SWTest 2025 Conference Guide and Exhibitor Directory

SWTest 2025 Conference Guide and Exhibitor Directory

Directory Coming Soon

Jump to the sections below:

Welcome

Registration

EXPO Scavenger Hunt

Program

EXPO Directory

Thank You To Our Corporate Sponsors

Platinum Sponsors

mjc logo
c-h-p-t
j-e-m
technoprobe
TSE

Gold Sponsors

oxford lasers
posalux
synergie cad group
intest e-m-s
teradyne
star technologies
TIPS technical innovation physical solutions

Silver Sponsors

yokowo
semics
t-e-l
advanced probing systems

Official Media Partners

chip scale review logo
semiconductor review logo

Conference Partners

Chairman’s Welcome to SWTest 2025 Conference and EXPO

Welcome to the 34th SWTest Conference and EXPO at the OMNI La Costa, Carlsbad, CA

On behalf of the SWTest Executive Team, Program Committee, and Committee Members, I am pleased to welcome you to the 2025 SWTest Conference and EXPO. This leading industry event is hosted once again at the OMNI La Costa Resort in Carlsbad, California.

The SWTest Conference and EXPO offers a conducive, relaxed environment for professionals to engage in discussions about significant industry trends and technologies.  Attendees have the opportunity to network with colleagues and interact with leading suppliers and service providers, all without conflicting with the technical program.

I would like to express my gratitude to our 10 Platinum, 10 Gold, and 10 Silver sponsors, as well as the 40 additional exhibitors who make SWTest possible. We sincerely appreciate the significant contributions of the presenters within technical program and poster sessions, committee members, and the numerous volunteers who assist in making the SWTest Conference and EXPO a premier global event for the wafer test industry.  

SWTest 2025 will be a multi-day conference filled with learning, connecting, and gaining industry insights!

Jerry Broz, PhD
General Chair

SWTest Conferences

SWTest Team and Committee Members

SWTest Executive Team

General Chair
Jerry Broz, PhD,
Advanced Probing Systems

Operations Chair
Rey Rincon,
PTSL

Program Chair
Patrick Mui,
JEM America

Finance Chair/Conference Management
Maddie Harwood,
Conference & Exhibits Management, Inc. (CEM)

SWTest SD Technical Program Committee

  • Jerry Broz, PhD, Delphon Industries (US)
  • John Caldwell, MJC Electronics Corp. (US)
  • Geert Gouwy, imec (Belgium)
  • Alistair Laing, Micron Technology (US)
  • Clark Liu, Taiwan MJC Co. (Taiwan)
  • Muru Meyyappan, enfabrica (US)
  • Patrick Mui, JEM America (US)
  • Mark Ojeda, Infineon (US)
  • Rey Rincon, PTSL (US)
  • Raffaele Vallauri, Technoprobe (Italy)
  • Joey Wu, consultant (Taiwan)

SWTest SD Steering Committee

  • Davide Appello, Technoprobe (Italy)
  • Karen Armendariz, Celadon Systems (US)
  • John Caldwell, MJC Electronics Corp. (US)
  • Geert Gouwy, imec (Belgium)
  • Michael Huebner, PhD, FormFactor GmbH (Germany)
  • Nobuhiro Kawamata, FormFactor KK (Japan)
  • BC Kim, Samsung (Korea)
  • JY Kim, TSE (Korea)
  • Alistair Laing, Micron Technology (US)
  • Clark Liu, Taiwan MJC Co. (Taiwan)
  • Karan Manier, AEM (US)
  • Muru Meyyappan, enfabrica (US)
  • Mark Ojeda, Infineon (US)
  • Kenny Tang, TSMC (Taiwan)
  • Raffaele Vallauri, Technoprobe (Italy)
  • Joey Wu, consultant (Taiwan)
  • Andrew Yick, PhD, Marvell (US)

SWTest Emeritus Committee

  • Amy Leong, AEM (Singapore)
  • Grace Liu, PhD, Intel Corporation (US)
  • Connie Smith, Texas Instruments (US)

Registration

Self-check in for registration is located in the Costa de la Luna Foyer of the Conference Center. Self-registering kiosks will allow you to enter your last name or email used to register. Once you have printed off your badge, bring it to the registration desk to receive you badge holder and lanyard. There will be some giveaway items at the desk for you to take as well.

Registration Check-in Hours

  • Sunday, June 1st
    1:00pm – 5:00pm
  • Monday, June 2nd
    7:00am – 4:00pm
  • Tuesday, June 3rd
    7:00am – 3:00pm

A registration badge is required for admission to events associated with your badge type:

  • Full Conference and Student:
    All Events, including Technical Sessions
  • EXPO Only:
    All Events, except Technical Sessions
  • Companion:
    All receptions, dinners and Tuesday Social Event

EXPO Scavenger Hunt

The EXPO Scavenger Hunt encourages attendees to visit all participating exhibitors to win big prizes!

How Do I Participate?

Be sure to visit all participating exhibitors for a chance to win big prizes!

  • Check the list of participating exhibitors in the Mobile App under the Scavenger Hunt icon.
  • There will be signs with the list of participating exhibitors located at the Registration Desk and the entrances to the EXPO.
  • Each participating exhibitor will also have a QR sign on their booth table with a yellow background indicating they are a Scavenger Hunt Participant.
  • Conference attendees must visit all participating exhibitors and scan their QR code to be eligible to win a prize. When all participating exhibitors’ QR codes have been scanned, they will automatically be entered in the contest drawing.
  • Finish scanning QR codes no later than 5:45pm on Tuesday, June 3.
  • Winners of the Scavenger Hunt will be drawn during the Tuesday evening EXPO reception between 7:30 and 8pm. Both winners and exhibitors will be notified to arrange for shipping if necessary.
  • Be sure to join in the fun by participating in the Scavenger Hunt!

Participating Exhibitors

EXHIBITORBOOTH #PRIZE
Aehr Test Systems313Apple AirPods Pro 2 Wireless Earbuds with Active Noise Cancellation
Celadon Systems414JBL Flip 6 Portable Bluetooth speaker
Dynamic Test Solutions306ScottyCameron Backpack Golf Cooler
Entegris5Entegris tote bag, with yeti and mini speaker
FormFactor307$100 Amazon Gift Card
Gel-Pak405$100 Target Gift Card
Heraeus Precious Metals3141g Heraeus Gold Kinebar
Integrated Technology Corporation 607Anker Laptop Docking Station
Integrated Test Corporation9Ninja wireless meat thermometer
inTEST EMS4134 pack of Apple AirTags
IWIN Co., Ltd.610Bluetooth sunglasses and Korea traditional design name card holder
JEM America Corp512Beats Studio Buds + True Wireless Noise Cancelling Earbuds
Keysight Technologies114Mini Sono Wireless Speaker
Lincstech Co., Ltd.503Japanese sake “Dassai 23 with Glass and Cypress wooden cup”
Mipox Corporation8Apple MagSafe Chargers (x2)
MJC Electronics312$100 Visa Card
MPI Corporation412A bottle of Kavalan Solist Vinho Barrique Single Cask Strength Single Malt Whisky
Nidec SV Probe203Great Wave Lego Set
Oxford Lasers507GoPro HERO11 Black Mini action camera
Posalux SA406CARAND’ACHE Special Edition Pen & Pencil
PTSL10The Balvenie 14 years , Single Malt Scotch Whisky
STAr Technologies207Logitech Mouse & Anniversary Bag
Technoprobe506$100 Amazon Card
Translarity601Contixo – F28 GPS Drone with Remote Controller – Silver
Xallent Inc.113Apple AirPods 4 Wireless Earbuds
YoungTek Electronics Corporation USA, Inc.514Titleist Pro V1 Golf Balls Prior Generation (One Dozen)

Sponsor Hospitality Events

All attendees are invited! Don’t miss these fun events after hours!

