2024 SWTest Exhibitors

The SWTest EXPO is the Who’s Who of Industry Leaders in the Semiconductor Wafer Test Industry.

The top probe card, probe equipment and related service suppliers will showcase the latest products and services at SWTest 2024.

2024 Exhibitor Listing Will be Available in early 2024

Last Updated: May 22, 2024 8:55 am PST

*TCE* stands for Trivia Contest Exhibitor (visit EXPO Trivia Contest for more details)

ACCRETECH

Booth: 503
www.accretech.jp

Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

accretech tokyo seimitsu
Advanced Probing Systems, Inc.

advancedprobing.com

Advanced Probing Systems, Inc. (APS) is the global leader in the manufacture of probe needles used in wafer sort testing, LCD probe testing and LED probe testing, various nanotechnology probe applications, medical electrodes, spotting pin blanks for genome testing, ion emitters and a variety of other industrial applications.

Ed Johnson
ejohnson@advancedprobing.com

advanced probing systems
Aehr Test Systems

Booth: 310 *TCE*
aehr.com

Aehr Test Systems is a worldwide provider of test systems for burning-in and testing logic, optical and memory integrated circuits and has over 2,500 systems installed worldwide. Increased quality and reliability needs of the Automotive and Mobility integrated circuit markets are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products in package, wafer level, and singulated die/module level test.

Tom Trexler
ttrexler@aehr.com

Celadon Systems, Inc.

Booth: 404
www.celadonsystems.com

Celadon Systems, a wholly-owned subsidiary of MPI, is a well-established 20-year-old US-based company known for providing “Peace of Mind” probing solutions to the semiconductor industry.

Celadon probe cards are known for thriving in temperature extremes while still delivering accurate and precise test results. Expect millions of touchdowns with Celadon probe cards. Celadon delivers the lowest cost of test in the industry.

Celadon is an industry leader in parametric probe both in production and in the lab.

Garrett Tranquillo
salesteam@celadonsystems.com

Chunghwa Precision Test Tech. Co., Ltd.

Booth: 211
www.cht-pt.com.tw

CHPT, one of the leading providers of semiconductor test interface products, employs a unique strategy that sets it apart from much of the industry. Our vertically integrated approach operates on an “All in House” business model. By utilizing the talent of our experts in the fields of electronics, chemistry, mechanics, and optics, we are able to create a win-win situation with customers and innovate at the pace of the ever-changing semiconductor industry. CHPT was established in Taoyuan, Taiwan in 2005, listed for trading on the Taipei Exchange in 2016 (stock code 6510), and relocated to a new R&D operational headquarters in 2019.

Paul Tai
paul_tai@chpt.com

chpt
Cohu, Inc.

Booth: 603
www.cohu.com

Cohu, Inc. (NASDAQ: Cohu) is a global leader in test and handling equipment, thermal subsystems, interface solutions, vision inspection and MEMS test solutions, and a leader in printed circuit board test. We deliver leading-edge solutions to enable a smarter, safer, and more connected future. Cohu offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop-shop for test and handling equipment, thermal subsystems, test contacting, vision inspection, and MEMS test solutions. Our enhanced product portfolio gives our customers the best possible combination of technologies to match their business and technical needs. Cohu has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods. Learn more: https://www.cohu.com/interface-solutions

Dan Campion
dan.campion@cohu.com

cohu
Complete Probe Solutions Inc.

Booth: 206
completeprobesolutions.com

Complete Probe Solutions is proud to announce the availability of the new APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems.

Kevin Chandler
kchandler@completeprobesolutions.com

complete probe solutions inc
cyberTECHNOLOGIES

Booth: 213 *TCE*
cybertechnologies.com

cyberTECHNOLOGIES is a world leading manufacturer of high-end 3D surface metrology systems for industrial and scientific applications. Based near Munich / Germany cyberTECHNOLOGIES provides major global and small companies in the semiconductor, and (micro)electronics industry with metrology solutions for production and R&D. The system range includes compact tabletop setups (Vantage-Series), versatile systems (CT-series) for samples up to 24 x 24 inches (600 x 600 mm) and fully automated metrology cells with sample handling (AL-series). The modular multi-sensor technology is suitable for vast variety of applications, delivering high accuracy in micrometers (µm) and nanometers (nm). With a worldwide network of qualified partners, distributors and representatives, cyberTECHNOLOGIES is a strong global player our customers can count on.

