SWTest 2025 Program

Jerry Broz, PhD
SWTest General Chair, SWTest Conference, USA

Mastering Emerging Probing Challenges: The Power of Agile and Continuous Innovation

Raffaele Vallauri
VP Director, Technoprobe SpA - Italy

Enabling the Semiconductorization of Photonics

Scott JORDAN (PI - USA)

Wafer-Level Testing of Photonic Devices

Philipp DIETRICH, Andres MACHADO, Florian RUPP, Roman ZVAHELSKYI (Keystone Photonics GmbH - Germany)

Photonics Chip Level Test Strategies in High Vibration Production Environments

Matthew PRICE, Nikta JALAYER (Physik instrumente - USA)

First Silicon Photonics High Speed (up to 67GHz) Wafer Probe Card Demonstration for S-Parameter Testing on the Production Wafer

Hsu Hao CHANG, Amit AGNIHOTRI, Andrew YICK, Dongwon LEE (Marvell - USA), Giulia ROTTOLI (Technoprobe - Italy)

Ultra-low leakage probe card for wafer parametric testing enabled by µ3D printing

Edgar HEPP, Wabe KOELMANS, Francesco COLANGELO, Patrik SCHüRCH (Exaddon - Switzerland), Francois GIX, Sebastien SCHOENE (Synergie CAD - France)

Optimizing Probe Card Performance, Longevity, and Cost for Small Parametric Pads

Victoria TRAN (Gel-Pak - USA), Garrett TRANQUILLO (Celadon Systems, Inc. - USA)

MEMS probe card solution to address parametric test challenges

Apoorva DUBE (FormFactor – USA), Judd GERBER, Sanjay BIDASARIA, Philip TAVERNIER (Intel – USA), Mukesh SELVARAJ (FormFactor – USA)

Revolutionary SiC-based micro-Vertical Cryogenic Probing Solutions down to 2K

Dalton ROEHL, Garrett TRANQUILLO, Karen ARMENDARIZ (Celadon Systems - USA), Gregory NIELSON, Brad FERGUSON, Jared PAYNE, Rebecca ANDERSON (Nielson Scientific LLC - USA), Alexander HORSPOOL, Dillon JENSEN, Noah JOHNSON, Stephen SCHULTZ (Brigham Young University - USA)

Wafer-level MEMS testing: challenges and solutions for high-yield manufacturing

Luca FANELLI (SPEA S.p.A. – Italy), Raimondo P. SESSEGO (NXP – USA)

Fine Pitch Probing of Micro-Bumps for Advanced Packages

Pardeep KUMAR, Zehao LI, Kwame AMPONSAH (Xallent Inc. – USA), Theodore LEVIN, Arthur GASASIRA (IBM – USA)

Karen Armendariz
Celadon Systems, USA

A novel approach for increased probe card parallelism utilizing device package substrates

Leon BESPROZVANNY, Cameron HARKER, Robert WHITE (FormFactor – USA)

Challenges and Improvement Actions for High Parallelism Wafer Testing

Oscar LEE, Harvey LIN (Taiwan Semiconductor Manufacturing Co., Ltd. – Taiwan)

Enabling 100+GHz launches for 448G signals.

Muhammad Hameem RAHMAN, Quaid Joher FURNITUREWALA (Advantest America Inc. – USA)

Fine Pitch RF Calibration and Sensitivity to Variation for RF Wafer Probing

Daniel BOCK (FormFactor - USA)

RF Probe Solutions - From Lab to Fab

Don THOMPSON (PTSL - USA)

How High-Speed Probe Cards Accelerate Time-to-Market

Emmett RICKS (Micron - USA)

Broadband Attenuators using Thin Film for Wafer Sort

Pratik GHATE (FormFactor, Inc. - USA)

HPC and AI Probing Devices Require New Integration Schemes

Ksenija VARGA, Alois MALZER, Thomas UHRMANN, Peter URBAN, Christoph WOLF, Tobias ZENGER (EV Group - Austria)

Engineering Tomorrow’s Advance Vertical Probe Card Guide Plates: Balancing Precision and Economy whilst Meeting next generation Demands

Chris STOKES (Oxford Lasers Ltd - United Kingdom)

Cost reduction in probing operations by surveillance of mechanical probe card integrity

Martin KUNZ (Solarius GmbH - Germany), Franz STEGER (Texas Instruments Deutschland GmbH - Germany)

A new generation Probe Card Analyzer for large area, high load devices

Luigi MILAZZO, Antonio RINALDI, Federico MARIANI, Federico TRESOLDI (Technoprobe - Italy), Alfredo BENSO (Politecnico di Torino - Italy)

Tester on a Probe Card: Solution to challenges in Chiplet-Testing

Patrick SULLIVAN (ElevATE Semiconductor – USA), Dan HICKS (STAr-Edge Technologies – USA), Matthew GETZ, Sandeep D’SOUZA, Tim BAKKEN (ElevATE Semiconductor – USA)

Early detection of CRES degradation on High Current Power Planes

Brent BULLOCK (Advantest America Inc. - USA)

High-Voltage Test: Deflection study for LuPo pressure chamber probe cards

Diana DAMIAN, Georg FRANZ (T.I.P.S. Messtechnik GmbH - Austria)

KGD - Ultrafast Dynamic Power Device Probing

Rainer GAGGL, Sebastian SALBRECHTER (T.I.P.S. Messtechnik GmbH - Austria), Davide GRISAFI, Sebastiano GRIMALDI (ST Microelectronics, Catania - Italy)

Advanced Localized Thermal Management for Wafer Probing in High-Power AI and GPU Applications Under Dynamic Thermal Conditions

Klaudiusz HOLECZEK (Watttron GmbH - Germany), Klemens REITINGER (ERS electronic GmbH - Germany)

Ultra-High-Conductivity Palladium Alloy for Test Probes: The Road to 33%IACS

Patrick BOWEN, Grant JUSTICE (Deringer-Ney Inc - USA)

Revolutionizing Semiconductor Wafer Testing: A Breakthrough in Ultra-Precise High-Performance Foil Material

Thilo HAPP (Sickert&Hafner Automotive Gmbh – Germany)

Understanding the Factors for Power supply characteristics (2nd Study)

Wai Kit K (Lincstech Co., Ltd. - Japan)

Innovations in Testing for Truly Known Good High Bandwidth Memory Stacks

Alan LIAO (FormFactor - USA), Hiromitsu TAKASU (ADVANTEST - Japan)

Probing test system with optical fiber array for photonic integrated circuits

Takaharu OHYAMA, Shigeki OKA, Tomohisa HOSHINO, Yasushi WATANABE (YOKOWO CO., LTD. – Japan)

Innovative Testing Strategies for Silicon Photonic Devices in Engineering and Production Applications*

Dan RISHAVY, Quan YUAN (FormFactor, Inc. – USA)
* PDF not provided

One-time-touchdown Probe Card Tester with 1000kg Chuck Force Probing System Total Solution

Kenny SONG, River HUANG (Probing Semiconductor Technology Shanghai Co.,Ltd – China)

Automation of Large and Heavy Probe Card Exchange, Handling and Storage

Matthias WEGNER, Jochen SCHUSTER, Nail AKROUTI (Heraeus Precious Metals - Germany)

Probe Card Analyzer Motherboard Flexibility and Performance Improvement

Benedikt PONGRATZ (Turbodynamics - USA)