Sunday, June 1/Monday, June 2Monday, June 2Tuesday, June 3
Who: MPI Corporation
When: 8pm
Where: Villa Suite 6012/6013
Who: PTSL
When: 8pm
Where: Orchid & Orchid Terrace
Who: Technoprobe
When: 8pm
Where: Orchid & Orchid Terrace
Who: MJC
When: 9pm
Where: Villa Suite 6010

Program Schedule

The program schedule is available conveniently in the mobile app, please refer to the agenda listed.
If you do not have the mobile app installed, you can view the program online here.

Sunday, June 1
TimeEventLocation
7:00 a.m. – 8:00 a.m.Golfers BreakfastValley Promenade
8:00 a.m. – 1:30 p.m.William Mann Memorial Golf TournamentStarter Area – Legends Course
1:00 – 5:00 p.m.Conference Registration Check-InCosta de la Luna Foyer
6:00 – 8:00 p.m.Attendee Welcome MixerBar Traza
Monday, June 2
TimeEventLocation
7:00 – 8:00amContinental BreakfastCosta de la Luna Courtyard/Lawn
7:00 – 8:00amSpeakers’ BreakfastLas Palmas 1 and 2
7:00am – NoonExhibitor Check-inCosta de la Luna Foyer
7:00am – 4:00pmConference Registration Check-InCosta de la Luna Foyer
8:00 – 9:15amPoster SetupCosta de la Luna Foyer
8:00 – 8:30amWelcome to SWTest 2025
Jerry BROZ, PhD (SWTest Conference General Chair – USA)
Costa de la Luna Ballroom
8:30 – 9:30amVISIONARY KEYNOTE SPEAKER (more details)
Mastering Emerging Probing Challenges: The Power of Agile and Continuous Innovation
Raffaele VALLAURI
VP Director (Technoprobe SpA – Italy)
Costa de la Luna Ballroom
9:30 – 10:00amTechnical Poster Session and Coffee BreakCosta de la Luna Foyer
10:00am – NoonTechnical Session 1: Driving High-Volume Photonics Test
Session Chair: Mark OJEDA (Infineon Semiconductor – USA)
Costa de la Luna Ballroom
10:00 – 10:30amEnabling the Semiconductorization of Photonics
Scott JORDAN (PI – USA)
Costa de la Luna Ballroom
10:30 – 11:00amWafer-Level Testing of Photonic Devices
Philipp DIETRICH, Andrés MACHADO, Florian RUPP, Roman ZVAHELSKYI (Keystone Photonics GmbH – Germany)
Costa de la Luna Ballroom
11:00 – 11:30amPhotonics Chip Level Test Strategies in High Vibration Production Environments
Matthew PRICE, Nikta JALAYER (Physik instrumente – USA)
Costa de la Luna Ballroom
11:30am – NoonFirst Silicon Photonics High Speed (up to 67GHz) Wafer Probe Card Demonstration for S-Parameter Testing on the Production Wafer
Hsu Hao CHANG, Amit AGNIHOTRI, Andrew YICK, Dongwon LEE (Marvell – USA), Giulia ROTTOLI (Technoprobe – Italy)
Costa de la Luna Ballroom
Noon – 1:30pmEnjoy Lunch and Networking with Colleagues and Attendees!Costa de la Luna Courtyard/Lawn
Noon – 4:00pmExhibitor SetupCosta Del Sol Ballroom
1:30 – 3:00pmTechnical Session 2: Innovations for Parametric Test
Session Chair: Geert GOUWY (imec – Belgium)
Costa de la Luna Ballroom
1:30 – 2:00pmUltra-low leakage probe card for wafer parametric testing enabled by µ3D printing
Edgar HEPP, Wabe KOELMANS, Francesco COLANGELO, Patrik SCHüRCH (Exaddon – Switzerland), Francois GIX, Sebastien SCHOENE (Synergie CAD – France)
Costa de la Luna Ballroom
2:00 – 2:30pmOptimizing Probe Card Performance for Small Pad Sizes in Parametric Testing – Maintaining Probe Pin Geometry for Extended Probe Card Lifetime and Lower Cost of Test
Victoria TRAN (Gel-Pak – USA), Garrett TRANQUILLO (Celadon Systems, Inc. – USA)
Costa de la Luna Ballroom
2:30 – 3:00pmMEMS probe card solution to address parametric test challenges
Apoorva DUBE (FormFactor – USA), Judd GERBER, Sanjay BIDASARIA, Philip TAVERNIER (Intel – USA), Mukesh SELVARAJ (FormFactor – USA)
Costa de la Luna Ballroom
3:00 – 3:30pmTechnical Poster Session and Coffee BreakCosta de la Luna Foyer
3:30 – 5:00pmTechnical Session 3: Pushing Test Limits
Session Chair: Muru MEYYAPPAN (enfabrica – USA)
Costa de la Luna Ballroom
3:30 – 4:00pmRevolutionary SiC-based micro-Vertical Cryogenic Probing Solutions down to 2K
Dalton ROEHL, Garrett TRANQUILLO, Karen ARMENDARIZ (Celadon Systems – USA), Gregory NIELSON, Brad FERGUSON, Jared PAYNE, Rebecca ANDERSON (Nielson Scientific LLC – USA), Alexander HORSPOOL, Dillon JENSEN, Noah JOHNSON, Stephen SCHULTZ (Brigham Young University – USA)
Costa de la Luna Ballroom
4:00 – 4:30pmWafer-level MEMS testing: challenges and solutions for high-yield manufacturing
Luca FANELLI (SPEA S.p.A. – Italy), Raimondo P. SESSEGO (NXP – USA)
Costa de la Luna Ballroom
4:30 – 5:00pmFine Pitch Probing of Micro-Bumps for Advanced Packages
Pardeep KUMAR, Zehao LI, Kwame AMPONSAH (Xallent Inc. – USA), Theodore LEVIN, Arthur GASASIRA (IBM – USA)
Costa de la Luna Ballroom
5:00 – 8:00pmSWTest 2025 EXPO OpenCosta Del Sol Ballroom
8:00 – 10:00pmSponsor Hospitality Events

