2012 IEEE SW Test Workshop
(Each presentation is in Adobe Acrobat format)

Download the SW Test 2012 Summary to be published in CPMT Newsletter.

TABLE OF CONTENTS

Tutorial - Manufacturing Process Control System (PCS)
Dinner Session - Keynote
Opening Session - Chairman's Welcome
Session 1 - Process Improvements for HVM
Session 2 - Optimizing Probe Depth Performance
Session 3 - Probe Potpourri
Session 4 - New Contactor Technologies and RF PCB Design
Session 5 - New Probe Card and Contact Technologies
Session 6 - "Meet The Challenge"
Session 7 - Fine Pitch Probing Challenges
Session 8 - Probe Process and Metrology
Session 9 - Productivity / COO


 

Tutorial Session
"Manufacturing Process Control System (PCS)"

Doug Sottaway (Intel Corporation)

 

 


Dinner Session
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

Keynote Speaker - "Emerging High Density 3D Through Silicon Stacking (TSS) � What�s Next?"

Matt Nowak
Senior Director, Advanced Technology
(Qualcomm CDMA Technologies)
   


Chairman's Welcome and Workshop Overview
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Welcome to Semiconductor Wafer (IEEE SW Test) Workshop 2012"

Jerry Broz, Ph.D. (SW Test General Chair)  

 


Session 1 - Process Improvements for HVM
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

Winner - Best Presentation, Tutorial in Nature
"Crossover in TD efficiency - When brick wall is not the best."

Keith Breinlinger, Ph.D. (FormFactor, Inc.)

 


"Floating touchdown � new methodology for high parallelism testing driving test time reduction"

Doron Avidar (Micron - Israel)
Roy Cohen (Micron - Israel)

 


Co-Winner - Best Data Presentation
"
Wafer probe challenges for the automotive market"

Luc Van Cauwenberghe (ON Semiconductor � Belgium)
Frank De Ruyck (ON Semiconductor � Belgium)
Riccardo Liberini (Technoprobe SpA � Italy)
Marco Di Egidio (Technoprobe SpA � Italy)
Riccardo Vettori (Technoprobe SPA � Italy)
Wim Dobbelaere (ON Semiconductor � Belgium)

   


Session 2 - Optimizing Probe Depth Performance
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9


"Actual vs. Programmed Over Travel for Advanced Probe Cards"

Tommie Berry (FormFactor, Inc.)
Keith Breinlinger, Ph.D. (FormFactor, Inc.)
Rey Rincon (Freescale Semiconductor)
 

 


"Aluminum Probe Pad Thickness and Properties for Stable Parametric 'Probe-Ability'"

Bernd Bischoff (Texas Instruments - Germany)
Uwe Schiessl (Texas Instruments - Germany)
Jerry Broz, Ph.D. (International Test Solutions)
Seyedsoheil Khavandi (International Test Solutions)

Swen Harder (FormFactor - Germany)

 

 


"Comparison of Bond Pad Cracking in Harsh Probing with Three Different Probe Cards"

Stevan Hunter (ON Semiconductor - Pocatello, USA) 

 

 


Session 3 - Probe Potpourri
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9


"Is parametric testing about to enter a period of growth and innovation?"

Larry Levy (FormFactor, Inc.)    


"Trends in Test and Probe"

John West (VLSI Research Europe - United Kingdom)    


"Wafer Map Failure Pattern Recognition Using Artificial Intelligence"

Wee Tick Lo (GLOBALFOUNDRIES - Singapore)
Kong Meng Hui (ISS-NUS - Singapore)

   


"The Road to 450 mm Semiconductor Wafers"

Ira Feldman (Feldman Engineering Corp.)    


Session 4 - New Contactor Technologies and RF PCB Design
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9


"Are Spring Probes Valid Below 400 Micron Pitch?"

Jon Diller (Interconnect Devices, Inc.)
Jiachun (Frank) Zhou, Ph.D. (Interconnect Devices, Inc.)

 

 


"Quantifying the Impact of the Environment on PCB Transmission Lines"

Zaven Tashjian, Ph.D. (Circuit Spectrum, Inc.
Kevin Chan (Circuit Spectrum, Inc.)

