SWTest 2026 Program

Jerry Broz, PhD
SWTest General Chair, SWTest Conference - USA

Connectivity Scalability: Architecting the Invisible Backbone of the AI Data Center

Radha Nagarajan, PhD
Senior Vice President and Chief Technology Officer, Optical Engineering Group, Marvell – USA
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Optimizing Test Solution for High-Volume Manufacturing of Photonic Devices

Nikta JALAYER (PI (Physik Instrumente) L.P. - USA), Philipp DIETRICH, Andrés MACHADO, Roman ZVAHELSKYI (Keystone Photonics GmbH - Germany), Axel GRABOWSKI, Jones SCHANSKER, Markus SIMON (Physik Instrumente - Germany)

Demonstration of integrated sources and detectors used for ATE optical wafer testing of Silicon Photonic ASICs

Chris BARNARD, Brandon GOMEZ, George SOSNOWSKI, Vu NGUYEN (OpenLight Photonics – USA)

High Volume Silicon Photonics Testing with a Fully Integrated ATE Solution

Amit AGNIHOTRI, Andy CHANG (Marvell - USA), Lakshmi-Anusha CONDON, Monica DAVIS, Ethan DWYER (Teradyne, Inc. - USA), Alessia GALLI (Technoprobe SpA - Italy)

Opto‑electronic wafer‑level probe card with optical fiber array and RF interface

Takaharu OHYAMA, Takahiro NAKAMURA, Yasushi WATANABE, Tomohisa HOSHINO (YOKOWO CO., LTD. – Japan), Shigeki OKA (YOKOWO AMERICA CORPORATION – USA)

Micro-bump probing for advanced System-on-Chip testing: A Preview into Native-Pitch Solutions and their challenges

Chandru PERIASAMY, Nikhila MAHADEVAPURAM, Saad AHMED, Ashwin ASHOK (Intel Foundry – USA), Francesco PARLATO, Alice GHIDONI, Daniele PEREGO, Federico LUCCHI, Francesca CATTANEO (Technoprobe SpA – Italy)

New PEMS Probe and Wire Probe Designs Enabled by High-Conductivity Pd Alloys

Patrick BOWEN, Grant JUSTICE (Deringer-Ney Inc – USA), Hiroyuki NAKAMURA (Nidec SV Probe – Japan), Taeyoon KIM (PTK – Korea)

Resolving the Contact Dilemma: An industrialized framework for ultra-fine pitch wafer test using µ3D printed probes

Francesco COLANGELO, Wabe KOELMANS, Edgar HEPP, Patrik SCHüRCH (Exaddon AG – Switzerland)

The Ever-Increasing Challenge of Probe Card Power Delivery

Blake RAPP (Micron Technology, Inc. – USA)

Integrated Solution for HPC Testing in AI Era

Oscar LEE, Kenny TANG (TSMC – Taiwan)

A Novel Advanced Probe Card Approach for Multi-Temperature HBM Testing

Seunghoon YANG (SK hynix – South Korea), Timothy BLOMGREN, Kalyanjit GHOSH, BeomKu LEE (FormFactor – USA)

Semiconductor Market Outlook – Challenges and Opportunities

Boris METODIEV (TechInsights – UK)

High-Volume Wafer Testing Solutions for Released-MEMS and BioChip Applications

Mickey YANG, Wen Yuan HSU (Hermes Testing Solutions Inc. – Taiwan)

Integer Linear Programming Optimization for Wafer Sort Touchdown Reduction and Mechanical Risk Mitigation

Kelvin LO (Google – Taiwan)

Next generation thermal chuck for improved temperature control of singulated die testing

Milos BASOVIC, Alexander MAMCHIK, Goutham KUKKADAPU (Intel – USA), Federica BERETTA, Flavio MAGGIONI, Elia MISSAGLIA (Technoprobe SpA – Italy)

Three new effective ways for AI Chip testing

Shoun YU (SEMICS INC. – Korea)

Various thermal control solution capability under actual device testing

Takehiko TOMITA (TEL – Japan)

Marvell ATE Test Cell Digital Thermal Feedback Loop Architecture & Implementation

Enrico ZSCHEMISCH, Kris HUBLITZ (Marvell – USA)