Karl-Heinz Strass
karl-heinz.strass@cybertechnologies.com

DIS Tech

Booth: 512
technoprobe.com

DIS Tech is the largest test interface hardware supplier to the Semiconductor industry.  Our final test and probe interface boards are used by the world’s major semiconductor suppliers across major segments such as AI and high-performance computing, mobile communication, and automotive electronics. Our interface solutions enable our customers to test their chips from wafer sort to module and system test with the highest quality and performance.

DIS Tech started as the Device Interface Solutions (DIS) business unit of Teradyne’s Semiconductor Test Division building test interfaces for the past 20 years.  In 2023, Technoprobe, the world’s leading probe head manufacturer, entered a strategic partnership with Teradyne which resulted in the acquisition of the DIS business unit and established DIS Tech as a wholly owned subsidiary.  

Our mission is to deliver interface hardware solutions that enable the highest production yield, throughput, and quality. To support this mission, we closely partner with customers at their development and manufacturing centers around the world. DIS Tech is headquartered in Taiwan and has over 400 talented team members and industry experts in technology development, design & manufacturing, and support around the world.

Steve Ledford
steve.ledford@technoprobe.com

Elevate Semiconductor

Booth: 102
elevatesemi.com

Elevate Semiconductor is the world’s leading manufacturer of IC’s for Semiconductor test.

Kurt Erikson
kerikson@elevatesemi.com

elevate semiconductor
Elohim

Booth: 111
elohiminc.com

Elohim is a semiconductor passive device manufacturing company with a main product of deep trench silicon capacitor. Our silicon capacitor is proven to have high stability and reliability compared to off-the-shelf capacitors and can be used in several applications including mobile/HPC, data center, device tester, etc.

Samuel Lim
sglim@elohiminc.com

Entegris

Booth: 500 *TCE*
www.entegris.com

Entegris, Inc. (NASDAQ: ENTG) is a world-class supplier of advanced materials and process solutions for the semiconductor, life sciences, and other high-tech industries. For over 50 years, we have been committed to solving our customers’ most demanding process challenges through a broad solutions portfolio, collaborative and innovative product development, and a focus on science and applications knowledge. Entegris has ~9,000 employees throughout its throughout its global operations and is ISO 9001 certified. It has manufacturing, customer service, and/or research facilities throughout United States, Canada, China, France, Germany, Israel, Japan, Malaysia, Singapore, South Korea, Taiwan and the United Kingdom. Our highly skilled team members, facilities and resources are right where you need them in order to help you solve your most advanced technology challenges.

entegris
ERS electronic GmbH

Booth: 212 *TCE*
www.ers-gmbh.com

ERS electronic GmbH, based in Germering close to Munich, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65°C to +550°C for analytical, parameter-related and manufacturing probing. ERS also supplies the Advanced Packaging market with its fully automatic and manual debonding and warpage adjust tools used for Fan-Out Wafer-Level-Packaging (FOWLP) and Panel-Level-Packaging (FOPLP) technologies up to 650 x 650 mm format. Our headquarter, sales department, engineering center and production facilities are in the Munich suburb of Germering, and we also have sales and support offices worldwide.

Bernd Krafthöfer
krafthoefer@ers-gmbh.de

e-r-s
esmo USA

Booth: 412 *TCE*
www.esmo-group.com

Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan, we are truly global. We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.

Homan Amin
sales@esmo-usa.com

esmo semicon
Exaddon AG

Booth: 605
probes.exaddon.com

Template-free 3D Printing via Local Electrodeposition : No heat, no lasers, no layers. Metal is deposited directly in place, with submicrometer resolution. Printed material is mechanically stable with excellent conductivity and tensile strength.

Edgar Hepp
edgar.hepp@exaddon.com

Feinmetall GmbH

Booth: 204
www.feinmetall.com

Since 1964 FEINMETALL GmbH is a leading company for spring contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments. It does not matter where in this world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe. Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards. Even for the most difficult contact-making tasks, highly specialized development and engineering teams we find the best possible solutions for our customers.

Helmut Seefeldt
helmut.seefeldt@feinmetall.de

Feinmetall GmbH logo
Ferrotec USA Corp.

Booth: 501
www.ferrotec.com

Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.

John Wu
john.wu@ferrotec.com

ferrotec
FormFactor, Inc.

