SWTest Expo

The SWTest EXPO is the Who’s Who of Industry Leaders in the Semiconductor Wafer Test Industry.

The top probe card, probe equipment and related service suppliers will showcase the latest products and services at SWTest 2019.

You’ll never have a better opportunity to meet face-to-face with the leading suppliers in one place, at one time in a relaxed atmosphere, enhanced by great food, open bars, and all your industry friends and colleagues.

We expanded our 2018 EXPO from 42 booths to 64 booths and we’re welcoming new suppliers every year.  We also added an EXPO Scavenger Hunt in 2018 to make it easy for our attendees to engage with suppliers and win great prizes.

REGISTER TO EXHIBIT

Check out the list of industry leading exhibitors and corporate sponsors below.

2019 Exhibitors

Below is a list of our 2019 exhibitors. If you’re a supplier, make sure your company’s name is on the list for 2019. REGISTER TODAY!

Booth: Tent – #29
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Description:
Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

Contact:
Masatomo Takahashi | takahashimt@accretech.jp
2968-2, Ishikawa-machi, Hachioji-shi 1920032 Japan
+1-214-459-1688

Booth: Tent – #24
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Description:
Advantest is the leading producer of automatic test equipment (ATE) for the semiconductor industry and a premier manufacturer of measuring instruments. The company’s leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also focuses on R&D for emerging markets that benefit from advancements in nanotech and terahertz technologies. More information available at www.advantest.com

Contact:
Dave Armstrong | dave.armstrong@advantest.com
3061 Zanker Rd., San Jose, CA 95184
+1-917-568-5395

Booth: Bernardo – #205
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Description:
Headquartered in Fremont, California, Aehr Test Systems is a worldwide provider of test systems with an installed base of more than 2,500 systems worldwide for both burn-in / test of integrated circuits and optoelectronics devices such as: VCSELs, Laser Diodes, LEDs, Gesture Recognition, Proximity Sensors and Contact Image Sensors (CIS).

Contact:
Aehr Test Systems | mallison@aehr.com
400 Kato Terrace, Fremont, CA 94539, USA
+358-2-274-6040

Booth: Tent – #22
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Description:
Afore provides special probe stations with real physical stimulus. Chamber type prober AIOLOS for environmental sensor testing and rotating prober KRONOS for motion sensor testing in wafer level. in 2019 Afore releases, in cooperation with BlueFors, a Cryogenic probe station for 12″ wafers.

Contact:
Ari Kuukkala | ari.kuukkala@afore.fi
Vakiotie 5 Lieto, 21420 Finland
+1-510-623-9400

Booth: Tent – #40
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Description:
Celadon produces high performance probe cards for production parametric, multi-probe, modeling & characterization, burn-in and wafer level reliability. Celadon probe cards thrive in extreme test environments, deliver accurate measurements and precise data with a very low cost of ownership.

Contact:
Garrett Tranquillo | garrett.tranquillo@celadonsystems.com
13795 Frontier Court, Burnsville, MN 55337, USA
+1-952-232-1700

Booth:  Tent – #3
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Description:
Chunghwa Precision Test Tech. Co., Ltd. (CHPT) was founded on Aug. 26, 2005. It was located in Pingzhen Industrial Park, Taoyuan City. CHPT was the high-speed PCB team in the Chunghwa Telecom Laboratories. We have been focusing on the interface board services required for testing in the semiconductor industry since 2001. Our primary products are Load Board for IC test, probe card for wafer test, substrate for vertical probe card and DUT board for memory test.

Contact:
Brian Chang | brian@cht-pt.com.tw
No.15, Gongye 3rd Rd., Pingzhen Dist., Taoyuan City 324, Taiwan (R.O.C.)
+1-408-603-1838

Booth: Tent – #19
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Description:
CMRSummit Technologies proudly celebrates 35 years in business and takes pride in working with all major IDM and Fabless semiconductor companies. CMR is a one stop, full service PCB supplier specializing in ATE load boards, probe cards, and all other types of PCB’s. We provide complete start to finish services that include PCB Design, Validation, Fabrication (our own fab), Assembly, Engineering Applications and an outstanding customer service support team.

