2019 SWTest Conference - Technical Program

SEMICONDUCTOR WAFER TEST CONFERENCE 2019

(Each presentation is in Adobe Acrobat format)

Awarded Presentations

Keynote Session: “Automotive, the Roadmap of Technologies and their Influences on Testing” – Davide Appello

Tutorials: Best Known Methods and Innovations

Session #1: Enabling 5G Test Strategies

Session #2: Process Optimization

Session #3: Challenges of 5G test and beyond

Session #4: MEMS & Optical Test Solutions

Session #5: Extreme Probing at High Temperature and High Power

Session #6: Expanding Probecard Capability

Session #7: PCB Innovation: High performance – simplified & gotyas!

Session #8: Extreme probing – Quantum Computing to Smart Cars, the future is here

Session #9: Prober – Thermal Accuracy & Innovations

Poster Session 1: Poster Medley

Poster Session 2: Poster Potpourri

Awarded Presentations

Best Overall Presentation (tie)
5G Wafer Test and the New Age of Parallelism
- Author/Presenter: Daniel Bock, Ph.D. (FormFactor – Beaverton, USA)
Large Area High Temperature Copper Pillar Probing
- Author/Presenter: Gunther Boehm (FEINMETALL GmbH – Herrenberg, Germany)

Best Data Presentation
Practical method for detecting hot-stepping, micro-arcing or hot switching during wafer probe
- Authors: Enrique Guerra (Texas Instruments – Dallas, USA), Imran Ahmed (Texas Instruments – Dallas, USA)
- Presenter: Imran Ahmed (Texas Instruments – Dallas, USA)

“Most Inspirational” Presentation (tie)
Silicon Photonics – Challenges and Solutions for Wafer-Level Production Tests
- Authors: Dr. Choon Beng Sia (FormFactor Inc. – Singapore), Dr. Johnny Yap (Global Foundries Singapore – Singapore), Ashesh Sasidharan (GLOBALFOUNDRIES Singapore – Singapore), Robin Chen (Globalfoundries – Singapore), Dr. Soon Leng Tan (Globalfoundries – Singapore), Guo Chang Man (Globalfoundries – Woodlands, Singapore)
- Presenters: Dr. Choon Beng Sia (FormFactor Inc. – Singapore), Dr. Johnny Yap (Global Foundries Singapore – Singapore)
Quantum Computing sets new demand for wafer probing
- Author/Presenter: Ari Kuukkala (Afore – Lieto, Finland)

Best Presentation, Tutorial in Nature
High Density Probe Card PCB’s, are you being your own worst enemy to achieving Higher Parallelism on your Designs?
- Authors: Shawn Powell (Formfactor – Livermore, USA), Mark Ojeda (Cypress Semiconductor – San Jose, USA)
- Presenter: Shawn Powell (Formfactor – Livermore, USA)

Best Poster
Design and Analysis of Test Interposer for ASIC Package Test with 3D MEMS Co-axial Probe
- Authors: Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea), Yong Ho Cho (Microfriend Inc. – Nowongu, Korea), Sangkyu Yoo (Samsung Electronics – Hwasung City, Korea), Jong Gwan Yook (Yonsei Univ. – Shinchon-dong, Korea)
- Presenter: Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea)

Keynote Presentation

“Automotive, the Roadmap of Technologies and their Influences on Testing”
- Davide Appello
  Director of Product Engineering
  STMicroelectronics

Tutorials: Best Known Methods and Innovations

Session Chair: Clark Liu (PTI – Hsinchu, Taiwan)

Temperature Probing Process
- Author/Presenter: Imran Ahmed (Texas Instruments Inc – Dallas, USA)
A Journey to Achieve lower test cost – Massive High Multisite
- Author/Presenter: Weihung Wu (Texas Instruments – Sugar Land, USA)
Simulating S-parameters Of RF Probes
- Author/Presenter: Michael Ricci (Rika Denshi Group, LTD – San Jose, USA)

Session #1: Enabling 5G Test Strategies

Session Chair: Dr. Jerry Broz (SWTest Workshop – Longmont, USA)

