2005 Southwest Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS

High Power Probing Tutorial
Dinner Guest Speaker - Dr. Igor Khandros
Opening Session - Chairman's Welcome
Session 1 - Modeling to Reduce Dielectric Cracking
Session 2 - Reducing Probe Costs
Session 3 - Probe Potpourri
Session 4 - New Technologies
Session 5 - On the Road to Full Wafer Test
Session 6 - Minimizing Contact Resistance Instability
Session 7 - Probe Process Characterization
Session 8 - Probe Test Data Management

 




HIGH POWER PROBING TUTORIAL
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"Optimum Wafer to Thermal Chuck Interface"

Harald Ibele

Maccs LLC

harald.ibele@maccs.us

Klemens Reitinger

ERS GmbH

kreitinger@ers-gmbh.de

 


"Liquid Interface at Wafer Test"

Phil Diesing

David Gardell

David Audette

IBM Microelectronics

pdiesing@us.ibm.com

 

 


"Power Delivery Model of Test Probe Cards"

Habib Kilicaslan

Bahadir Tunaboylu, Ph.D.

Kulicke & Soffa Industries

hkilicaslan@kns.com

btunaboylu@kns.com

 

"Sort Tooling Probe Burn Control"

Matt Cladius

Intel Corporation

matthew.claudius@intel.com



CHAIRMAN'S WELCOME
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"Welcome to SWTW-2005"

Bill Mann
General Chair
Southwest Test Workshop
william.mann@ieee.org

 

 


"SWTW Lifetime Achievement Award" as presented by Bill Mann

Yoshiei Hasegawa
President and CEO

Micronics Japan Co.

 

 



Session 1 - MODELING TO REDUCE DIELECTRIC CRACKING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"Eliminating Dielectric Cracking of Cu/Low-k Devices During Cantilever Probing"

Daniel Stillman
Cheryl Hartfield
Texas Instruments, Inc.
d-stillman2@ti.com
Hartfield@ti.com

 

 


"Why Using Finite Element Analyses to Optimize Cantilever Probe Card Design?"

Lich Tran, Ph.D.

Rey Rincon

Kulicke & Soffa Industries

LTTran@kns.com

RRincon@kns.com

 

 


"Key Methods in Reducing Pad Void Formation and Experimental Result"

Frank Hwang

Y.S. Kuo

Y.J. Hsiao

Taiwan Semiconductor Manufacturing Company, Ltd.

sxhwang@tsmc.com



Session 2 - REDUCING PROBE COSTS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  

"
Microprocessor Probing Challenges: Scaling Sort Cost with Moore’s Law"

Jun Ding

Thomas Little

Jin Pan

Tim Swettlen

Intel Corporation

jun.ding@intel.com

 

 


"Optimizing Test Strategies for Multi-DUT Wafer Probing"

Ken Smith

Cascade MicroTech

Ken_Smith@cmicro.com

 

 


"Extra Large Multi-DUT Array Probing Enabling > X100 Parallel Testing"

Bassam Dabit

Trung Nguyen

Intel Corporation

bassam.dabit@intel.com

 

 


"Decreasing Repair Cost and Improving Probe Card Life A Case Study"

Rod Schwartz

Integrated Technology Corporation

rod@inttechcorp.com

Sue Neises

Intel Corporation

sue.neises@intel.com

 



Session 3 - PROBE POTPOURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"ISMI Probe Council: Standard Probe Head Interface for Cobra Space Transformer
"

Jack Courtney

IBM Microelectronics

jcourtne@us.ibm.com

Michael Egloff

AMD

michael.egloff@amd.com

Mike Harris

Texas Instruments, Inc.

mpharris@ti.com


"Laser Micromachining: A flexible tool in Vertical Probe Card Manufacturing"

D.Karnakis

G.Rutterford

M.Knowles

Oxford Lasers Ltd. (UK)

dimitris.karnakis@oxfordlasers.com

A.Webb

Oxford Lasers Inc. (USA)

awebb@oxfordlasers.com

 

 



"DDR2 DRAM High-Frequency Test at Probe (HFTAP)"

Masahide Ozawa

Elpida Memory, Inc.

ozawa-masahide@elpida.com

Yoichi Funatoko

FormFactor Inc., Asia

yfunatoko@formfactor.com

 



Session 4 - NEW TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  


"
MEMS Solution for Semiconductor Probing"

Dr. Howard Hsu

SCS Hightech Inc. (Taiwan)

titanic64@hotmail.com

 

 


Winner - Most Inspirational Presentation
"Cobra FP Probe Card for Multi-DUT Logic and Memory Applications"

Lucie Mialhe

Isabelle Garidi, Ph.D.

Kulicke & Soffa Industries (France)

lmialhe@kns.com

IGaridi@kns.com

Bahadir Tunaboylu, Ph.D.