Contact:
Tom Mordue | tmordue@cmrsummit.com
473 Sapena Ct., Suite 11, Santa Clara, CA 95054, USA
+1-408-844-9550

Booth: Tent – #31
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Description:
Cohu, the market leader for semiconductor test interfaces, provides innovative, reliable and cost-efficient production singulated package and wafer test solutions for RF, precision analog, high end digital, mobility, and analog power applications.

Cohu’s Interface Solutions Group is a one-stop partner with domain knowledge of the entire test cell.

Contact:
Dan Campion | dan.campion@cohu.com
12367 Crosthwaite Circle, Poway, CA 92064, USA
+1-858-848-8000

Booth: Tent – #18
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Description:
Complete Probe Solutions is proud to introduce the Apex 200mm wafer prober. Apex offers all the major benefits of the popular automatic wafer probers with the addition of exciting advancements. Please come by our booth for a technical discussion of these advancements.

CPS also provides refurbished Electroglas style wafer probers. Parts and service for Electroglas probers as well. CPS is the most experienced supplier of the Electroglas brand.

Contact:
Kevin Chandler | kchandler@completeprobesolutions.com
393- E Tomkins Court, Gilroy, CA 95020, USA
+1-408-755-5567

Booth: Tent – #6
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Description:
cyberTECHNOLOGIES is a leading provider of powerful and easy-to-use high resolution 3D Optical Metrology Systems for non-destructive process control of surface topography, film thickness and quality inspection of Integrated Devices, Wafers, MEMS, Solar Cells, Fuel Cells, Lenses, Printed Products, Chip Packages, Ceramics, Specialty Plastic Products and many other related products. We serve many customers that measure and inspect the Coplanarity of Probe Cards and Cu Pillars and related devices with our systems.

Contact:
Karl-Heinz Strass | khstrass@cybertechnologiesUSA.com
Georg-Kollmannsberger-Straße 3, 85386 Eching-Dietersheim, Germany
+49-89-452-4666-0

Booth: Bernardo – #210
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Description:
Deringer-Ney Inc. specializes in the manufacture of platinum group metal alloys. In addition to custom alloy development, the company’s fabrication capabilities include precision machining, stamping, insert molding and micro-molding, miniature wire forming, MICROmfg cold heading, dissimilar metals joining, and clean room contract assembly services. Our manufacturing facilities create custom solutions for customers that range from prototype to full volume production quantities.

Contact:
Bruce Quimby | bquimby@deringerney.com
353 Woodland Avenue, Bloomfield, CT 06002 USA
+1-860-286-6101

Booth: Bernardo – #106
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Description:
ERS electronic GmbH pioneered the thermal wafer testing and invented the AirCool® technology for cooling without liquid.

ERS electronic GmbH have sold over 5,000 chucks worldwide since 1972, and almost 85 % are still in use. Almost every IC used lately in the automotive/safety industry has been tested on ERS chucks. More than 1 billion ICs have been debonded on ERS solutions.

Contact:
Miguel Adolfo Resendiz Jimenez | m.resendiz@ers-gmbh.de
Stettiner Strasse 3, Germering, 82110, Germany
+49 (0)89 894132-0

Booth: Tent – #7
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Description:
Excellent cost/performance ratio for most reliable testing esmo semicon products are available with standardized features for integration into most varied test floor environments, engineering, wafer sort, and final test, with all test system and mating equipment types. At request, they may be equipped with optional features for specific test cell and mating equipment demands. More information is available at https://esmo-group.com/en/

Contact:
Bert Bustamante | bert.bustamante@esmo-ag.com
1020 Winding Creek Road, Suite #120 Rosevillle, CA 95678 USA
+1-916-709-0398

Feinmetall GmbH logo 2018Booth: Bernardo – #207
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Description:
Feinmetall is a long-term supplier to the semiconductor industry with leading-edge technology for automotive applications masters all areas of probe cards for wafer test: from feasibility studies to design and fabrication of the probe card up to turnkey solutions and full repair-shop-management. We offer superior contacting solutions to our customers and worldwide local service.