SWTest 2019 Conference Introduction
- Author/Presenter: Dr. Jerry Broz (SW Test Workshop – Longmont, USA)
5G Wafer Test and the New Age of Parallelism
- Author/Presenter: Daniel Bock (FormFactor – Beaverton, USA)
5G Means Higher Frequency, Higher RF Port Count, and Higher Parallelism
- Authors: Jeffery Arasmith (Technoprobe America – San Jose, USA), Balbir Singh (Intel – Folsom, USA), Ken Walker (Intel Corporation – Folsom, USA)
- Presenters: Jeffery Arasmith (Technoprobe America – San Jose, USA)
Over the Air Test Solution for Antenna in Package Applications
- Author/Presenter: Jason Mroczkowski (Cohu – St. Paul , USA)

Session #2: Process Optimization

Session Chair: Patrick Mui (JEM America – Fremont, USA)

Reducing Test Costs by Optimizing the Prober Indexing Process
- Author/Presenter: Ken Walker (Intel Corporation – Folsom, USA)
Intelligent method for retesting a wafer
- Authors: Pai Chang (Teslence – Taipei, Taiwan), YK Hwang (Teslence – Taipei, Taiwan)
- Presenter: Pai Chang (Teslence – Taipei, Taiwan)
Practical method for detecting hot-stepping, micro-arcing or hot switching during wafer probe.
- Authors: Enrique Guerra (Texas Instruments – Dallas, USA), Imran Ahmed (Texas Instruments – Dallas, USA)
- Presenter: Imran Ahmed (Texas Instruments – Dallas, USA)

Session #3: Challenges of 5G test and beyond

Session Chair: Dr. Michael Huebner (FormFactor – Livermore, USA)

WLCSP xWave for high frequency wafer probe applications part 2
- Author/Presenter: Jason Mroczkowski (Cohu – St. Paul , USA)
On-chip Test with Microstrip Patch Antennas
- Author/Presenter: Dan Campion (Cohu – St. Paul, USA)
Probing 5G Devices Like It’s No Big Deal
- Authors/Presenters: Patrick Rhodes (FormFactor – Livermore, USA), Tim Lesher (FormFactor, Inc – Beaverton, USA)

Session #4: MEMS & Optical Test Solutions

Session Chair: Geert Gouwy (Melexis – IEPER, Belgium)

Hybrid MEMS Probe Technology 2.0
- Authors: Amy Leong (FormFactor Inc. – San Jose, USA), Jarek Kister (FormFactor, USA), Ashish Bhardwaj (FormFactor Inc. – Livermore, USA)
- Presenters: Ashish Bhardwaj (FormFactor Inc. – Livermore, USA), Amy Leong (FormFactor Inc. – San Jose, USA)
Evaluation of a MEMS Solution for Kelvin Probing on Bumps 180µm and Smaller
- Authors/Presenters: Christopher Lenczycki (Texas Instruments, Inc. – Dallas, USA), Kyle Cotner (Nidec SV TCL – Tempe, USA)
A Fully Automatic Electro-Optical Test System Enabling the Development of a Silicon Photonic Technology Platform
- Authors: Dr. Jeroen De Coster (IMEC – Heverlee, Belgium), Rafal Magdziak (IMEC – Heverlee, Belgium), Dr. Peter De Heyn (imec – Heverlee, Belgium), Erik Jan Marinissen (IMEC – Leuven, Belgium), Dr. Marianna Pantouvaki (IMEC – Heverlee, Belgium), Dr. Joris Van Campenhout (IMEC – Heverlee, Belgium), Dr. Philippe Absil (imec – Heverlee, Belgium), Dan Rishavy (FormFactor – Beaverton, USA), Joe Frankel (FormFactor – Beaverton, USA), Dr. Kainoa Kekahuna (FormFactor – Beaverton, USA), Dr. Kazuki Negishi (FormFactor – Beaverton, USA), Dr. Mike Simmons (FormFactor – Beaverton, USA), Dr. Eric Christenson (FormFactor – Beaverton, USA)
- Presenters: Dr. Jeroen De Coster (IMEC – Heverlee, Belgium), Dan Rishavy (FormFactor – Beaverton, USA)
Silicon Photonics – Challenges and Solutions for Wafer-Level Production Tests
- Authors: Dr. Choon Beng Sia (FormFactor Inc. – Singapore), Dr. Johnny Yap (Global Foundries Singapore – Singapore), Ashesh Sasidharan (GLOBALFOUNDRIES Singapore – Singapore), Robin Chen (Globalfoundries – Singapore), Dr. Soon Leng Tan (Globalfoundries – Singapore), Guo Chang Man (Globalfoundries – Woodlands, Singapore)
- Presenters: Dr. Choon Beng Sia (FormFactor Inc. – Singapore), Dr. Johnny Yap (Global Foundries Singapore – Singapore)