Poster Session

Session Chair: John CALDWELL (MJC Electronics Corporation – USA)
(Costa de la Luna Foyer)

  • Ultra-High-Conductivity Palladium Alloy for Test Probes: The Road to 33%IACS
    Patrick BOWEN, Grant JUSTICE (Deringer-Ney Inc – USA)
  • Revolutionizing Semiconductor Wafer Testing: A Breakthrough in Ultra-Precise High-Performance Foil Material
    Thilo HAPP (Sickert&Hafner Automotive Gmbh – Germany)
  • Understanding the Factors for Power supply characteristics ( 2nd Study )
    Wai Kit K (Lincstech Co., Ltd. – Japan)
  • Innovations in Testing for Truly Known Good High Bandwidth Memory Stacks
    Alan LIAO (FormFactor – USA), Hiromitsu TAKASU (ADVANTEST – Japan)
  • Probing test system with optical fiber array for photonic integrated circuits
    Takaharu OHYAMA, Shigeki OKA, Tomohisa HOSHINO, Yasushi WATANABE (YOKOWO CO., LTD. – Japan)
  • Innovative Testing Strategies for Silicon Photonic Devices in Engineering and Production Applications
    Dan RISHAVY, Quan YUAN (FormFactor, Inc. – USA)
  • One-time-touchdown Probe Card Tester with 1000kg Chuck Force Probing System Total Solution
    Kenny SONG, River HUANG (Probing Semiconductor Technology Shanghai Co.,Ltd – China)
  • Palysium C+ – Achieving Unprecedented Electrical Conductivity and Mechanical Strength in Palladium-Based Alloys through Structural & Compositional Optimization
    Matthias WEGNER, Jochen SCHUSTER, Nail AKROUTI (Heraeus Precious Metals – Germany)
  • Probe Card Analyzer Motherboard Flexibility and Performance Improvement
    Benedikt PONGRATZ (Turbodynamics – USA)
Tuesday, June 3
TimeEventLocation
7:00 – 8:00amContinental BreakfastCosta de la Luna Courtyard/Lawn
7:00 – 8:00amCommittee BreakfastLas Palmas 1 and 2
7:00am – 3:00pmConference Registration Check-InCosta le la Luna Foyer
8:00 – 8:30amUpdate on SWT Crew Initiative and Mentoring Program
Karen ARMENDARIZ (Celadon Systems – USA)
Costa de la Luna Ballroom
8:30 – 9:30amTechnical Session 4: In Pursuit of High Parallelism
Session Chair: Karen ARMENDARIZ (Celadon Systems – USA)
Costa de la Luna Ballroom
8:30 – 9:00amA novel approach for increased probe card parallelism utilizing device package substrates
Leon BESPROZVANNY, Cameron HARKER, Robert WHITE (FormFactor – USA)
Costa de la Luna Ballroom
9:00 – 9:30amEffective Solutions for Large Format Testing Challenges in High Parallelism HPC Device Testing
Oscar LEE, Harvey LIN (Taiwan Semiconductor Manufacturing Co., Ltd. – Taiwan)
Costa de la Luna Ballroom
9:30 – 10:00amTechnical Poster Session and Coffee BreakCosta de la Luna Foyer
10:00 – NoonTechnical Session 5: High Speed and RF Solutions
Session Chair: Karan MANIAR (AEM – USA)
Costa de la Luna Ballroom
10:00 – 10:30amEnabling 100+GHz launches for 448G signals.
Muhammad Hameem RAHMAN, Quaid Joher FURNITUREWALA (Advantest America Inc. – USA)
Costa de la Luna Ballroom
10:30 – 11:00amFine Pitch RF Calibration and Sensitivity to Variation for RF Wafer Probing
Daniel BOCK (FormFactor – USA)
Costa de la Luna Ballroom
11:00 – 11:30amRF Probe Solutions – From Lab to Fab
Don THOMPSON (PTSL – USA)
Costa de la Luna Ballroom
11:30 – Noon How High-Speed Probe Cards Accelerate Time-to-Market
Emmett RICKS (Micron – USA)
Costa de la Luna Ballroom
Noon – 1:30pmEnjoy Lunch and Networking with Colleagues and Attendees!Costa de la Luna Courtyard/Lawn
Noon – 1:30pmPoster RemovalCosta de la Luna Foyer
1:30 – 3:00pmTechnical Session 6: Probe Potpourri
Session Chair: Davide APPELLO (Technoprobe SpA – Italy)
Costa de la Luna Ballroom
1:30 – 2:00pmBroadband Attenuators using Thin Film for Wafer Sort
Pratik GHATE (FormFactor, Inc. – USA)
Costa de la Luna Ballroom
2:00 – 2:30pmHPC and AI Probing Devices Require New Integration Schemes
Ksenija VARGA, Malzer ALOIS, Uhrmann THOMAS, Urban PETER, Wolf CHRISTOPH, Zenger TOBIAS (EV Group – Austria)
Costa de la Luna Ballroom
2:30 – 3:00pmEngineering Tomorrow’s Advance Vertical Probe Card Guide Plates: Balancing Precision and Economy whilst Meeting next generation Demands
Chris STOKES (Oxford Lasers Ltd – United Kingdom)
Costa de la Luna Ballroom
3:30 – 5:00pmSWT CREW MixerCosta Del Sol Side Lawn
5:00 – 8:00pmSWTest 2025 EXPO ReceptionCosta Del Sol Ballroom
8:00 – 10:00pmSponsor Hospitality Events

Poster Session

Session Chair: John CALDWELL (MJC Electronics Corporation – USA)
(Costa de la Luna Foyer)