Contact:
Claudia Heidenreich | claudia.heidenreich@feinmetall.de
Zeppelinstr. 8, Herenberg 71083, Germany
+49-171-5372072

Booth: Tent – #39
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Description:
Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market.

Contact:
John Wu | jwu@ferrotec.com
3945 Freedom Circle #450, Santa Clara, CA 95054, USA
+1-408-964-7700

Booth: Tent – #9
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Description:
FormFactor, Inc. is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. Semiconductor companies rely upon FormFactor’s products and services to accelerate profitability by optimizing device performance and advancing yield knowledge. The Company serves customers through its network of facilities in Asia, Europe, and North America.

Contact:
David Viera | david.viera@formfactor.com
7005 Southfront Road, Livermore, CA 94551, USA
+1-925-290-4000

Booth: Tent – #1
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Description:
Harbor Electronics is one of the world’s preeminent providers of advanced printed circuit boards (PCB) for the semiconductor test market. Founded in 1995 to provide specialized PCBs for ATE applications, Harbor joined forces with Shenzhen Fastprint Circuit Technology in 2015 to become the largest ATE PCB supplier in the world. Our core capabilities and quality enable our customer base to meet the ever-advancing pace of technology and innovation in semiconductor manufacturing.

Contact:
Bill Selfridge | bill.selfridge@harbor-electronics.com
3021 Kenneth Street, Santa Clara, CA 95054
+1-408-988-6544

Booth: Bernardo Foyer – B1
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Description:
Heraeus is a leading manufacturer of precious metal based materials for the use of probe cards and the wafer test industry. A variety of alloys is available for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and / or withstand corrosion effects strongly. Customers benefit from outstanding precious metal expertise right at the heart of probe cards, the interface between wafer and the tester’s periphery.

Contact:
Marc Raettig | marc.raettig@heraeus.com
Heraeusstrasse 12-14, Hanau 63450, Germany
+49-171-5372072

Booth: Tent – #37
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Description:
We are a chemical manufacturing company that started from the research and development of ‘insulating varnish’ in Japan in 1912. Since then, we have developed a ‘technology platform’ consisting of ‘material technologies’, ‘process technologies’, and ‘evaluation technologies.’ And with these technologies, we contribute to society by delivering ‘wonders’ that exceed the expectations of our customers. At SWTest, we introduce and exhibit unique PWBs.

Contact:
Yoji Yamane | yamane@hitachi-chemical.com
2150 N 1st St, Suite 350, San Jose, CA 95131 USA
+1-408-873-2200

Booth: Bernardo – #202
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Description:
For more than 30 years htt Group has been representing well-known leading manufacturers of systems and consumables for the Semiconductor Industry, tools for Wafer Fab, Probing, Test and Backend. htt Group also offers Service, Maintenance, Application & CE-EMC conformity in its Service Division and worldwide ‘made in Germany’ OCR Wafer ID Readers in its Wafer Reader Division for single Wafer tracking. Additionally htt Group also has its own probe card production facility in Dresden for Cantilever and Blade type Probe Cards. Since 2017 htt Group took over the sales of Advaned Probe Cards by MPI Taiwan with its own Service Center in Dresden.

Contact:
Sebastian Siml | ssiml@httgroup.eu
Landsberger Straße 428, Munich 81241, Germany
+49 (0)89-54 67 85-0

Booth: Bernardo Foyer – B4
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Description:
INNO Global Inc. will provide PiS® Technology for interposer. PiS® (Pin in Silicone) makes tension with silicone. Pin embedded in Silicone body. Simple structure, just pin in silicone, can make fine pitch solution and reduce test cost. 0.2mm pitch or over 20GHz for high frequency test. Less Noise & Crosstalk with PiS design.