Session #5: Extreme Probing at High Temperature and High Power

Session Chair: Amy Leong (FormFactor Inc. – San Jose, USA)

Advances in Vertical Probe Material for 200C Wafer Test Applications
- Authors: Mitsuhiro Moriyama (SV TCL K.K – Toshima-Ku, Japan), Hiroyuki Ichiwara (SV TCL K.K – Toshima-Ku, Japan)
- Presenter: Mitsuhiro Moriyama (SV TCL K.K – Toshima-Ku, Japan)
High temperature wafer probing of power devices
- Authors/Presenters: Masatomo Takahashi (Tokyo Seimitsu – Hachioji, Japan), Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)
High-end, high-power devices: an integrated solution at probe card level
- Authors: Dr. Emanuele Bertarelli (Technoprobe SpA – Cernusco Lombardone, Italy), Alice Mari (Technoprobe SpA – Cernusco Lombardone, Italy), Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Flavio Maggioni (Technoprobe – Cernusco Lombardone, Italy), Stefano Felici (Technoprobe – San Jose, USA)
- Presenter: Dr. Emanuele Bertarelli (Technoprobe SpA – Cernusco Lombardone, Italy)

Session #6: Expanding Probecard Capability

Session Chair: Mark Ojeda (Cypress Semiconductor – San Jose, USA)

A Technique of Embedding Protection Resistors inside LTCC Substrate using as Space Transformer
- Authors: Kwangjae Oh (Microfriend Inc. – Seoul, Korea), Yong Ho Cho (Microfriend Inc. – Nowongu, Korea), SangKyu Yoo (Samsung Electronics – Hwasung City, Korea)
- Presenters: Kwangjae Oh (Microfriend Inc. – Seoul, Korea)
Terminated Tester Resource Enhancement (TTRE) Improves Signal Integrity Performance at higher signal sharing enables wafer sort at higher frequency and higher parallelism
- Authors/Presenters: Young-woo Lee (SK Hynix – Icheon, Korea), Quay Nhin (FormFactor Inc. – Livermore, USA)
New concepts for yield improvements and selective repair of cantilever pins for Flash and DRAM probe cards
- Authors: Thomas Oppert (PacTech-Packaging Technologies GmbH – Nauen, Germany), Thorsten Krause (PacTech-Packaging Technologies GmbH – Nauen, Germany), Matthias Fettke (PacTech-Packaging Technologies GmbH – Nauen, Germany), Dr. Thorsten Teutsch (PacTech-Packaging Technologies GmbH – Nauen, Germany)
- Presenter: Thomas Oppert (PacTech-Packaging Technologies GmbH – Nauen, Germany)

Session #7: PCB Innovation: High performance – simplified & gotyas!

Session Chair: Suz Ramsbottom (Texas Instruments – Dallas, USA)

IBM Low Force Rigid Probe Technology
- Authors: David Audette (IBM – Essex Junction, USA), Grant Wagner (IBM – Burlington, USA), Marc Knox (IBM – Essex Junction, USA), Jay Chey (IBM – Yorktown Heights, USA), Sankeerth Rajalingam (IBM – Yorktown Heights, USA), Doreen DiMilia (IBM – Yorktown Heights, USA)
- Presenter: Grant Wagner (IBM – Burlington, USA)
Stretching the Performance Envelope of ATE PCBs (Automatic Test Equipment Printed Circuit Boards)
- Author/Presenter: Tom Bleakley (Harbor Electronics – Santa Clara, USA)
High Density Probe Card PCB’s, are you being your own worst enemy to achieving Higher Parallelism on your Designs?
- Authors: Shawn Powell (Formfactor – Livermore, USA), Mark Ojeda (Cypress Semiconductor – San Jose, USA)
- Presenter: Shawn Powell (Formfactor – Livermore, USA)