  • Ultra-High-Conductivity Palladium Alloy for Test Probes: The Road to 33%IACS
    Patrick BOWEN, Grant JUSTICE (Deringer-Ney Inc – USA)
  • Revolutionizing Semiconductor Wafer Testing: A Breakthrough in Ultra-Precise High-Performance Foil Material
    Thilo HAPP (Sickert&Hafner Automotive Gmbh – Germany)
  • Understanding the Factors for Power supply characteristics ( 2nd Study )
    Wai Kit K (Lincstech Co., Ltd. – Japan)
  • Innovations in Testing for Truly Known Good High Bandwidth Memory Stacks
    Alan LIAO (FormFactor – USA), Hiromitsu TAKASU (ADVANTEST – Japan)
  • Probing test system with optical fiber array for photonic integrated circuits
    Takaharu OHYAMA, Shigeki OKA, Tomohisa HOSHINO, Yasushi WATANABE (YOKOWO CO., LTD. – Japan)
  • Innovative Testing Strategies for Silicon Photonic Devices in Engineering and Production Applications
    Dan RISHAVY, Quan YUAN (FormFactor, Inc. – USA)
  • One-time-touchdown Probe Card Tester with 1000kg Chuck Force Probing System Total Solution
    Kenny SONG, River HUANG (Probing Semiconductor Technology Shanghai Co.,Ltd – China)
  • Palysium C+ – Achieving Unprecedented Electrical Conductivity and Mechanical Strength in Palladium-Based Alloys through Structural & Compositional Optimization
    Matthias WEGNER, Jochen SCHUSTER, Nail AKROUTI (Heraeus Precious Metals – Germany)
  • Probe Card Analyzer Motherboard Flexibility and Performance Improvement
    Benedikt PONGRATZ (Turbodynamics – USA)
Wednesday, June 4
TimeEventLocation
7:00 – 8:00amContinental BreakfastCosta de la Luna Courtyard/Lawn
7:00 – 10:00amExhibitor TeardownCosta Del Sol Ballroom
8:00 – 9:30amTechnical Session 7: Innovations in Metrology
Session Chair: Patrick MUI (JEM America – USA)
Costa de la Luna Ballroom
8:00 – 8:30amCost reduction in probing operations by surveillance of mechanical probe card integrity
Martin KUNZ (Solarius GmbH – Germany), Franz STEGER (Texas Instruments Deutschland GmbH – Germany)
Costa de la Luna Ballroom
8:30 – 9:00amA new generation Probe Card Analyzer for large area, high load devices
Luigi MILAZZO, Antonio RINALDI, Federico MARIANI, Federico TRESOLDI (Technoprobe – Italy)
Costa de la Luna Ballroom
9:00 – 9:30amTester on a Probe Card: Solution to challenges in Chiplet-Testing
Patrick SULLIVAN (ElevATE Semiconductor – USA), Dan HICKS (STAr-Edge Technologies – USA), Matthew GETZ, Sandeep D’SOUZA, Tim BAKKEN (ElevATE Semiconductor – USA)
Costa de la Luna Ballroom
9:30 – 9:45amCoffee BreakCosta de la Luna Foyer
9:45 – NoonTechnical Session 8: High Power and Temperature
Session Chair: Jerry BROZ (SWTest Conference – USA)
Costa de la Luna Ballroom
9:45 – 10:15amEarly detection of CRES degradation on High Current Power Planes
Brent BULLOCK (Advantest America Inc. – USA)
Costa de la Luna Ballroom
10:15 – 10:45amHigh-Voltage Test: Deflection study for LuPo pressure chamber probe cards
Diana DAMIAN, Georg FRANZ (T.I.P.S. Messtechnik GmbH – Austria)
Costa de la Luna Ballroom
10:45 – 11:15amKGD – Ultrafast Dynamic Power Device Probing
Rainer GAGGL, Sebastian SALBRECHTER (T.I.P.S. Messtechnik GmbH – Austria), Davide GRISAFI, Sebastiano GRIMALDI (ST Microelectronics, Catania – Italy)
Costa de la Luna Ballroom
11:15 – 11:45amAdvanced Localized Thermal Management for Wafer Probing in High-Power AI and GPU Applications Under Dynamic Thermal Conditions
Klaudiusz HOLECZEK (Watttron GmbH – Germany), Klemens REITINGER (ERS electronic GmbH – Germany)
Costa de la Luna Ballroom
11:45 – NoonSWTest 2025 Awards and Adjournment
Jerry BROZ (SWTest Conference – USA)

See you June 8-10, 2026 at the Omni La Costa Resort!
Travel Safe and Stay Healthy!
Costa de la Luna Ballroom

Exhibitor Directory

EXPO Map

Exhibitors

*SHP* stands for Scavenger Hunt Participant (visit EXPO Scavenger Hunt for more details)

ACCRETECH

Booth: 111
www.accretech.com

Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

accretech tokyo seimitsu
Advanced Probing Systems, Inc.

advancedprobing.com

Advanced Probing Systems, Inc. (APS) is the global leader in the manufacture of probe needles used in wafer sort testing, LCD probe testing and LED probe testing, various nanotechnology probe applications, medical electrodes, spotting pin blanks for genome testing, ion emitters and a variety of other industrial applications.

Advanced Probing Systems sponsor ad
Advantest

Booth: 407
www.advantest.com

Advantest (TSE: 6857) is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility.

advantest ad
Aehr Test Systems

*SHP*
Booth: 313
aehr.com

Aehr Test Systems is a leading provider of test solutions for testing, burning-in, and stabilizing semiconductor devices in wafer level, singulated die, and package part form, and has installed thousands of systems worldwide. Increasing quality, reliability, safety, and security needs of semiconductors used across multiple applications, including electric vehicles, electric vehicle charging infrastructure, solar and wind power, computing, data and telecommunications infrastructure, and solid-state memory and storage, are driving additional test requirements, incremental capacity needs, and new opportunities for Aehr Test products and solutions.

aehr ad
Bright Toward Industrial Co., Ltd.

Booth: 614
relay.com/tw

Bright Toward Industrial Co., Ltd (TOWARD RELAYS as a brand ) has been a manufacturer of Solid State Relays, Opto-MOSFET Relays, Opto- SiC MOSFET Relays, Reed Relays, Wet Reed Relays, and RF MEMS Switches since 1988. We have been supplying the world’s semiconductor testing, Battery Management Systems (BMS), Automatic Test Equipment (ATE), Industrial Control, and Telecommunication Industries for over three decades. As of 2021, our annual revenue is USD 50million, with factories located in Hsinchu, Taiwan, and Zhejiang, China. Worldwide sales offices are located in Singapore, Germany, San Jose, Rhode Island, Beijing, Shenzhen, Suzhou, and Taipei.

Celadon Systems, Inc.

*SHP*
Booth: 414
www.celadonsystems.com

Celadon Systems, a wholly-owned subsidiary of MPI, is a distinguished US-based company with a rich 20-year history in the semiconductor industry. Renowned for our “Peace of Mind” probing solutions, Celadon is committed to providing reliable and innovative probe cards to meet the rigorous demands of our industry. Our probe cards are engineered to excel in extreme temperature conditions, ensuring consistent and precise test results. Our customers can anticipate millions of touchdowns, backed by our unwavering dedication to quality and performance. We take pride in offering the lowest cost of test in the industry, making Celadon the preferred choice for semiconductor testing solutions. Celadon stands as a leader in production environments and lab settings. Choose Celadon for unparalleled reliability, efficiency, and expertise in semiconductor probing solutions. Experience the difference with Celadon Systems, where precision meets peace of mind.

Chunghwa Precision Test Tech. Co., Ltd.

Booth: 213
www.cht-pt.com.tw

CHPT, one of the leading providers of semiconductor test interface products, employs a unique strategy that sets it apart from much of the industry. Our vertically integrated approach operates on an “All in House” business model. By utilizing the talent of our experts in the fields of electronics, chemistry, mechanics, and optics, we are able to create a win-win situation with customers and innovate at the pace of the ever-changing semiconductor industry. CHPT was established in Taoyuan, Taiwan in 2005, listed for trading on the Taipei Exchange in 2016 (stock code 6510), and relocated to a new R&D operational headquarters in 2019.

chpt
chpt ad
Cohu, Inc.