Contact:
Alex Lee | alex@inno50.com
123 Cheomdan Gwagiro, Gwagnju 61005, South Korea
+82-2-572-1525

Booth: Tent – #26
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Description:
Integrated Technology Corporation has been serving the needs of our customers for more than 35 years. We provide solutions for metrology and testing equipment in many areas:
– Test, analysis, and repair of IC probe cards
– Innovative metrology and inspection solutions
– Solutions for dynamic testing of power semiconductors

Contact:
Mark McLaren | markm@inttechcorp.com
1228 N Stadem Drive, Tempe, AZ 85281, USA
+1-480-612-2182

Booth: Tent – #35
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Description:
Design, manufacture and assemble printed circuits boards and hardware interface solutions for the ATE Industry.

Contact:
Tim Barr | tbarr@integratedtest.com
10365 Sanden Dr, Dallas, TX 75238, USA

Booth: Tent – #4
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Description:
Since 1999, International Test Solutions has been the leading global supplier of highly engineered cleaning materials supporting the semiconductor industry. ITS products are used for advanced probe cards at parametric test & wafer sort operations (PCC), test socket applications during package test (TCC) and chuck cleaning at front- and backend tools (CCW). International Test Solutions provides critical materials and turnkey products that enable device manufactures and foundries to maximize uptime and throughput for substantial cost of test savings.

Contact:
Cooper Smith | coopers@inttest.net
1595 Meadow Wood Lane, Reno, NV 89502, USA
+1-775-284-9220

Booth: Bernardo – #204
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Description:
inTEST Corporation designs and manufactures engineered solutions for ATE and other electronic test, as well as industrial process applications. Our products are used by semiconductor manufacturers to perform development, qualifying and final testing of integrated circuits (ICs) and wafers, and for other electronic test across a range of industries including the automotive, defense/aerospace, energy, industrial and telecommunications markets.

Contact:
Dan Adney | d.adney@intest.com
47777 Warm Springs Blvd, Freemont, CA 94539, USA
+1-408-678-9123

Booth: Bernardo – #101
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Description:
IWIN develops test parts and produces test equipment for the post processes of semiconductors. We offer products of the best correspondence and the top quality for customer needs.

Contact:
AJ Park | aj@iwinsn.com
201 CBTP Yangcheongri, Ochang, Cheongju Chungbuk, 28115, Korea
+82-43-212-7580

Booth: Tent – #23
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Description:
JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC) and image sensors. Our probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. We have manufacturing and support facilities in Japan, US, China, Korea, Taiwan, Europe and Southeast Asia.

Contact:
Karen Wong | sales@jemam.com
3000 Laurelview Court, Fremont, CA 94538, USA
+1-510-683-9234

Booth: Tent – #17
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Description:
Johnstech International is a global R&D leader in the field of microcircuit testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works together with the world’s most respected OSATs, foundries, and EDA companies to develop the most precise and dependable test contactors and test sockets on the marketplace today. For more info, visit www.johnstech.com.

Contact:
John Chung | jlchung@johnstech.com
1210 New Brighton Blvd., Minneapolis, MN 55413, USA
+1-612-378-2020

Booth: Tent – #42
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Description:
Distributor of ATE products, such as prober, test socket and probe heads.

Contact:
Max Goto | mgoto@kanematsuusa.com
2043 Zanker Road, San Jose, CA 95131, USA
+1-847-981-5600

Booth: Bernardo – #206
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Description:
Kyocera offers a wide selection of semiconductor packages for many applications. The combination of Kyocera’s advanced material technologies, manufacturing processes, and design capabilities allow us to offer high-quality package and service solutions to meet the needs of a variety of customers in multiple markets.

Contact:
Jake Morikami | jun.morikami@kyocera.com
8611 Balboa Ave., San Diego, CA 92123, USA
+1-858-576-2600

Booth: Tent – #16
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Description:
LEENO offers you the most comprehensive assortment of test, i.e. Spring Contact Test Probes, IC Test Sockets, WLCSP Probe Card/Probe Head, Secondary Battery Charging Discharging Probes and Parts of Medical Equipment. Our strength is to have customized solutions. Here you can learn more about the wide range of products and services from LEENO.