Booth: 403 *TCE*
formfactor.com

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

Cameron Harker
cameron.harker@formfactor.com

Gel-Pak

Booth: 305
gelpak.com

For over 40 years, Gel-Pak®, a division of Delphon, has been a leading manufacturer of Gel-coated device carriers and films extensively used in semiconductor applications. Our carriers secure valuable components during shipping, handling, and processing while the proprietary film products serve a wide range of applications including fixturing and surface protection. As the manufacturer of the original Gel-Wafer, Gel-Pak has recently re-entered the probe tip cleaning market with the enhanced Gel-Probe™ product line which includes the Gel-Probe ReFine and Gel-Probe ReMove products. Gel-Probe ReFine polishing wafers and sheets are comprised of a unique Gel elastomer based material blended with abrasive particles that provide an effective solution for eliminating embedded and bonded debris from probe tips. Our Gel-Probe ReMove wafers and sheets feature an exclusive non-abrasive Gel-based polymer, optimized for efficiently cleaning loose debris from probe tips.

Jerry Broz
jbroz@delphon.com

Heraeus Deutschland GmbH & Co. KG

Booth: 309 *TCE*
www.herae.us/probing

Heraeus Precious Metals is globally leading in the precious metals industry. For the use of probe cards and the wafer test industry, the product range comprises a variety of alloys for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and/or withstand corrosion effects strongly. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to recycling. It has extensive expertise in all platinum group metals as well as gold and silver. By 2025 Heraeus Precious Metals will be the first company in the industry that operates carbon neutral.

Nail Akrouti
nail.akrouti@heraeus.com

Hioki USA Corp

Booth: 604 *TCE*
hioki.com

For over 80 years, Hioki has been driven by a singular passion: empowering your success through cutting-edge technology and exceptional products. We understand your need for reliable, accurate, and innovative measurement solutions. Our unwavering commitment to advancements in sensing, high-frequency measurement, and electrochemistry is evident in our legacy of pioneering technologies, such as no-metal-contact voltage and high-sensitivity current measurement. These innovations are a testament to our dedication to exceeding your expectations and driving the industry forward. With our dedication to excellence, we have developed Probe Card Analyzers that offer unparalleled performance, pushing the boundaries of accuracy and reliability. We firmly believe in the power of innovation to elevate your work and contribute to the betterment of society. Let us showcase how our expertise and unwavering commitment to progress can unlock new possibilities for your business.

Ichihiko Uchibori
ichiu@hiokiusa.com

HTT High Tech Trade GmbH

Booth: 113
www.httgroup.eu

The privately held htt group was founded in 1988 in Munich. Under the mission statement “Reliability and a unique value for customers and Suppliers “, the focus of the htt group is to be a major supplier to the Semiconductor Industry by representing well-known leading manufacturers of systems and consumables, tools for Wafer Fab, Wafer Sort, Wafer Probe, Wafer Test, Final Test, Assembly and Backend. Additionally, since 1992 the htt Dresden Probecards facility is designing, developing, producing high sophisticated Epoxy-Cantiler Probe Cards, as well as Probe Card Specials, Miniprober and the Dresden Service Center is providing Repairs to all kind of Standard and Advanced Probe Cards. The European Probe Cards Repair- and Servicecenter in Dresden is ISO 9001: 2015 certified and covers Standard htt Dresden built Probecards as well as the Advanced Probe Cards from MPI Taiwan. Since this year, htt Dresden is the new Service Center for Repairs of all kinds of CELADON Probe Cards.

David Liese
dliese@httgroup.eu

Instec, Inc.

Booth: 303
instec.com

Instec Inc. manufactures precision temperature-controlled scientific instruments for any application. Instec instrument solutions include miniature probing stages, miniature probing stations, full-size probing stations, wafer chucks, thermal stages, compact thermal plates, and much more. Instec products combine precision temperature control with optical access and application specific features such as electrical probers to meet the needs of any experiment or industry.

Alec Laws
sales@instec.com

instec
Integrated Technology Corporation

Booth: 611 *TCE*
www.inttechcorp.com

Manufacturer of probe card analyzers and power semiconductor dynamic test systems.

Mark McLaren
markm@inttechcorp.com

itc - integrated technology corporation
Integrated Test Corporation

Booth: 109
integratedtest.com

PCB Design, Simulation, Fabrication, assembly and test hardware solutions in Dallas, TX. Certified WBE and WOSB.

Dana Freeman
dfreeman@integratedtest.com

integrated test
inTEST EMS

Booth: 311 *TCE*
www.intest-ems.com

inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.

Bill Wyckoff
b.wyckoff@intest-ems.com

intest ems
IWIN Co., Ltd.

Booth: 606 *TCE*
www.iwinsn.com

IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price

AJ Park
aj@iwinsn.com

JCM JAPAN Co., Ltd.

