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2002 Southwest Test Workshop
(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS

Full Wafer Burn-In Tutorial
Dinner Guest Speakers
Opening Session - Chairman's Welcome
Session 1 - High Power Probing
Session 2 - Process Optimization
Session 3 - Advances in Probe Card Analyzers
Session 4 - Probe Potpourri
Session 5 - C4 Bump Challenges
Session 6 - RF and Parametric Probing
Session 7 - What's Next for Probers?
Session 8 - New Probe Technologies
Session 9 - Probe Process Assessment

Final Test Report - July, 2002 Issue on the SouthWest Test Workshop




WAFER LEVEL BURN-IN TUTORIAL
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Introduction to Wafer Level Burn-In"
Bill Mann
General Chair
Southwest Test Workshop
519 Westminster Ave.
Newport Beach, CA 92663
949-645-3294
william.mann@ieee.org
   

"WLBI at Motorola"
Teresa McKenzie
Motorola Semiconductor Products Sector
6501 William Cannon Dr. West
Austin, TX 78435
512.895.4826
t.mckenzie@motorola.com
   

"Solutions to Technical Challenges for WLBI"
Steve Steps
Aehr Test Systems
400 Kato Terrace
Fremont, CA 94539
510-623-9400 x-257
ssteps@aehr.com
   





DINNER GUEST SPEAKERS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Wafer Testing - Where Back End Meets the Front End"
Charles L. Lassen
Managing Partner
Prismark Partners, LLC

130 Main Street
Cold Springs Harbor, NY 11724
   

"The Need for a Revolution in Test Tooling"
Steven B. Strauss
Intel Test Tooling Operation Manager
Intel Corp.
5000 W. Chandler Blvd., M/S CH2-112
Chandler, AZ 85226
480-554-8123
steven.b.strauss@intel.com
   

"Cassini Spacecraft Exploration of Saturn"
Kevin Grazier, Ph.D.
Jet Propulsion Labs
4800 Oak Grove Dr., M/S 230-205
Pasadena, CA 91109
krg@anlashok.jpl.nasa.gov
 

"International SEMATECH Wafer Probe Benchmarking Project"
Fred Taber
Probe Project Chair
IBM Microelectronics
ZIP 5E1
2070 Route 52
Hopewell Junction, NY 12533
845-894-2348
taber@us.ibm.com
   





OPENING SESSION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Welcome to SWTW-2002"
Bill Mann
General Chair
Southwest Test Workshop
Newport Beach, CA 92663
949-645-3294
william.mann@ieee.org
   



Session 1 - HIGH POWER PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

Winner - Best Overall Presentation
"Modeling Distributed Power Delivery Effects in High Performance Sort Interface Units"
Brett Grossman
Intel Corp.
2501 NW 229th Street, RA2-215
Hillsboro, OR 97124
971-214-5107
Brett.Grossman@intel.com
Tim Swettlen
Intel Corp.
2200 Mission College Blvd
Santa Clara, CA 95054
408-653-7846
tim.swettlen@intel.com

"Enabling at Speed Parallel Testing for High Power Products"
Tim Swettlen
Abdel Abdelrahman
Intel Corp.
2200 Mission College Blvd
Santa Clara, CA 95054
408-653-7846
tim.swettlen@intel.com

abdel.abdelrahman@intel.com
 

Winner - Most Inspirational Presentation
"Probing 10 kV and 100 Amps: Challenges and Solutions for High Voltage / High Current Wafer Probing"
Rainer Gaggl, Ph.D.
T.I.P.S. Messtechnik GmbH
Getreideweg 1, A-9500 Villach
+43 4242 319720
r.gaggl@tips.co.at



Session 2 - PROCESS OPTIMIZATION
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"How to Reach more than 1 Million Touchdowns per Probe Head when Testing High Current / High Pin Count Microprocessors ???"
Jens Kober
AMD Saxony Manufacturing GmbH
Mail Stop E23-TE
Wilschdorfer Landstr. 101
D-01109 Dresden, Germany
(+49) 351 - 277 44 13
Jens.Kober@amd.com