Booth: 605
www.cohu.com

Cohu, Inc. (NASDAQ: Cohu) is a global leader in test and handling equipment, thermal subsystems, interface solutions, vision inspection and MEMS test solutions, and a leader in printed circuit board test. We deliver leading-edge solutions to enable a smarter, safer, and more connected future. Cohu offers the broadest portfolio of equipment and services for back-end semiconductor manufacturing, including a one-stop-shop for test and handling equipment, thermal subsystems, test contacting, vision inspection, and MEMS test solutions. Our enhanced product portfolio gives our customers the best possible combination of technologies to match their business and technical needs. Cohu has 50+ years of semiconductor test expertise providing optimal test contactor and probe pin solutions for every type of application and challenge, using innovative and sophisticated R&D methods. Learn more: https://www.cohu.com/interface-solutions

cohu
Complete Probe Solutions Inc.

Booth: 404
completeprobe.com

Complete Probe Solutions is proud to announce the APEX 200mm fully automatic wafer prober. APEX has an icon-based UI and full remote control capability with live video, allowing for setting up and running the prober from anywhere you have a network connection. CPS offers options for specialty probing applications such as customized easy swap Chuck-tops, 3” compound semiconductor wafers, and silicon photonic test cells (prober and laser head). CPS is also the premier provider of Electroglas support, service, and refurbished systems.

Deringer-Ney

Booth: 606
deringerney.com

Deringer-Ney Inc. specializes in the manufacture of platinum group metal alloys, high-reliability electrical contacts, and precision components for the Medical, Automotive, Semiconductor, Industrial, and Aerospace industries. In addition to custom alloy development, the company’s fabrication capabilities include precision machining, stamping, insert molding and micro-molding, miniature wire forming, cold heading, and dissimilar metals joining. Our manufacturing facilities create custom solutions for customers that range from prototype to full-volume production quantities. ISO 9001 / ISO 13485 / IATF 16949

deringer ney ad
Dynamic Test Solutions

*SHP*
Booth: 306
www.dynamic-test.com

PCB Design, High speed simulation, PCB Fabrication and assembly services, Probe head manufacturer, final test contractors and socket manufacturer, Full-Turkey supplier and fully owned Substrate manufacturer all for ATE test market.

ELSPES

Booth: 107
www.elspes.com

The Leading Company in Next Generation Passive Devices

Entegris

*SHP*
Booth: 5
www.entegris.com

Entegris provides innovative, high-performance cleaning materials and application-specific engineering solutions to the semiconductor market. Our cleaning material solutions enable our customers to reduce defectivity, maximize yield, improve tool uptime, and reduce production costs. Our product portfolio includes a wide array of advanced cleaning products that serve the front-end, wafer test, and back-end (advanced packaging) semiconductor manufacturing ecosystem. Our solutions are specifically tailored to keep pace with new technology nodes and address the evolving demands of our customer-base.

entegris
ERS electronic GmbH

Booth: 212
www.ers-gmbh.com

ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process.

e-r-s
esmo USA

Booth: 204
www.esmo-group.com

Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan, we are truly global. We develop customized solutions for our customers, realizing value-creation opportunities and adapting to local needs. Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.

esmo semicon
Exaddon AG

Booth: 304
exaddon.com

Exaddon provides next-generation wafer probing solutions through high-precision micro3D printing. This template-free printing technology delivers probes with outstanding mechanical and electrical properties, unlocking new testing capabilities from extreme fine-pitches to non-invasive probe contacting.

EXATRON, INC.

Booth: 612
exatron.com

Since 1974, Exatron has designed and manufactured custom IC test sockets for nearly any application and device type. Our Copperhead® thermal test sockets, specifically designed for tri-temp testing, cut soak times in half, reduce calibration deltas, and increase temperature stability. With 50,000 contact points per square inch, our Diamond Interconnect socket interposers offer zero inductance, zero capacitance, and zero resistance up to 1 million insertions. For all applications, the same socket can be used across our entire product line, from benchtop hand test to high volume automated production. See exatrontestsockets.com for more information.

FEINMETALL GmbH

Booth: 210
www.feinmetall.com

Since 1964 FEINMETALL GmbH is a leading company for contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments. It does not matter where in the world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe. Spring contact probes are used to test printed circuit boards, wire harnesses, connectors and other electronic components. We offer a wide range of contact probe varieties for each specific contact-making task, always tailored to the customers’ needs. Wafer probe cards are used for contacting semiconductor wafers. Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards.

Feinmetall GmbH logo
feinmetall ad
Ferrotec

Booth: 504
www.ferrotec.com

Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market. For more information, go to www.ferrotec.com.

ferrotec
FormFactor, Inc.

*SHP*
Booth: 307
formfactor.com

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test. By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

formfactor ad
Gel-Pak

*SHP*
Booth: 405
gelpak.com

For over 40 years, Gel-Pak®, a division of Delphon, has been a leading manufacturer of elastomer-based device carriers and films extensively used in semiconductor applications. Our carriers secure semiconductor components during shipping and internal processing, while the proprietary film products serve a wide range of applications including fixturing and surface protection. We also offer the Gel-Probe™ line of probe tip cleaning and polishing wafers and sheets, which are proven to enhance operational efficiency and improve wafer yield. The Gel-Probe ReFine, ReMove, and ReCover products offer solutions for cleaning, polishing, and reshaping probe tips using proprietary abrasive and non-abrasive elastomers. We continue to innovate in partnership with some of the world’s leading probe card manufacturers to develop probe cleaning technologies for next-generation applications.

gel pak ad
Heraeus Precious Metals GmbH & Co. KG

*SHP*
Booth: 314
www.herae.us/probing

Heraeus Precious Metals is globally leading in the precious metals industry. For the use of probe cards and the wafer test industry, the product range comprises a variety of alloys for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and/or withstand corrosion effects strongly. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to recycling. It has extensive expertise in all platinum group metals as well as gold and silver. By 2025 Heraeus Precious Metals will be carbon-neutral for its own operations and reach net zero in 2033 – as the first company in the industry.

heraeus ad
Integrated Technology Corporation

*SHP*
Booth: 607
www.inttechcorp.com

Manufacturer of probe card analyzers and power semiconductor dynamic test systems.

itc - integrated technology corporation
Integrated Test Corporation

*SHP*
Booth: 9
integratedtest.com

PCB Design, Simulation, Fabrication, Assembly and Test hardware solutions in Dallas, TX. Certified WBE, WOSB, ITAR, AS9100

inTEST EMS

*SHP*
Booth: 413
www.intest-ems.com

inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.

intest ems
intest ad
IWIN Co., Ltd.

*SHP*
Booth: 610
www.iwinsn.com

IWIN Co.,ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price.

iwin sponsor ad
JEM America Corp.

