SWTest 2019 Technical Program

Awarded Presentations

Best Overall Presentation (tie)

5G Wafer Test and the New Age of Parallelism

Author/Presenter: Daniel Bock, Ph.D. (FormFactor – Beaverton, USA)

Large Area High Temperature Copper Pillar Probing

Author/Presenter: Gunther Boehm (FEINMETALL GmbH – Herrenberg, Germany)

Best Data Presentation

Practical method for detecting hot-stepping, micro-arcing or hot switching during wafer probe

Authors: Enrique Guerra (Texas Instruments – Dallas, USA), Imran Ahmed (Texas Instruments – Dallas, USA)
Presenter: Imran Ahmed (Texas Instruments – Dallas, USA)

“Most Inspirational” Presentation (tie)

Silicon Photonics – Challenges and Solutions for Wafer-Level Production Tests

Authors: Dr. Choon Beng Sia (FormFactor Inc. – Singapore), Dr. Johnny Yap (Global Foundries Singapore – Singapore), Ashesh Sasidharan (GLOBALFOUNDRIES Singapore – Singapore), Robin Chen (Globalfoundries – Singapore), Dr. Soon Leng Tan (Globalfoundries – Singapore), Guo Chang Man (Globalfoundries – Woodlands, Singapore)
Presenters: Dr. Choon Beng Sia (FormFactor Inc. – Singapore), Dr. Johnny Yap (Global Foundries Singapore – Singapore)

Quantum Computing sets new demand for wafer probing

Author/Presenter: Ari Kuukkala (Afore – Lieto, Finland)

Best Presentation, Tutorial in Nature

High Density Probe Card PCB’s, are you being your own worst enemy to achieving Higher Parallelism on your Designs?

Authors: Shawn Powell (Formfactor – Livermore, USA), Mark Ojeda (Cypress Semiconductor – San Jose, USA)
Presenter: Shawn Powell (Formfactor – Livermore, USA)

Best Poster

Design and Analysis of Test Interposer for ASIC Package Test with 3D MEMS Co-axial Probe

Authors: Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea), Yong Ho Cho (Microfriend Inc. – Nowongu, Korea), Sangkyu Yoo (Samsung Electronics – Hwasung City, Korea), Jong Gwan Yook (Yonsei Univ. – Shinchon-dong, Korea)
Presenter: Tae Kyun Kim (Microfriend Inc. – Nowongu, Korea)

Keynote Presentation

“Automotive, the Roadmap of Technologies and their Influences on Testing”

Davide Appello
Director of Product Engineering
STMicroelectronics

Tutorials: Best Known Methods and Innovations

Session Chair: Clark Liu (PTI – Hsinchu, Taiwan)

Temperature Probing Process

Author/Presenter: Imran Ahmed (Texas Instruments Inc – Dallas, USA)

A Journey to Achieve lower test cost – Massive High Multisite

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Author/Presenter: Weihung Wu (Texas Instruments – Sugar Land, USA)

Simulating S-parameters Of RF Probes

Author/Presenter: Michael Ricci (Rika Denshi Group, LTD – San Jose, USA)

Session #1: Enabling 5G Test Strategies

Session Chair: Dr. Jerry Broz (SWTest Workshop – Longmont, USA)

SWTest 2019 Conference Introduction

Author/Presenter: Dr. Jerry Broz (SW Test Workshop – Longmont, USA

5G Wafer Test and the New Age of Parallelism

Author/Presenter: Daniel Bock (FormFactor – Beaverton, USA)

5G Means Higher Frequency, Higher RF Port Count, and Higher Parallelism

Authors: Jeffery Arasmith (Technoprobe America – San Jose, USA), Balbir Singh (Intel – Folsom, USA), Ken Walker (Intel Corporation – Folsom, USA)
Presenters: Jeffery Arasmith (Technoprobe America – San Jose, USA)

Over the Air Test Solution for Antenna in Package Applications

Author/Presenter: Jason Mroczkowski (Cohu – St. Paul , USA)

Session #2: Process Optimization

Session Chair: Patrick Mui (JEM America – Fremont, USA)

Reducing Test Costs by Optimizing the Prober Indexing Process

Author/Presenter: Ken Walker (Intel Corporation – Folsom, USA)

Intelligent method for retesting a wafer

Authors: Pai Chang (Teslence – Taipei, Taiwan), YK Hwang (Teslence – Taipei, Taiwan)
Presenter: Pai Chang (Teslence – Taipei, Taiwan)

Practical method for detecting hot-stepping, micro-arcing or hot switching during wafer probe.

