SEMICONDUCTOR WAFER TEST WORKSHOP 2018

(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS


Awarded Presentations

 
  • Best Data Presentation (tie)
    Probing solutions and inherent customization to enable advanced copper-based 3D integration schemes
    • Authors: Mr. Dong-pill Yang (Samsung Electronics Co., Ltd – Hwasung city, Korea), Mr. Jung-woo Sung (Samsung Electronics Co., Ltd – Hwasung city , Korea), Mr. Daniele Acconcia (Technoprobe – Cernusco Lombardone, Italy) Dr. Andrea Calaon (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Dr. Emanuele Bertarelli (Technoprobe – Cernusco Lombardone, Italy), Mr. Daniel Lee (Technoprobe Korea Co. Ltd – Yongin-city, Korea), Prea Marco (Technoprobe S.p.A. – Italy)
    • Presenters: Dr. Emanuele Bertarelli (Technoprobe – Cernusco Lombardone, Italy)
    A Real Life Pad Crack Study
    • Presenters/Authors: Mr. Gunther Boehm and Dr. Matthias Schnaithmann (FEINMETALL GmbH – Herrenberg, Germany), Mr. Jory Twitchell (NXP, USA)
  • Best Presentation, Tutorial in Nature
    A Novel Measurement Method for Measuring CCC and MAC at once
    • Authors: Dr. Matthias Schnaithmann (FEINMETALL GmbH – Herrenberg, Germany), Mr. Achim Weiland (FEINMETALL GmbH – Herrenberg, Germany), Mr. Gunther Boehm (FEINMETALL GmbH – Herrenberg, Germany)
    • Presenter: Dr. Matthias Schnaithmann (FEINMETALL GmbH – Herrenberg, Germany)
  • Best Poster Presentation
    Tri-Temperature Probing: -55C to >125C
    • Presenters/Authors: Mr. Chris Buckholtz (Teradyne, Inc. – Agoura Hills, USA), Mr. Roger Sinsheimer (Teradyne, Inc. – Agoura Hills, USA)
 

Technical Tutorials - Get Your Tutor On!

 
Mr. Clark Liu (PTI – Hsinchu, Taiwan)

Session #1 - Wafer Test Trends and Complications

 

Session #2 - Advanced Probing Process!

 
  • Effects of Pad Structure on the Scrub Performance of MEMS Probes for Memory Devices
    • Authors: Mr. Alistair Laing (Micron Technology, USA), Ms. Miho Kitayama (Micronics Japan Corp. – Aomori, Japan), Mr. Yuma Tanaka (Micronics Japan Corp. – Aomori, Japan), Mr. Dick Duncan (MJC Electronics – Boise, USA)
    • Presenter: Mr. Aaron Woodard (Micron Technology, USA)
  • Probing solutions and inherent customization to enable advanced copper-based 3D integration schemes
    • Authors: Mr. Dong-pill Yang (Samsung Electronics Co., Ltd – Hwasung city, Korea), Mr. Jung-woo Sung (Samsung Electronics Co., Ltd – Hwasung city , Korea), Mr. Daniele Acconcia (Technoprobe – Cernusco Lombardone, Italy) Dr. Andrea Calaon (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Dr. Emanuele Bertarelli (Technoprobe – Cernusco Lombardone, Italy), Mr. Daniel Lee (Technoprobe Korea Co. Ltd – Yongin-city, Korea), Prea Marco (Technoprobe S.p.A. – Italy)
    • Presenters: Dr. Emanuele Bertarelli (Technoprobe – Cernusco Lombardone, Italy)
  • Leading-Edge Wide-I/O2 Memory Probing Challenges: TPEG™ MEMS Solution
    • Authors: Mr. Ferenc Fodor (IMEC – Leuven, Belgium), Mr. Erik Jan Marinissen (IMEC – Leuven, Belgium), Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Mr. Daniele Acconcia (Technoprobe – Cernusco Lombardone, Italy)
    • Presenter: Mr. Ferenc Fodor (IMEC – Leuven, Belgium)

Session #3 - All About The Probe!

 
Dr. Darren James (Rudolph Technologies – Bloomington, USA)

Session #4 - Dial Up the Frequency!

 

Session #5 - Extreme Wafer Probing (ONE)!

 

Session #6 - Extreme Wafer Probing (TWO)!

 
Patrick Mui (JEM America – Fremont, USA)
  • Known Good “Power” Die: Diced Wafer Test at 7 kV and 1000 A
    • Authors: Dr. Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Villach, Austria), Mr. Mauro Serra (CREA s.r.l. – Torino, Italy), Mr. Ernest Fischer (INFOTECH AG – Solothurn, Switzerland)
    • Presenter: Dr. Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Villach, Austria)
  • Vertical MEMS Probe Card Applied to High Speed Loopback Test of Network Communication IC
    • Authors: Mr. Haiyong Song ( Hisilicon Technologies Co., Ltd. A Huawei Company – ShangHai, China), Mr. Zheng Li ( Hisilicon Technologies Co., Ltd. A Huawei Company – ShangHai, China), Mr. Adolph Cheng (MPI Corporation – Chu-Pei, Taiwan), Mr. Fred Chou (MPI Corporation – Chu-Pei, Taiwan), Mr. Alex Wei (MPI Corporation – Chu-Pei, Taiwan), Ms. Jessie Deng (MPI Corporation – Chu-Pei, Taiwan), Mr. Zach Hsieh (MPI Corporation – Chu-Pei, Taiwan), Mr. Bobby Chen (MPI Corporation – Chu-Pei, Taiwan)
    • Presenter: Mr. Adolph Cheng (MPI Corporation – Chu-Pei, Taiwan)
  • A Real Life Pad Crack Study
    • Presenters/Authors: Mr. Gunther Boehm and Dr. Matthias Schnaithmann (FEINMETALL GmbH – Herrenberg, Germany), Mr. Jory Twitchell (NXP, USA)

Session #7 - Session #7: Probe Cleaning and Wafer Inspection!

 

Session #8 - Probe Potpourri!

 

Session #9 - High Performance Space Transformers & PCB’s!

 
Mr. Rey Rincon (SWTest – Austin, USA)

Poster Session 1: Probe Optimization

 
Mr. Rey Rincon (SWTest – Austin, USA)

Poster Session 2: Probe Infrastructure – Equipment

 
Mr. Mark Ojeda (Cypress Semiconductor – San Jose, USA)

 

 


Steering Committee Members for SW Test 2018:

Dr. Jerry Broz, Ph.D., MJC Electronics, Corp., General Chair
Rey Rincon, NXP Semiconductor, Technical Program Chair
Maddie Harwood, CEM Inc., Finance Chair
John Caldwell, Micron Technology, Program Committee
Patrick Mui, JEM America, Program Committee
Fred Taber, Consultant
Karen Armendariz, Celadon Systems
Gunther Boehm, FeinMetall GmbH
Michael Huebner, Ph.D., FormFactor
Amy Leong, FormFactor, Inc.
Clark Liu, Powertech Technology, Inc. (PTI – Taiwan)
Gary Maier, IBM Corporation
Mark Ojeda, Cypress Semiconductor
Joey Wu, MPI Corporation (Taiwan)
Al Wegleitner, Texas Instruments, Inc.
Sang Kyu (SK) Yoo, Samsung Electronics – Korea
Stevan Hunter, Ph.D., ON Semiconductor, Committee Emeritus
Darren James, Rudolph Technologies, Committee Emeritus

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee.


Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a workshop environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.