Booth: 107
ja.jcmchina.com

JCM JAPAN Co., Ltd. was established in Tokyo, Japan in 2009. We have offices and production bases in Japan and China. The Japanese office is in Tokyo, Japan, and the factory is located in Shizuoka Prefecture. The Chinese offices are located in Shenzhen and Shanghai, China, and the factory is located in Shenzhen. Factories in China and Japan are equipped with advanced equipment and professional operating staff. We are mainly engaged in the sales and processing of high-grade engineering plastics into the sizes desired by customers, as well as the production of precision machined parts. Our products enjoy a high reputation in the market because we always insist on using the highest quality raw materials and utilizing the latest and stable technology for production, which allows our products to always meet or even exceed our customers’ expectations.

Jiang Zhenliang
z-jiang@jcmchina.com

JEM America Corp

Booth: 302 *TCE*
jem-net.co.jp

JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC, Flip-chip, WLCSP), image sensors and parametric test application. As semiconductor factories have expanded globally, JEM organizes a global manufacturing network in Japan, Asia, USA, and Europe to support customers’ needs in each region. JEM expands sales by creating JEM technology roadmap and sales strategies based on demands from global customers and technology roadmap of the semiconductor industry. With our global strategies and proactive development actions, JEM is striving to provide probe cards that exceed the demands of our customers. Our comprehensive probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. In addition, we offer custom design and fabrication services for printed circuit boards and space transformers.

Karen Wong
sales@jemam.com

j-e-m
Johnstech International

Booth: 201
www.johnstech.com

JOHNSTECH INTERNATIONAL is a global R&D leader in the field of semiconductor testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works hand-in-hand with the world’s most respected OSATs, foundries, and IDMs to develop the most precise and dependable test contactors on the marketplace today.

Jamieson Wardall
jbwardall@johnstech.com

KSMT

Booth: 101
www.ksmt.com/tw

KEYSTONE MICROTECH(KSMT) provides PCB board design, SI/PI/Thermal simulations, manufacturing, and full component and mechanical assembly on ATE load board, probe card, burn-in board, and system level test boards. We offer global support and are not only providing our customers with a product but with a turnkey service as well.

James Lu
james.lu@ksmt.com.tw

Laser Job Inc.

Booth: 202
www.laserjob.co.jp

We are providing Laser Drilling services to Probe Card Manufacturers.

Yoshitaka Yamaguchi
y-yamaguchi@laserjob.co.jp

laser job
Lincstech Co., Ltd.

Booth: 401 *TCE*
lincstech.com

On October 1, 2021 the Lincstech Group made a fresh start as an independent manufacturer specializing in printed wiring boards (PWBs).

As the PWB division of Hitachi Chemical and Showa Denko Materials, we have accumulated distinctive and advanced technologies over the past 50 plus years. We have also built connections and trust with our customers by listening to them and proposing solutions to improve the value of their products and services.

Our company name, Lincstech, is a combination of Link + C + Technology. Our company name incorporates our desire to provide value to our customers by using technology to connect the various “Cs” (communication, collaboration, co-creation…) that we consider important.

At Lincstech we are proud that our printed wiring boards assist our customers in realizing superior value in their products and services.

Satoko Goto
goto.satoko.ra@lincstech.com

LST America Inc.

Booth: 104
www.lst-tek.co.kr

LST has been providing test solutions since 2008 in South Korea. Our expertise is in the test socket, interposer, probe pin, test board, SMT, and assembly. Customized solutions are also welcome to be discussed. Short lead times, reasonable pricing, and highly reliable quality are the factors of LST.

Dahee Yoon
dahee@lst-tek.co.kr

LST
MarTek Inc.

Booth: 313
martekprober.com

MarTek, Inc. is a leading provider of semiconductor Wafer Probe solutions. Established in 1995, our company is dedicated to developing innovative technologies that enhance the efficiency and quality of semiconductor manufacturing and testing processes. Over the years, we have built a strong reputation for delivering state-of-the-art solutions to meet the evolving demands of the Semiconductor industry.

John Luis
marketing2024@martekprober.com

Megatouch Co. Ltd

Booth: 513
www.megatouch.co.kr

Megatouch has own contact technology and supply high quality pin of Semiconductor, Interposer and Battery to everywhere. New concept Interposer and electroformed body to achieve the industry leader. Our goal is providing excellent quality product to global.

Alex Lee
alex@megatouch.co.kr

megatouch
MJC Electronics Corp.

Booth: 411 *TCE*
www.mjc.co.jp

MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.

John Caldwell
johnc@mjcelectronics.com

mjc logo
MPI Corporation

Booth: 406 *TCE*
mpi-corporation.com

MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI is dedicated to producing a state-of-the-art probing tool that enhances the speed of worldwide semiconductor technology migration.