Authors: Enrique Guerra (Texas Instruments – Dallas, USA), Imran Ahmed (Texas Instruments – Dallas, USA)
Presenter: Imran Ahmed (Texas Instruments – Dallas, USA)

Session #3: Challenges of 5G test and beyond

Session Chair: Dr. Michael Huebner (FormFactor – Livermore, USA)

WLCSP xWave for high frequency wafer probe applications part 2

Author/Presenter: Jason Mroczkowski (Cohu – St. Paul , USA)

On-chip Test with Microstrip Patch Antennas

Author/Presenter: Dan Campion (Cohu – St. Paul, USA)

Probing 5G Devices Like It’s No Big Deal

Authors/Presenters: Patrick Rhodes (FormFactor – Livermore, USA), Tim Lesher (FormFactor, Inc – Beaverton, USA)

Session #4: MEMS & Optical Test Solutions

Session Chair: Geert Gouwy (Melexis – IEPER, Belgium)

Hybrid MEMS Probe Technology 2.0

Authors: Amy Leong (FormFactor Inc. – San Jose, USA), Jarek Kister (FormFactor, USA), Ashish Bhardwaj (FormFactor Inc. – Livermore, USA)
Presenters: Ashish Bhardwaj (FormFactor Inc. – Livermore, USA), Amy Leong (FormFactor Inc. – San Jose, USA)

Evaluation of a MEMS Solution for Kelvin Probing on Bumps 180µm and Smaller

Authors/Presenters: Christopher Lenczycki (Texas Instruments, Inc. – Dallas, USA), Kyle Cotner (Nidec SV TCL – Tempe, USA)

A Fully Automatic Electro-Optical Test System Enabling the Development of a Silicon Photonic Technology Platform

Authors: Dr. Jeroen De Coster (IMEC – Heverlee, Belgium), Rafal Magdziak (IMEC – Heverlee, Belgium), Dr. Peter De Heyn (imec – Heverlee, Belgium), Erik Jan Marinissen (IMEC – Leuven, Belgium), Dr. Marianna Pantouvaki (IMEC – Heverlee, Belgium), Dr. Joris Van Campenhout (IMEC – Heverlee, Belgium), Dr. Philippe Absil (imec – Heverlee, Belgium), Dan Rishavy (FormFactor – Beaverton, USA), Joe Frankel (FormFactor – Beaverton, USA), Dr. Kainoa Kekahuna (FormFactor – Beaverton, USA), Dr. Kazuki Negishi (FormFactor – Beaverton, USA), Dr. Mike Simmons (FormFactor – Beaverton, USA), Dr. Eric Christenson (FormFactor – Beaverton, USA)
Presenters: Dr. Jeroen De Coster (IMEC – Heverlee, Belgium), Dan Rishavy (FormFactor – Beaverton, USA)

Silicon Photonics – Challenges and Solutions for Wafer-Level Production Tests

Session #5: Extreme Probing at High Temperature and High Power

Session Chair: Amy Leong (FormFactor Inc. – San Jose, USA)

Advances in Vertical Probe Material for 200C Wafer Test Applications

Authors: Mitsuhiro Moriyama (SV TCL K.K – Toshima-Ku, Japan), Hiroyuki Ichiwara (SV TCL K.K – Toshima-Ku, Japan)
Presenter: Mitsuhiro Moriyama (SV TCL K.K – Toshima-Ku, Japan)

High temperature wafer probing of power devices

Authors/Presenters Masatomo Takahashi (Tokyo Seimitsu – Hachioji, Japan), Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)

High-end, high-power devices: an integrated solution at probe card level

Authors: Dr. Emanuele Bertarelli (Technoprobe SpA – Cernusco Lombardone, Italy), Alice Mari (Technoprobe SpA – Cernusco Lombardone, Italy), Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy), Flavio Maggioni (Technoprobe – Cernusco Lombardone, Italy), Stefano Felici (Technoprobe – San Jose, USA)
Presenter: Dr. Emanuele Bertarelli (Technoprobe SpA – Cernusco Lombardone, Italy)

