Keynote Speaker

SWTest 2020 Cancelled – to Resume in 2021

William (Bill) Miller,

Vice President of Engineering, Qualcomm

William Miller is Vice President of Engineering with responsibility for RF, PMIC, and RFFE product testing and characterization as well as Yield and Diagnostic analysis of all Qualcomm’s products. Additionally, Bills team has responsibility for leading edge technology IP test chip characterization as well as all failure analysis and circuit edit for Qualcomm’s products. Bill also works with Qualcomm’s Foundries and OSATs to drive process and device improvements to meet Qualcomm’s product requirements. Bill has over 40 years in the semiconductor industry with experience in all aspects of semiconductor manufacturing and development. Prior to moving to Qualcomm, Bill was Director of Outsource Engineering and Product and Test Engineering at IBM Microelectronics Division with broad responsibility for managing multiple new products and technologies at the IBM 300mm Fabricator as well at IBM’s partner fabricators. Bill is also an author of multiple published articles and professional society presentations, patent holder, and former conference chairman of the Advanced Semiconductor Manufacturing Conference and former chairman of the Industrial Advisory Board for the Center for Micro Contamination Control at U of Arizona, RPI, and Northeastern University.
During his presentation on Sunday, June 7, Mr. Miller will focus on four key areas:
  1. How the introduction of Qualcomm Technologies, Inc. (QTI), and 5G/mm wave will affect overall business growth beyond Phone into Auto, IOT, Laptops, etc.
  2. Challenges to the industry caused by the slowing of technology and the increasing complexity of our processors and RF products
    • Discuss the key statics on die complexity, die size, bump counts, etc.
    • Review the market demand for vertical ramps and the pressure it puts on the end to end suppliers and QTI
  3. Big data, diagnostics, and QTI’s need for machine learning for faster yield learning and for improving quality demanded by the market.
  4. Cost of Test, probe, other associated hardware requirements and issues

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