Cahris Lin
cahris.lin@mpi-corporation.com

MPI
Nidec SV Probe Inc.

Booth: 400 *TCE*
www.nidecsvprobe.com

Nidec SV Probe is a leading provider of high-quality semiconductor testing solutions. With a diverse product line that includes MEMSFlex™, a range of customizable MEMS probes/probe cards and a variety of other probe card technologies, we supply advanced testing products for some of the most complex RF, 5G, Mobile, Automotive and IoT devices. Nidec SV Probe’s unmatched manufacturing and support infrastructure provides coverage for major semiconductor regions across the globe. We have full design and manufacturing capabilities in the USA, China, Japan, Taiwan and Singapore.

Gary Luu
gluu@nidecsvprobe.com

NTK Technologies, Inc.

Booth: 200
www.ntktech.com

At Niterra NTK Technologies, INC., we build robust packages for complex applications. Computers, optical communication, wireless networks, medical devices, automotive, space and aeronautics — many of the applications in these markets would not be possible without the technology that Niterra provides.

Oxford Lasers

Booth: 505 *TCE*
www.oxfordlasers.com

Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.

Alan Ferguson
Alan.Ferguson@oxfordlasers.com

oxford lasers
PointEngineering

Booth: 100
www.pointeng.co.kr

PEC has been serving the needs of our customers who play in the semiconductor fields for more than 26 years. Our providing technologies are ceramic coating and substrate that can control specified micro-patterns by MEMs process. Now we have shown a unique ceramic substrate in the finer mold for various micro-pins and guide plates for logic and memory devices.

David Song
thsong@pointeng.co.kr

Posalux SA

Booth: 408 *TCE*
posalux.com

Experiencing challenges to process small holes and tiny probes? As a machine tool manufacturer, Posalux offers reliable µ-machining solutions for mass production environments. To best answer your requirements of small holes with tight pitch as well as wafer and wire probes, we develop new ways to produce and manufacture parts. With our FEMTO-LASER μ-machining equipment, you will be able to perform various processes like drilling, cutting, and turning in almost all materials.

Valentin Beuchat
vbeuchat@posalux.com

Prober.com

Booth: 301
www.prober.com

Prober.com is one of the longest running companies dedicated to refurbishment and resale of wafer prober lines. We offer complete sourcing and parts support for our customers. We pride ourselves in the satisfaction of our customers and we partner with them to provide solutions to capacity needs in a timely manner. We work with our customers to plan for large and small capacity increases as well as integrating thermal and OCR solutions for their changing test requirements.

Dennis Bonciolini
dennis@prober.com

Protec MEMS Technology Inc.

Booth: 608
www.pmt23.com

Since its foundation in 2004, Protec MEMS Technology Inc. has been constantly growing as the next generation Probe Card Supplier. Protec MEMS Technology Inc. is the solution provider for diverse test products related to technology with MEMS Application, including Probe Card and many others.

Kevin Lee
leek17@pmt23.com

PTSL

Booth: 307 *TCE*
probetestsolutions.com

PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

David Glatley
dglatley@probetestsolutions.com

Qualmax Inc.

Booth: 110 *TCE*
www.qualmax.com

Semiconductor probe and probe head manufacturer.

Behrouz Sadrabadi
bsadrabadi@qualmax.com

qualmax experience maximum quality
R&D Altanova, Advantest Group

Booth: 300
www.advantest.com

Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

Bassam Asfoor
bassam.asfoor@advantest.com

r and d altanova advantest group
Reid-Ashman Manufacturing

Booth: 613 *TCE*
reidashman.com

Established in 1979 and based in St. George, Utah, Reid-Ashman Manufacturing is a distinguished provider of complete solutions for semiconductor test equipment integration. Our company excels in delivering superior custom engineering designs and manufacturing services, specializing in Test Head Manipulators, Mechanical Docking, and Electrical Interfacing. Committed to excellence, we prioritize the delivery of exceptional quality across all facets of our products and services. With a global presence, our seasoned team ensures that our solutions adhere to the most rigorous industry standards. At Reid-Ashman Manufacturing, our objective is to consistently lead the market through a commitment to innovation, uncompromising quality, and dedicated responsiveness to our clients’ evolving needs.

Chris McArthur
cmcarthur@reidashman.com

reid ashman
Samtec

Booth: 602
www.samtec.com

Samtec is the service leader in the electronic interconnect industry and a global manufacturer of Connectors, Cables, Optics and RF Systems, with full channel system support from the IC to the board and beyond.

Pete Robinson
pete.robinson@samtec.com

SEMICS Inc.

