"WLBI at Motorola"
"Solutions to Technical Challenges for WLBI"
DINNER GUEST SPEAKERS Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "Wafer Testing - Where Back End Meets the Front End"
"The Need for a Revolution in Test Tooling"
"Cassini Spacecraft Exploration of Saturn"
"International SEMATECH Wafer Probe Benchmarking Project"
OPENING SESSION Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "Welcome to SWTW-2002"
Session 1 - HIGH POWER PROBING Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 Winner - Best Overall Presentation "Modeling Distributed Power Delivery Effects in High Performance Sort Interface Units"
"Enabling at Speed Parallel Testing for High Power Products"
Winner - Most Inspirational
Presentation
Session 2 - PROCESS OPTIMIZATION Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "How to Reach more than 1 Million Touchdowns per Probe Head when Testing High Current / High Pin Count Microprocessors ???"
"Best Practice Metrology Protocol"
"Extending Probe Card Life for Fine Pitch Probe Cards"
Session 3 - ADVANCES IN PROBE CARD ANALYZERS Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "Probe Card Metrology and Correlation at High Temperature"
"Application of Precision Engineering Principles in Linear Stage Design"
"A Novel, High Precision Approach for Probe Card Metrology"
Session 4 - PROBE POTPOURRI Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "Dynamic Variation of Contact Resistance in Test Interfaces"
"Advances in Laser Micromachining for Wafer Probing and Trimming"
"Using MLO Packages to Build Vertical Probe Space Transformers"
Session 5 - C4 BUMP CHALLENGES Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "Electrical and Mechanical Characterization of MicroSpring BladeRunner tips on Reflowed Eutectic Bumps"
Winner - Best Data Presentation "Probing Lead Free Solder Bumps in Final Wafer Test"
"Intel Sort-Interface-Unit (SIU) Design Methods for Reducing Burn Rates on Tight-Pitch C4 Logic Arrays"
Session 6 - RF and PARAMETRIC PROBING Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "40 GHz on Wafer Testing for Two Port Devices"
Winner - Best Presentation, Tutorial in Nature
"Production Test of Process Control Monitors (PCMs) with Pyramid Probe Cards"
"Ultra Low Noise Probing for Parametric and RF Testing"
Session 7 - WHAT'S NEXT FOR PROBERS? Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "Advanced Fiducial Alignment for Photolithography Probe Cards"
"Speed Bumps in Fast Probing"
"GlasTest : Interface Management Software for EG2001"
Session 8 - NEW PROBE TECHNOLOGIES Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "HAWK: High Parallel Hybrid Probe Card for Memory Devices"
"Area Array Cobra Probe Card With 5 GHz. Bandwidth"
"Advantest's PhotoFinger Probecard"
"VSCC: Vertical Spring Contact Card for Bump Probing"
Session 9 - PROBE PROCESS ASSESSMENT Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 "High Productivity/Cost Effective Wafer Probing"
"Towards the Fine Pitch - Constraints and Methodology"
SWTW 2002 Program Committee Members: Bill Mann, General Chair, william.mann@ieee.org Rey Rincon, Texas Instruments, Technical Program Chair, r-rincon@ti.com Jerry Broz, Technical Program Vice-Chair, jerry.broz@swtest.org Fred Taber, IBM, taber@ibm.com |
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