Intel Fellow, Technology and Manufacturing Group Director, Test Probe Technology
“Moore’s Law and the Future of Test”
Abstract
Moore’s Law has fueled the semiconductor industry for the last 50 years and as scaling has slowed down, attention is being shifted towards die disaggregation and heterogeneous integration. This in turn is driving the need for advanced packaging, which drives the need for a true known-good-die (tKGD) coming out of wafer test. Achieving a tKGD places significant challenges on the test platform and test tooling; these include, but are not limited to, thermal management, power delivery, mechanical state of the device, and test content. Addressing these challenges, in an economically viable way, is key to advancing Moore’s Law and will require a high degree of innovation from players across the industry to enable.
Biography
Dr. Pooya Tadayon is an Intel Fellow and the director of test probe technology in the Technology and Manufacturing Group at Intel Corporation. He is responsible for defining novel architectures, materials and processes for manufacturing Intel’s next-generation test interconnects. An expert in probing technology, Tadayon has specialized in the field since joining Intel in 1998 as a test integration engineer focused on sort and wafer probing technologies. In 2002, he was tapped to lead engineering for Intel’s test probe business, spending two years in that position. Starting in 2006, Tadayon became a test integration manager responsible for test flow optimization. In that role, he focused on innovative data system solutions to enable adaptive test techniques targeted at optimizing microprocessor yield and performance. Before assuming his current role in 2018, Tadayon served as director of test pathfinding. During his seven years in that role, he led the team charged with developing breakthrough test solutions for Intel’s next-generation products. Tadayon holds a bachelor’s degree in chemistry, biochemistry and biology from the University of Washington and a Ph.D. in physical chemistry from Oregon State University. In 2015, he earned an Intel Achievement Award, the company’s highest recognition, for his contributions to advancing test interconnect technology. He was appointed an Intel Fellow in 2018.
Michael D. Slessor, Ph.D.
Chief Executive Officer FormFactor, Incorporated
“Probe in the Spotlight – enabling advanced packaging, chiplets, and heterogenous integration”
Abstract
To offset the slowing of front-end-driven Moore’s Law and sustain the innovation trajectory that has fueled fifty-plus years of semiconductor industry growth, the development of advanced packaging is rapidly accelerating. As industry focus moves from front-end fab to post-fab integration, wafer probe is taking a prominent role in enabling a variety of advanced-packaging schemes like heterogenous integration of chiplets. This rise in prominence is being driven by two basic trends, one economic and one technical. On the economic front, surprisingly high pre-assembly chiplet yields are required for viable composite product yields, driving increased test fidelity and coverage. On the technical front, chiplet-to-chiplet interconnect structures are at least an order of magnitude denser than traditional flip-chip interconnect, driving a corresponding intensification in both probe pitch and probe count. As a consequence, advanced packaging is driving more probes, on more probe cards, with more challenging requirements for the wafer test community, pushing us into the spotlight previously occupied by our friends in the fab.
Biography
Michael D. Slessor has served as the Chief Executive Officer of FormFactor, Inc. since December 2014, and as a Director since October 2013. Mike served as President from October 2013 to December 27, 2014, and as Senior Vice President and General Manager, MicroProbe Product Group from October 2012 to October 2013. Before joining FormFactor, he was President and Chief Executive Officer of MicroProbe from July 2008 through the October 2012 closing of FormFactor’s acquisition of MicroProbe. Prior to joining MicroProbe, he held various management, product-marketing, and applications-engineering positions in the semiconductor industry, primarily with KLA-Tencor. Mike received his Ph.D. in Aeronautics and Physics from the California Institute of Technology and his B.A.Sc. in Engineering Physics from the University of British Columbia.
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