2010 IEEE SW Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS
Dinner Session - Year in Review and Keynote
Opening Session - Chairman's Welcome
Session 1 - New Contact Technologies
Session 2 - High Temperature Probing
Session 3 - Improving Cost of Ownership
Session 4 - Standards and Methods
Session 5 - Signal Integrity
Session 6 - Parametric / Scribeline Probing
Session 7 - Probe Potpourri
Session 8 - Area Array Probing
Session 9 - Challenges of RF Probing
 

 

Download the SW Test 2010 Summary to be published in CPMT Newsletter.
Dinner Session
 Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Probe Year in Review"

Jerry Broz, Ph.D.
 General Chair
SW Test Workshop

  

 


Keynote Speaker - "What's Going to Rock Your World … Or, At Least Push Your Probes."

Dean Freeman
Research Vice President
(Gartner Research, Inc.)

 

  



Chairman's Welcome AND Workshop Overview
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Welcome to Semiconductor Wafer (IEEE SW Test) Workshop 2010"

Jerry Broz, Ph.D.
General Chair
(SW Test Workshop)

  

 



Session 1 - New Contact Technologies
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"New Probe Card Architecture – Ceramic without MLC"

Jay Kim, PE
(Western Specialty Technologies, LLC)		 Jae-Ha Lee
(Fine Instrument Co., Ltd.)

 


"Standardizing WSP-Wafer Socket Pogo Pin-Probe Cards"
John Hite
(Texas Instruments)		  

 


"Benefits of Flip Chip Wafer Sort using MEMs Multi Site Capability"
Lo Wee Tick
(GLOBALFOUNDRIES)		 Pascal Pierra
(FormFactor, Inc.)

 



Session 2 - High Temperature Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Addressing the Operating Challenges of Full Wafer Contactors"

Keith Breinlinger, Ph.D.
(FormFactor)		  

 


"The Thermal Frontier …. High Temp Probing System Solutions and Analysis"

Lou Molinari
(ESA Corporation/Probe Solutions)		  

 


"Remembering Good Friends of SW Test"

Jerry Broz, Ph.D.
(SWTW General Chair)

 

 



Session 3 - Improving Cost of Ownership
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Optimizing Test Cell Performance Using Probing Process Analysis and Predictive Scrub"

Rey Rincon
(Freescale Semiconductor)

John Strom
Jeff Greenberg
(Rudolph Technologies)

  


"Reducing the Cost of Test on Gold and Copper Pads"

Thomas Logue
(Seagate)		    


"Probe Card Cleaning by Laser"

Rocky J.M.Lee
J.S.Choi
(IMT Co Ltd. – KR)		 J.H.Park
(Willtechnology Co. Ltd. – KR)		  


"Impact of Bond Pad Corrosion"

Terence Q. Collier
(CVInc.)		    



Session 4 - Standards and Methods
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Adaptive test on wafer level focus on: test-time reduction (TTR)"

Rob Marcelis
(Salland Engineering Europe BV)

  

 


"'Metrology Solutions for Very Large Probe Cards"

Mark McLaren
(Integrated Technology Corporation)

    

 

"A New Methodology for Assessing the Current Carrying Capability of Probes used at Sort"

Matthew C. Zeman, Ph.D.
(Intel Corporation)		  

 


Co-Winner - Most Inspirational Presentation
 "Measuring Current Carrying Capability (CCC) of Vertical Probes"

Rehan Kazmi, Ph.D.
Habib Kilicaslan
Jeffrey Hicklin
Bahadir Tunaboylu, Ph.D.
(SV Probe, Inc.)		  

 



Session 5 - Signal Integrity
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Hidden Performance Limiters in the Signal Path"

Gert Hohenwarter
(GateWave Northern, Inc.)

 


"The Affects of Probe Impedance on RF KGD Measurements"
Jeff Arasmith
(Cascade Microtech)		    


"The Importance of the Signal Return Path in Test Applications"

Zaven Tashjian
(Circuit Spectrum, Inc.)

