmut Seefeldt

Feinmetall GmbH logo

Booth: TBD

Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.

John Wu


Booth: TBD

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.

By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

Cameron Harker

Heraeus Deutschland GmbH & Co. KG

Booth: TBD

Heraeus Precious Metals is a world leader in precious metal services and products. For the use of probe cards and the wafer test industry, the product range comprises a variety of alloys for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and/or withstand corrosion effects strongly. Heraeus Precious Metals brings together all activities in the precious metals cycle from trading to precious metals production to recycling.

Nail Akrouti

Instec, Inc.

Booth: TBD

Instec manufactures precision temperature-controlled scientific instruments for optical measurements. Applications include electrical probing, biological research, material science, and more. Instec offers many standard products for use with all optical systems and offers customization to match any instrument or specifications.

Alec Laws

Integrated Technology Corporation

Booth: TBD

Manufacturer of probe card analyzers and power semiconductor dynamic test systems.

Mark McLaren


Booth: TBD

inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.

William Ira Wyckoff

intest ems
IWIN Co., Ltd.

Booth: TBD

IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price

AJ Park


Booth: TBD

JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC, Flip-chip, WLCSP), image sensors and parametric test application. As semiconductor factories have expanded globally, JEM organizes a global manufacturing network in Japan, Asia, USA, and Europe to support customers’ needs in each region. JEM expands sales by creating JEM technology roadmap and sales strategies based on demands from global customers and technology roadmap of the semiconductor industry. With our global strategies and proactive development actions, JEM is striving to provide probe cards that exceed the demands of our customers. Our comprehensive probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. In addition, we offer custom design and fabrication services for printed circuit boards and space transformers.

Karen Wong

Johnstech International

Booth: TBD

JOHNSTECH INTERNATIONAL is a global R&D leader in the field of microcircuit testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works together with the world’s most respected OSATs, foundries, and EDA companies to develop the most precise and dependable test contactors and test sockets on the marketplace today. For more info, visit www.johnstech.com.

Jamieson Wardall

Megatouch Co. Ltd

Booth: TBD

Megatouch has own contact technology and supply high quality pin of Semiconductor, Interposer and Battery to everywhere. New concept Interposer and electroformed body to achieve the industry leader. Our goal is providing excellent quality product to global.

Alex Lee


Booth: TBD

MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets, for the semiconductor industry.

John Caldwell

MPI Corporation

Booth: TBD

MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI is dedicated to producing a state-of-the-art probing tool that enhances the speed of worldwide semiconductor technology migration.

Cahris Lin

NTK Technologies, Inc.

Booth: TBD

At NTK Technologies, we build robust packages for complex applications. However, our innovation helps to advance many of the technologies and products that improve people’s lives. Computers, optical communication, wireless networks, medical devices, automotive, space and aeronautics — many of the applications in these markets would not be possible without the technology that NTK provides. Whether it’s IC packaging, peizoelectronics, ceramic filters, fine ceramics, or ceramic cutting tools, NTK is there providing these vital components that make it possible for the technologies that we use every day to exist.

Otto Liang

Oxford Lasers

Booth: TBD

Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.

Alan Ferguson

oxford lasers
Posalux SA

Booth: TBD

Experiencing challenges to process small holes and tiny probes? As a machine tool manufacturer, Posalux offers reliable µ-machining solutions for mass production environments. To best answer your requirements of small holes with tight pitch as well as wafer and wire probes, we develop new ways to produce and manufacture parts. With our FEMTO-LASER μ-machining equipment, you will be able to perform various processes like drilling, cutting, and turning in almost all materials.

Angelo Rizzo


Booth: TBD

Prober.com is one of the longest running companies dedicated to refurbishment and resale of wafer prober lines. We offer complete sourcing and parts support for our customers. We pride ourselves in the satisfaction of our customers and we partner with them to provide solutions to capacity needs in a timely manner. We work with our customers to plan for large and small capacity increases as well as integrating thermal and OCR solutions for their changing test requirements.

