2005 Southwest Test Workshop
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Harald Ibele Maccs LLC |
Klemens Reitinger ERS GmbH |
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"Liquid
Interface at Wafer Test"
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Phil Diesing David Gardell David Audette IBM Microelectronics |
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"Power
Delivery Model of Test Probe Cards"
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Habib Kilicaslan Bahadir Tunaboylu, Ph.D. Kulicke & Soffa Industries |
"Sort Tooling Probe Burn Control"
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Matt Cladius Intel Corporation |
CHAIRMAN'S WELCOME
Top | Session
1 | Session 2 | Session 3
| Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Welcome
to SWTW-2005"
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Bill Mann |
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"SWTW Lifetime
Achievement Award" as presented by
Bill Mann
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Yoshiei Hasegawa Micronics Japan Co. |
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Session 1 - MODELING TO REDUCE DIELECTRIC CRACKING
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Eliminating Dielectric Cracking of
Cu/Low-k Devices During Cantilever Probing"
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Daniel Stillman |
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"Why Using Finite Element
Analyses to Optimize Cantilever Probe Card Design?"
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Lich Tran, Ph.D. Rey Rincon Kulicke & Soffa Industries |
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"Key Methods in Reducing Pad Void
Formation and Experimental Result"
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Frank Hwang Y.S. Kuo Y.J. Hsiao Taiwan Semiconductor Manufacturing Company, Ltd. |
Session 2 - REDUCING PROBE COSTS
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Microprocessor
Probing Challenges: Scaling Sort Cost with Moore’s Law"
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Jun Ding Thomas Little Jin Pan Tim Swettlen Intel Corporation |
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"Optimizing Test
Strategies for Multi-DUT Wafer Probing"
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Ken Smith Cascade MicroTech |
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"Extra Large
Multi-DUT Array Probing Enabling > X100 Parallel Testing"
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Bassam Dabit Trung Nguyen Intel Corporation |
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"Decreasing
Repair Cost and Improving Probe Card Life A Case Study"
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Rod Schwartz Integrated Technology Corporation |
Sue Neises Intel Corporation |
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Session 3 - PROBE POTPOURRI
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"ISMI Probe Council: Standard
Probe Head Interface for Cobra Space Transformer"
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Jack Courtney IBM Microelectronics |
Michael Egloff AMD |
Mike Harris Texas Instruments, Inc. |
"Laser
Micromachining: A flexible tool in Vertical Probe Card Manufacturing"
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D.Karnakis G.Rutterford M.Knowles Oxford Lasers Ltd. (UK) |
A.Webb Oxford Lasers Inc. (USA)
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"DDR2 DRAM
High-Frequency Test at Probe (HFTAP)"
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Masahide Ozawa Elpida Memory, Inc. |
Yoichi Funatoko FormFactor Inc., Asia |
Session 4 - NEW TECHNOLOGIES
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"MEMS
Solution for Semiconductor Probing"
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Dr. Howard Hsu SCS Hightech Inc. (Taiwan) |
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Winner -
Most Inspirational Presentation
"Cobra FP Probe
Card for Multi-DUT Logic and Memory Applications"
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Lucie Mialhe Isabelle Garidi, Ph.D. Kulicke & Soffa Industries (France) |
Bahadir Tunaboylu, Ph.D. Kulicke & Soffa Industries
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"New Composite Probe of Rh and Ni-Mn for High Current and Fine Pitch Testing"
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Kazunori Okada Yoshihiro Hirata Tsuyoshi Haga Masao Sakuta Sumitomo Electric Industries, LTD. |
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Session 5 - ON THE ROAD TO FULL WAFER TEST
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Full Wafer Test: Making Test More Cost Effective"
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Steve Steps Aehr Test Systems |
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"A Novel
Probe-Card for 8-inch Full Wafer Contact using MLS"
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Tatsuo Inoue Micronics Japan Co. LTD (Aomori) |
Fred Megna Micronics Japan Co. LTD (Phoenix) |
"Application of
Larger Probing Area by Cantilevered Probes"
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Dave Oh Gyo-chol Chu TSE (South Korea) |
"Large
Area Probing Meets Small Pitch"
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Gunther Boehm Feinmetall GmbH |
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Session 6 - MINIMIZING CRES INSTABILITY
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
Winner - Best Technical
Presentation
"Comprehensive Approach to
Control Contact Resistance Instability and Improve First Pass Yield of
Bumped Devices"
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Joe Foerstel Sean Chen Altera Corporation |
Atsushi Mine Phill Mai JEM |
Jerry Broz, Ph.D. International Test Solutions |
Winner - Best Data Presentation
"Impact
of Vibration on Contact Resistance"
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Al Wegleitner Texas Instruments, Inc. |
"Dynamic
Switching Test Technology for IGBT Chip Under High Power Operating
Condition"
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Y. Masuma A.Yoshida K.Yamada S. Sumi Fuji Electric Device Technology Co., Ltd. |
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"An Advanced
Probe Characterization Tool for Online Contact Basics Measurements"
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Oliver Nagler Infineon Technologies AG |
Markus Reinl Prof. Dr. Ignaz Eisele Universität der Bundeswehr |
Session 7 - PROBE PROCESS CHARACTERIZATION
Top | Session
1 | Session 2 | Session 3
| Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Reducing
False Defects: Debris and Edge Excursions"
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Rajiv Roy August Technologies |
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"Probe Card
Metrology Qualification Methodology"
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Yossi Revah Intel Corporation (Israel) |
Eugene T. Doan Intel Corporation |
Winner - Best Presentation,
Tutorial in Nature
"The
'Probe Card Signature' Syndrome or Who has the 'Old Maid'"
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Frank Pietzschmann Infineon Technologies |
Jim Andersen Applied Precision, LLC |
"Fully
Integrated True CRES Measurement for Probe Cards and Probing Process
Characterization"
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Rick Hales Koorosh Zaerpoor Intel Corporation |
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Session 8 - PROBE TEST DATA MANAGEMENT
Top | Session
1 | Session 2 | Session 3
| Session 4 | Session 5 |
Session 6 | Session 7 | Session 8
"Test
Data Management in a Complex Environment"
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Glenn Claudi-Magnussen Skyworks Solutions, Inc. |
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Paul Buxton Test Advantage Ltd. (Scotland) |
Paul Tabor Test Advantage, Inc. (USA) |
"Dynamic
Parts Average Testing in Real-time"
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Micky Ray Pintail Technologies, Inc. |
"Meeting the
New Challenges of Test "
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Micky Ray Pintail Technologies, Inc. |
SWTW 2005 Chairs:
William Mann, General Chair
Jerry Broz, Ph.D., International Test Solutions, Technical Program Chair
Maddie Harwood, CEM Inc., Registration and Finance Chair
Megan White, CEM Inc., EXPO Coordinator
SWTW 2005 Program Committee:
Jack Courtney, IBM Microelectronics
Michael Egloff, AMD
Michael Harris, Texas Instruments
Ken Karklin, Agilent Technologies
Ger Koch, Philips Semiconductor
Scott Mitchell, Texas Instruments
Rey Rincon, Kulicke and Soffa
Phil Seitzer, Agere (Retired)
Roger Sinsheimer, Xandex
Tim Swettlen, Intel
Fred Taber, BiTS Workshop General Chair
Bill Williams, Freescale (Retired)