Booth: 507
www.semics.com

The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.” SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns. SEMICS has always brought ‘trust’ to our partners. Offering “trust“ is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far. SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.

sales1@semics.com

Sigma Sensors TCL GmbH

Booth: 112
sigma-sensors.com

Sigma Sensors is a temperature calibration laboratory, manufacturing calibration wafers for automated wafer probers. Our advanced automation options make temperature calibration a hands off process ensuring documentary compliance, enabling confidence while simultaneosly decreasing engineer workload resulting in unmatched ROI of 3-6 months. Sigma Sensors also calibrates third party wafers in Europe, the US and Asia.

Austin Ibele
info@sigma-sensors.com

sigma sensors
Solarius Development

Booth: 601
solarius-inc.com

Solarius Development is a leading provider of precision systems for non-contact surface inspection, measurement and analysis to serve Semiconductors, Electronics, Medical and Energy customers. Our systems combine high-resolution sensors with automated data acquisition and powerful analysis tools range from desktop systems for off-line inspection, to customized multi-station platforms for high-volume in-line inspection. The company’s headquarter is in San Jose, California. Our global reach includes Solarius entities in China (Shanghai), Europe (Munich and Essen) responsible for sales, application engineering, customer support, and product development. Augmented by our international partner network Solarius takes care for an installed base exceeding 2,000 active metrology systems worldwide.

STAr Technologies, Inc.

Booth: 509 *TCE*
www.star-quest.com

STAr enables SoC ICs testing with MEMS vertical, high pin count probe cards down to 45um pitch and >2A driving current over tri-temperature. Our one-touch 3D MEMS micro-cantilever probe cards can significantly lower Cost-of-Test for Flash memory ICs by enabling tri-temperature tests with just one probe card. In addition, STAr supplies MEMS probe cards to CMOS image sensor (CIS) customers with C-PHY tests at >3.5GSPS and with next generation 6GSPS in development. STAr’s MEMS probe cards enables WAT tests for femto-ampere low-leakage current tests and 35um-pitch requirements.

star technologies
Synergie Cad Group

Booth: 402 *TCE*
www.synergie-cad.com

YOUR PARTNER FOR ALL TEST SOLUTIONS We are the preferred partner of large and small semiconductor industry players since 1986. With over 30 years of experience, our high-performance solutions maximize yield improvements while ensuring the most competitive cost of test over our product lifetime.

Malcolm Owens
m.owens@synergie-cad.com

TANAKA Kikinzoku International (America), Inc.

Booth: 410
tanaka-preciousmetals.com

Since its foundation in 1885, TANAKA Precious Metals has built a diversified range of business activities focused on precious metals. TANAKA is a leader in Japan regarding the volumes of precious metals handled. A wide range of precious metal materials are available as probe pins for inspections conducted in the front-end and back-end processes of semiconductor manufacturing. We have a lot of type of material that can be applied to a wide range of probe pin types, such as the cantilever type and the vertical type for wafer testing (front-end process) probe cards.

Marita F. Villarreal
marita.villarreal@technoprobe.com

Technoprobe

Booth: 510 *TCE*
technoprobe.com

Innovation Begins with Us

Technoprobe (XMIL: TPRO) is a leading provider of the most advanced wafer test solutions for the semiconductor industry.

The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio capable of meeting complex testing requirements and reducing the overall cost of test.

Technoprobe works relentlessly to keep pace with the constant evolution of semiconductors. Our culture to drive Innovation leads us to explore new concepts, to push Technology beyond its limits, and to use customization as a guiding principle to enable the next generation products.

Technoprobe strives to be the technology leader to help build our customers’ future.

Marita F. Villarreal
marita.villarreal@technoprobe.com

technoprobe
TEL

Booth: 413
www.tel.com

As a leading global company of innovative semiconductor and flat panel display (FPD) production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.

Doug Heins
doug.heins@us.tel.com

t-e-l
Teradyne, Inc

Booth: 502
teradyne.com

Teradyne companies deliver manufacturing automation across industries, applications and the world. Together, we solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI.

Eric Shoemaker
eric.shoemaker@teradyne.com

Test Tooling Solutions Group

Booth: 600 *TCE*
tts-grp.com

Being in the business since 1979, TTS Group dedicates itself to bring the best possible solutions to help our customers solve some of the most challenging issues in semiconductor test and tooling today. Right from R&D to design to simulation to validation, we focus on lowering the total cost of final test through relentless pursuit of innovation, yield, quality, reliability and on-time delivery for our customers. Our solutions range from probe heads, probe pins, and test contactors.

Mehdi Attaran
mehdiattaran@tts-grp.com

TFE Co.,LTD.