*SHP*
Booth: 512
jem-net.co.jp

JEM is a leading manufacturer of advanced probe cards for memory devices (DRAM, Flash), logic devices (SoC, Flip-chip, WLCSP), image sensors and parametric test application. As semiconductor factories have expanded globally, JEM organizes a global manufacturing network in Japan, Asia, USA, and Europe to support customers’ needs in each region. JEM expands sales by creating JEM technology roadmap and sales strategies based on demands from global customers and technology roadmap of the semiconductor industry. With our global strategies and proactive development actions, JEM is striving to provide probe cards that exceed the demands of our customers. Our comprehensive probing technologies include MEMS, vertical, cantilever and parametric probe cards to support various pad, bump materials as well as Cu pillar probing. In addition, we offer custom design and fabrication services for printed circuit boards and space transformers.

j-e-m
jem ad
Johnstech International

Booth: 2
www.johnstech.com

JOHNSTECH INTERNATIONAL is a global R&D leader in the field of semiconductor testing, providing reliable, cost-effective testing solutions for automotive, commercial, and industrial applications. Founded in 1991 by David Johnson, Johnstech works hand-in-hand with the world’s most respected OSATs, foundries, and IDMs to develop the most precise and dependable test contactors on the marketplace today.

Keysight Technologies

*SHP*
Booth: 114
www.keysight.com

Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation, and test challenges to create the best product experiences. Through our fusion of technology knowledge, measurement science expertise, and tailored solutions, we deliver intelligent insights throughout the innovation workflow to ensure fast time-to-market with reduced risk.

Keystone Photonics GmbH

Booth: 103
www.keystone-photonics.com

Keystone Photonics offers probe heads for wafer-level testing of trench, V-groove, and surface coupling interfaces including testing methods for optical pluggable.

KSMT

Booth: 402
www.ksmt.com/tw

KEYSTONE MICROTECH(KSMT) provides PCB board design, SI/PI/Thermal simulations, manufacturing, and full component and mechanical assembly on ATE load board, probe card, burn-in board, and system level test boards. We offer global support and are not only providing our customers with a product but with a turnkey service as well.

Laser Job Inc.

Booth: 305
www.laserjob.co.jp

From prototype development to mass production, we offer ultra-high precision processing to Probe Card Manufacturers using ultra-short pulsed lasers.

laser job
Lincstech Co., Ltd.

*SHP*
Booth: 503
lincstech.com

On October 1, 2021 the Lincstech Group made a fresh start as an independent manufacturer specializing in printed wiring boards (PWBs).

As the PWB division of Hitachi Chemical and Showa Denko Materials, we have accumulated distinctive and advanced technologies over the past 50 plus years. We have also built connections and trust with our customers by listening to them and proposing solutions to improve the value of their products and services.

Our company name, Lincstech, is a combination of Link + C + Technology. Our company name incorporates our desire to provide value to our customers by using technology to connect the various “Cs” (communication, collaboration, co-creation…) that we consider important.

At Lincstech we are proud that our printed wiring boards assist our customers in realizing superior value in their products and services.

lincstech ad
Megatouch Co., Ltd.

Booth: 513
www.megatouch.co.kr

Megatouch leads the market in core components for secondary battery and semiconductor testing based on the best technology. We provide optimal products that meet our customers’ needs by independently designing the pins, processing components, conducting plating, and assembly, and establishing a quality evaluation system to ensure perfect quality management. We will continue to grow and advance as a company that is always prepared for the future and leads changes.

megatouch
Menlo Micro

Booth: 315
menlomicro.com

Headquartered in Irvine, California, Menlo Micro has created an entirely new category of electronic switches with its Ideal Switch technology. The Ideal Switch eliminates compromises and tradeoffs by combining the benefits of electromechanical and solid-state switches into the best of both worlds. Menlo Micro is bringing more than 99 percent reductions in size, weight, power, and cost to dozens of industries such as medical, aerospace and defense, telecommunications, consumer electronics, industrial IoT, and test and measurement.

Mipox Corporation

*SHP*
Booth: 8
mipox.co.jp

Mipox combines our core technologies of coating, slitting, and polishing to provide products and services that create added value for our customers’ success. We manufacture consumable items such as polishing films and liquid polishing agents for rough polishing processing of products including aircraft, ships, automobile bodies, woodworking components for musical instruments and building materials, as well as for high-tech fields such as hard disks, optical fibers, and semiconductors that require high-precision polishing performance. We also develop and sell polishing equipment for using these polishing materials, as well as observation equipment for inspecting the polishing accuracy. In addition, we manufacture and sell reflective products under the brand name RefLite, which are created through the combination of our “coating” and “slitting” technologies.

MJC Electronics Corporation

*SHP*
Booth: 312
www.mjc.co.jp

MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.

mjc logo
mjc ad
MPI Corporation

*SHP*
Booth: 412
mpi-corporation.com

MPI Corporation, founded in 1995, leads the world with advanced probing technology. MPI is dedicated to producing a state-of-the-art probing tool that enhances the speed of worldwide semiconductor technology migration.

MPI
mpi ad
Nidec SV Probe Inc.

*SHP*
Booth: 203
www.nidecsvprobe.com

Nidec SV Probe is a leading provider of high-quality semiconductor testing solutions. With a diverse product line that includes MEMSFlex™, a range of customizable MEMS probes/probe cards and a variety of other probe card technologies, we supply advanced testing products for some of the most complex RF, 5G, Mobile, Automotive and IoT devices. Nidec SV Probe’s unmatched manufacturing and support infrastructure provides coverage for major semiconductor regions across the globe. We have full design and manufacturing capabilities in the USA, China, Japan, Taiwan and Singapore.

nidec ad
Niterra

Booth: 202
www.ntktech.com

At Niterra NTK Technologies, INC., we build robust packages for complex applications. Computers, optical communication, wireless networks, medical devices, automotive, space and aeronautics — many of the applications in these markets would not be possible without the technology that Niterra provides.

Oxford Lasers

*SHP*
Booth: 507
www.oxfordlasers.com

Oxford Lasers is the Home of Laser Innovation since 1977. We provide ultra-high precision laser services and systems to advanced manufacturing industries worldwide including probe card companies. Our capabilities extend to applications in micromachining, trimming and imaging. Our world-class facility in Oxford, UK supported by our experienced multi-disciplinary team, provides an extensive range of products supporting semiconductor, pharmaceutical, medical technology and aerospace industries. We excel at micromachining a wide range of materials and features for products such as Guide Plates. Unparalleled in the industry, Oxford Lasers has expertise in laser technologies including applying machine learning into our production process for enhanced performance and pinpoint accuracy.

oxford lasers
oxford ad
Point Engineering

Booth: 205
www.pointeng.co.kr

As a dedicated foundry in MEMS probes with high performance for wafer & package test, we support our customer push their products competitive and take it to next level. Our main product includes MEMS buckling probes with performance (short length, high CCC), Cantilever probes, fine pitch spring probes.