Session #8: Extreme probing – Quantum Computing to Smart Cars, the future is here

Session Chair: Karen Armendariz (Celadon Systems – Burnsville, USA)

Quantum Computing sets new demand for wafer probing
- Author/Presenter: Ari Kuukkala (Afore – Lieto, Finland)
“Smart cars – smart probe cards” – Probing of devices for advanced driver assistance systems
- Author/Presenter: Sebastian Salbrechter (TIPS Messtechnik GmbH – Villach, Austria)
Technoprobe TPEG™ MEMS T4 OPM eliminates challenges faced with Cobra-like solutions
- Authors: Froilan Jandoc (Allegro Microsystems Philippines Inc. – Paranaque, Philippines), Wally Lacson (Technoprobe Philippines – Cabuyao, Philippines), Mer Joy Uy (Allegro Microsystems Philippines Inc. – Paranaque, Philippines)
- Presenters: Froilan Jandoc (Allegro Microsystems Philippines Inc. – Paranaque, Philippines), Mer Joy Uy (Allegro Microsystems Philippines Inc. – Paranaque, Philippines)
Recent Breakthrough in Tight Pitch Laser Microdrilling for MEMS Guideplates
- Authors: Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom), Michael Cullimore (Oxford Lasers – Didcot, United Kingdom)
- Presenters: Michael Cullimore (Oxford Lasers – Didcot, United Kingdom)

Session #9: Prober – Thermal Accuracy & Innovations

Session Chair: Rey Rincon (SWTest – Austin, USA)

Absolute temperature accuracy, a new standard for wafer testing.
- Author/Presenter: Klemens Reitinger (ERS electronic GmbH – Germering, Germany)
Study on Thermal Stability of Probe Mark
- Authors: Byung-Hyun Shin (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea), Shoun Yu (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea), Gabriel Tak (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea)
- Presenters: Gabriel Tak (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea)
A novel method of accredited high accuracy temperature measurement on a thermal wafer chuck in support of IATF 16949:2016 (AS/TS16949)
- Author/Presenter: Harald Ibele (Sigma Sensors (TCL) GmbH iG – Pfullendorf, Germany)

Poster Session 1: Poster Medley

Session Chair: Darren James (Rudolph Technologies – Bloomington, USA)

Innovative “Featured-Surface” Cleaning Materials Engineered for Advanced Vertical and Micro-Cantilevered Probe Technologies
- Authors: Alexander Baglione (International Test Solutions – Reno, USA), Alex Poles (International Test Solutions – Reno, USA), W. Cooper Smith (International Test Solutions – Reno, USA), Dr. Jerry Broz (International Test Solutions – Reno, USA)
- Presenters: Alexander Baglione (International Test Solutions – Reno, USA)
Implementing Advanced Shaping on Vertical MEMS Probe Technology
- Authors: Mai Sawada (JEM America – San Jose, USA), Akila Murali (JEM America Corp. – Fremont, USA), Joe Mai (JEM Europe – Montbonnot, France), Alex Poles (International Test Solutions – Reno, USA), Alexander Baglione (International Test Solutions – Reno, USA), W. Cooper Smith (International Test Solutions – Reno, USA), Dr. Jerry Broz (International Test Solutions – Reno, USA), Victor Tran (JEM America – Fremont, USA), Atsushi Mine (JEM – Kikuchi-City, Japan)
- Presenters: Victor Tran (JEM America – Fremont, USA), Alex Poles (International Test Solutions – Reno, USA), Akila Murali (JEM America Corp. – Fremont, USA)
RF Broadband Matching for 5G Probe Card without Using VNA
- Author: Norman Hsu (Chunghwa Precision Test Technology Co.,Ltd – Pinzhen, Taiwan)
- Presenter: Weicheng Wang (Chunghwa Precision Test Technology Co.,Ltd – Pinzhen, Taiwan)
Fabricating PdCo pads on mixed surface of nickel and solder mask of a surface laminar carrier for Cobra Probe application
- Authors: Jay Chey (IBM – Yorktown Heights, USA), Michael Gaynes (Universal Instrument Corporation – Conklin, USA)
- Presenter: Jay Chey (IBM – Yorktown Heights, USA)