Contact:
Jay Kim | sjkim@leeno.co.kr
3003 N.1st Street, San Jose, CA 95134, USA
+82-(0)51-831-3232

Booth: Tent – #12
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Description:
LeoLSI has been creating cost-effective Multi Channel Switch IC solutions in partnership with customers, who are in Industrial markets since 2007.
Many of our industry-experienced Engineers, who are now covering automotive industry, are looking forward to meeting you and to defining the solution which will completely meet your needs.

Contact:
Yongseok Chang | yscghang@leolsi.com
414, Hyoryeong-ro, Seocho-gu, Jungsung Bd. 1F, Seoul 06728, South Korea
+82-2-581-5510

Booth: Bernardo – #109
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Description:
MarTek, Inc., the only Electroglas OEM, is a global supplier of automatic wafer probe systems supporting and manufacturing Electroglas products. MarTek is now the sole owner of all Electroglas IP.

Contact:
John Luis | john@martekprober.com
112 S Rockford Dr. Ste 103, Tempe, AZ 85281, USA
+1-480-947-5757

Booth: Bernardo – #102
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Description:
MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce a portfolio of high performance test sockets: J-Contact and Bee-Contact, for the semiconductor industry.

Contact:
John Jordan | johnj@mjcelectronics.com
11004 Metric Blvd., Austin, TX 78758, USA
+1-512-276-8951

Booth: Tent – #25
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Description:
MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI dedicates in producing state-of-art fine pitch probing tool which enhances the speed of worldwide semiconductor technology migration.

Contact:
Cahris Lin | Cahris.Lin@mpi.com.tw
No. 155, Chung-Ho St.,
Chu-pei City, Hsinchu County, 302 Taiwan (R.O.C.)
+886-3-555-1771 Ext.8608

Booth: Bernardo – #104
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Description:
National Instruments builds innovative, modular test products which are used through the entire semiconductor life cycle from design through manufacturing test. The NI Semiconductor Test System (STS) leverages PXI modular hardware to deliver cost effective and flexible ATE used in wafer and package test focused on RF and mixed signal devices. More information is available at ni.com/sts.

Contact:
Heath Noxon | heath.noxon@ni.com
11500 N Mopac Expy, Austin, TX 78759, USA
+1-512-683-5847

Booth: Bernardo – #200
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Description:
Nidec SV TCL and our parent company, Nidec-Read Corporation, are global providers of high quality testing products. Our extensive product line includes probe cards, innovative test accessories & inspection/measurement technologies. Visit us and learn how we can reduce your costs and improve your test solutions.

Contact:
Ray W. Grimm | rwgrimm@svprobe.com
7810 S. Hardy Drive, #109, Tempe, AZ 85284, USA
+1-480-635-4700

Booth: Tent – #2
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Description:
NTK Technologies is a leader in IC Ceramic Packaging. Large and small scale Ceramic STFs are manufactured for high-speed/high density probe-cards for semiconductor wafer test. NTK supports fast paced product cycle times with our advanced design and production flows featuring high precision processes for fast turn-around with the highest quality.

Contact:
Mariel Stoops | mstoops@ntktech.com
3979 Freedom Circle Drive, Santa Clara, CA 95054, USA
+1-408-727-5180

Booth: Tent – #21
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Description:
Laser Micromachining and precision drilling for manufacturing vertical probe card guide plates. We use the power of laser light to make precise alterations to any material. Fully integrated workstations and contract manufacturing services.

Drilling arrays of micro holes down to few microns diameter including round and square holes – Exceptional hole placement accuracy and repeatability. www.opteksystems.com

Contact:
Andrew Webb | osi@opteksystems.com
12 Pilgrim Road, Greenville, SC 29607, USA
+1-864-272-2640

Booth: Tent – #14
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Description:
Oxford Lasers specialize in the production of vertical guide plates, providing a global outsourcing service to many Probe Card companies throughout the world. We have the ability to drill and cut features with extremely high precision in a wide variety of materials from Silicon Nitride and Alumina etc. through to Photoveel and polymers. These micro holes being suitable for square, rectangular or round probes with dimensions from 20 microns upwards. We also supply our Probe Drill tools.