Kulicke & Soffa Industries

btunaboylu@kns.com

 

 

 

"New Composite Probe of Rh and Ni-Mn for High Current and Fine Pitch Testing"

Kazunori Okada

Yoshihiro Hirata

Tsuyoshi Haga

Masao Sakuta

Sumitomo Electric Industries, LTD.

okada-kazunori@sei.co.jp

 

 



Session 5 - ON THE ROAD TO FULL WAFER TEST
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 
 

"Full Wafer Test: Making Test More Cost Effective"

Steve Steps

Aehr Test Systems

ssteps@aehr.com

 


"A Novel Probe-Card for 8-inch Full Wafer Contact using MLS"

Tatsuo Inoue

Micronics Japan Co. LTD (Aomori)

inoue@mjc.co.jp

Fred Megna

Micronics Japan Co. LTD (Phoenix)

fmegna@earthlink.net


"Application of Larger Probing Area by Cantilevered Probes"

Dave Oh

Gyo-chol Chu

TSE (South Korea)

daveoh@tse21.com

gc_chu@tse21.com


"Large Area Probing Meets Small Pitch"

Gunther Boehm

Feinmetall GmbH

g.boehm@feinmetall.de

 

 



Session 6 - MINIMIZING CRES INSTABILITY
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8  

Winner - Best Technical Presentation
"Comprehensive Approach to Control Contact Resistance Instability and Improve First Pass Yield of Bumped Devices
"

Joe Foerstel

Sean Chen

Altera Corporation

jfoerste@altera.com

Atsushi Mine

Phill Mai

JEM

pmai@jemam.com

Jerry Broz, Ph.D.

International Test Solutions

jerryb@inttest.net


Winner - Best Data Presentation
"Impact of Vibration on Contact Resistance"

Al Wegleitner

Texas Instruments, Inc.

a-wegleitner@ti.com

   


"Dynamic Switching Test Technology for IGBT Chip Under High Power Operating Condition"

Y. Masuma

A.Yoshida

K.Yamada

S. Sumi

Fuji Electric Device Technology Co., Ltd.

masuma-yoshitaka@fujielectric.co.jp

 

 


"An Advanced Probe Characterization Tool for Online Contact Basics Measurements"

Oliver Nagler

Infineon Technologies AG

oliver.nagler@infineon.com

Markus Reinl

Prof. Dr. Ignaz Eisele

Universität der Bundeswehr

markus.reinl@unibw-muenchen.de

ignaz.Eisele@unibw-muenchen.de

 



Session 7 - PROBE PROCESS CHARACTERIZATION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8

"
Reducing False Defects: Debris and Edge Excursions"

Rajiv Roy

August Technologies

Rajiv.Roy@augusttech.com

 

 


"Probe Card Metrology Qualification Methodology"

Yossi Revah

Intel Corporation (Israel)

yossi.revah@intel.com

Eugene T. Doan

Intel Corporation

eugene.t.doan@intel.com


Winner - Best Presentation, Tutorial in Nature
"The 'Probe Card Signature' Syndrome or Who has the 'Old Maid'"

Frank Pietzschmann

Infineon Technologies

frank.pietzschmann@infineon.com

Jim Andersen

Applied Precision, LLC

JAndersen@api.com


"Fully Integrated True CRES Measurement for Probe Cards and Probing Process Characterization"

Rick Hales

Koorosh Zaerpoor

Intel Corporation

rick.d.hales@intel.com

koorosh.zaerpoor@intel.com

 

 



Session 8 - PROBE TEST DATA MANAGEMENT
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 

"
Test Data Management in a Complex Environment"

Glenn Claudi-Magnussen

Skyworks Solutions, Inc.

glenn.claudi-magnussen@skyworksinc.com


"
Analysis of EWS Test Data for Reliability Improvement through Outlier Detection and Automated Ink Map Generation"

Paul Buxton

Test Advantage Ltd. (Scotland)

paul.buxton@testadvantage.com

Paul Tabor

Test Advantage, Inc. (USA)

paul.tabor@testadvantage.com


"Dynamic Parts Average Testing in Real-time"

Micky Ray

Pintail Technologies, Inc.

micky.ray@pintail.com


"Meeting the New Challenges of Test "

Micky Ray

Pintail Technologies, Inc.

micky.ray@pintail.com


 




SWTW 2005 Chairs:

William Mann, General Chair

Jerry Broz, Ph.D., International Test Solutions, Technical Program Chair

Maddie Harwood, CEM Inc., Registration and Finance Chair

Megan White, CEM Inc., EXPO Coordinator
 

SWTW 2005 Program Committee:

Jack Courtney, IBM Microelectronics

Michael Egloff, AMD

Michael Harris, Texas Instruments

Ken Karklin, Agilent Technologies

Ger Koch, Philips Semiconductor

Scott Mitchell, Texas Instruments

Rey Rincon, Kulicke and Soffa

Phil Seitzer, Agere (Retired)

Roger Sinsheimer, Xandex

Tim Swettlen, Intel

Fred Taber, BiTS Workshop General Chair

Bill Williams, Freescale (Retired)