Booth: 210
tfe.co.kr

TFE is a world class innovator and manufacturer of advanced contactor, load board, and handler interface solutions for the semiconductor test industry including SoC & Memory applications. Please contact us to help resolve your most challenging test tooling requirements. TFE, The Future of Excellence!

Fred Megna
Fred@tfe.co.kr

tfe
T.I.P.S. Messtechnik GmbH

Booth: 312
www.tips.co.at

Probe Cards for HV/HC power device test (Si, SiC, GaN)
Known Good Die Test (KGD) for power device (Si, SiC: IGBT, MOSFET, Diode…)
Probe Cards for Sensors (MEMS, pressure, magnetic, gas, radiation…)
Vertical Probe Cards for Automotive ASICS, RADAR
Docking solutions for High Power probe cards (probe card, signal tower, load board suitable for automatic probe card changer)

Rainer Gaggl
office@tips.co.at

Translarity, Inc.

Booth: 203 *TCE*
translarity.com

Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.

Greg Hunt
greg.hunt@translarity.com

translarity
TSE

Booth: 511
www.tse21.com

As a Technology and Science Enabler in the field of Semiconductor Test and Display Test, TSE has enveloped the innovative technologies needed by its customers and has engaged in continuous research and productivity improvement activities. Founded in 1994, it has engaged as a leader in interface systems for Semiconductor Test. Main Products: Probe Card, Interface Board, Load Board, STO-ML(STF)

Edwin Jeong
edwinjeong@tse21.com

Turbodynamics Inc.

Booth: 105
www.turbodynamics.com

At Turbodynamics, we view ourselves as a service provider for cutting-edge technology in the semiconductor industry. We provide our customers with solutions for their automatic test equipment that are individually tailored to their needs. And we develop innovative solutions on our own initiative. Our first product, the compact locking element P-DockⓇ, is now successfully in use worldwide and forms the benchmark in semiconductor test. The success story of P-DockⓇ we repeat according to the same principles: listen to our customers, develop solutions and deliver reliably.

Benedikt Pongratz
benedikt.pongratz@turbodynamics.com

Vermont Microtechnologies

Booth: 208
vtmicro.com

Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.

Caleb Harwood
caleb@vtmicro.com

vermont microtechnologies
WinWay Technology

Booth: 612
www.winwayglobal.com

WinWay Technology Co Ltd is an IC testing interface supplier. WinWay provides services to industries such as semiconductors, optical, information technology, and optoelectronics. The main products and services include Test Sockets, Contact Elements, Probe Cards, and thermal units. The company has a presence in Taiwan, America, China, Asia, Europe, and Canada.

Rob LaNoce
sales@winwayglobal.com

yieldHUB

Booth: 103 *TCE*
www.yieldhub.com

Since 2005, yieldHUB has offered semiconductor companies a game-changing yield management platform that has helped them to improve yields, reduce scrap and get to market faster. Today, there are thousands of yieldHUB users around the world. We’ve built a reputation on smart engineering and reliable customer service, which is at the heart of everything we do. One of the many benefits we are able to offer customers are on-premise and cloud-based solutions. The idea is users can access our platform from anywhere in the world at anytime with just a web browser. Our data model is unique and hugely scalable. Our customers have the power to analyse data without having to download it first. This means they can analyse hundreds of wafers worth of data in seconds through clever data processing and innovative database design. yieldHUB development labs is always working hard in the background to bring customers the latest in yield management.

Madelaine Finucane
madelaine@yieldhub.com

Yole Group

Booth: 610
yolegroup.com

Yole Group provides market research, technology and strategy analysis, reverse engineering and costing, and photonics module performance evaluation, focused on the semiconductor industry and related fields.

John West
john.west@yolegroup.com

*TCE* stands for Trivia Contest Exhibitor (visit EXPO Trivia Contest for more details)

2024 Floorplan

AEM

Booth: #604 *TCE*
aem.com.sg

AEM Wafer Test Solutions has established leadership positions in developing and deploying application-specific test solutions for MEMS devices, offering wafer and frame probing stations suitable for R&D, Wafer Sort, and Final Test. We offer state-of-the-art solutions to test environmental and motion sensors in wafer level and other advanced packages.