Contact:
Alan Ferguson | alan.ferguson@oxfordlasers.com
2 Shaker Road, Unit B104, Shirley, MA 01464, USA
+1-978-425-0755

Booth: Bernardo – #203
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Description:
Pac Tech – Packaging Technologies GmbH (group member of NAGASE & CO. Ltd.) is headquartered in Germany with wholly owned subsidiaries: PacTech USA Inc. in Silicon Valley, USA, and PacTech ASIA Sdn. Bhd. in Penang, Malaysia. PacTech is comprised of three business units: EQUIPMENT MANUFACTURING: Manual & Automatic ENIG & ENEPIG plating tools, Laser solder jetting equipment, Wafer-level solder ball transfer systems, Laser assisted flip-chip bonders. SUBCONTRACT SERVICES: Flip Chip and Wafer Level Package Bumping Services including ENIG or ENEPIG for UBM (solder bumping) or OPM (wirebond). Other services include Electroplating, Laser Solder Jetting, Wafer Level Solder Balling, Re-passivation, RDL, Backmetal, Wafer Thinning, Wafer Dicing, Tape & Reel, AOI, X-Ray, SEM, FIB. CHEMISTRY: Pre-Treatment and process chemistry for electroless plating.

Contact:
Bernd Otto | bernd.otto@pactech.com
328 Martin Ave., Santa Clara, CA 95050, USA
+1-408-588-1925 x 241

Booth: Tent – #15
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Description:
TBD

Contact:
Harry An | ahs@pli.co.kr
9,Banwol-gil 12beon-gil, Hwaseong-si, Gyeonggi-do, Korea
+82-031-204-7963

Booth: Bernardo – #107
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Description:
Leader in micro technologies for mass production, Posalux is a Swiss company specialized in mechanical engineering, focusing on markets needing high-tech equipments.

Posalux solution integrates the FEMTO Laser technology for microdrilling applications in electronics and automotive industries.

Contact:
Angelo Rizzo | arizzo@posalux.ch
Rue Fritz-Oppliger 18, Biel/Bienne, 2504 Switzerland
+41 (0)32-344-75-00

Booth: Tent – #41
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Description:
Prober.com is a subsidiary of HighTech Enterprises, Inc. and one of the longest running prober refurbishing companies in the industry. We’re an innovator and leader, developing integration of technologies that transform what’s possible. We’re also a partner with other resellers and OEMs, making it easier for our customers to try new things and gain competitive advantages in their markets.

Contact:
Dennis Bonciolini | sales@prober.com
15532 SW Pacific Hwy., Suite C1B 501, OR 97224, USA
+1-503-822-5182

Booth: Tent – #27
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Description:
PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include:
• Advanced PCB Design, Manufacture & Assembly
• Leading edge probe cards for pad, bump & Cu pillar probing
• High performance Test Sockets
• Full turn-key ATE solutions

Contact:
Jordan Mackellar | jmackellar@probetestsolutions.com
1 Argyle Crescent, Hamilton, Glasgow, South Lanarkshire, ML3 9BQ, UK
+44(0)1698-745268

Booth: Tent – #8
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Description:
Celebrating over fifty years of excellence in leading-edge, technology driven, quick-turn printed circuit board manufacturing, R&D Altanova specializes in advanced automated test equipment solutions for the semi-conductor test market.

R&D Altanova offers a full turn-key test solution including simulation, design, layout, fabrication and assembly of both interface boards (wafer sort probe cards and final test) as well as MLO substrates.

Contact:
R&D Altanova Sales Team | sales@rdaltanova.com
3601 S Clinton Ave, South Plainfield, NJ 07080, USA
+1-844-732-5826

Booth: Bernardo Foyer – B3
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Description:
Reid-Ashman’s success is primarily due to its ability and willingness to design and develop innovative equipment and customize existing products in order to best meet the challenges of our customers’ specific test-floor environments and test-system applications.

Contact:
Carl Vargas | cvargas@reidashman.com
582 North 3050 East, St. George, UT 84790, USA
+1-408-499-6028

Booth: Bernardo – #105
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Description:
Rika Denshi offers a broad array of test probes (spring probes) for tester interfaces, test and burn-in sockets, microprocessor, PCB and wafer testing.

