Keynote Speakers

William Miller

Vice President of Engineering

William Miller is Vice President of Engineering with responsibility for RF, PMIC, and RFFE product testing and characterization as well as Yield and Diagnostic analysis of all Qualcomm’s products. Additionally, William’s team has responsibility for leading-edge technology IP test chip characterization as well as all failure analysis and circuit edit for Qualcomm’s products. William also works with Qualcomm’s Foundries and OSATs to drive process and device improvements to meet Qualcomm’s product requirements. William has over 40 years in the semiconductor industry with experience in all aspects of semiconductor manufacturing and development. Prior to moving to Qualcomm, William was Director of Outsource Engineering and Product and Test Engineering at IBM Microelectronics Division with broad responsibility for managing multiple new products and technologies at the IBM 300mm Fabricator as well at IBM’s partner fabricators. William is also an author of multiple published articles and professional society presentations, patent holder, and former conference chairman of the Advanced Semiconductor Manufacturing Conference and former chairman of the Industrial Advisory Board for the Center for Micro Contamination Control at U of Arizona, RPI, and Northeastern University.

During his presentation, Mr. Miller will focus on four key areas:

  1. How the introduction of Qualcomm Technologies, Inc. (QTI), and 5G/mm wave will affect overall business growth beyond Phone into Auto, IOT, Laptops, etc.
  2. Challenges to the industry caused by the slowing of technology and the increasing complexity of our processors and RF products
    • Discuss the key statics on die complexity, die size, bump counts, etc.
    • Review the market demand for vertical ramps and the pressure it puts on the end to end suppliers and QTI
  3. Big data, diagnostics, and QTI’s need for machine learning for faster yield learning and for improving quality demanded by the market.
  4. Cost of Test, probe, other associated hardware requirements and issues

Hans Stork, PhD

Senior Vice President and CTO
ON Semiconductor

Dr. Hans Stork is Senior Vice President and Chief Technology Officer (CTO) at ON Semiconductor. He oversees the development of wafer process technologies, modeling and design kits, design libraries, as well as packaging technologies and assembly support.

Prior to joining ON Semiconductor, Dr. Stork was Group Vice President and CTO of the Silicon Systems Group at Applied Materials. From 2001 to 2007 he was Senior Vice President and the CTO of Texas Instruments. Before that, Dr. Stork held various R&D and management positions at Hewlett Packard Laboratories and at IBM’s T.J. Watson Research Center.

Dr. Stork serves on the supervisory board of ASML, is a member of the Scientific Advisory board at IMEC, and has previously served on the boards of Sematech and the SRC. He is also a longstanding member of the SIA Technology Strategy Committee.

He authored more than 100 cited papers and holds 11 U.S. patents. He was elected IEEE Fellow in 1994, and served on several IEEE sponsored conference program committees, and is currently vice-chair of the Technical Field Awards Council and a member of the Awards Policy and Portfolio Review Committee.

Dr. Stork was born in Soest, The Netherlands, and received the Ingenieur degree in electrical engineering (EE) from Delft University of Technology, Delft, The Netherlands, and holds a PhD in EE from Stanford University.


The Growing Challenge of Testing Automotive Analog and Sensor Systems

Automotive systems are facing an accelerated introduction of electronic components, driven by megatrends such as electrification and autonomous driving. This leads to an explosion of ever more complex sensors generating an abundance of data/sec that need to be processed real-time to drive a wide variety of electronic and mechanical systems in the car. Furthermore, those systems need to function in hostile environments (e.g., high electromagnetic fields, high temperatures, etc.) while quality needs to be guaranteed at the ppb level and cost is a constant challenge. As a result, testing of such electronic components becomes significantly more complex both in the amount and variety of functions to be tested: testing speed, signal integrity and accuracy, test coverage, and cost.
Besides giving a general overview of the above fields, the talk will address two specific test topics that are critical for those automotive systems:
  1. Analog testing: while test coverage for digital systems is quite well established, achieving similar levels of analog test coverage to support high quality and yield (cost) is very demanding and a field of constant research, including upcoming standards like IEEE1687.02.
  2. Image sensor testing: with ever increasing requirements in image resolution, S/N ratio, dynamic range, frame rate etc. testing of image sensors to guarantee functionality and high yield is likewise very demanding. Main challenges are signal integrity at very high data rates, power integrity, combined electrical and optical testing at wafer- and package-level, and testing at extreme temperatures.

2019 Keynote Speaker Photo Gallery

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