Poster Session 2: Poster Potpourri

Session Chair: Rey Rincon (SWTest – Austin, USA)

Comparison study of dry resist strippers during high aspect ratio test probe fabrication
- Authors: Jay Chey (IBM – Yorktown Heights, USA), Sankeerth Rajalingam (IBM – Yorktown Heights, USA), Doreen DiMilia (IBM – Yorktown Heights, USA), David Audette (IBM – Essex Junction, USA), Grant Wagner (IBM – Burlington, USA), Marc Knox (IBM – Essex Junction, USA), Edgar Tremblay (IBM – Bromont, Canada)
- Presenter: Jay Chey (IBM – Yorktown Heights, USA)
The differences between ISO 9000 and ISO 17025
- Author/Presenter: Harald Ibele (Sigma Sensors (TCL) GmbH iG – Pfullendorf, Germany)
Electrical Performance of Advanced Interconnect Technologies for 5G applications
- Authors: Brandon Sherrieb(Integrated Test Corp. – Dallas, USA), Steve Karas (Integrated Test Corp. – Dallas, USA), Dana Freeman (Integrated Test Corp. – Dallas, USA), Glenn Tetmyer (Probe Test Solutions – Hamilton, UK), Gert Hohenwarter (GateWave Northern, Inc. – Madison, USA)
- Presenters: Brandon Sherrieb(Integrated Test Corp. – Dallas, USA), Steve Karas (Integrated Test Corp. – Dallas, USA)
Design and Analysis of Test Interposer for ASIC Package Test with 3D MEMS Co-axial Probe
- Authors: Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea), Yong Ho Cho (Microfriend Inc. – Nowongu, Korea), Sangkyu Yoo (Samsung Electronics – Hwasung City, Korea), Jong Gwan Yook (Yonsei Univ. – Shinchon-dong, Korea)
- Presenter: Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea)

Committee Members for SWTest 2019:

Jerry Broz, Ph.D., International Test Solutions, General Chair
Rey Rincon, Translarity, Technical Program Chair
Maddie Harwood, Conference & Exhibits Management, Inc. (CEM), Finance Chair
Technical Program Committee
John Caldwell, Micron Technology, Program Committee
Patrick Mui, JEM America, Program Committee
Darren James, Rudolph Technologies, Program Committee
Steering Committee
Karen Armendariz, Celadon Systems
Gunther Boehm, FeinMetall GmbH (Germany)
Geert Gouwy, Melexis Semiconductor (Belgium)
Michael Huebner, Ph.D., FormFactor
Amy Leong, FormFactor, Inc.
Clark Liu, Powertech Technology, Inc. (Taiwan)
Mark Ojeda, Cypress Semiconductor
Suz Ramsbottom, Texas Instruments, Inc.
Raffaele Vallauri, Technoprobe (Italy)
Joey Wu, Member-At-Large (Taiwan)
Alex Yang, MPI Corporation (Taiwan)
Sang Kyu (SK) Yoo, Samsung Electronics (Korea)

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Conference Committee.

Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a Conference environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.

SEMICONDUCTOR WAFER TEST CONFERENCE 2019

TABLE OF CONTENTS

Awarded Presentations

Keynote Presentation

Tutorials: Best Known Methods and Innovations

Session #1: Enabling 5G Test Strategies

Session #2: Process Optimization

Session #3: Challenges of 5G test and beyond

Session #4: MEMS & Optical Test Solutions

Session #5: Extreme Probing at High Temperature and High Power

Session #6: Expanding Probecard Capability

Session #7: PCB Innovation: High performance – simplified & gotyas!

Session #8: Extreme probing – Quantum Computing to Smart Cars, the future is here

Session #9: Prober – Thermal Accuracy & Innovations

Poster Session 1: Poster Medley

Poster Session 2: Poster Potpourri