Session #6: Expanding Probecard Capability

Session Chair: Mark Ojeda (Cypress Semiconductor – San Jose, USA)

A Technique of Embedding Protection Resistors inside LTCC Substrate using as Space Transformer

Authors: Kwangjae Oh (Microfriend Inc. – Seoul, Korea), Yong Ho Cho (Microfriend Inc. – Nowongu, Korea), SangKyu Yoo (Samsung Electronics – Hwasung City, Korea)
Kwangjae Oh (Microfriend Inc. – Seoul, Korea): NAMES

Terminated Tester Resource Enhancement (TTRE) Improves Signal Integrity Performance at higher signal sharing enables wafer sort at higher frequency and higher parallelism

Authors/Presenters: Young-woo Lee (SK Hynix – Icheon, Korea), Quay Nhin (FormFactor Inc. – Livermore, USA)

New concepts for yield improvements and selective repair of cantilever pins for Flash and DRAM probe cards

Authors: Thomas Oppert (PacTech-Packaging Technologies GmbH – Nauen, Germany), Thorsten Krause (PacTech-Packaging Technologies GmbH – Nauen, Germany), Matthias Fettke (PacTech-Packaging Technologies GmbH – Nauen, Germany), Dr. Thorsten Teutsch (PacTech-Packaging Technologies GmbH – Nauen, Germany)
Presenter: Thomas Oppert (PacTech-Packaging Technologies GmbH – Nauen, Germany)

Session #7: PCB Innovation: High performance – simplified & gotyas!

Session Chair: Suz Ramsbottom (Texas Instruments – Dallas, USA)

IBM Low Force Rigid Probe Technology

Authors: David Audette (IBM – Essex Junction, USA), Grant Wagner (IBM – Burlington, USA), Marc Knox (IBM – Essex Junction, USA), Jay Chey (IBM – Yorktown Heights, USA), Sankeerth Rajalingam (IBM – Yorktown Heights, USA), Doreen DiMilia (IBM – Yorktown Heights, USA)
Presenter: Grant Wagner (IBM – Burlington, USA)

Stretching the Performance Envelope of ATE PCBs (Automatic Test Equipment Printed Circuit Boards)

Author/Presenter: Tom Bleakley (Harbor Electronics – Santa Clara, USA)

High Density Probe Card PCB’s, are you being your own worst enemy to achieving Higher Parallelism on your Designs?

Authors: Shawn Powell (Formfactor – Livermore, USA), Mark Ojeda (Cypress Semiconductor – San Jose, USA)
Presenter: Shawn Powell (Formfactor – Livermore, USA)

Session #8: Extreme probing – Quantum Computing to Smart Cars, the future is here

Session Chair: Karen Armendariz (Celadon Systems – Burnsville, USA)

Quantum Computing sets new demand for wafer probing

Author/Presenter: Ari Kuukkala (Afore – Lieto, Finland)

“Smart cars – smart probe cards” – Probing of devices for advanced driver assistance systems

Author/Presenter: Sebastian Salbrechter (TIPS Messtechnik GmbH – Villach, Austria)

Technoprobe TPEG™ MEMS T4 OPM eliminates challenges faced with Cobra-like solutions

Authors: Froilan Jandoc (Allegro Microsystems Philippines Inc. – Paranaque, Philippines), Wally Lacson (Technoprobe Philippines – Cabuyao, Philippines), Mer Joy Uy (Allegro Microsystems Philippines Inc. – Paranaque, Philippines)
Presenters: Froilan Jandoc (Allegro Microsystems Philippines Inc. – Paranaque, Philippines), Mer Joy Uy (Allegro Microsystems Philippines Inc. – Paranaque, Philippines)

Recent Breakthrough in Tight Pitch Laser Microdrilling for MEMS Guideplates

Authors: Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom), Michael Cullimore (Oxford Lasers – Didcot, United Kingdom)
Presenters: Michael Cullimore (Oxford Lasers – Didcot, United Kingdom)

Session #9: Prober – Thermal Accuracy & Innovations

Session Chair: Rey Rincon (SWTest – Austin, USA)

Absolute temperature accuracy, a new standard for wafer testing.