Kevin Hoffmann
(Micrel, Inc.)


"Expanding Test Coverage at Sort to Reduce Overall Product Costs"

Larry Levy
(FormFactor, Inc.)



Session 6 - Parametric / Scribeline Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Probe Cards with Modular Integrated Switching Matrices"

Evan Grund
Jay Thomas
(Grund Technical Solutions, LLC.)		  


"New Directions In Parametric and Defect Structure Testing"

R. Robertazzi
(IBM Research)

L. Medina
E. Shiling
G. Moore
R. Geiger
J. Liao
(IBM Systems and Technology Group)

J. Williamson
(White Eagle Consulting)

 

"Wafer Level ESD Probe Card Solutions"

Evan Grund
Jay Thomas
(Grund Technical Solutions, LLC.)		    



Session 7 - Probe Potpourri
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Very Low Cost Probe Cards – A Two Piece Approach"

E Boyd Daniels
Martin Gao
(Texas Instruments)		 Mitch Baumann
(Millennium Circuits)		  

 


"Metrology and Probe Repair Challenges with Tighter Pitch Probe Cards"

Anil Kaza
(Intel Corporation)


 


 


"Ultra Low Leakage Probes and Cables For Fine Pitch Probe Cards"

Hiroyuki Kamibayashi
(Mitsubishi Cable Industries)

 


"Overpad Metallization and Probe Challenges"

Terence Q. Collier
(CVInc.)

 



Session 8 - Area Array Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

 Co-Winner - Most Inspirational Presentation
"Probing Assessment on Fine Pitch Copper Pillar Solder Bumps"

S. Theppakuttai, Ph.D.
B. Tunaboylu, Ph.D.
(SV Probe, Inc.)


Winner - Best Data Presentation
"Contacting Various Metal Compositions Using ViProbe® Vertical Technology"

Denis Deegan
(Analog Devices, Inc.)

Simon Allgaier
(Feinmetall GmbH)


Winner - Best Presentation, Tutorial in Nature
"High Speed Control Bus for Advanced TRE™"

Michael Huebner, Ph.D.
(FormFactor, Inc.)

 


Winner - Best Technical Presentation

"Low-Force MEMS Probe Solution for Full Wafer Single Touch Test "

Matt Losey, Ph.D.
Yohannes Desta
Melvin Khoo
Lakshmikanth Namburi
Georg Aigeldinger
(Touchdown Technologies)

 


 Session 9 - Challenges of RF Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Novel Vertical Probe Card Solution for Multi-DUTs and RF Device on 3GHz Applications"

Ellis Huang
(MPI Corp. – TW)


"High Frequency Solutions for Wafer Level Package Test"

Ryan Satrom and Jason Mroczkowski
(Multitest | ECT Interface Products)

 

 

SWTW 2010 Chairs:

  • Dr. Jerry Broz, International Test Solutions, General Chair

  • Rey Rincon, Freescale Semiconductor, Technical Program Chair

  • Maddie Harwood, CEM America, Inc.,Finance Chair

  • Meredith M. Griffith, CEM America, Inc., Registration / EXPO Coordinator

  • Kellie Easterling, CEM America, Registration Coordinator
     

SWTW 2010 Steering Committee:

  • Darren James, Rudolph Technologies, Technical Program Committee

  • Jan Martens,  NXP Semiconductors Germany GmbH, Technical Program Committee

  • Rod Martens, FormFactor, Inc.

  • Patrick Mui, JEM-America, Technical Program Committee

  • Roy Swart, Intel Corporation

  • Fred Taber, BiTS Workshop, Proceedings Coordinator

 
 

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee, IEEE CPMT Society, IEEE Computer Society or the IEEE Test Technology Council.

Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a workshop environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.
 

 

© 2010 swtest.org      |      last modified 08/23/2010