   


Session 5 - New Probe Card and Contact Technologies
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

Winner - Best Technical Presentation
"Full Wafer Contact Breakthrough with Ultra-High Pin Count"

Daisuke Takano (ADVANTEST - Japan)
Tsutomu Shoji (JAPAN ELECTRONIC MATERIALS CORP - Japan)
Takashi Naito (ADVANTEST - Japan)

 


"High Density and Low Cost Approach for the PCB of semiconductor tester"

Takashi Sugiyama (Hitachi Chemical Co.,Ltd. - Japan) 
Seiichi Kurihara (Hitachi Chemical Co.,Ltd - Japan)

 


"LIGA and its Application to Electrical Interconnects"

Frank Schonig (Rosenberger)
Jim Jaquette (Rosenberger)
 

 


"TPEG�: a new vertical MEMS solution for high current, low pitch applications"

Raffaele Vallauri, Ph.D. (Technoprobe Spa � Italy)
Cristian Gozzi, Ph.D. (Technoprobe Spa � Italy)

 


Session 6 - "Meet The Challenge"
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9


"Meeting the 1st Silicon: An Alternate Approach for Reducing Probe Card Cycles"

Robert Stampahar (SV Probe - An Ellipsiz Company)
Wally Haley (Qualcomm) 

 


"Fine pitch high performance needle probe concept using novel micro-plating technique"

Gert Hohenwarter, Ph.D. (GateWave Northern, Inc.)  


"Improved Cantilever Probing - Minimizing Scub Marks"

Rey Rincon (Freescale Semiconductor)
Stefano Felici (TechnoProbe - USA)
 


Session 7 - Fine Pitch Probing Challenges
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9


"28nm Mobile SoC Copper Pillar Probing Study"

Jose Horas (Intel Mobile Communications - Germany)
Amy Leong (Microprobe - USA)

Darko Hulic (Nikad - Germany)

 


"Advanced Cu-Pillar Applications at 50um - Enabling Fine Pitch Probing"

Senthil Theppakuttai, Ph.D. (SV Probe)
Todd Tsao (ASE Global - Taiwan)

 


"Test and Measurement Challenges for 3D IC Development"

Raphael Robertazzi, Ph.D. (IBM Research)

 


Winner - Most Inspirational Presentation

"An analysis of probing CRES in Gold bumping pad using Automatic Test Equipment"

Chang Hyun (Samsung Semiconductor Institution Technology)
Hyun-Ho Park (Samsung - Korea)
Sik-Sang Hahm (Samsung - Korea)


Session 8 - Probe Process and Metrology
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"
H3D profiler for contact less probe-card inspection
"

Rob Marcelis (BE Precision Technology - Netherlands)  


Co-Winner - Best Data Presentation

"
Case Study: Integrating a 300mm Probing Solution with a Diagnostic Emission Microscopy
"

Richard Portune (DCG Systems, Inc.)
Kevin Eseltine (DCG Systems, Inc.)

 


"Approaches for Reducing the Cost of Probe Card Test"

John Strom (Rudolph Technologies)
Jeff Greenberg (Rudolph Technologies)

 

 
Session 9 - Productivity / COO
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Unique characteristics of the novel carbonaceous film with high electrical conductivity and ultra high hardness for semiconductor test probes
"

Teruyuki Kitagawa, Ph.D. (Nomura Plating, Co., Ltd. � Japan)  


"High Frequency Performance of Modular Wafer Probecards - A Numerical Approach"

Jim Brandes (Multitest)
Ryan Satrom (Multitest)
Joerg Seekamp, Ph.D. (Feinmetall)
Simon Allgaier (Feinmetall)
Gunther Boehm (Feinmetall)

 


"High Volume Low Cost Stamped Spring Probe Development"

Samuel Pak  (IWIN CO.,Ltd. - Korea)
AJ Park
(IWIN CO.,Ltd. - Korea) 
 

 

 


SWTW 2012 Chairs:

  • Dr. Jerry Broz, International Test Solutions, General Chair

  • Rey Rincon, Freescale Semiconductor, Technical Program Chair

  • Maddie Harwood, CEM America, Inc.,Finance Chair

  • Meredith M. Griffith, CEM America, Inc., Registration / EXPO Coordinator

SWTW 2012 Committee:

  • Jan Martens, NXP Semiconductor, Program Committee
  • Darren James, Rudolph Technologies, Program Committee
  • Patrick Mui, JEM America, Program Committee
  • Fred Taber, BiTS Workshop, Proceedings Coordinator
  • Matt Zeman, Ph.D., Intel, Steering Committee
  • Gunther Boehm, FeinMetall GmbH
  • John Caldwell, Micron Technology
  • Boyd Daniels, Texas Instruments
  • Michael Huebner, Ph.D., FormFactor
  • Tatsuo Inoue, Micronics Japan (MJC)
  • Amy Leong, Microprobe
  • Mark Ojeda, Spansion

 

 

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee, IEEE CPMT Society, IEEE Computer Society or the IEEE Test Technology Council.

Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a workshop environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.
 

 

� 2012 swtest.org      |      last modified 08/10/2012