Author/Presenter: Klemens Reitinger (ERS electronic GmbH – Germering, Germany)

Study on Thermal Stability of Probe Mark

Authors: Byung-Hyun Shin (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea), Shoun Yu (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea), Gabriel Tak (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea)
Presenter: Gabriel Tak (SEMICS Inc. – Gonjiam-eup, Gwangju-si, Korea)

A novel method of accredited high accuracy temperature measurement on a thermal wafer chuck in support of IATF 16949:2016 (AS/TS16949)

Author/Presenter: Harald Ibele (Sigma Sensors (TCL) GmbH iG – Pfullendorf, Germany)

Poster Session #1: Poster Medley

Session Chair: Darren James (Rudolph Technologies – Bloomington, USA)

Innovative “Featured-Surface” Cleaning Materials Engineered for Advanced Vertical and Micro-Cantilevered Probe Technologies

Authors: Alexander Baglione (International Test Solutions – Reno, USA), Alex Poles (International Test Solutions – Reno, USA), W. Cooper Smith (International Test Solutions – Reno, USA), Dr. Jerry Broz (International Test Solutions – Reno, USA)
Presenter: Alexander Baglione (International Test Solutions – Reno, USA)

Implementing Advanced Shaping on Vertical MEMS Probe Technology

Authors: Mai Sawada (JEM America – San Jose, USA), Akila Murali (JEM America Corp. – Fremont, USA), Joe Mai (JEM Europe – Montbonnot, France), Alex Poles (International Test Solutions – Reno, USA), Alexander Baglione (International Test Solutions – Reno, USA), W. Cooper Smith (International Test Solutions – Reno, USA), Dr. Jerry Broz (International Test Solutions – Reno, USA), Victor Tran (JEM America – Fremont, USA), Atsushi Mine (JEM – Kikuchi-City, Japan)
Presenters: Victor Tran (JEM America – Fremont, USA), Alex Poles (International Test Solutions – Reno, USA), Akila Murali (JEM America Corp. – Fremont, USA)

RF Broadband Matching for 5G Probe Card without Using VNA

Author: Norman Hsu (Chunghwa Precision Test Technology Co.,Ltd – Pinzhen, Taiwan)
Presenter: Weicheng Wang (Chunghwa Precision Test Technology Co.,Ltd – Pinzhen, Taiwan)

Fabricating PdCo pads on mixed surface of nickel and solder mask of a surface laminar carrier for Cobra Probe application

Authors: Jay Chey (IBM – Yorktown Heights, USA), Michael Gaynes (Universal Instrument Corporation – Conklin, USA)
Presenter: Jay Chey (IBM – Yorktown Heights, USA)

Poster Session #2: Poster Potpourri

Session Chair: Rey Rincon (SWTest – Austin, USA)

Comparison study of dry resist strippers during high aspect ratio test probe fabrication

Authors: Jay Chey (IBM – Yorktown Heights, USA), Sankeerth Rajalingam (IBM – Yorktown Heights, USA), Doreen DiMilia (IBM – Yorktown Heights, USA), David Audette (IBM – Essex Junction, USA), Grant Wagner (IBM – Burlington, USA), Marc Knox (IBM – Essex Junction, USA), Edgar Tremblay (IBM – Bromont, Canada)
Presenter: Jay Chey (IBM – Yorktown Heights, USA)

The differences between ISO 9000 and ISO 17025

Author/Presenter: Harald Ibele (Sigma Sensors (TCL) GmbH iG – Pfullendorf, Germany)

Electrical Performance of Advanced Interconnect Technologies for 5G applications

Authors: Brandon Sherrieb(Integrated Test Corp. – Dallas, USA), Steve Karas (Integrated Test Corp. – Dallas, USA), Dana Freeman (Integrated Test Corp. – Dallas, USA), Glenn Tetmyer (Probe Test Solutions – Hamilton, UK), Gert Hohenwarter (GateWave Northern, Inc. – Madison, USA)
Presenters: Brandon Sherrieb(Integrated Test Corp. – Dallas, USA), Steve Karas (Integrated Test Corp. – Dallas, USA)