Michael Siebert
michael.siebert@aem.com.sg

aem wafer test solutions
BUSCH Microsystems Consult GmbH

Booth: #102
www.busch-microsystems-consult.de

Positioning systems from Busch: Always unique. Product development, precision, durability – a promise is behind our products: To smartly solve tasks, accurately meet requirements and deliver durable quality. We design and manufacture XY, linear and lifting stages, gantry systems and XYZ axes according to the customer’s requirements. Get a quick overview here or specifically look for systems that match your demands.

sales@busch-microsystems-consult.de

busch microsystems
KATAOKA-SS America

Booth: TBD
kataokaamerica.com

KATAOKA, a manufacturer of ultra precision laser drilling equipment located in Kyoto Japan.

Kyocera International, Inc.

Booth: #113
global.kyocera.com

Kyocera, the world leader of fine ceramics, offers a wide selection of ceramic multilayer packages and substrates for space transformer, automotive, consumer device, infrastructure, industrial, testing, medical, etc.

Sho Hokonohara
sho.hokonohara@kyocera.com

kyocera
LASEA Inc.

Booth: #101
www.lasea.com

Founded in 1999, LASEA designs and manufactures workstations and special machines for applications in marking, engraving, cutting, drilling, texturing, thin film removal, welding and micromachining. With 180 employees over 6 global sites, LASEA has installed more than 1500 machines in 30 countries across 5 continents. As a pioneer in the use of femtosecond lasers since 2003, LASEA continually invests in order to stay at the forefront of innovation. With a strong team of experts in optics, mechanical engineering and automation, LASEA develops new technologies and processes for the most complex and demanding applications in the Electronics Test industry.

Robert Braunschweig
rbraunschweig@lasea.com

lasea laser solutions
LUKEN Technologies

Booth: #112 *TCE*
www.luken.co.kr

M-POGO Pin – Silicon socket has excellent precision by MEMS processing and is easy to implement fine spacing. – Customize the socket probe according to the customer’s specifications.

Da Yeong An
dyan@luken.co.kr

luken technologies
Pozzetta

Booth: #602 *TCE*
pozzetta.com

Pozzetta Products designs and manufactures solutions for the packaging, storage, and transportation of critical devices, including probe cards, probe heads, wafers, photomasks, and filters.

Collin Sloan
collin.sloan@pozzetta.com

pozzetta products creating secure environments
Riff Company Inc.

Booth: #111
www.riff-co.com

Machine shop specializing in ceramic drilling and machining

Daniel McCormick
dan@riff-co.com

riff company co
Rika Denshi America Inc.

Booth: #109
rikadenshi.com

Rika Denshi offers a broad array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing.

Pete Blitchington
pete.blitchington@us.rikadenshi.com

Smiths Interconnect

Booth: #512 *TCE*
www.smithsinterconnect.com

Smiths Interconnect is a leading provider of innovative solutions for critical semiconductor test applications. Smiths Interconnect’s test sockets and probe card solutions offer superior quality and reliability, providing customers with a competitive advantage. Our best-in-class engineering and technical expertise ensure the development of cutting-edge test platforms for area array, peripheral, wafer level and Package on Package (PoP) devices. Our extensive product portfolio accommodates both devices with finest micro pitches and those with very high bandwidth requirements. Off-the-shelf and custom products are proven to deliver the best solution for the customer’s specific needs.

Peter Ursu
peter.ursu@smithsinterconnect.com

smiths interconnect
SPEA S.p.A.

Booth: #301 *TCE*
www.spea.com

Established in 1976, SPEA is a world leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards. SPEA serves the big semiconductor IDMs and OSATs with the most cost-effective and high-performance equipment to test automotive, SoCs, analog mixed-signal devices, MEMS sensors and actuators, power and discretes, identification devices, delivering highest measurement capabilities, lowest cost of test and fastest time-to-market. SPEA systems are designed to detect any possible defect in electronic products, so that they won’t fail on the field. High throughput, best detection capability, test techniques designed on the latest technologies requirements, complete configurability. For SPEA customers, testing is not an additional cost, but a tangible competitive advantage.

Sara Monfreda
sara.monfreda@spea.com

spea
WILL Instrument

Booth: #613
www.willinstrument.com

Will Instrument is providing the equipment for vertical probe card manufacturing. In SWTest 2023 exhibition, we’d like to introduce our brand new equipment, Automated Vertical Probe Pin Insert System. We’re looking forward to meet you in our booth, and hope you experience the latest technology that we’re offering!

Harry An
ahs@willinstrument.com

Yokowo America Corporation

Booth: #401
yokowotestsocket.com

As a fine connector specialist, backed by mold tooling, micro precision machining, microwave and MEMS technologies and capabilities, Yokowo develops and supplies wide variety of wafer sort testing and final test solution to memory, RF, Logic, Sensor and analog Semi-conductor companies.

Naoto Hasaka
n-hasaka@jp.yokowo.com

yokowo