Contact:
Pete Blitchington | pete.blitchington@us.rikadenshi.com
112 Frank Mossberg Dr, Attleboro, MA 02703, USA
+1-508-226-2080

Booth: Tent – #28
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Description:
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of probe card test and analysis systems that are used to monitor probe card health insuring cards are ready and capable of testing semiconductor devices.

Contact:
John McCarthy | john.mccarthy@rudolphtech.com
4900 W. 78th Street, Bloomington, MN 55435, USA
+1-516-429-7793

Booth: Tent – #20
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Description:
SEMICS Inc. is a wafer prober manufacturing company, and we are the industry’s leading provider of the global semiconductor test industry. We deliver the highest performance advantages and competitive cost of ownership to integrated device manufacturers, wafer foundries, outsource test suppliers, fabless chip companies, and probe card companies worldwide.

Contact:
Gabriel Tak | hjtak@semics.com
732-37, Gyeongchung-daero, Gonjiam-eup, Gwangju-si, Gyeonggi-do, Korea
+82-10-3326-0409

Booth: Bernardo – #103
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Description:
Specialty Coating Systems is the leader in Parylene conformal coating services and technologies with locations throughout the Americas, Europe and Asia and over 45 years of experience. Ultra-thin and pinhole-free, SCS Parylene coatings offer excellent moisture, chemical, and dielectric barrier properties to protect components in the electronics, defense, aerospace, transportation and medical device industries.

Contact:
Alan Hardy | scssales@scscoatings.com
7645 Woodland Dr., Indianapolis, IN 46278, USA
+1-317-244-1200

Booth: Tent – #34
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Description:
STAr Technologies, as “Semiconductor Test Architects”, we provide semiconductor test solutions such as probe cards, intellectual property, system and services to meet requirements and challenges within the industry.

Contact:
Steve Groden | sales@star-quest.com
2F., No. 101, Gongdao 5th Rd., Sec. 2, Hsinchu, 30070 Taiwan
+1-760-931-5085

Booth: Tent – #30
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Description:
TBD

Contact:
Malcolm Owens | malcolm.owens@synergie-cad.us
1105 E. Main St., No. 252, Allen, TX 75002, USA
+1-214-998-1618

Booth: Tent – #38
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Description:
Probe Cards and Test Interfaces for: High Voltage, High Current Devices (Si, SiC, GaN), Sensors (Pressure, Magnetic, Light, X-Ray….), Automotive/Power ASICs, Automotive RADAR, TIPS Probe Refresher TPR-HD, ”Doubling Probe Card Lifetime”, Precise Tip Shape Control, Maintain Probe Card Performance over Lifetime.

Contact:
office@tips.co.at
Europastrasse 5, Villach, 9524 Austria
+43-4242-319720 ext.4

Technoprobe LogoBooth:  Tent – #5
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Description:
Technoprobe is one of the world’s leading providers of advanced wafer testing solutions for the semiconductor industry.
The company offers design, development and manufacturing of advanced wafer probe cards. Our mission is to be a strategic partner to our customers and their overall success. We do this by enabling an early insight into the performance and yield of the customer’s products. Also, by aligning to their roadmaps to enable next generation products with one of the most advanced wafer probing test solutions. We offer an extensive portfolio of products to meet customers complex testing requirements and reducing their overall cost of test.

Contact:
Marita Villarreal | mvillarreal@technoprobe.com
526 Qume Drive Ste# 27, San Jose, CA 95131, USA
+1-408-573-9911

Booth:  Tent – #10
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Description:
Teradyne Automated Test Equipment (ATE) is used to test semiconductors, wireless products, data storage and complex electronic systems. Our Industrial Automation products include Collaborative Robots used to improve quality and increase manufacturing efficiency.

The Global Services Organization (GSO) is the technical services arm of Teradyne, providing world-class engineering services in applications, hardware design, production support and system maintenance to customers worldwide.

