Keynote Speaker

Dr. Luca Fasoli

Senior Vice President, Silicon Technology & Manufacturing at Western Digital

Dr. Luca Fasoli is responsible for the strategy and the development of Western Digital solid-state memory technologies. Previously, he held engineering management positions at Waferscale Integration, STMicroelectronics, Matrix Semiconductor and at SanDisk after its acquisition of Matrix. 

As a 25-year industry veteran and IEEE Senior Member, Dr. Fasoli has worked on a variety of non-volatile memory technologies and solid-state storage products, leading product development teams from concept definition to mass production. 

Dr. Fasoli has published many technical papers and holds more than 90 U.S. patents. 

He earned a doctorate and master’s degree in Electronic Engineering from the Polytechnic University of Milan, and completed the Engineering Leadership Professional Program at UC Berkeley.

He is based at the company’s Milpitas, CA location.

Testing in the 3D NAND Zettabyte era: how to achieve quality and minimize cost

The 3D NAND Flash industry is now approaching the Zettabyte era – an era in which the Flash industry will ship more than a trillion gigabytes every year. Technology innovations in silicon processing, device concepts, circuit design, and system architecture have consistently enabled us to achieve increased performance and reliability over multiple NAND generations.

With every new 3D NAND generation, bit production has increased exponentially while cost per bit has correspondently been decreasing. This trend has disrupted industries and created new markets. From mobile devices and connected vehicles to gaming and data centers, Flash is at the core. Always hidden from view, 3D NAND testing has been evolving to keep up with this on-going revolution. Armies of engineers have been working in parallel to perfect test architectures, test equipment, and test flows to make sure that test cost per bit scales similarly while not affecting product quality.

Transition to the Zettabyte era poses a new set of challenges to the test industry and demands close cooperation between NAND vendors and equipment manufacturers to ensure quality without affecting overall cost per bit. In this keynote, we will cover how Western Digital has been approaching the 3D NAND technology evolution and its testing challenges and relative opportunities.

Guest Virtual Speaker

Max Lowe

Award-Winning Filmmaker

During his Visionary Keynote Presentation, Dr. Luca Fasoli is pleased to include Mr. Max Lowe as a virtual presenter.  Max Lowe, an award-winning filmmaker, has been regularly using various SanDisk memory storage devices under some of the most extreme conditions.  

Max is a world-renowned photographer and filmmaker who grew up mountaineering alongside his parents Alex and Jennifer Lowe and his stepfather, Conrad Anker.  As a documentary filmmaker, Max is known for his ability to capture stories in the most remote corners and extreme conditions of the world.  He received a National Geographic Young Explorers grant in 2012, and has produced for National Geographic Adventure, National Geographic Travel, and National Geographic magazine.  Max has appeared on The BBC as well as in the internationally released National Parks Adventure IMAX film, and in publications including Science Magazine, Men’s Journal, and Outside Magazine.  He has produced still and film content for brands such as The North Face, Red Bull, Yeti Coolers, and Eddie Bauer.  In recent years, Max has directed, shot, and produced numerous award-winning short documentary films that garnered screen time at festivals such as Cannes, Tribeca and Indi Short Docs.  His first full-length feature documentary, “Torn” premiered at Telluride Film Festival with National Geographic Docs and went on to win best doc at Kenal and Banff before a limited theatrical release and streaming on Disney+ in spring of 2022.  With his journalistic style of storytelling, Max has emerged with a distinct style by which he crafts unheard narratives.

Tuesday Keynote Speaker

rebeca jimenez

Rebeca Jimenez,

Corporate Vice President Advanced SiP Business Unit, Amkor Technology, Inc.

Rebeca Jimenez joined Amkor in 2014 and is currently Corporate Vice President, Advanced SiP Business Unit. Prior to assuming her current role, Ms. Jimenez served in various sales and strategic program management roles. She has more than 25 years of experience in the global semiconductor industry. Prior to joining Amkor, she spent 15 years with IDT (previously ICS) in both test engineering and operations roles as well as management positions. In addition, Ms Jimenez worked in various engineering and engineering management roles at Motorola. She holds a BS in Electrical Engineering from Arizona State University, as well as an MS in Electrical Engineering from National Technological University.

Advanced Packaging and Test Enabling Our Digital Society

Semiconductors are the building blocks of our modern digital society and allow us to be connected anywhere and everywhere. We interact with semiconductors every day through almost everything we do, whether using our smartphones, personal electronics, connected homes or our cars, which have become digital cockpits, immersed with advanced safety features. All of these digital interactions require massive computing and connectivity power to process, store and transfer data.

Join me as we explore innovations in advanced packaging and test technology and how they enable further transformation in our digital society with a focus on the key catalysts of 5G, High Performance Computing, IoT and Automotive applications.