(Each presentation is in Adobe Acrobat format) |
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Bill Mann |
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DINNER SPEAKER
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"The IC Market Recovery Outlook"
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Brian Matas Vice President IC Insights, Inc. Scottsdale, AZ 480-348-1133 |
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CHAIRAMN'S WELCOME
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Winner - Lifetime Achievement Award
"Welcome to SWTW-2003"
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Bill Mann |
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Session 1 - NEW PROBE TECHNOLOGIES
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"Full Wafer Contact Repeatability and Reliability"
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Steve Steps Scott Lindsey, Ph.D. Aehr Test Systems 400 Kato Terrace Fremont, CA 94539 510-623-9400 |
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"A High Parallelism, High Bandwidth Probe Card using SiFi MEMS Probes"
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Keith Lee Bob Aldaz Yu Zhou, Ph.D. David Yu, Ph.D. Gert Hohenwarter Tassos Golnas Advantest America, Inc. Buffalo Grove, IL 847-821-3204 |
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"Vertical Micro-Probe Design Based on the EFABTM Micro-Fabrication Process"
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Chris Bang Nelsimar Vandelli MEMGen Corporation 1103 W. Isabel St. Burbank, CA 91506 818-295-3996 |
Session 2 - MEMORY PROBING
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"High Throughput Challenges for 300mm Wafer Testing"
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Clark Liu Powerchip Semiconductor Corp NO 12 LI-HSIN RD.I , SBIP HsinChu, Taiwan,300 886-3-5792131
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Nobuhiro Kawamata FormFactor, Inc., Asia Re-Ju Oh-imachi Bldg. 7F 4-13-17, Oh-i, Shinagawa-ku Tokyo 140-0014 81-3-5746-3100 |
Ken Taoka Tokyo Electron Limited 2381-1 Kitagejo Fujii-cho, Nirasaki City
Yamanashi 81-551-23-2148 |
"Critical Factors in Testing MRAM Devices"
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Bill Stevenson Cypress Semiconductor 3901 North First Street San Jose, CA 95134-1599 408-456-1926
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George Asmerom Chris Taylor Electroglas Inc.
6024 Silver Creek Valley Rd 408-528-3325 |
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"Memory XXL Another Step on the Way to Full Wafer Probing - 256 DUT on Beta-mode"
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Klaus Giringer Gunther Boehm FEINMETALL GMBH Zeppelinstraße 8 D- 71083 Herrenberg 0 70 32 / 20 10 - 0 |
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Session 3 - VERTICAL PROBE CHALLENGES
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"International SEMATECH Wafer Probe Council Report on Vertical Probing Experiences"
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Frederick L. Taber IBM Microelectronics Zip 5E1 2070 Route 52 Hopewell Junction, NY 12533 845-894-2348 |
Gavin Gibson Infineon Technologies Room 02/352 St Martin Straße 76 D-81541 Munich, Germany 49-89-234-28290 |
"Hybrid Buckling Beam Contact for Vertical Probe Cards"
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Robert Murphy Wentworth Laboratories, Inc. 101 Commerce Drive Brookfield, CT 06804 408-919-1875 x 29 |
"Ultimate Frequency Limitations of Cobra Probe Contactors"
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Raphael Robertazzi IBM T.J. Watson Research Center Building 801 Rt 134 MS 13-257 Yorktown Heights, NY 10598 914-945-3620 |
Winner - Best Presentation, Tutorial in Nature
"Predicting the Performance of Sort Tooling to 40 Gb/s"
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Brett Grossman Intel Corp.
2501 NW 229th Street Hillsboro, OR 97124 971-214-5107 |
Bryan Boots Ansoft Corporation 3800 Arapahoe Boulevard Suite 250 Boulder, CO 80303 303-541-9525 |
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Session 4 - METAL STACK / DIELECTRIC CHARACTERIZATION
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Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Multi-site
Probing for Wafer-Level Reliability"
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Louis Solis De Ancona Agilent Technologies 5301 Stevens Creek Blvd M/S 54L-WY Santa Clara, CA 95051
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Sharad Prasad David Pachura LSI LOGIC 1621 Barber Ln MS AD-222 Milpitas, CA 95035
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Winner - Best Technical Presentation
"A Novel In-situ Methodology to Characterize Bond Pad and Dielectric Mechanical Behavior during Wafer Level Test"
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Cheryl Hartfield Texas Instruments, Inc. 13560 N. Central Expressway Dallas, TX 75265 USA 972-995-6007
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Tom Moore, Ph.D. Omniprobe, Inc. 7738 Forest Lane, Ste. 426 Dallas, TX 75230 972-840-8815
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Jerry Broz, Ph.D. Point Technologies, Inc. 6859 N. Foothills Hwy Boulder, CO 80302 800-557-7059
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"Vertical Probe Development for Copper Probing Challenges"
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Bahadir Tunaboylu, Ph.D. Kulicke & Soffa Industries 1150 N. Fiesta Blvd. Gilbert, AZ 85233
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Ethan Caughey Intel Corp. 2200 Mission College Blvd Santa Clara, CA 95054
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"MicroForce™
Probing for low-k ILD Testing"
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Rod Martens, Ph.D. Form Factor, Inc. 2140 Research Drive Livermore, CA 94550 925-456-3813 |
Abdel Abdelrahman Intel Corp. 2200 Mission College Blvd Santa Clara, CA 95054
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Steve Martinez Tokyo Electron Limited 2400 Grove Boulevard Austin, Texas 78741 512-424-1414 |
Session 5 - MEMS TECHNOLOGIES
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Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"MEMs
Technology in Testing"
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Richard Chuang SCS Hightech Inc. 1F, No.40, Industry E. 4th rd., Science-Based Industrial Park Hsin-Chu, Taiwan 300
Taiwan. R.O.C.