"Best Practice Metrology Protocol"
Sal Gullotta
Wentworth Laboratories, Inc.
101 Commerce Drive
Brookfield, CT 06804
203-775-9311 x 1137
sgullotta@wentworthlabs.com
W. Stuart Crippen
Intel Corp.
5000 W. Chandler Blvd.
Chandler AZ 85224
480-554-8961
warren.crippen@intel.com
 

"Extending Probe Card Life for Fine Pitch Probe Cards"
Gene Humphrey
International Test Solutions
2479 Chardonnay Way
Livermore, CA 94550
925-606-9828
geneh@inttest.net
   



Session 3 - ADVANCES IN PROBE CARD ANALYZERS
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Probe Card Metrology and Correlation at High Temperature"
Rod Schwartz
Daniel Kosecki
Integrated Technology Corporation
1228 N. Stadem Drive
Tempe, Arizona 85281 USA
480-968-3459
rod@inttechcorp.com

dank@inttechcorp.com

"Application of Precision Engineering Principles in Linear Stage Design"
Gary Gunderson
Applied Precision, LLC
1040 12th Avenue NW
Issaquah, WA 98027
425-557-1000
ggunder@api.com
   

"A Novel, High Precision Approach for Probe Card Metrology"
Raymond Kraft, Ph.D.
Applied Precision, LLC
1040 12th Avenue NW
Issaquah, WA 98027
425-557-1000
rkraft@api.com
   



Session 4 - PROBE POTPOURRI
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Dynamic Variation of Contact Resistance in Test Interfaces"
Todd Sargent
Testdesign / inTest Corporation
1124 Davis St.
Redwood City, CA 94061
650-369-5928
wavebox@pacbell.net

t.sargent@intest.com
   

"Advances in Laser Micromachining for Wafer Probing and Trimming"
Andrew Webb
Oxford Lasers, Inc.
29 King Street
Littleton, MA 01460-1528
800-222-3632 x106
awebb@oxfordlasers.com
   

"Using MLO Packages to Build Vertical Probe Space Transformers"
Bill Pardee
Bill Fulton
Wentworth Laboratories, Inc.
101 Commerce Drive
Brookfield, CT 06804
203-775-9311 x1189 / x1105
bfulton@wentworthlabs.com

bpardee@wentworthlabs.com
   



Session 5 - C4 BUMP CHALLENGES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Electrical and Mechanical Characterization of MicroSpring BladeRunner tips on Reflowed Eutectic Bumps"
Rod Martens, Ph.D.
Form Factor, Inc.
2140 Research Drive
Livermore, CA 94550
925-456-3813
rmartens@formfactor.com
Scott Mitchell
Texas Instruments, Inc.
13560 North Central Expressway, MS 3738
Dallas TX, 75265
972-995-5055
s-mitchell1@ti.com

Winner - Best Data Presentation
"Probing Lead Free Solder Bumps in Final Wafer Test"
Sam McKnight
IBM Microelectronics
ZIP 5E1
2070 Route 52
Hopewell Junction, NY 12533
mcknighs@us.ibm.com

"Intel Sort-Interface-Unit (SIU) Design Methods for Reducing Burn Rates on Tight-Pitch C4 Logic Arrays"
Kip Stevenson
Pooya Tadayon
Intel Corp.
Sort Test Technology Development
2501 N.W. 229th Street , RA1-331
Hillsboro, OR 97124
Kip.P.Stevenson@intel.com

Pooya.Tadayon@intel.com



Session 6 - RF and PARAMETRIC PROBING
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"40 GHz on Wafer Testing for Two Port Devices"
Mark Echeagaray
MaCom Tech
5300 Hellyer
San Jose, CA
408-624-3087
markech@california.com

Winner - Best Presentation, Tutorial in Nature
"RF S-Parameter Measurements - A Production Solution"

William Knauer
Keithley Instruments, Inc.
Cleveland, OH
knauer_bill@keithley.com

"Production Test of Process Control Monitors (PCMs) with Pyramid Probe Cards"
Ken Smith
Cascade MicroTech
Portland, OR
503-601-1955
Ken_Smith@cmicro.com
William Knauer
Keithley Instruments, Inc.
Cleveland, OH
knauer_bill@keithley.com
Jerry Broz, Ph.D.
Jason Aronoff
Texas Instruments, Inc.
13560 North Central Expressway
Dallas TX, 75265
j-aronoff@ti.com