Mapping the Invisible: Dynamic Path Resistance De-embedding and Spatial Analytics

Sujith THOMAS, Dinesh SHARMA, Mathangi RAGHURAMAN, Siva Elango S (SanDisk Corporation – India)

High-Throughput SiC KGD Testing: Enabling Mass Production via Dual-Die Handler Architecture

Marcus KONTOROWITZ, Jiawei LIN, Allen ZHANG, Yishen ZHANG (Nexustest Pte Ltd – Singapore)

The Dual Action MEMS Solution: Cleaning Innovation Meets Cost Reduction

Kenneth BOBLAK (Entegris – USA), Kaden BYRD (Texas Instruments – USA)

Micro Bump Probing: High Volume Experience Driven Capability Demonstration and Direction for Advanced 3D/2.5D Packaging

Saad AHMED, Hamed BARGHI, Karthik SUBRAMANIAN, Thakshila WICKRAMARATNE (Intel Foundry – USA), Jeremy STREIFER, Ethan CAUGHEY (FormFactor – USA)

Benefits and Challenges of High Temperature Probe

Emmett RICKS (Micron – USA)

A New 300mm Vertical Probing Solution Enabling Automotive Microcontroller High Volume Manufacturing and Test

Francesco CASARTELLI, Raffaele VALLAURI (Technoprobe SpA – Italy), Johann HEITZER, Oliver NAGLER (Infineon Technologies AG – Germany)

UltraFLEXplus Deflection and Thermal Performance Across Multiple Interface Configurations

Chris BUCKHOLTZ (Teradyne, Inc (SAA/EAA) At Wafer Probe. – USA), Doug GARRETT (NXP – USA)

Loadboard Cooling Technology to Support Higher Currents on ATE Boards

Quaid Joher FURNITUREWALA (Advantest America Inc. – USA)

Telemetry‑Driven Predictive Maintenance for Wafer Acceptance Test Probe Cards

Mohammed Hussain SUHAIL, Chuan Hau CHUAH, Ei Zin EL, Joo Chuan GOH, Tee Whay LIM, Meng Yew SEAH (GlobalFoundries – Singapore)

Revolutionary Solutions for Cryogenic On-Wafer Test

Garrett TRANQUILLO (Celadon Systems, Inc. – USA)

First Probe Card for DUT Measurements at 120 GHz to Support 1.6 Tbps

Christopher LEMOINE (FormFactor – USA)

Atomic-Level Design of Palladium Alloys: Decoding the Mechanisms for High-Performance Semiconductor Test Materials

Jonas FECHER (Sickert – Germany)

Eliminating Cleaning-Induced Failures: Achieving Zero-Debris Probe Tips in Low and High Temperature Wafer Testing

Victoria TRAN (Gel-Pak – USA), Tomonao NAKASHIMA (Japan Electronic Materials – Japan)

High Density Laser Drilling in Semiconductor Test Hardware: Evaluating the Trade-Off Between In-House Capability and Outsourced Manufacturing

Chris STOKES, Namrata LACHMAN (Oxford Lasers Ltd – United Kingdom)

Lens-Based Free-Space Characterization of High-Resistivity Silicon Wafers at Microwave Frequencies

Zhonghao HU, Bevan JONES (Ascan Technologies – Australia), Anton SARESSALO, Iiro LEHTO, Katja PARKINEN (Okmetic – Finland)

Enabling Die Level KGD Testing for CPO Optical Engine

Ai Heong TAN, Jiawei LIN, Tim JIN (Nexustest Pte Ltd – Singapore)

New approaches to protect probe cards during high-power short-circuit test

Alvaro ROSA, Georg FRANZ, Rainer GAGGL (T.I.P.S. Messtechnik GmbH – Austria)

Demonstration of High Precision Silicon Photonics Wafer Measurements Using a PLC (Planar Lightwave Circuit) Probe and Its Applicability to Multi Channel, Large Scale Inspection

Shinji MINO, Akihito DOI, Kenya SUZUKI, Masaki UENO, Yoshinori HIBINO (NTT Innovative devices – Japan)

Introduction of an MLO with Excellent Geometric Stability

Osamu OGURA (Lincstech – Japan)