Posalux SA

*SHP*
Booth: 406
posalux.com

We are a Swiss machine tools manufacturer offering outstanding micro-machining solutions for mass production since 1943. Through our mechanical & Femto-LASER technologies, we drill, mill, route, and cut ceramics, polymers, and precious metals dedicated to Test Equipment applications. Bring a new perspective to your challenges!

posalux ad
Probing Group

Booth: 303
probing.com.cn

Probing Group

PTSL

*SHP*
Booth: 10
probetestsolutions.com

PTSL is a leading supplier of Semiconductor ATE Hardware Solutions with highly technical design and manufacturing teams globally. Products and services include: Advanced PCB Design, Manufacture & Assembly, Leading edge probe cards for pad, bump & Cu pillar probing, High-performance Test Sockets, Full turn-key ATE solutions.

ptsl ad
Qualmax Inc.

Booth: 505
www.qualmax.com

Semiconductor probe and probe head manufacturer.

qualmax experience maximum quality
Reid-Ashman Manufacturing

Booth: 6
reidashman.com

Established in 1979 and based in St. George, Utah, Reid-Ashman Manufacturing is a distinguished provider of complete solutions for semiconductor test equipment integration. Our company excels in delivering superior custom engineering designs and manufacturing services, specializing in Test Head Manipulators, Mechanical Docking, and Electrical Interfacing. Committed to excellence, we prioritize the delivery of exceptional quality across all facets of our products and services. With a global presence, our seasoned team ensures that our solutions adhere to the most rigorous industry standards. At Reid-Ashman Manufacturing, our objective is to consistently lead the market through a commitment to innovation, uncompromising quality, and dedicated responsiveness to our clients’ evolving needs.

reid ashman
Saigon Fabrication

Booth: 105
saigonfabrication.com

Prime supplier of PCB and PCB Assembly to the Semiconductor ATE Industry. * Quick Turn Quality PCB and PCB Assemblies Excellence in rapid process engineering and product assembly * Scalability Flexible production capability and capacity to ramp from small prototypes lots to full-scale production * Complex Engineering Multi-disciplinary capabilities solving complex issues. The people, the process, the equipment * Accelerating Time to Market Responsiveness and service. Quotes in as little as a few hours; 24/7 service and support * Quality and Certifications A proven Quality Management System and a culture of continuous improvement that pushes the envelope on technology, speed and responsiveness.

Samtec

Booth: 112
www.samtec.com

Samtec is the service leader in the electronic interconnect industry and a global manufacturer of Connectors, Cables, Optics and RF Systems, with full channel system support from the IC to the board and beyond.

SEMICS Inc.

Booth: 604
www.semics.com

The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.” SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns. SEMICS has always brought ‘trust’ to our partners. Offering “trust“ is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far. SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.

semi ad
Sigma Sensors TCL GmbH

Booth: 415
sigma-sensors.com

Sigma Sensors is an ISO9001 and ISO17025 accredited temperature calibration laboratory, manufacturing calibration wafers for automated wafer probers. Our advanced automation options make temperature calibration a hands off process ensuring documentary compliance, enabling confidence while simultaneosly decreasing engineer workload resulting in unmatched ROI of 3-6 months. Sigma Sensors also calibrates third party wafers in Europe, the US and Asia.

sigma sensors
Solarius Development Corp.

Booth: 215
solarius-metrology.com

Solarius is a leading provider of precision systems for non-contact 3D metrology, and inspection. Thanks to the combination of high-resolution sensors with automated data acquisition systems and powerful analysis tools, Solarius provides fast and accurate system from desktop for off-line inspection, to semi-automated ones for in-line measurements. Customizing data acquisition software, analysis tools, and user interfaces is a part of our approach to solve specific metrology tasks. Solarius headquarter is in San Jose, California. Our structure includes China Operations (Shanghai) and Europe Operations (Essen) responsible for sales, application engineering, customer support, and product development. In addition to our international partner network Solarius takes care for an installed base exceeding 2,000 active metrology systems worldwide.

Standex Electronics

Booth: 100
standexelectronics.com

Standex Electronics is a global manufacturer of relays, reed switch-based sensors, custom magnetics, and electro-mechanical components. We serve critical markets including semiconductor testing, automatic test equipment (ATE), battery management systems (BMS), medical devices, industrial applications, and renewable energy. As the market leader in reed switch production, we offer vertically integrated manufacturing that ensures supply chain reliability and product consistency. We combine this with advanced contact technologies to deliver high-performance, reliable solutions for complex applications. Our acquisition of Sanyu Switch further expanded our relay portfolio with new package types, including high-frequency solutions. With manufacturing operations in the U.S., Mexico, Germany, India, Japan, and China, and sales offices across North America, Europe, and Asia, Standex Electronics generates annual revenues exceeding $400 million. We are a wholly owned subsidiary of Standex International Corporation (NYSE: SXI), a diversified, publicly traded company.

standex ad
STAr Technologies, Inc.

*SHP*
Booth: 207
www.star-quest.com

STAr delivers innovative probe card solutions for the most demanding semiconductor testing applications. We excel in SoC IC testing with our Optima MEMS vertical high pin count probe cards (down to 35µm pitch and >2A currents across tri-temperature).

STAr’s one-touch 3D MEMS probe cards significantly lower the Cost-of-Test for Flash memory ICs with single-card tri-temperature testing. For CMOS image sensors (CIS), we offer 3D MEMS probe cards supporting >3.5GSPS C-PHY tests, with next-gen 6GSPS in development.

STAr also introduced Zeus Membrane Probe Cards for signal-critical RF applications, featuring tunable components, adjustable contact force, high channel density, and versatile RF connectors. Additionally, our MEMS WAT probe cards support femto-ampere low-leakage current WAT tests with 35µm pitch capability.

STAr is dedicated to providing our customers with the most advanced and reliable probe card solutions.

star technologies
star swtest 2025 ad
Synergie Cad Group

Booth: 302
www.synergie-cad.com

PCB Design, Manufacture and Assembly – Full In House Turnkey PCB Solution

synergie ad
TDK Lambda Americas Inc

Booth: 403
us.lambda.tdk.com

TDK-Lambda Americas, Inc. is a leading manufacturer of high reliability Low/High Voltage Programmable DC Power Supplies, AC Sources, High Voltage Capacitor Chargers and DC Electronic Loads. Programmable DC products include the GENESYS™ Series, the GENESYS+™ Series, the ALE Series and the SFL Series. For more information, please visit https://www.us.lambda.tdk.com.

Technoprobe

*SHP*
Booth: 506
technoprobe.com

Innovation Begins with Us

Technoprobe (XMIL: TPRO) is a leading provider of the most advanced wafer test solutions for the semiconductor industry.

The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio capable of meeting complex testing requirements and reducing the overall cost of test.

Technoprobe works relentlessly to keep pace with the constant evolution of semiconductors. Our culture to drive Innovation leads us to explore new concepts, to push Technology beyond its limits, and to use customization as a guiding principle to enable the next generation products.