"Ultra Low Noise Probing for Parametric and RF Testing"
Larry Hendler
Hendler Enterprises
10330 Colby Ave.
Cupertino, CA 95014
408-528-3280
lhendler@electroglas.com
John Salois
Steve Lugosi
Karl Heiman
Robert Fenton
Electroglas
6024 Silver Valley Creek Rd
San Jose, CA 95138
408-528-3879
jsalois@electroglas.com

slugosi@electroglas.com
kheiman@electroglas.com
rfenton@electroglas.com
 



Session 7 - WHAT'S NEXT FOR PROBERS?
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"Advanced Fiducial Alignment for Photolithography Probe Cards"
Troy Harnisch
Ira Feldman
NanoNexus Inc.
400 Kato Terrace
Fremont, CA 94539
510 623-9911
tharnisch@nanonexus.com

ifeldman@nanonexus.com
Karl Heiman
Fenglei Du
Electroglas Inc.
6024 Silver Creek Valley Rd
San Jose, CA 95138-1011
408 528-3884
krheiman@electroglas.com

FDu@electroglas.com
 

"Speed Bumps in Fast Probing"
Lalit Kumar, Ph.D.
Janaki Vegiraju
Bob Fenton
Electroglas, Inc.
6024 Silver Creek Valley Rd
San Jose, CA 95138
408-528-3432
Lkumar@Electroglas.com

Jvegiraju@Electroglas.com
bfenton@electroglas.com

"GlasTest : Interface Management Software for EG2001"
Philippe Sandri
Brice Blanc
PHS MEMS
Av de Rochepleine , BP 420
F38524 Saint Egreve cedex
33 (0) 476 58 4955
p.sandri@phsmems.com

b.blanc@phsmems.com



Session 8 - NEW PROBE TECHNOLOGIES
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"HAWK: High Parallel Hybrid Probe Card for Memory Devices"
Phill Mai
JEM America Corp.
3000 Laurelview Court
Fremont, CA 94538
510-683-9234 ext 114
pmai@jemrd.com

"Area Array Cobra Probe Card With 5 GHz. Bandwidth"
Raphael Robertazzi
IBM T.J. Watson Research Center
Building 801 Rt 134
MS 13-257
Yorktown Heights, NY 10598
914-945-3620
tazzi@us.ibm.com

"Advantest's PhotoFinger™ Probecard"
David Yu, Ph.D.
Yu Zhou, Ph.D.
Advantest America, Inc.
Buffalo Grove, IL
847-821-3204
d.yu@advantest.com

y.zhou@advantest.com

"VSCC: Vertical Spring Contact Card for Bump Probing"
Patrick Mui
Kaz Okubo
JEM America Corp.
3000 Laurelview Court
Fremont, CA 94538
510-683-9234 ext 114
pmui@jemam.com
Shunsuke Sasaki
Akira Okuma
NHK International
 


Session 9 - PROBE PROCESS ASSESSMENT
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9

"High Productivity/Cost Effective Wafer Probing"
Larry Hendler
Hendler Enterprises
10330 Colby Ave.
Cupertino, CA 95014
408-528-3280
lhendler@electroglas.com
Karl Heiman
Robert Fenton
Electroglas
6024 Silver Valley Creek Rd
San Jose, CA 95138
408-528-3879
kheiman@electroglas.com

rfenton@electroglas.com
 

"Towards the Fine Pitch - Constraints and Methodology"
Geraldine Persico
David Papazian
Roger Milesi
ST Microelectronics
850, rue Jean Monnet
CROLLES Cedex
+33 (4) 76925431
Geraldine.persico@st.com

David.papazian@st.com
Roger.milesi@st.com
 


SWTW 2002 Program Committee Members:
Bill Mann, General Chair, william.mann@ieee.org
Rey Rincon, Texas Instruments, Technical Program Chair, r-rincon@ti.com
Jerry Broz, Technical Program Vice-Chair, jerry.broz@swtest.org
Fred Taber, IBM,
taber@ibm.com
 
   
 

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Last updated: May 05, 2008