Contact:
Steve Ledford | steve.ledford@teradyne.com
600 Riverpark Drive, North Reading, MA 01864, USA
+1-978-370-2700

Tokyo ElectronBooth:  Tent – #32
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Description:
As a leading global company of semiconductor and flat panel display (FPD) production equipment, Tokyo Electron Limited (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All of TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network of approximately 75 locations in 16 countries in the U.S., Europe, and Asia.

Contact:
Blake Nogay | blake.nogay@us.tel.com
2400 Grove Boulevard, Austin, TX 78741, USA
+1-512-424-1000

TranslarityBooth: Tent – #11
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Description:
Translarity offers probe card solutions for the global semiconductor and packaging test industries, tailored to customer specifications. The company’s IP portfolio, design capabilities, innovative products, and reputation for quality, reliability and customer support ensure the right solution for your testing requirements.

Contact:
Garry Crossland | gcrossland@sbcglobal.net
107 McNutt Road, Building 1 Ste. A, Hutto, TX 78634, USA
+1-925-984-6036

Booth: Bernardo Foyer – B2
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Description:
TSE Co. LTD. is an OEM of test interface solutions, load boards, test sockets, Pogo pins, handler change kits, probe cards and docking kits to over 30 companies in 13 countries. Our strengths are semiconductor memory & logic test engineering, and characterization & high volume production equipment expertise.

Contact:
YH Jeon | yeonghyu@tse21.com
78, 4sandan 5-gil,  jiksan-eup, Seobuk-gu, Cheonan-si, Chungnam, 31040, South Korea
+82-41-580-1880

Booth: Bernardo – #209
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Description:
Veco is a leading producer of electroformed vertical and cantilver probes with a highly
stable contact resistance and excellent mechanical and electrical characteristics. Our state-of-the-art lithographic equipment allows for rapid, accurate, and economic tooling of thousands of probes in a single batch. Every single probe is carefully monitored to meet the most demanding quality standards and guarantee consistency of the products, yielding probes that perform optimally across a range of temperatures, currents, and pitch sizes.

Contact:
Scott Aitken | scott.aitken@vecoprecision.com
3201 Rotary Drive, Charlotte, NC 28269, USA
+31 (0) 485-599-555

Booth: Tent – #36
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Description:
Vermont Microtechnologies is an industry leader in the manufacture and assembly of semiconductor wafer probe cards. Contract drilling services.

Contact:
Caleb Harwood | charwood@vtmicro.com
4693 Garland Hill Rd. Barnet, VT 05821, USA
+1-802-633-2300

Booth: Tent – #33
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Description:
Wentworth Laboratories have been providing wafer probing solutions for over 50 years. With the support of a global network of representatives, we enable customers to maximize productivity and reduce cost. The ability to create customized wafer test solutions partnered with meticulous project communication ensures that our products fulfill even the most challenging requirements.

Wentworth wafer probe stations and cantilever probe cards have been selected for many leading-edge wafer test applications in the semiconductor industry across the globe.

Contact:
Marcus Keenan | info@wentworthlabs.com
1 Gosforth Close, Sandy, Bedfordshire, SG19 1RB, UK
+44 1767 681221

Booth: Tent – #13
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Description:
Founded in 2001, WinWay Technology Co., Ltd. (WWT) is the worldwide leader of IC testing interface supplier. We serve various fields, including semiconductor, optical, information technology and optoelectronics. With advanced knowledge and technologies, WWT is committed to providing the most competitive prices, highest quality products, best customized design, expedient lead time, and professional worldwide services.

Contact:
Ginger Yang | ginger.yang@winwayglobal.com
1800 Wyatt Drive, Suite 1, Santa Clara, CA 95054, USA
888-7-3610999

Booth: Bernardo – #110
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Description:
Yokowo offers a broad spectrum of fine connectors and test systems for front to back-end testing, which excel in signal integrity and are capable of testing the high-speed performance of semiconductors and electronic components amid trends towards higher density, greater integration and higher frequency. With complete before- and after-sales service systems, Yokowo answers the needs of customers.

Contact:
Shigeki Oka | shigeki.oka@yokowo.com
301 W Warner Road, Suite 112, Tempe, AZ 85284 USA
Tel: +1-408-315-8678

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