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Winner - Best Data Presentation
"The New Probe Tip Fabricated by MEMS (LIGA Process) for No-cleaning Test"
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Tsuyoshi Haga K.Okada J.Yorita Y.Hirata Harima R&D Department Sumitomo Electric Industries, LTD. |
S.Shimada Analysis Technology Research Center Osaka R&D Laboratories Sumitomo Electric Industries, LTD. |
"A Comparison of Scrub Marks & Contact Resistance Between Cantilever Type and New MEMS Type Probe Cards"
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Jae-Ha Lee Byung-Ho Jo, Ph.D. Phicom Ltd. 153-801, 60-29, Gasan-dong Kumchon-gu Seoul Korea 02-3282-1900 |
"Multi-die
Testing using Silicon Micro-Cantilever Probe Card"
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Dong Il Kim, Ph.D. AMST Co., Ltd. 404-2, Woncheondong, Paldalgu Suwon Kyonggido 442-823 +82-31-217-6168 |
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Session 6 - CONTROLLING CONTACT RESISTANCE
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Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"On
the Way to 30-um Pads - A New Generation of Kerf Cards"
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Swen Harder Formfactor Inc. Maximilianstrasse 35 80539 Munich, Germany +491738657835 |
Frank Pietzschmann Infineon Technologies Dresden P.O. Box 10 09 40 01076 Dresden, Germany +49 351 886 2032 |
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"Controlling Contact Resistance with Probe Tip Shape and Cleaning Recipe Optimization"
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Scott Stalnaker Clint Churchill Vail McBride Kelly Burnside AMI Semiconductor 2300 Buckskin Road Pocatello, ID 83201
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Jerry Broz, Ph.D. Point Technologies, Inc. 6859 N. Foothills Hwy Boulder, CO 80302 800-557-7059 |
Gene Humphrey
International Test Solutions Livermore, CA 94550
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"Off-Line Chemical Cleaning Technology for Removal of Solder Contaminant from Cobra® Vertical Technology Probe Tips"
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Bill Fulton Wentworth Laboratories, Inc. 101 Commerce Drive Brookfield, CT 06804 408-919-1875
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Session 7 - PROBE PROCESS CHARACTERIZATION
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"New Tools for Probing Process Management"
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Cary Kiest Electroglas 1749 SW Airport Avenue Corvallis, OR 97333 USA 541.738.2233 |
Jim Andersen Applied Precision, LLC 1040 12th Avenue NW Issaquah, WA 98027 425-657-1348
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"A Computer-based Probing C.O.O. Model"
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Oliver Nagler Gavin Gibson Infineon Technologies AG Corporate Test - Probing Technologies Munich, Germany |
"A Statistical Method for Eliminating False Counts Due to Debris, Using Automated Visual Inspection for Probe Marks"
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Max Guest Mike Clay August Technology – Plano TX 4900 West 78th Street Bloomington, Minnesota 55435 952-820-0080
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Winner -
Most Inspirational Presentation
"44
Micron Pitch Probe Capabilities Assessment"
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Bill Williams Tony Angelo S.S. Yan Tu-Anh Tran Stephen Lee Matt Ruston
Motorola - Chandler |
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Session 8 - ADVANCES IN PROBE CARD ANALYZERS
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Session 6 | Session 7 | Session 8
"Test and Maintenance of Very
High Pin Count Cards"
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Rod Schwartz Daniel Kosecki Integrated Technology Corporation 1228 N. Stadem Drive Tempe, Arizona 85281 USA 480-968-3459 X363 |
"Performance of a Next Generation High Speed, High Precision, Probe Card Analyzer"
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Jeffrey S. Greenberg Raymond Kraft, Ph.D. Applied Precision, LLC 1040 12th Avenue NW Issaquah, WA 98027 425-657-1348 |
"Future Trends in Wafer Level Test"
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Bill Mann General Chair 519 Westminster Ave. Newport Beach, CA 92663 949-645-3294 |
SWTW 2003 Chairs:
William Mann, General Chair
Jerry Broz, Ph.D., Point Technologies, Technical Program Chair
Maddie Harwood, CEM Inc., Registration and Finance Chair
SWTW 2003 Program Committee:
Michael Egloff, AMD
Tom Foerster, Jazz Semiconductor
Gavin Gibson, Infineon Technologies
Michael Harris, Texas Instruments
Ken Karklin, Agilent Technologies
Ger Koch, Philips Semiconductor
Rey Rincon, Kulicke and Soffa
Phil Seitzer, Agere Systems
Roger Sinsheimer, Xandex
Tim Swettlen, Intel
Fred Taber, IBM Microelectronics
Bill Williams, Motorola