Dennis Bonciolini


Booth: TBD

PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

Jordan Mackellar

R&D Altanova, Advantest Group

Booth: TBD

Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

Junko Nakaya

Reid-Ashman Manufacturing

Booth: TBD

Reid-Ashman Manufacturing Incorporated is a fully integrated engineering, manufacturing, and service company specializing in providing solutions for the semiconductor test industry. Established in “The Silicon Valley”, California in 1978; we are now headquartered in Saint George, Utah with sales and service personnel located around the world. Although we provide world-class engineering and manufacturing services for virtually any industry, we are primarily known for inventing the test head manipulator. It is our goal to continually lead through innovation, quality, and dedication to our customers and their evolving needs. Reid-Ashman is a vertically integrated organization, maintaining control of the entire manufacturing process. All production, engineering, QA, machine-shop, crating, paint-shop, shipping & receiving, and main-office functions are located in three buildings on the 5 acre Reid-Ashman site in St. George, Utah.

Martin Kurtz

Riff Company Inc.

Booth: TBD

Machine shop specializing in ceramic drilling and machining

Daniel McCormick

riff company co
Rika Denshi America Inc.

Booth: TBD

Rika Denshi offers a broad array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing.

Pete Blitchington


Booth: TBD

The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.” SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns. SEMICS has always brought ‘trust’ to our partners. Offering “trust“ is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far. SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.


Smiths Interconnect

Booth: TBD

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.

smiths interconnect

Booth: TBD

Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

Sara Monfreda

STAr Technologies, Inc.

Booth: TBD

STAr’s MEMS probe cards enables WAT tests for femto-ampere low-leakage current tests and 35um-pitch requirements. STAr further enables SoC ICs tests with MEMS vertical probe cards down to 45um pitch and >2A driving current. Our one-touch 3D MEMS micro-cantilever probe cards can significantly lower Cost-of-Test for Flash memory ICs by enabling tri-temperature tests with just one probe card. In addition, STAr supplies MEMS probe cards to CMOS image sensor (CIS) customers with C-PHY tests at >3.5GSPS and with next generation 6GSPS in development.

star technologies
Synergie Cad Group

Booth: TBD

YOUR PARTNER FOR ALL TEST SOLUTIONS We are the preferred partner of large and small semiconductor industry players since 1986. With over 30 years of experience, our high-performance solutions maximize yield improvements while ensuring the most competitive cost of test over our product lifetime.

Malcolm Owens

Technoprobe America Inc

Booth: TBD

Technoprobe is a leading provider of the most advanced wafer test solutions for the semiconductor industry. Headquartered in Cernusco Lombardone (LC), in Italy, Technoprobe has 14 offices worldwide, in Europe, Asia and the United States. The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio, ranging from Cantilever , 2D-3D MEMS Vertical and Spring pin technology, motherboards, final test boards, advanced micromachining, AI, and advanced manufacturing capable of meeting complex requirements and reducing the overall cost of test.

Marita F. Villarreal


Booth: TBD

As a leading global company of innovative semiconductor and flat panel display (FPD) production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.

Doug Heins


Booth: TBD

Teradyne tests and helps build the world’s most innovative products. Our leading-edge testers and interface hardware make sure that new products work right the first time, every time. Our portfolio of industrial automation solutions helps manufacturers to develop and deliver new products quickly, efficiently and cost-effectively.

Eric Shoemaker

T.I.P.S. Messtechnik GmbH

Booth: TBD

Probe Cards for High Power, Magnetic, Pressure, Radiation Sensors, Mixed Signal Devices, Automotive RADAR Power KGD – Contact Units TIPS Probe Refresher

Rainer Gaggl

Vermont Microtechnologies

Booth: TBD

Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.

Caleb Harwood

Yokowo America Corporation

Booth: TBD

As a fine connector specialist, backed by mold tooling, micro precision machining, microwave and MEMS technologies and capabilities, Yokowo develops and supplies wide variety of wafer sort testing and final test solution to memory, RF, Logic, Sensor and analog Semi-conductor companies.

Naoto Hasaka


2023 Floorplan

2023 expo floorplan december 18th version

2023 Exhibitor Listing Coming Soon

Back to top