Technoprobe strives to be the technology leader to help build our customers’ future.

technoprobe
technoprobe ad
TEL

Booth: 106
www.tel.com

As a leading global company of innovative semiconductor and flat panel display (FPD) production equipment, Tokyo Electron (TEL) engages in development, manufacturing, and sales in a wide range of product fields. All TEL’s semiconductor and FPD production equipment product lines maintain high market shares in their respective global segments. TEL provides outstanding products and services to customers through a global network in the U.S., Europe, and Asia.

t-e-l
Teradyne

Booth: 602
teradyne.com

Teradyne test technology helps bring high-quality innovations such as smart devices, life-saving medical equipment and data storage systems to market, faster. Its advanced test solutions for semiconductors, electronic systems, wireless devices and more ensure that products perform as they were designed. Its robotics offerings include collaborative and mobile robots that help manufacturers of all sizes increase productivity, improve safety, and lower costs. In 2023, Teradyne had revenue of $2.7 billion and today employs over 6,500 people worldwide. For more information, visit teradyne.com.

teradyne ad
Test Tooling Solutions Group

Booth: 502
tts-grp.com

Being in the business since 1979, TTS Group dedicates itself to bring the best possible solutions to help our customers solve some of the most challenging issues in semiconductor test and tooling today. Right from R&D to design to simulation to validation, we focus on lowering the total cost of final test through relentless pursuit of innovation, yield, quality, reliability and on-time delivery for our customers. Our solutions range from probe heads, probe pins, and test contactors.

T.I.P.S. Messtechnik GmbH

Booth: 613
www.tips.co.at

Probe Cards for HV/HC power device test (Si, SiC, GaN)
Known Good Die Test (KGD) for power device (Si, SiC: IGBT, MOSFET, Diode…)
Probe Cards for Sensors (MEMS, pressure, magnetic, gas, radiation…)
Vertical Probe Cards for Automotive ASICS, RADAR
Docking solutions for High Power probe cards (probe card, signal tower, load board suitable for automatic probe card changer)

tips ad
Translarity, Inc.

*SHP*
Booth: 601
translarity.com

Translarity is a growing player in the semiconductor test industry, providing innovative wafer test solutions that are essential to the technology driving our digital lives. Headquartered in Silicon Valley and with operations in California, the Philippines, Texas, Taiwan, and Vietnam, the company serves leading semiconductor manufacturers, and their supply chain partners globally. Translarity’s mission is to enhance semiconductor wafer testing through a focus on innovation and excellence. The company’s approach to full-wafer testing offers a combination of low cost, high performance, and fast cycle times, utilizing innovative MEMS probe technology. Translarity has secured over 100 patents, highlighting our commitment to tackling pressing industry challenges. With a dynamic and growing team, Translarity remains dedicated to addressing the ever-evolving needs of semiconductor manufacturers worldwide.

translarity
TSE

Booth: 511
www.tse21.com

The i3unify integrated solution provides a comprehensive portfolio of test interconnect hardware, including probe cards, interface boards, and test sockets, all designed within TSE’s vertically integrated architecture. This ensures seamless compatibility, enhanced performance, and reliability across platforms while streamlining implementation and reducing dependency on multiple vendors. The unified approach simplifies installation, after-sales support, and optimization, enabling innovative, customized solutions that maximize efficiency and customer satisfaction. As the ultimate test interconnect solution for semiconductor testing, i3unify supports diverse applications, including AI, high-speed networks, advanced data centers, and autonomous vehicles. It redefines connectivity, unlocking limitless possibilities and driving transformative opportunities for our customers through cutting-edge innovation and exceptional user experience.

TSE
tse ad
Turbodynamics GmbH

Booth: 104
www.turbodynamics.com

At Turbodynamics, we view ourselves as a service provider for cutting-edge technology in the semiconductor industry. We provide our customers with solutions for their automatic test equipment that are individually tailored to their needs. And we develop innovative solutions on our own initiative. Our first product, the compact locking element P-DockⓇ, is now successfully in use worldwide and forms the benchmark in semiconductor test. The success story of P-DockⓇ we repeat according to the same principles: listen to our customers, develop solutions and deliver reliably.

UNITES Systems a.s.

Booth: 615
www.unites-systems.com

UNITES Systems a.s. is a private company located in the Czech Republic founded in 1991. Main focus is on development and production of semiconductor testers – ATEs (Automatic Test Equipment), especially for discrete semiconductors (MOSFETs, IGBTs, Diodes, etc.) but also for mixed-signal devices like Analog ICs, PWM, Voltage regulators, etc.

WinWay Technology

Booth: 515
www.winwayglobal.com

WinWay Technology Co Ltd is an IC testing interface supplier. WinWay provides services to industries such as semiconductors, optical, information technology, and optoelectronics. The main products and services include Test Sockets, Contact Elements, Probe Cards, and thermal units. The company has a presence in Taiwan, America, China, Asia, Europe, and Canada.

Xallent Inc.

*SHP*
Booth: 113
www.xallent.com

A global leader in fine pitch probing, Xallent Inc. designs, develops, manufactures, and markets advanced hardware and software tools for micro and nanoscale probing measurements. Xallent’s patented fine pitch probe cards and test systems are used for the most demanding testing applications of chiplets, advanced packages, and thin film materials. As the semiconductor industry pushes the design frontier, Xallent’s technologies enable industry-leading research labs and production facilities to dramatically improve their measurement and analytics capabilities with greater accuracy, speed, and at lower costs.

Yokowo America Corporation

Booth: 206
yokowo.co.jp

Yokowo proposes a broad spectrum of fine connectors and test systems for front to back-end testing, which excel in signal integrity and are capable of testing the high-speed performance of semiconductors and electronic components amid trends towards higher density, greater integration and higher frequency. With complete before- and after-sales service systems, Yokowo answers the needs of customers.

yokowo
yokowo ad
YoungTek Electronics Corporation USA, Inc.

*SHP*
Booth: 514
ytec.com.tw/en

Founded in 1991, YTEC started as a semiconductor sawing and pick & place OEM business, and has been committed to the back-end OEM services of semiconductor and has invested in the research and development, manufacturing and sales in related production equipment for 30 years up to date. The semiconductor OEM service strategy of YTEC is oriented to provide customers with integrated Turn-key Solution services, establishing a complementary and balanced diversified product line to meet PC peripherals, Logic, Mix-Signal, Non-volatile memory, MCU, USB, Analog power management IC, CIS image sensor IC, MEMS, RF communication product IC, LCD driver IC, lot/3C IC, automotive IC and other testing requirements, in addition to self-manufactured ATE equipment and continuous upgrades to High Power and High Speed in coordination with customer technology evolution, stable service quality and strong engineering support capabilities have allowed YTEC to become the most trusted business partner for our customers.

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SWTest 2026

See You Next Year at SWTest 2026
June 8 – 10, 2026
at the Omni La Costa Resort!

Travel safe and stay healthy!

SWTest Asia 2025

Mark Your Calendars for SWTest Asia 2025
November 20 – 22, 2025
at the Hilton Fukuoka Seahawk
in Fukuoka, Japan

See you in Japan!